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VM810C50A-N

VM810C50A-N

  • 厂商:

    BRIDGETEK

  • 封装:

  • 描述:

    FT810 LCD 控制器 显示 评估板

  • 数据手册
  • 价格&库存
VM810C50A-N 数据手册
VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# FTDI Chip VM810C Datasheet Embedded Video Engine Credit Card Board General Purpose Multi Media Controller 1 Introduction The VM810C is a development module for FTDI’s FT810, which is used to develop and demonstrate the functionality of the FT810 Embedded Video Engine, EVE. This module behaves as an SPI slave, and requires a SPI Master for proper micro-controller interfacing and system integration. VM810C modules support 5.0” LCD panel size options. Users can also connect to different LCD screens as long as they meet the FT810 technical specification and fit the VM810C LCD connector.  VM810C50A-D, 3.3/5V microcontroller adaptor card with 5.0” LCD  VM810C50A-N, 3.3/5V microcontroller adaptor card, with 4.3/5.0” LCD connector but no display 1.1 Features The VM810C utilises the FTDI FT810 Embedded Video Engine. Graphic, audio and touch features of the FT810 can be accessed with the VM810C. For a full list of the FT810’s features please see the FT810 datasheet. The VM810C has the following features:  Ready to use LCD module  Options with or without 5” LCDs supporting resistive touch with pressure sensing  On board LCD backlight LED Driver  Supports mono audio output  On board audio power amplifier and micro speaker  Flexible power supply. Powering the VM810C using SPI host connector, or via USB Micro-B port, or via a 2.0mm JST connector  5 V tolerant buffers when used with a 5V SPI Master. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 2 Clearance No.: FTDI# Ordering Information Note that the kits below require a 5V/1A power supply. It is NOT provided in the development kit, but is offered as an optional accessory, as is the USB to SPI cable, with the following part types: Part No. Description VM810C50A-N Credit Card Size VM810C module, supports 3.3/5v MCU Adapter Board, with FPC/FFC 40 LCD connector. No display is provided. VM810C50A-D Credit Card Size VM810C module, supports 3.3/5v MCU Adapter Board, with FPC/FFC 40 LCD connector. Includes 5 inch 800x480 TFT LCD display with resistive touch panel. VA-PSU-UK1 Accessory - UK Model 5V/1A USB Power Supply (Mfr # JX-B0520C-1-B) VA-PSU-US1 Accessory - US Model 5V/1A USB Power Supply (Mfr # JX-B0520B-1-B) VA-PSU-EU1 Accessory - EU Model 5V/1A USB Power Supply (Mfr # JX-B0520A-1-B) VA800A-SPI Accessory - High Speed Micro USB to SPI adapter for BASIC boards based on FT232H MPSSE design VA-FC-1M-BKW Accessory - Flat USB A to Micro B Cable 1M- Black and White VA-FC-1M-BLW Accessory - Flat USB A to Micro B Cable 1M- Blue and White VA-FC-STYLUS1 Accessory - Resistive Touch Screen Pen Stylus Table 2-1 – Ordering information 2 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 Table of Contents 1 Introduction ................................................................................... 1 1.1 Features ........................................................................................................ 1 2 Ordering Information ..................................................................... 2 3 Hardware Description ..................................................................... 4 3.1 VM810C board ............................................................................................... 4 3.2 Physical Descriptions .................................................................................... 5 3.2.1 PCB layout ................................................................................................ 5 3.2.2 VM810C Connectors ................................................................................... 6 4 Board Schematics ........................................................................... 9 5 Hardware Setup Guide .................................................................. 11 5.1 Power Configuration ................................................................................... 11 5.2 MPSSE Setup ............................................................................................... 11 6 Mechanical Dimensions ................................................................ 