BDCCDG201208R47MFC

RoHS & Halogen Free & REACH Compliance. SPECIFICATION FOR APPROVAL Digi-key Customer： Customer P/N: A0X2002614 Drawing No： Quantity： 0 Pcs. Date : 2020/12/01 BDCCDG201208R47MFC Chilisin P/N： SPECIFICATION ACCEPTED BY: COMPONENT ENGINEER ELECTRICAL ENGINEER MECHANICAL ENGINEER APPROVED REJECTED 奇力新電子股份有限公司 東莞奇力新電子(東莞廠)有限公司 Chilisin Electronics Corp No. 29, Alley 301, Tehhsin Rd., Hukou,Hsinchu 303, Taiwan TEL：+886-3- 599-2646 FAX：+886-3- 599-9176 E-mail：sales@chilisin.com http：//www.chilisin.com Chilisin Electronics (Dongguan) Co., Ltd. No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Guangdong,China TEL：+86-769-8773-0251~3 FAX： +86-769-8773-0232 E-mail：cect@chilisin.com 奇力新電子(越南廠)有限公司 奇力新電子(湖南廠)有限公司 Chilisin Electronics (Vietnam) Limited No 143 - 145, Road No 10, VSIP Hai Phong, Lap Le Commune, Thuy Nguyen Dist, Haiphong City, Vietnam Tel：84-316 255 688 Fax：84-316 255 689 E-mail：sales@chilisin.com Drawn by 張鈺雯 Chang.Yuwen HuNan Chilisin Electronics Technology Co., Ltd No. 8, Shaziao Liangshuijing Town, Yuanling County, Huaihua City, Hunan Province 419601, China Tel：86-745-867-5882 E-mail：cect@chilisin.com Checked by 張鈺雯 Chang.Yuwen Approved by 鍾瑞民Jacky.Chung REVISIONS REV. A Description Preliminary release Date APPROVED BY CHECKED DRAWN BY 2020/12/1 Jacky.Chung Yuwen.Chang Yuwen.Chang BDCCDG201208 Series Specification 1 Scope: This specification applies to Molding power inductors 2 Part Numbering: 3 Rating: Operating Temperature: －４０℃ ~ １２５℃(Including self - temperature rise) Storage Temperature: －４０℃ ~ １２５℃(after PCB) －５℃~３５℃,Humidity ４５％~８５％(before PCB) 4 Marking: 5 Standard Testing Condition Temperature Humidity Unless otherwise specified Ordinary Temperature(15 to 35℃) Ordinary Humidity(25 to 85% RH) In case of doubt 20 to 30℃ 50 to 80 %RH BDCCDG201208 Series Specification 6 Configuration and Dimensions: Dimensions in mm TYPE 201208 A 2.0±0.2 B 1.2±0.2 C 0.8Max D 0.5±0.3 7 Electrical Characteristics: Part No. BDCCDG201208R47MFC Inductance (uH ) Tolerance (±%) Test Freq. Irms(A) Max. Isat(A) Max. RDC(mΩ) Max.(Typ) 0.47 20 2MHz,0.2V 3.7 4.3 27(23) Note: 1.Operating temperature range －４０℃ ~ １２５℃(Including self - temperature rise) 2.Isat for Inductance drop 30% from its value without current. 3.Irms for a 40℃ temperature rise from 25℃ ambient. 4.All test data is referenced to 25℃ ambient 5.Absolute maximum voltage 20VDC 6. Rated current: Isat or Irms, whichever is smaller BDCCDG201208 Series Specification 8 BDCCDG201208 Series 8.1 Construction: 8.2 Material List: ITEM PART DESCRIPTION 1 Core Metal Power 2 Wire Copper wire 3 4 5 Cu Terminal Ni Sn BDCCDG201208 Series Specification 9 Reliability Of Molding power inductors 1-1.Mechanical Performance No Item Test Method Specification 1-1-1 Flexure Strength The forces applied on the right Test device shall be soldered on the substrate conditions must not damage Substrate Dimension: 100x40x1.6mm the terminal electrode and the Deflection: 2.0mm metal body Keeping Time: 30sec 1-1-2 Vibration Appearance:No damage (for Test device shall be soldered on the substrate microscope of CASTOR MZ-45 20X) Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs 1-1-3 Resistance to Soldering Heat Appearance: No damage Pre-heating: 150℃, 1min More than 75% of the terminal. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) electrode should be covered Solder Temperature: 260±5℃ with solder. Immersion Time: 10±1sec Inductance: within ±20% of initial value 1-1-4 Solder ability The electrodes shall be at Pre-heating: 150℃, 1min least 95% covered with new Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) solder coating Solder Temperature: 245±5℃ Immersion Time: 4±1sec Inductance change shall be within ±20% 1-1-5 Terminal Strength Test No split termination Chip F Test device shall be soldered on the substrate, then apply a force in the direction of the arrow. Force : 5N Keeping Time: 10±1sec Mounting Pad 1-2.Environmental Performance No Item 1-2-1 Temperature Cycle 1-2-2 Humidity Resistance 1-2-3 High Temperature Resistance 1-2-4 Low Temperature Resistance Specification Appearance: No damage Inductance:within±20% of initial value Test Method One cycle: Step Time (min) Temperature (℃) 1 -40±3 30 2 25±2 3 3 125±3 30 4 25±2 3 Total: 100cycles Measured after exposure in the room condition for 24hrs Temperature: 60±2℃ Relative Humidity: 90 ~ 95% / Time: 500hrs Measured after exposure in the room condition for 24hrs Temperature: 85±3℃ Relative Humidity: 0% / Time: 500hrs Measured after exposure in the room condition for 24hrs Temperature: -40±3℃ Relative Humidity: 0% / Time: 500hrs Measured after exposure in the room condition for 24hrs BDCCDG201208 Series Specification BDCCDG201208 Series Specification 10 Packaging: 10.1 Packaging -Cover Tape The force for tearing off cover tape is 10 to 100 grams in the arrow direction. 10.2 Packaging Quantity 10.3 Reel Dimensions BDCCDG201208 Series Specification 10 Packaging: 10.4 Tape Dimensions in mm TYPE A B T W P F K 201208 1.45 2.25 0.22 8 4 3.5 1.04 B C 11 Recommended Land Pattern: Dimensions in mm TYPE 201208 A 0.8~1.2 2.3~2.9 1.0~1.45 12 Note: 1. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 2. Do not knock nor drop. 3. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) 5.After manufacturing process, there might be slight irregular shape on the edge of the products, and it's a normal phenomenon that can be neglected 6.The moisture sensitivity level (MSL) of products is classified as level 1. BDCCDG201208 Series Specification 13 Graph: