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G400D-SM-400

G400D-SM-400

  • 厂商:

    GHIELECTRONICS,LLC

  • 封装:

  • 描述:

    G400-D .NET 嵌入式模块 ARM926EJ-S 400MHz 32KB(内部),128MB(外部) 4MB(外部)

  • 数据手册
  • 价格&库存
G400D-SM-400 数据手册
GHI Electronics, LLC 501 E. Whitcomb Ave. Madison Heights, Michigan 48071 Phone: (248) 397-8856 Fax: (248) 397-8890 www.ghielectronics.com G400S and G400D SoM Datasheet G400S SoM G400D SoM Where Hardware Meets Software GHI Electronics, LLC 1 2 3 4 5 6 7 8 9 Introduction G400S and G400D SoM Datasheet Contents Introduction ..........................................................................................................................................................4 2.1 G400S vs G400D ...........................................................................................................................................4 2.2 Key Features .................................................................................................................................................5 2.3 Example Applications ...................................................................................................................................5 The .NET Micro Framework ..................................................................................................................................6 3.1 GHI Electronics and NETMF..........................................................................................................................6 Pinout Tables ........................................................................................................................................................7 4.1 G400S Pinout ................................................................................................................................................7 4.2 G400D Pinout ...............................................................................................................................................8 Reference Design ..................................................................................................................................................9 Device Startup .....................................................................................................................................................10 Libraries ..............................................................................................................................................................11 7.1 General Purpose Input and Output (GPIO) ................................................................................................11 7.2 Analog Input ...............................................................................................................................................11 7.3 Pulse Width Modulation (PWM) ................................................................................................................11 7.4 Signal Generator ........................................................................................................................................11 7.5 Signal Capture ............................................................................................................................................11 7.6 Pulse Feedback ...........................................................................................................................................11 7.7 Universal Asynchronous Receiver Transmitter (UART) ..............................................................................12 7.8 Serial Peripheral Interface (SPI) .................................................................................................................12 7.9 Inter-Integrated Circuit (I2C) ......................................................................................................................12 7.10 Controller Area Network (CAN) ..................................................................................................................12 7.11 1-Wire ........................................................................................................................................................12 7.12 Graphics .....................................................................................................................................................12 7.13 Touch Screen ..............................................................................................................................................13 7.14 USB Host .....................................................................................................................................................13 7.15 USB Client ...................................................................................................................................................13 7.16 File System .................................................................................................................................................13 7.17 Networking .................................................................................................................................................13 7.17.1 Ethernet .............................................................................................................................................13 7.17.2 Wi-Fi ..................................................................................................................................................13 7.17.3 Point to Point.....................................................................................................................................13 7.18 Extended Weak References .......................................................................................................................14 7.19 Configuration .............................................................................................................................................14 7.20 Real Time Clock ..........................................................................................................................................14 7.21 Watchdog ...................................................................................................................................................14 7.22 Power Control ............................................................................................................................................14 7.23 In-Field Update ...........................................................................................................................................14 7.24 SQLite Database .........................................................................................................................................14 7.25 Direct Memory Access ...............................................................................................................................14 7.26 Battery RAM ...............................................................................................................................................15 7.27 Runtime Loadable Procedures ...................................................................................................................15 Design Considerations ........................................................................................................................................16 8.1 Required Pins .............................................................................................................................................16 8.2 Power Supply .............................................................................................................................................16 8.3 Crystals .......................................................................................................................................................16 8.4 SPI Channels ...............................................................................................................................................16 8.5 Ethernet .....................................................................................................................................................16 8.6 Direct Memory Access ...............................................................................................................................16 Footprints............................................................................................................................................................17 9.1 G400S Recommended Footprint ................................................................................................................17 Rev 1.1 2 www.ghielectronics.com GHI Electronics, LLC Introduction G400S and G400D SoM Datasheet 9.2 G400D Recommended Footprint ...............................................................................................................17 10 Soldering the G400S............................................................................................................................................18 10.1 Oven Reflow ...............................................................................................................................................18 11 Legal Notice ........................................................................................................................................................19 11.1 Licensing .....................................................................................................................................................19 11.2 Trademarks ................................................................................................................................................19 11.3 Disclaimer ...................................................................................................................................................19 12 Revision History ..................................................................................................................................................20 Rev 1.1 3 www.ghielectronics.com GHI Electronics, LLC 2 Introduction G400S and G400D SoM Datasheet Introduction The G400 SoMs are powerful, low-cost, surface-mount System on Modules (SoM) running Microsoft's .NET Micro Framework. The .NET Micro Framework enables the SoM to be programmed from Microsoft Visual Studio using a USB or serial cable. Programming in a modern managed language, such as C# or Visual Basic, allows developers to accomplish more work in less time by taking advantage of the extensive built-in libraries for networking, file systems, graphical interfaces, and more. A simple two-layer circuit board with a power source and a few connectors can utilize the G400 SoMs to bring the latest technologies to any product. There are no additional licensing or other fees and all the development tools are provided freely. Throughout this document, the G400S SoM and the G400D SoM will be referred to as the G400S and G400D, respectively. When only G400 is listed, the information applies to both the G400S and the G400D unless specified otherwise. For more information and support, please see https://www.ghielectronics.com/support/netmf and the product catalog entry. For advanced electrical characteristics and details on the underlying SAM9X35 processor, please consult the processor’s datasheet. 2.1 G400S vs G400D The G400 comes in a standard and an extended format. They are not pinout compatible. The below table lists the differences. G400S G400D Package 120 pin surface-mount module (SMT) 200 pin SODIMM module Dimensions 48.3 x 33.1 x 4.6 mm 67.6 x 31.8 x 4.1 mm GPIO 89 102 Analog Input 12 Ethernet ENC28J60 over SPI 8 ENC28J60 over SPI and/or Built in base 100 Ethernet PHY Rev 1.1 4 www.ghielectronics.com GHI Electronics, LLC 2.2 Introduction G400S and G400D SoM Datasheet Key Features                      2.3   .NET Micro Framework RoHS Lead Free 400 MHz ARM 9 Atmel SAM9X35 64 Mbytes available RAM 1.4 Mbytes available flash Embedded LCD controller 89 to 102 interrupt capable GPIO 2 SPI 1 I2C 6 UART 2 CAN 4 PWM 8 to 12 10-bit analog input 4-bit SD/MMC memory card interface Low power modes -40°C to +85°C operational RTC Watchdog Threading USB host USB client     SQLite database TCP/IP with SSL o Full .NET socket interface o Ethernet o Wi-Fi o PPP Graphics o Images o Fonts o Controls File System o Full .NET file interface o SD cards o USB drives Native extensions o Runtime Loadable Procedures o Device register access Signal controls o Generation o Capture o Pulse measurement Example Applications         Vending machines POS Terminals Measurement tools and testers Networked sensors Robotics Central alarm system Smart appliances Industrial automation devices Rev 1.1 5 www.ghielectronics.com GHI Electronics, LLC 3 The .NET Micro Framework G400S and G400D SoM Datasheet The .NET Micro Framework Inspired by the full .NET Framework, Microsoft developed a lightweight version called .NET Micro Framework (NETMF). NETMF focuses on the specific requirements of resource-constrained embedded systems. Development, debugging, and deployment are all conveniently performed using Microsoft's powerful Visual Studio through a standard USB or serial cable. Programming is done in C# or Visual Basic with libraries that cover sockets, memory management with garbage collection, advanced file system support, multitasking services, and many others. In addition to supporting many standard .NET features, NETMF has additional embedded extensions supporting microcontroller specific needs such as PWM outputs and analog inputs. 3.1 GHI Electronics and NETMF Since signing the partnership agreement with Microsoft in 2008, GHI Electronics has become the leading Microsoft partner on NETMF through its work on integrating and extending the NETMF core. GHI Electronics's NETMF products are extended with important features extending the NETMF libraries such as databases, USB Host, Wi-Fi, and native programming. Rev 1.1 6 www.ghielectronics.com GHI Electronics, LLC 4 Pinout Tables G400S and G400D SoM Datasheet Pinout Tables Many signals on the G400 are multiplexed to offer multiple functions on a single pin. Developers can decide on the pin functionality to be used through the provided libraries. Any pin with no name, function, or note must be left unconnected. 