14 7 Specifications ............................................................................... 15 7.1 8 Optical Specification ................................................................................... 15 Contact Information ..................................................................... 16 Appendix A - References ....................................................................................... 17 Appendix C – Revision History ............................................................................... 19 3 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 3 Clearance No.: FTDI# 464 Hardware Description Please refer to section 3.2.2 for connector settings. Some VM810C jumpers must be set to work properly with your system. 3.1 VM810C board Figure 3-1 – VM810C board top view The VM810C module is intended for direct use into existing applications that require a display.This module is suitable for interfacing with an external microcontroller that has a SPI Master channel. The main functions of the VM810C are as follows:  Micro USB, SPI connector or 2-pin connector for power supply  3.3V regulator : Takes 5V input and outputs 3.3V for on-board circuits  WVGA(800x480) TFT LCD touch screen panel (for the VM810C50A-D module)  LCD backlight driver. On board back light driver has over voltage protection (OVP) of 34V, and drive current 32mA.  5V tolerant buffers between the SPI master interface and the Slave interface of the FT810 o SPI timing requirements can be referenced in the FT810 datasheet. The on board level converter buffers introduce additional delay. The actual maximum SPI clock frequency depends on the host system timing and connection cable length to the VM810C.  3 stage audio filter and power amplifier  8Ω speaker  Audio line out option 4 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 3.2 Physical Descriptions 3.2.1 PCB layout The VM810C is an 85.6mm x 54.1mm, four-layer printed circuit board. Board thickness is approximately 1.6mm. Figure 3-2 – VM810C board top layer Figure 3-3 – VM810C board bottom layer 5 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 3.2.2 VM810C Connectors Connectors and jumpers are described in the following sections.  CN1- 2-pin power connector 2 pin JST connector for 5V/3.3V power input to the board. Alternative to Micro USB connector.  Pin No. Name Type Description 1 VCC P 5V power supply 2 GND Table 3-1 – CN1 Pinout P Ground CN2- Micro USB Receptical This receptical is strictly for 5V input to power the board. There is no USB Functionality Pin No. Name Type 1 VBUS P 2 NC NA No connection 3 NC NA No connection 4 NC NA No connection 5 GND Table 3-2 – CN2 Pinout  Description 5V power supply P Ground J1- LCD Flex Cable connector This connector is the interface between the FT810 IC and the LCD Module. Signal Pin No Description LED K 1 LED- LED A 2 LED+ DISP 31 HSYNC 32 VSYNC 33 DCLK 30 LCD Pixel Clock DE 34 LCD Data Enable R2 7 Bit 2 of Red RGB signals R3 8 Bit 3 of Red RGB signals R4 9 Bit 4 of Red RGB signals R5 10 Bit 5 of Red RGB signals R6 11 Bit 6 of Red RGB signals R7 12 Bit 7 of Red RGB signals LCD Display Enable LCD Horizontal Sync LCD Vertical Sync 6 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225  Signal Pin No G2 15 Bit 2 of Green RGB signals G3 16 Bit 3 of Green RGB signals G4 17 Bit 4 of Green RGB signals G5 18 Bit 5 of Green RGB signals G6 19 Bit 6 of Green RGB signals G7 20 Bit 7 of Green RGB signals B2 23 Bit 2 of Blue RGB signals B3 24 Bit 3 of Blue RGB signals B4 25 Bit 4 of Blue RGB signals B5 26 Bit 5 of Blue RGB signals B6 27 Bit 6 of Blue RGB signals B7 28 Bit 7 of Blue RGB signals XP 37 touch panel X right YM 38 touch panel Y down XM 39 touch panel X left YP 40 touch panel Y up 3V3 4 GND 3,5,6,13,14,21,22,29,36 NC Table 3-3 – J1 Pinout 35 Clearance No.: FTDI# 464 Description 3V3 Power Ground No connect J2 - Selection between lineout or loop back into the power amplifier. Selection between audio lineout or loop back into the power amplifier. (Footprint only, JP2 next to J2 is connected by default for on board amplifier and on board mini speaker). If J2 is soldered and used for audio output selection, JP2 needs to be removed. Pin Name Description 1 Audio line out Use pin 1 and 3 for FT810 audio line out to external speaker 2 Audio line in Short pin1 and 2 to loopback FT810 audio into the on-board power amplifier 3 Audio GND Table 3-4 – J2 Pin Options  Audio GND J3 – SP+ Audio speaker +ve from the onboard amplifier.  