0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
S14OB381-057

S14OB381-057

  • 厂商:

    GOERTEK(歌尔)

  • 封装:

  • 描述:

    100 Hz ~ 10 kHz 模拟 麦克风 MEMS(硅) 2.3 V ~ 3.6 V 全向 (-38dB ±1dB @ 94dB SPL) 焊盘

  • 数据手册
  • 价格&库存
S14OB381-057 数据手册
Confidential Degree : Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : Goermicro Model : S14OB381-057 10644 ISO/TS16949:2009 013 013 2551 2728 ISO14001:2004 ISO9001:2008 Version: 4.0 Tel : + 86 536 3051234 E- Mail : goermicro@goermicro.com Website: http://www.goermicro.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C. Confidential in Goermicro, shall not be spread if not be privileged. page 1/14 Confidential Degree : Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of Goermicro Inc. and should not be disclosed to any third party without the written consent of Goermicro Inc. 2 Publication History Version Description Date Author Approved 1.0 New Design 2021.03.15 Aaron Roy 2.0 Update THD performance in Section 3 2021.07.28 Update Tape Drawing in Section 9 Zamp Roy 3.0 Update THD performance in Section 3 2021.08.19 Pauline Roy Enoch Roy 4.0 Version: 4.0 Update the Logo to Goermicro 2021.08.25 Confidential in Goermicro, shall not be spread if not be privileged. page 2/14 Confidential Degree : Confidential Contents 1 2 3 4 5 6 7 Introduction Test Condition Electrical Characteristics Frequency Response Curve Measurement Circuit Test Setup Drawing Mechanical Characteristics 4 4 4 4 5 5 6 7.1 Appearance Drawing 6 7.2 Weight 6 8 Reliability Test 7 8.1 Vibration Test 7 8.2 Drop Test 7 8.3 Temperature Test 7 8.4 Humidity Test 7 8.5 Mechanical Shock Test 7 8.6 Thermal Shock Test 7 8.7 Reflow Test 7 8.8 Electrostatic Discharge Test 7 9 Package 8 9.1 Tape Specification 8 9.2 Reel Dimension 9 9.3 The Content of Box 9 9.4 Packing Explain 10 10 Storage and Transportation 11 Land Pattern Recommendation 10 11 11.1 The Pattern of MIC Pad 11 11.2 Recommended Soldering Surface Land Pattern 11 12 Soldering Recommendation 12 12.1 Soldering Machine Condition 12 12.2 The Drawing and Dimension of Nozzle 12 12.3 Reflow Profile 13 13 Cautions 14 13.1 Board Wash Restrictions 14 13.2 Nozzle Restrictions 14 13.3 Blowing Restrictions 14 13.4 Ultrasonic Restrictions 14 13.5 Case Adaption to Pressure Restrictions 14 14 Output Inspection Standard Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. 14 page 3/14 Confidential Degree : Confidential 1 Introduction: MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, laptop computers, and other portable electronic devices etc. 2 Test Condition (Vs=2.7V,L=50cm) StandardConditions (As IEC 60268-4) Temperature Environment Conditions +15°C~+35°C 25%R.H.~75%R.H. 86kPa~106kPa Basic Test Conditions +20°C±2°C 60%R.H.~70%R.H. 86kPa~106kPa Air pressure Humidity 3 Electrical Characteristics Symbol Test Conditions Min Typ Max Unit S f=1KHz, Pin=1pa -39 -38 -37 dB Output Impedance Zout f=1KHz, Pin=1pa 400 Ω Directivity D(θ) 200 μA Item Sensitivity Operating Voltage Range I Current Consumption S/N Ratio Omnidirectional S/N(A) Power Supply Rejection Decreasing Voltage Characteristic PSR S 50 f=1kHz, Pin=1Pa A-Weighted 100mVpp square wave @217Hz ,A-weighted f=1kHz, Pin=1Pa Vs=3.6-1.6V 65 dB -100 dB No Change dB Operating Voltage Range Vs Total Harmonic Distortion THD 94dB SPL@1 kHz Total Harmonic Distortion THD 1% THD@1 kHz 123 dBSPL Acoustic Overload Point AOP 10% THD @1 kHz 128 dBSPL Load Resistor RL Load Capacitance CL 2.3 0.15 3.6 V 1 % 10 KΩ pF 150 4 