4.1 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 G400S Pinout Name PD0 PD4 PA27 PA16 PA8 PA3 PA2 PC28 PC23 PC5 PC1 Function SD CMD COM4 RX COM2 CTS COM2 RTS LCD HS LCD G0 LCD B1 1.8 V GND PB3 PB1 PB18 PB8 PB14 PB12 PB6 PB15 PB0 PB5 PC2 PC9 PC11 PC12 PC24 PA0 PC21 PC19 PC22 PA7 PA4 PB11 PB13 ADC9 ADC3 ADC1 TOUCH YU ADC7 ADC4 LCD B2 LCD G4 COM5 RX LCD R0 LCD R1 COM2 TX PWM3 PWM1 COM4 TX LDR1 ADC0 ADC2 TOUCH XL Pin 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Name PB10 Function ADC11 3.3 V VBAT ADC8 PB7 PB2 PC0 PC6 LCD B0 LCD G1 1.8 V LCD G5 LCD B3 LCD R4 PWM0 1.0 V LCD R2 PC10 PC3 PC15 PC18 PC13 PC31 GND PC26 PC30 PB16 PB17 PB9 PB4 PC4 PC7 PC8 PC14 PC16 PC20 PC17 PC27 PC29 PA5 PA1 PA10 PA9 PA15 PA18 PA20 LCD CLK SPI1 MOSI ADC5 ADC6 ADC10 LCD B4 LCD G2 LCD G3 COM5 TX LCD R3 COM6 TX PWM2 COM6 RX LCD VS LCD OE COM3 TX CAN2 TD COM2 RX SPI1 MISO COM1 TX CAN1 TD COM1 RX CAN1 RD SD D0 SD D1 SD D3 Pin 81 82 831 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 1101 111 112 113 114 115 116 117 118 119 120 Name PA23 PA28 PA31 Function SPI2 SCK I2C SCL 3.3 V USBC D+ USBC DUSBH0 D+ USBH0 DUSBH1 D+ USBH1 DRESET PA19 PA21 PA24 PA25 GND SPI1 SCK SD D2 SPI2 MISO LDR0 MODE 1.0 V PA6 PA17 PA22 PA26 PA30 PA29 COM3 RX CAN2 RD SD CLK SPI2 MOSI PD2 PD1 PD7 PD3 PD5 PD6 TOUCH XR TOUCH YD I2C SDA GND 1 Open drain requiring a 2.2 kΩ pull-up resistor Rev 1.1 7 www.ghielectronics.com GHI Electronics, LLC 4.2 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Name Pinout Tables G400S and G400D SoM Datasheet G400D Pinout Function GND ETH PHY TXETH PHY TX+ GND ETH PHY RXETH PHY RX+ ETH PHY SPEED ETH PHY LINK GND 3.3 V GND 3.3 V GND GND 3.3 V Pin 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 Name Function GND PD18 PD17 PD16 3.3 V PD15 PD14 PD13 PD12 GND PD11 PD10 PD9 PD8 3.3 V GND 3.3 V PB8 PD2 PC23 PD0 ADC9 TOUCH XR GND PB18 PB11 PA5 PA6 PC22 ADC0 COM3 TX CAN2 TD COM3 RX CAN2 RD Pin 101 102 103 104 105 106 107 108 109 110 111 112 113 114 1151 1161 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 Name PC31 PA0 PA1 PB12 PC18 PB17 PA4 PC19 PB16 PA30 PA31 PA9 PA10 PC24 PA2 PA3 PD7 PA15 PA16 PA17 PA18 PA19 PA20 PC21 PC26 PC20 PA24 PA25 PA26 PA27 PA28 PA29 PC16 PC17 PC27 PC28 PC30 PC29 PD3 PD4 PD5 PD6 Function COM2 TX COM2 RX ADC1 TOUCH YU PWM0 3.3 V SPI1 MISO SPI1 MOSI SPI1 SCK ADC6 LDR1 PWM1 GND ADC5 I2C SDA I2C SCL COM1 RX CAN1 RD COM1 TX CAN1 TD COM2 RTS COM2 CTS SD D0 3.3 V SD CMD SD CLK SD D1 SD D2 SD D3 PWM3 GND PWM2 LDR0 MODE COM6 TX COM6 RX 3.3 V LCD VS LCD HS LCD CLK LCD OE Pin 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 Name PC10 PC11 PC12 PC13 PC14 PA23 PA21 Function GND LCD B0 LCD B1 LCD B2 LCD B3 LCD B4 ADC2 TOUCH XL ADC3 ADC4 3.3 V LCD G0 LCD G1 LCD G2 LCD G3 COM5 TX LCD G4 COM5 RX TOUCH YD COM4 RX LCD R4 GND LCD G5 LCD R0 LCD R1 LCD R2 LCD R3 SPI2 CLK SPI2 MISO PA22 SPI2 MOSI PC0 PC1 PC2 PC3 PC4 PB13 PB14 PB15 PC5 PC6 PC7 PC8 PC9 PD1 PA8 PC15 3.3 V USBH1 D+ VBAT USBH1 DGND GND RESET USBH0 D+ USBH0 D3.3 V USBC D+ USBC DGND PA7 1 Open drain requiring a 2.2 kΩ pull-up resistor Rev 1.1 8 www.ghielectronics.com COM4 TX GHI Electronics, LLC 5 Reference Design G400S and G400D SoM Datasheet Reference Design The G400D Dev Board is an excellent starting point and reference design for anyone interested in evaluating and developing with the G400. See the product catalog entry for more information and additional resources. Rev 1.1 9 www.ghielectronics.com GHI Electronics, LLC 6 Device Startup G400S and G400D SoM Datasheet Device Startup The G400 is held in reset when the reset pin is low. Releasing it will begin the system startup process. It is pulled high internally. There are four different components of the device firmware: 1. 2. 3. 4. GHI Bootloader: initializes the system, updates TinyBooter when needed, and executes TinyBooter. TinyBooter: executes TinyCLR, updates TinyCLR when needed, and updates the system configuration. TinyCLR: loads, debugs, and executes the managed application. Managed application: the program developed by the customer. Which components get executed on startup can be control by manipulating the LDR0 and LDR1 pins. LDR0 and LDR1 are pulled high on startup. LDR0 LDR1 Effect Ignored High Execute the managed application. High Low Wait in TinyBooter Low Low Wait in GHI Bootloader Additionally, the communications interface between the host PC and the G400 is selected on startup through the MODE pin, which is pulled high on startup. The USB interface is selected when MODE is high and COM1 is selected when MODE is low. The above discussed functions of LDR0, LDR1, and MODE are only during startup. After startup, they return to the default GPIO state and are available to use as GPIO in the user application. Rev 1.1 10 www.ghielectronics.com GHI Electronics, LLC 7 Libraries G400S and G400D SoM Datasheet Libraries Similar to the full .NET Framework, NETMF includes many built in libraries to help in modern application development with additional libraries to support embedded systems. Please see https://www.ghielectronics.com/support/netmf for more information. 