J4 – SPAudio speaker -ve from the onboard amplifier.  J5- SPI Interface This is the interface where the SPI control and data signals are routed. There are also power and ground pins on this interface. Note J5 is not soldered on the VM810C board by default. 7 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Pin No. Name Type 1 SCLK I SPI Clock input 2 MOSI I Master Out Slave in 3 MISO O Master In Slave out 4 CS# I Chip select , active low 5 INT# OD 6 PD# I Active low power down input. 7 5V P 5V power supply 8 3.3V P 3.3V power supply 9 GND P Ground GND P Ground 10 Table 3-5 – J5 Pinout  Clearance No.: FTDI# Description Host interrupt open drain output, active low. On board 47kΩ pull-up to 3.3V. JP1- Audio Amplifier Power Select This jumper provides the option to select the power supply voltage for the onboard power amplifier. Pin No. Name 1-2 3V3 selected (default, recommended) 2-3 Table 3-6 – JP1 Pin options 5V selected *This needs to be configured before audio can be heard.  JP2 – On board amplifier enable Solder connection fitted by default.  JP3 - On board amplifier mute Solder connection not fited by default. Do not fit this solder connection.  SW1 – Power source select Pin No. Name 1-2 Power from CN1 2-3 Power from CN2 Table 3-7 – JP1 Pin options 8 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 4 Clearance No.: FTDI# Board Schematics 1 Figure 4-1 - FT810 and LCD circuit 9 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 47k 47k 47k R28 R29 R30 47k 47k R26 R27 3V3 47k 5V R25 3V3 J5 R19 R20 R21 R22 R23 R24 1 2 3 4 5 6 7 8 9 10 33R 33R 33R 33R 33R 33R SCK MOSI MISO CS# INT# PD# SCK MOSI MISO CS# INT# PD# C27 C28 C29 C30 C31 C32 6x10pF GND GND XL2 To bypass 3.3V regulator place jumper Shunt 0.1" on pins J5-7 and J5-8. VBUS SW1 SS-1290AP U7 AP1117E33G-13 3 Vin Vout 2 1 2 3 4 5 3V3 GND C24 19108 1 VBUS CN2 VBUS DD+ ID GND 5V CN1 1 2 0.1uF GND GND GND C25 C26 0.1uF 10uF GND GND R18 USB Micro-B 0R GND Figure 4-2 – SPI Interface Circuit AUD_3V3 AUDIO_L AUDIO_L R8 33R 5 U5 2 4 R9 R11 1k C13 4.7nF 3 AUD_3V3 C17 R10 1k OE 1 C16 1k C14 4.7nF AUDIO_L_out 0.47uF C15 4.7nF JP2 J2 AGND SN74LVC1G125DBVR 0.1uF AGND AGND AGND AGND R12 10k/1% JP3 AUD_3V3 R13 AUDIO_SHDN# AUDIO_SHDN# R16 33R 1 2 ININ+ JP3-Audio Amp. Mute Header 0.1" 20k/1% U6 4 3 JP2-Audio Amp. Enabled 1 2 3 AGND VDD VO+ VOSHDN GND BYPASS GND SP1 6 5 8 7 9 SP+ SP- J3 J4 1W/8Ohm TPA6205A1 R15 20k/1% R14 10k/1% R17 47k AGND 5V 3V3 XL1 Shunt 2.0mm C18 0.47uF AGND C20 C19 0.22uF AGND 1uF AGND AGND AUD_3V3 JP1 1 2 3 Jumper 2.0mm FB1 600R/1A FB2 C21 100uF C22 0.1uF C23 10nF 600R/1A GND AGND Max peak current ~400mA for 8-ohm speaker Figure 4-3 – Audio Circuit 10 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 5 Clearance No.: FTDI# 464 Hardware Setup Guide 5.1 Power Configuration There are 3 methods of powering the VM810C board. 1) USB Power(5V) - Connect USB power through micro-USB cable to CN2 2) DC IN(5V) - Connect 5V to CN1 3) J5 Power(5V) - Connect 5V to J5 pin 7 The following table summarise how to power the VM810C board using the various methods. Power Method CN2 CN1 J5 Pin 7 SW1 USB Power 5V N/C N/C Short pin 2-3 DC IN(5V) N/C 5V N/C Short pin 1-2 J5 Power(5V) N/C N/C 5V Any Position Table 5-1 – Board power configuration 5.2 MPSSE Setup To give a quick start with the VM810C development board, a Windows based Sample Application and demo applications are provided for users to experiment and experience the FT810 in the VM810C system. The following paragraphs provide a short description for development procedures. MPSSE is a “multi purpose synchronous serial engine” interface available in some FTDI device (e.g. FT2232D, FT232H, FT2232H anf FT4232H). This engine allows users to bridge from a USB port on a PC to an SPI interface. Sample code is available for driving the FT810 over this interface with a FT232H device that has been integrated into a cable. This device is available in the VA800A-SPI board, or C232HM- EDHSL-0(5V) cable or C232HM-DDHSL-0(3.3V) cable. VA800A-SPI is a MPSSE