Frequency Response Curve +10 +5.5 +5 +2 +3 +3 +3 +3 +3 0 -0.5 -5 -4 -10 100 -3 200 -3 500 -3 -3 -3 1K 3K 5K 8K 10K 20K Frequency Response(Relative to 1kHz) Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 4/14 Confidential Degree : Confidential 5 Measurement Circuit Term.1(Power) CP Vs + 2.7V Filter Term.2 (Output) OUTPUT Amp C=10μF Term.3 (GND) MEMS Microphone GND 6 Test Setup Drawing Power Amplifier Free-field 1/2" Microphone 50cm Speaker Audio Analyzer MIC Input Output Power&Load Remote Control Turn Table Anechoic Room Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 5/14 Confidential Degree : Confidential 7 Mechanical Characteristics 7.1 Appearance Drawing (Unit: mm) W H 1.07 2-0.9 2-0.68 ② ① ③ 1.08 L 3.12 YLLL 0.54 2-0.2X45° AP 0.28 R0.25 1.25 2.24 Top View Bottom View Side View Pin# Function 1 Power 2 Output 3 GND Item Length(L) Width(W) Height(H) Acoustic Port (AP) Dimention 3.35 2.50 0.98 Ø0.25 Tolerance ±0.10 ±0.10 ±0.10 Units mm mm mm ±0.05 mm Note: 1. Tolerance ±0.1 unless otherwise specified. 2. Identification Number Convention: Job Identification Number. Identification Number GWWD Y LLL G : Goermicro W W :Week Y :Year L L L D :Day : Serial Number 2D Code 7.2 Weight The weight of the MIC is Less than 0.03g. Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 6/14 Confidential Degree : Confidential 8 Reliability Test 8.1 Vibration Test To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) 8.2 Drop Test To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5 meter height in state of JIG,JIG weight of 100g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) 8.3 Temperature b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dB from initial Test sensitivity.   (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) 8.4 Humidity Test After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in 8.5 each direction (for six axes in total) along each of the three mutually perpendicular axes Mechanical for a total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity. Shock Test (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds) 8.6 32 cycles, sensitivity should vary within ±3dB from initial sensitivity. Thermal (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) Shock Test 8.7 Reflow Test Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dB from initial sensitivity. (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%~75%) 8.8 Under C=150pF, R=330ohm. Electrostatic Air discharge to case with±8kV and contact discharge to I/O terminals with±2kV , 10 times, Discharge Grounding. Sensitivity should vary within ±3dB from initial sensitivity. Test Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 7/14 Confidential Degree : Confidential 9 Package 9.1 Tape Specification P0 ØD0 E P2 A B W F A B ØD1 P1 Power B-B A-A T 10° 10° B0 A0 K0 The Dimensions as Follows: ITEM W E F ØD0 ØD1 DIM(mm) 12.0±0.30 1.75±0.10 5.5±0.05 1.50+0.10 0 0.50±0.10 ITEM P0 10P0 P1 DIM(mm) 4.00±0.10 40.00±0.20 8.00±0.10 ITEM K0 P2 T DIM(mm) 1.30±0.10 2.00±0.05 0.30±0.05 Version: 4.0 A0 3.75±0.05 Confidential in Goermicro, shall not be spread if not be privileged. B0 2.85±0.05 page 8/14 Confidential Degree : Confidential 9.2 Reel Dimension 7'' reel for sample stage 13'' reel will be provided for the mass production stage The following is 13'' reel dimensions (unit:mm) 12.4±0.2 inner side DETAIL A A 1.9±0.4 Ø100±0.5 Ø330(max) Ø21±0.4 Ø13±0.2 120° 9.3 The Content of Box(13'' reel) Packing (5,000PCS) Inner