7.1 General Purpose Input and Output (GPIO) GPIOs can read and write logical high and low signals. Keep the following in mind:       7.2 They default to inputs with internal weak pull-up resistors They operate on 3.3 V logic levels. They are not 5 V tolerant. They have controllable pull up and pull down resistors. All pins are interrupt capable. See the processor’s documentation for information on sourcing and sinking current. Analog Input Analog inputs can read voltages from 0 V to 3.3 V with 10-bit resolution. The built in analog circuitry uses the source voltage as a reference which can cause some noise on the analog signal. High accuracy ADCs with a dedicated reference can be added externally. 7.3 Pulse Width Modulation (PWM) PWM is used to create a waveform with a specified frequency and duty cycle. It uses built-in hardware so no processing resources are needed to keep it running. Frequencies can range from 2 Hz to 24 MHz. 7.4 Signal Generator Signal Generator is used to generate a waveform on any GPIO with varying frequency and duty cycle. The feature is software driven and can generate frequencies up to 200 kHz ±10%. More processing time is required for higher frequencies. 7.5 Signal Capture Signal Capture monitors any GPIO pin and records the time from the last change. This feature is software driven and can measure frequencies up to 400 kHz ±10%. Lower frequencies have higher accuracy. 7.6 Pulse Feedback Pulse Feedback is used for sensing capacitance on any GPIO input and measuring pulses from ultrasonic distance and other sensors. When used for sensing capacitance, a 100 pF capacitor and 1 MΩ resistor between the pad and ground are recommended. Rev 1.1 11 www.ghielectronics.com GHI Electronics, LLC 7.7 Libraries G400S and G400D SoM Datasheet Universal Asynchronous Receiver Transmitter (UART) UART is a common, full duplex, communications interface. Baud rates from 2,400 to 1,500,000 are supported. Handshaking is supported on COM2 only. Data bits between 5 and 8 are supported. Stop bits of 1, 1.5, and 2 are supported. Space, mark, even, and odd parities are supported. 7.8 Serial Peripheral Interface (SPI) SPI is a common three or four wire serial interface. The G400 can act as a SPI bus master only. The maximum supported clock is 66.6 MHz and all four SPI modes are supported. The SPI bus is designed to interface with multiple SPI slave devices. The active slave is selected by asserting the chip select line on the slave device. SPI1 is shared internally with the flash memory on the G400. Use of a chip select with devices on this channel is required or the G400 will not function properly. The use of another SPI channel is recommended. 7.9 Inter-Integrated Circuit (I2C) I2C is a two-wire addressable serial interface. The G400 can act as an I2C bus master only with 7-bit slave addresses. It can connect to one or more slave devices over the same connection with a maximum clock of 400 kHz. The I2C bus interface requires pull up resistors to be added on both the SCL and SDA pins, usually 2.2 kΩ. It is possible to simulate an independent I2C bus on any two GPIO pins with the appropriate resistors though the software I2C class, but performance will be lower. 7.10 Controller Area Network (CAN) CAN is a common interface in industrial control and the automotive industry. CAN on the G400 is compliant with the CAN 2.0B specifications. Bitrates up to 1 Mbit/s are supported. For systems with higher traffic, different message filter options are available. 7.11 1-Wire Through 1-Wire, a master can communicate with multiple 1-Wire slaves using any GPIO. 7.12 Graphics The G400 supports 16-bit color TFT displays up to 800x600. Displays require the horizontal sync, vertical sync, clock, enable, and the 16 color lines. The color format is 565 (5 bits for red, 6 bits for green, and 5 bits for blue). If the display has more than 16 color lines, connect the most significant color lines to the G400 and the remaining lines to ground. While SPI displays can be utilized as well, the native TFT interface is recommended as it allows for a faster update rate. NETMF includes support for drawing though the bitmap object. TrueType font files can be used once converted to the TinyFont format used by NETMF. Rev 1.1 12 www.ghielectronics.com GHI Electronics, LLC Libraries G400S and G400D SoM Datasheet 7.13 Touch Screen The G400 supports displays with four-wire restive touch without the need for any additional hardware, though using an external controller is possible. The default touch pins can be remapped if required. Capacitive touch displays can be used through the I2C interface. 7.14 USB Host USB host allows the use of USB mass storage devices, joysticks, keyboards, and mice. Additionally, for USB devices that do not have a standard class included, low level USB access is provided for bulk transfers. USB hubs are supported allowing multiple devices to be connected. 7.15 USB Client The USB client interface is typically used as the G400 debug interface and for application deployment through Visual Studio. However, it is controllable and may be used to simulate other USB devices such as mice, keyboards, and Communications Device Class (CDC) interfaces using low level access instead of the debug interface. 