module accessory which can connect to the VM810C modules directly. Detailed information of VA800A-SPI can be found at: http://www.ftdichip.com/Support/Documents/DataSheets/Modules/DS_VA800A-SPI_MPSSE_Module.pdf. More information about MPSSE cables may be found at: http://www.ftdichip.com/Support/Documents/DataSheets/Cables/DS_C232HM_MPSSE_CABLE.pdf. In this section it is assumed the 5V version of the MPSSE cable (FTDI part no C232HM-EDHSL-0) is used. If the 3.3V version of the MPSSE cable (FTDI part no C232HM-DDHSL-0) is available, the setup is similar except for the power pin connection which requires an additional 5V power source to connect to CN2 or CN1. Refer to table 5-1 for board power configuration. 11 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 Figure 5-1 – VM810C connects to PC via VA800A-SPI or MPSSE cable. Hardware Setup VA800A-SPI  Solder a 10 position single row pin header to J5 footprint of the VM810C board  Connect VA800A-SPI to the VM810C module in the correct orientation(pin1 to pin1 aligned).  Connect USB cable (e.g. FTDI accessory VA-FC-1M-BKW or VA-FC-1M-BLW) from the VA800ASPI to the PC USB host port.  VA800A-SPI will supply power to VM810C after MPSSE driver is properly loaded and the USB host completed USB device configuration. Hardware Setup MPSSE Cable  Solder a 10 position single row pin header to J5 footprint of the VM810C board  Connect MPSSE leads to VM810C board’s J5( SPI interface) in accordance with Table 5-2  Plug MPSSE cable to PC USB host port Software Setup  Download PC based MPSSE software libraries. MPSSE cable and driver information can be found at http://www.ftdichip.com/Products/Cables/USBMPSSE.htm.  Launch the Sample Application based on MPSSE from the PC  For more information on utilizing the VM810C development system with the MPSSE cable and Sample Application, refer to AN_245. Note the procedure is the same as for previous generation VM800C modules. 12 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# Further documentation associated with the VM810C development system and design flow at following link: http://www.ftdichip.com/Products/Modules/VM810C.html 464 can be found The FT81x Programming Guide describes the programming code and formats used by the FT810. The Sample Application is a well-formatted, and documented program that illustrates the Programming Guide, and provides numerous design examples and reference code demonstrations. J5 Pin number J5 Signal MPSSE pin number MPSSE Signal MPSSE Lead Color 1 SCK 2 SK ORANGE 2 MOSI 3 DO YELLOW 3 MISO 4 DI GREEN 4 CS# 5 CS BROWN 5 INT# 7 GPIOL1 PURPLE 6 PD# 9 GPIOL3 BLUE 7 5V 1 VCC RED 8 3.3V - - - 9 GND 10 GND Black 10 GND - - - Table 5-2 – MPSSE cable (C232HM-EDHSL-0) connection 13 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 6 Clearance No.: FTDI# Mechanical Dimensions Figure 6-1 – PCB mechanical dimensions Figure 6-2 – 5” WVGA LCD dimensions 14 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 7 Clearance No.: FTDI# Specifications 7.1 Optical Specification Table 7-1 – 5” TFT Optiocal Specification 15 Copyright © 2015 Future Technology Devices International Limited 464 VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 8 Clearance No.: FTDI# 464 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) sales1@ftdichip.com support1@ftdichip.com admin1@ftdichip.com us.sales@ftdichip.com us.support@ftdichip.com us.admin@ftdichip.com Branch Office – Taipei, Taiwan Branch Office – Shanghai, China 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 Room 1103, No. 666 West Huaihai Road, Changning District, Shanghai, 200052 China Tel: +86 (0)21 6235 1596 Fax: +86 (0)21 6235 1595 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-mail (Sales) E-mail (Support) E-mail (General Enquiries) tw.sales1@ftdichip.com tw.support1@ftdichip.com tw.admin1@ftdichip.com cn.sales@ftdichip.com cn.support@ftdichip.com cn.admin@ftdichip.com Web Site http://ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640 16 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 Appendix A - References For module documentations, please refer to URL below: http://www.ftdichip.com/Products/Modules/VM810C.html FT810 datasheet: DS_FT81x FT810 software programming guide: FT81x_Programmer_Guide C232HM-DDHSL-0 