Confidential Degree : Confidential
Specification of MEMS
Microphone
( RoHS Compliance & Halogen-free )
Customer
Name :
Customer
Model :
Goermicro Model :
10644
ISO/TS16949:2009
013
013
2551
2728
ISO14001:2004
ISO9001:2008
Version:3.0
S15OT421-017
Tel : + 86 536 3051234
E- Mail : goermicro@goermicro.com
Website: http://www.goermicro.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
Confidential in Goermicro, shall not be spread if not be privileged.
page 1/14
Confidential Degree : Confidential
Restricted
1 Security Warning
The information contained in this document is the exclusive property of Goermicro
Inc. and should not be disclosed to any third party without the written consent of
Goermicro Inc..
2 Publication History
Version
Date
Description
1.0
2021.02.27
New Design
2.0
2021.03.23
3.0
2021.11.23
Author
Approved
Aaron
Roy
Updata performance parameter
Aaron
Roy
Update Document Template
Zamp
Roy
page 2/14
Confidential Degree : Confidential
Contents
1
2
3
4
5
6
7
Introduction
Test Condition
Electrical Characteristics
Frequency Response Curve
Measurement Circuit
Test Setup Drawing
Mechanical Characteristics
4
4
4
4
5
5
6
7.1 Appearance Drawing
6
7.2 Weight
6
8 Reliability Test
7
8.1 Vibration Test
7
8.2 Drop Test
7
8.3 Temperature Test
7
8.4 Humidity Test
7
8.5 Mechanical Shock Test
7
8.6 Thermal Shock Test
7
8.7 Reflow Test
7
8.8 Electrostatic Discharge Test
7
9 Package
8
9.1 Tape Specification
8
9.2 Reel Dimension
9
9.3 The Content of Box
9
9.4 Packing Explain
10
10 Storage and Transportation
11 Land Pattern Recommendation
10
11
11.1 The Pattern of MIC Pad
11
11.2 Recommended Soldering Surface Land Pattern
11
12 Soldering Recommendation
12
12.1 Soldering Machine Condition
12
12.2 The Drawing and Dimension of Nozzle
12
12.3 Reflow Profile
13
13 Cautions
14
13.1 Board Wash Restrictions
14
13.2 Nozzle Restrictions
14
13.3 Blowing Restrictions
14
13.4 Ultrasonic Restrictions
14
13.5 Case Adaption to Pressure Restrictions
14
14 Output Inspection Standard
14
page 3/14
Confidential Degree : Confidential
1 Introduction:
MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be
used in SMT process. It is widely used in telecommunication and electronics device such as
mobile phone, laptop computers, and other portable electronic devices etc.
2 Test Condition (Vs=2.7V,L=50cm)
StandardConditions
(As IEC 60268-4)
Environment Conditions
Basic Test Conditions
Air pressure
Humidity
Temperature
+15℃~ +35℃
25%RH~75%RH
86kPa~106kPa
+20±2℃
60%RH~70%RH
86kPa~106kPa
3 Electrical Characteristics
Symbol
Test Conditions
Min
Typ
Max
Unit
S
f=1kHz, Pin=1Pa
-43
-42
-41
dB
Output Impedance
Zout
f=1kHz, Pin=1Pa
Directivity
D(θ)
Item
Sensitivity
400
Omnidirectional
I
Current Consumption
S/N(A)
f=1kHz, Pin=1Pa
A-Weighted
Decreasing Voltage Characteristic
△S
f=1kHz, Pin=1Pa
Vs=3.6 --2.0V
Operating Voltage Range
Vs
Total Harmonic Distortion
THD
110dB SPL@ f=1kHz
Acoustic Overload Point
AOP
10% THD @1kHz
S/N Ratio
μA
150
58
59
dB
No Change
2.0
130
3.6
V
1
%
dBSPL
Relative Response (dB)
4 Frequency Response Curve Limits
+15
+10
+5
+2
+3
+3 +3
+3
+6
-3
-3
-3
-3
0
-5
-4
-3
-10
-15
100
200
300
500
1k 1.1k
Frequency (Hz)
3k
5k
8k
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5 Measurement Circuit
Term.1 (Power)
CP
Vs + 2.7V
Filter
Term.4 (Output)
Amp
OUTPUT
C=10μF
Term.2 and Term.3 (GND)
MEMS
Microphone
GND
6 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
50cm
Speaker
Audio Analyzer
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
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7 Mechanical Characteristics
7.1 Appearance Drawing (Unit: mm)
AP
H
1.39 0.68
0.78
W
0.925
L
1
0.7
0.45
1
4
2
3
0.28
4-0.54*0.56
Top View
Pin Output
Pin# Function
Bottom View
Item
Dimension
Tol.(±)
Units
Length
2.75
0.1
mm
1
Power
Width
1.85
0.1
mm
2
GND
Height
0.95
0.1
mm
3
GND
AP
0.5
0.1
mm
4
Output
(Acoustic port)
Note: 1. Tolerance ±0.10mm unless otherwise specified.
2. Identification Number Convention: Job Identification Number.
Identification
Number
2D Code
7.2 Weight
The weight of the MIC is Less than 0.04g.
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Confidential Degree : Confidential
8 Reliability
8.1
Vibration
Test
To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each
direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary
within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
8.2
Drop
Test
To be no interference in operation after dropped to 1.0cm steel plate 18 times from 1.5
meter height, sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dB from initial
8.3
sensitivity.