7.16 File System The G400 supports accessing files on SD cards and USB memory devices formatted as FAT16 or FAT32. SD cards use a true 4-bit interface. SD/SDHC/SDXC cards in full, mini, and micro formats and any USB device with mass storage class are supported. Access speeds are dependent on many different factors and can be up to 500 Kbyte/s. 7.17 Networking The G400 supports Ethernet, Wi-Fi, and PPP through the built in LwIP stack. The full stack includes TCP, UDP, DHCP, DNS, HTTP, FTP, and others. Secure connections can be created using the built in SSL stack. 7.17.1 Ethernet Ethernet support is available using the built-in NETMF TCP/IP and SSL stack through the on-board base-100 Ethernet PHY on the G400D and through an external ENC28J60 SPI Ethernet chip on both the G400S and the G400D. 7.17.2 Wi-Fi Any Wi-Fi module with a built-in TCP/IP stack can be used with the G400. However, these modules are typically limited. Through the supported Redpine RS9110-N-11-22-04 and RS9110-N-11-22-05 chips, Wi-Fi is usable with the built-in NETMF TCP/IP and SSL stacks. 7.17.3 Point to Point The Point to Point (PPP) protocol is often used for devices needing to connect to mobile networks. While typical embedded devices use the mobile modem's built-in and very limited TCP/IP stack, systems using the G400 can use these modems with the internal NETMF TCP/IP and SSL stack. Rev 1.1 13 www.ghielectronics.com GHI Electronics, LLC Libraries G400S and G400D SoM Datasheet 7.18 Extended Weak References Extended Weak References are a way for managed applications to store data in non-volatile memory. This is meant to be used as a configuration store that does not change frequently where the data can be recreated if needed. There are 128 KBytes available for use. 7.19 Configuration Access to the configuration sector of the device is provided for storage of small, infrequently changing, entries. The data will be lost if the configuration is reflashed. Space is limited and varies based on other information stored in the configuration. 7.20 Real Time Clock The real time clock (RTC) is used to keep time while the processor is off, drawing its power from a backup battery or super capacitor providing 1.65 V to 3.6 V. The required circuitry and crystal are included. 7.21 Watchdog Watchdog is used to reset the system if it enters an erroneous state. The G400 supports timeouts between 1 ms and 15,995 ms. Watchdog support is included through the GHI Electronics libraries replacing the built in NETMF version. 7.22 Power Control The G400 supports entering sleep, deep sleep, and off modes in order to reduce power usage. It can consume as little as 56 mA in sleep, 27 mA in deep sleep, and 20 mA in off. It may be woken from an RTC alarm or a GPIO interrupt. Sleep pauses execution of the program. Deep sleep pauses execution of the program and shuts down many internal functions. Off shuts down all internal functions and can only be woken by the RTC alarm or a system reset. The system will be automatically reset when exiting off mode. 7.23 In-Field Update Through In-Field Update, the G400 can update its firmware and managed application. The update can come from the network, a bus, or connected media. 7.24 SQLite Database SQLite can be used to created databases that can be stored in memory or on a supported storage device such as a USB drive or SD card. 7.25 Direct Memory Access Low level device registers and memory can be accessed to further configure the G400’s underlying processor. Not all functionality of the processor is available as some functions may be used or configured internally for use in NETMF. Rev 1.1 14 www.ghielectronics.com GHI Electronics, LLC Libraries G400S and G400D SoM Datasheet 7.26 Battery RAM Battery-backed RAM is provided as part of the internal RTC. This memory retains its contents when the power is lost as long as there is a backup battery. There are 16 bytes of battery backed RAM available. Consult the processor's documentation for details on use. 7.27 Runtime Loadable Procedure s Similar to code loaded from a DLL, Runtime Loadable Procedures (RLP) allows a binary or ELF image to be loaded into memory and executed on the device. This is useful for advanced and critical performance scenarios. The RLP region starts at address 0xA0000000 and is 0x16FFFFC bytes in size. Your compiled images must fall completely within that range. Rev 1.1 15 www.ghielectronics.com GHI Electronics, LLC 8 Design Considerations G400S and G400D SoM Datasheet Design Considerations 8.1 Required Pins Exposing the following pins is required in every design to enable device programming, updates, and recovery:      8.2 LDR0 LDR1 Desired debug interface(s) MODE if required to select a debug interface SPI1 MISO to update TinyBooter in SDK 2015 R1 and earlier and to install the GHI Bootloader once for SDK 2016 R1 and later Power Supply A typical clean power source, suited for digital circuitry, is needed to power the G400. Voltages should be within at least 10% of the needed voltage. Decoupling capacitors of 0.1 μF are needed near every power pin. Additionally, a large capacitor, typically 47 μF, should be near the G400 if the power supply is more than few inches away. Additionally, the G400 requires additional voltages beyond the typical 3.3 V to function properly. See the pinout table for details. 