Box(25,000PCS) (340mm 135mm 355mm) Two Inner Box(50,000PCS) Version: 4.0 Outer Box(50,000PCS) (370mm 300mm 390mm) Confidential in Goermicro, shall not be spread if not be privileged. page 9/14 Confidential Degree : Confidential 9.4 Packing Explain 9.4.1 The Label Content of the Reel xx xx x xx xx xxxx x xx x x xx xxx xxx x x xx xxx x xx The Content Includes: Product type, Lot, Customer P/N; and other essential information such as Quantity, Date etc. 9.4.2 The RoHS Label RoHS HF Compliance Mark RoHS 10 Storage and Transportation 10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden temperature change, acid air, any other harmful air or strong magnetic field. Recommend storage period no more than 1 year and floor life(out of bag) at factory no more than 4 weeks. 10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please protect products against moist, shock, sunburn and pressure during transportation. 10.3 Storage Temperature Range:-40℃~+70℃ 10.4 Operating Temperature Range:-40℃~+100℃ Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 10/14 Confidential Degree : Confidential 11 Land Pattern Recommendation 11.1 The Pattern of MIC Pad(Unit:mm) 0.54 2-0.2X45° 1.07 2-0.9 2-0.68 Ø1.55 Ø0.95 11.2 Recommended Soldering Surface Land Pattern 2-0.68 1.07 2-0.9 0.54 2-0.2X45° Ø1.55 Ø0.95 3*0.1 Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 11/14 Confidential Degree : Confidential 12 Soldering Recommendation 12.1 Soldering Machine Condition 8 zones Temperature Control Heater Type Hot Air Solder Type Lead-free 12.2 The Drawing and Dimension of Nozzle Nozzle Diameter: Ø1.0mm; Please don't blow the acoustic port directly. Ø1.0 Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 12/14 Confidential Degree : Confidential 12.3 Reflow Profile Temp. °C Tp Max. Ramp-up rate = 3°C/s Max. Ramp-down rate = 6°C/s TL tp tL Tsmax Preheat area Tsmin ts 25 time 25°C to peak Time. sec Key Features of The Profile: Average Ramp-up rate(Tsmax to Tp) 3°C/s max. Preheat : Temperature Min(Tsmin) Temperature Max(Tsmax) Time(Tsmin to Tsmax)(ts) 150°C 200°C 60~180s Time maintained above : Tempreature(TL) Time(tL) 217°C 60~150s Peak Temperature(Tp) Max 260°C Time within 5°C of actual Peak Temperature(tp) : 30~40s Ramp-down rate(Tp to Tsmax) 6°C/s max Time 25°C to Peak Temperature 8min max When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste and the thickness of PCB etc. Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 13/14 Confidential Degree : Confidential 13 Cautions 13.1 Board Wash Restrictions It is very important not to wash the PCBA after reflow process, otherwise this could damage the microphone. 13.2 Nozzle Restrictions It is very important not to be put a nozzle over the acoustic hole of the microphone, otherwise this could damage the microphone. 13.3 Blowing Restrictions It is very important not to blow the acoustic port of the microphone directly,otherwise this could damage the microphone. 13.4 Ultrasonic Restrictions It is very important not to use ultrasonic process. otherwise this could damage the microphone. 13.5 Case Adaption to Pressure Restrictions It is very important not to press the case with a force larger than 2.5kgf, otherwise this would damage the microphone. 14 Output Inspection Standard Output inspection standard is executed according to . Version: 4.0 Confidential in Goermicro, shall not be spread if not be privileged. page 14/14
S14OB381-057 价格&库存

很抱歉,暂时无法提供与“S14OB381-057”相匹配的价格&库存,您可以联系我们找货

免费人工找货