Temperature (The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
Test
b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dB from initial
sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
8.4
Humidity
Test
After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary within
±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
8.5
Mechanical
Shock Test
Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in
each direction (for six axes in total) along each of the three mutually perpendicular axes for a
total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~
75%)
8.6
Thermal
Shock Test
After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds)
5 cycles, sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~
75%)
8.7
Reflow
Test
Adopt the reflow curve of item 12.3, after five reflows, sensitivity should vary within ±2dB
from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15℃~+35℃, R.H 25%~75%)
Under C=150pF, R=330ohm.
8.8
Electrostatic Tested to ±8KV contact to the case and tested to ±2kV contact to I/O terminals.10 times.
Discharge Grounding. Sensitivity should vary within ±2dB from initial sensitivity.
Test
page 7/14
Confidential Degree : Confidential
9 Package
9.1 Tape Specification
P0
ØD0
Power Pin 1
E
P2
A
B
W
F
A
B
ØD2
P1
ØD1
B-B
A-A
T
10°
B0
10°
A0
K0
The Dimensions as Follows:
ITEM
W
E
F
ØD0
ØD1
DIM(mm)
12.0±0.30
1.75±0.10
5.5±0.05
1.50+0.10
-0
1.00+0.10
0
ITEM
P0
10P0
P1
A0
B0
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
3.00±0.05
2.05±0.05
ITEM
K0
P2
T
ØD2
DIM(mm)
1.10±0.10
2.00±0.1
0.30±0.05
0.50±0.10
page 8/14
Confidential Degree : Confidential
9.2 Reel Dimension
7'' reel for sample stage
13'' reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
inner side
DETAIL A
A
11 12 1
10
2
9
8
7 65
3
4
1.9±0.4
Ø330(max)
Ø21±0.4
Ø100±0.5
Ø13±0.2
120°
9.3 The Content of Box(13'' reel)
11121
10
2
9
87
3
6 54
Packing (5,500PCS)
Inner Box(27,500PCS)
(340mm 135mm 355mm)
Two Inner Box(55,000PCS)
Outer Box(55,000PCS)
(370mm 300mm 390mm)
page 9/14
Confidential Degree : Confidential
9.4 Packing Explain
9.4.1 The Label Content of the Reel
xx
xx x
xx
xx xxxx x
xx
x
x
xx xxx xxx
x
x
xx xxx
x
xx
The Content Includes:
Product type, Lot, Customer P/N;
and other essential information such as
Quantity, Date etc.
9.4.2 The RoHS Label
RoHS
RoHS HF
Compliance Mark
10 Storage and Transportation
10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden
temperature change, acid air, any other harmful air or strong magnetic field.
Recommend storage period no more than 1 year and floor life(out of bag) at factory
no more than 4 weeks.
10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please
protect products against moist, shock, sunburn and pressure during transportation.
10.3 Storage Temperature Range:-40℃~+70℃(Microphone units with package)
10.4 Operating Temperature Range:-40℃~+100℃
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11 Land Pattern Recommendation
11.1 The Pattern of MIC Pad(Unit:mm)
0.45
1.39 0.68
0.7
4-0.54*0.56
11.2 Recommended Soldering Surface Land Pattern
1.39
0.45
4-0.54*0.56
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12 Soldering Recommendation
12.1 Soldering Machine Condition
8 zones
Temperature Control
Heater Type
Hot Air
Solder Type
Lead-free
12.2 The Drawing and Dimension of Nozzle
Nozzle Diameter: 0.8mm
Ø1 Forbidden area for
vacuum application
1.1
0.3
1.21
Recommendation
area for pick up
Please don't vacuum over the acoustic port
directly. The recommendation is for reference.
0.8
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Confidential Degree : Confidential
12.3 Reflow Profile
Temp. °C
Tp
Max. Ramp-up rate = 3℃/s
Max. Ramp-down rate = 6℃/s
TL
tp
tL
Tsmax
Preheat area
Tsmin
ts
25
time 25℃ to peak
Time. sec
Key Features of The Profile:
Average Ramp-up rate(Tsmax to Tp)
3℃/s max.
Preheat :
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(Tsmin to Tsmax)(ts)
150℃
200℃
60~180s
Time maintained above :
Tempreature(TL)
Time(tL)
217℃
60~150s
Peak Temperature(Tp)
260℃
Time within 5℃ of actual Peak Temperature(tp) :
30~40s
Ramp-down rate(Tp to Tsmax)
6℃/s max
Time 25℃ to Peak Temperature
8min max
When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
page 13/14
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13 Cautions
13.1 Board Wash Restrictions
It is very important not to wash the PCBA after reflow process, otherwise this could
damage the microphone.
13.2 Nozzle Restrictions
It is very important not to be put a nozzle over the acoustic hole of the microphone,
otherwise this could damage the microphone.
13.3 Blowing Restrictions
It is very important not to blow the acoustic port of the microphone directly,otherwise
this could damage the microphone.
13.4 Ultrasonic Restrictions
It is very important not to use ultrasonic process. otherwise this could damage the
microphone.
13.5 Case Adaption to Pressure Restrictions
It is very important not to press the case with a force larger than 2.5kgf, otherwise
this would damage the microphone.
14 Output Inspection Standard
Output inspection standard is executed according to .
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