8.3 Crystals The G400 includes the needed system and RTC crystals and their associated circuitry. 8.4 SPI Channels SPI1 is shared internally with the flash memory on the G400. Use of a chip select with devices on this channel is required or the G400 will not function properly. The use of another SPI channel is recommended. 8.5 Ethernet The built in Ethernet available on the G400D includes all needed Ethernet circuitry internally. However, an appropriate magnet and connector, like the J0011D or similar, are required. 8.6 Direct Memory Access Most of the core processor’s resources are used by NETMF. Some resources are permanently used, like the main system timer while others are used when specific features, like the timers for PWM, are enabled. Used resources can change from one firmware version to another so care must be taken when using these resources through RLP or other direct memory access methods. When absolutely required, applications can use resources in conjunction with NETMF. For example, creating a special baud rate, utilizing the timer capture feature, and making use of many other features supported by the processor. Please contact GHI Electronics’s consulting services to determine exactly what resources are available and if the G400 can fulfill the specific requirements. Rev 1.1 16 www.ghielectronics.com GHI Electronics, LLC 9 Footprints G400S and G400D SoM Datasheet Footprints We recommend no traces or vias under the module. Dimensions are in inches. 9.1 G400S Recommended Footprint 9.2 G400D Recommended Footprint The G400D uses a standard SODIMM 200 form factor. We recommend the use of TE Connectivity AMP Connectors’s connector with part number 1565917-4. Rev 1.1 17 www.ghielectronics.com GHI Electronics, LLC Soldering the G400S G400S and G400D SoM Datasheet 10 Soldering the G400S The G400S is designed to be easily machine-placed or hand-soldered. Static sensitive precautions should be taken when handling the module. 10.1 Oven Reflow The G400S is not sealed for moisture. Baking the module before reflow is recommended and required in a humid environment. The process of reflow can damage the G400 if the temperature is too high or exposure is too long. The lead-free reflow profile used by GHI Electronics is shown below. The profiles shown are based on SAC 305 solder (3% silver, 0.5% copper). The thermal mass of the assembled board and the sensitivity of the components on it affect the total dwell time. Differences in the two profiles are where they reach their respective peak temperatures as well as the time above liquids (TAL). The shorter profile applies to smaller assemblies, whereas the longer profile applies to larger assemblies such as back-planes or high-density boards. The process window is described by the shaded area. These profiles are only starting-points and general guidance. The particulars of an oven and the assembly will determine the final process. Rev 1.1 18 www.ghielectronics.com GHI Electronics, LLC Legal Notice G400S and G400D SoM Datasheet 11 Legal Notice 11.1 Licensing The G400S SoM and G400D SoM, with all their built-in software components, are licensed for commercial and noncommercial use. No additional fee or licensing is required. Software, firmware, and libraries provided for the G400S SoM and the G400D SoM are licensed to be used on the G400S SoM and the G400D SoM only. 11.2 Trademarks G400S and G400D are trademarks of GHI Electronics, LLC. .NET Micro Framework and Visual Studio are registered or unregistered trademarks of Microsoft Corporation. Other registered or unregistered trademarks are owned by their respective companies. 11.3 Disclaimer IN NO EVENT SHALL GHI ELECTRONICS, LLC BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS PRODUCT, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. GHI ELECTRONICS, LLC LINE OF PRODUCTS ARE NOT DESIGNED FOR LIFE SUPPORT APPLICATIONS. SPECIFICATIONS AND AVAILABILITY ARE SUBJECT TO CHANGE WITHOUT ANY NOTICE. Rev 1.1 19 www.ghielectronics.com GHI Electronics, LLC Revision History G400S and G400D SoM Datasheet 12 Revision History Revision Date Change 1.1 2017-01-17 Clarified TinyBooter update pin 1.0 2015-11-12 Initial release. Rev 1.1 20 www.ghielectronics.com
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G400D-SM-400
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