datasheet: http://www.ftdichip.com/Support/Documents/DataSheets/Cables/DS_C232HM_MPSSE_CABLE.pdf D2xx Programmers Guide: http://www.ftdichip.com/Support/Documents/ProgramGuides/D2XX_Programmer's_Guide(FT_000071).p df AN_108: Command Processor for MPSSE and MCU Host Bus Emulation Modes 8.1.1.1.1.1.1.1.1 http://www.ftdichip.com/Support/Documents/AppNotes/AN_108_Command_ Processor_for_MPSSE_and_MCU_Host_Bus_Emulation_Modes.pdf 17 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# 464 Appendix B - List of Figures and Tables List of Figures Figure 3-1 – VM810C board top view ............................................................................................................. 4 Figure 3-2 – VM810C board top layer ............................................................................................................ 5 Figure 3-3 – VM810C board bottom layer ...................................................................................................... 5 Figure 4-1 - FT810 and LCD circuit ................................................................................................................ 9 Figure 4-2 – SPI Interface Circuit ................................................................................................................. 10 Figure 4-3 – Audio Circuit ............................................................................................................................. 10 Figure 5-1 – VM810C connects to PC via VA800A-SPI or MPSSE cable. ................................................. 12 Figure 6-1 – PCB mechanical dimensions .................................................................................................. 14 Figure 6-2 – 5” WVGA LCD dimensions ...................................................................................................... 14 List of Tables Table 2-1 – Ordering information ................................................................................................................... 2 Table 3-2 – CN1 Pinout .................................................................................................................................... 6 Table 3-3 – CN2 Pinout .................................................................................................................................... 6 Table 3-4 – J1 Pinout ....................................................................................................................................... 7 Table 3-5 – J2 Pin Options .............................................................................................................................. 7 Table 3-6 – J5 Pinout ....................................................................................................................................... 8 Table 3-7 – JP1 Pin options ............................................................................................................................ 8 Table 3-8 – JP1 Pin options ............................................................................................................................ 8 Table 5-1 – Board power configuration ....................................................................................................... 11 Table 5-2 – MPSSE cable (C232HM-EDHSL-0) connection........................................................................ 13 Table 7-3 – 5” TFT Optiocal Specification ................................................................................................... 15 18 Copyright © 2015 Future Technology Devices International Limited VM810C EVE2 Credit Card Module Version 1.0 Document Reference No.: FT_001225 Clearance No.: FTDI# Appendix C – Revision History Document Title: DS_VM810C Document Reference No.: FT_001225 Clearance No.: FTDI# 464 Product Page: http://www.ftdichip.com/eve.htm Document Feedback: Send Feedback Version 1.0 Initial Datasheet relased 14 Sept 2015 19 Copyright © 2015 Future Technology Devices International Limited 464
VM810C50A-N 价格&库存

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VM810C50A-N
  •  国内价格 香港价格
  • 1+427.548341+53.03718
  • 10+348.7203810+43.25860
  • 100+311.33456100+38.62091

库存:13

VM810C50A-N
    •  国内价格
    • 1+315.97665
    • 5+303.33425

    库存:16