S18OB381-028

Confidential Degree : Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : Goermicro Model : S18OB381-028 Goermicro 10644 Zamp Wang CHKD Hubery Zhang 2021.11.22 STANDARD Angela Kong 2021.11.22 APVD Roy Wang 2021.11.22 2021.11.22 013 2551 2728 ISO14001:2004 ISO9001:2008 Version:5.0 DESIGN Tel : + 86 536 3051234 E- Mail : goermicro@goermicro.com Website: http://www.goermicro.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C. ISO/TS16949:2009 013 CUSTOMER APPROVAL Confidential in Goermicro, shall not be spread if not be privileged. page 1/15 Confidential Degree : Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of Goermicro Inc. and should not be disclosed to any third party without the written consent of Goermicro Inc.. 2 Publication History Version Description Date Author 1.0 New Design 2018.05.23 Hubery 2.0 3.0 Version:5.0 Approved Worden Update 3 electrical characteristics 2019.08.19 & 7.1 appearance drawing&9.1 Tape Specification Paul Sunny 2021.01.27 Ariel Jenny Add THD Curve 4.0 Update the Logo to Goermicro 2021.08.25 Enoch Roy 5.0 Update Current and THD Performance 2021.11.22 Zamp Roy Confidential in Goermicro, shall not be spread if not be privileged. page 2/15 Confidential Degree : Confidential Contents 1 2 3 4 Introduction Test Condition Electrical Characteristics 4.1Frequency Response Curve 4.2THD Curve 5 Measurement Circuit 6 Test Setup Drawing 7 Mechanical Characteristics 4 4 4 5 5 6 6 7 7.1 Appearance Drawing 7 7.2 Weight 7 8 Reliability Test 8 8.1 Vibration Test 8 8.2 Drop Test 8 8.3 Temperature Test 8 8.4 Humidity Test 8 8.5 Mechanical Shock Test 8 8.6 Thermal Shock Test 8 8.7 Reflow Test 8 8.8 Electrostatic Discharge Test 8 9 Package 9 9.1 Tape Specification 9 9.2 Reel Dimension 10 9.3 The Content of Box 10 9.4 Packing Explain 11 10 Storage and Transportation 11 Land Pattern Recommendation 11 12 11.1 The Pattern of MIC Pad 12 11.2 Recommended Soldering Surface Land Pattern 12 12 Soldering Recommendation 13 12.1 Soldering Machine Condition 13 12.2 The Drawing and Dimension of Nozzle 13 12.3 Reflow Profile 14 12.4 Rework 15 13 Cautions 15 13.1 Board Wash Restrictions 15 13.2 Nozzle Restrictions 15 13.3 Blowing Restrictions 15 13.4 Ultrasonic Restrictions 15 13.5 Case Adaption to Pressure Restrictions 14 Output Inspection Standard Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. 15 15 page 3/15 Confidential Degree : Confidential 1 Introduction: MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, MP3, PDAs etc. 2 Test Condition (Vs=2.0V,L=50cm) StandardConditions (As IEC 60268-4) Environment Conditions Basic Test Conditions Temperature Air pressure Humidity +15℃～ +35℃ 25％R.H.～75%R.H. 86kPa～106kPa +20℃±2℃ 60％R.H.～70%R.H. 86kPa～106kPa 3 Electrical Characteristics Symbol Test Conditions Min Typ Max Unit S f=1KHz, Pin=1pa -39 -38 -37 dB Output Impedance Zout f=1KHz, Pin=1pa 400 Ω Directivity D(θ) Omnidirectional I Operating Voltage Range 200 μA S/N(A) f=1kHz, Pin=1Pa A-Weighted Curve 66 dB PSR Measured with 217Hz, 100mVpp square wave -98 dB Item Sensitivity Current Consumption S/N Ratio Power Supply Rejection Decreasing Voltage Characteristic S 50 f=1kHz, Pin=1Pa Vs=3.6 --1.6V 110 Operating Voltage Range Vs Total Harmonic Distortion THD 94dB SPL@1 kHz 0.2 Acoustic Overload Point AOP 10% THD @1 kHz 124 Load Resistor RL Load Capacitance CL VDD ramp up time tVDDup Version:5.0 1.6 10 VDD reaches its final value within +/- 10 % tolerance Confidential in Goermicro, shall not be spread if not be privileged. dB No Change 0.001 3.6 V 0.5 % dB SPL 100 KΩ 150 pF 2 ms page 4/15 Confidential Degree : Confidential 4.1 Frequency Response Curve and Limits Relative Response (dB) +15 +10 +5 +1 0 -5 -5 +3 +3 +3 +3 +5 -3 -3 -3 -3 -3 -10 -15 -20 100 200 300 500 1k 1.1k Frequency (Hz) 3k 5k 8k 4.2 THD Curve THD 20 15 % 10 5 0 90 100 110 120 130 dBSPL Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 5/15 Confidential Degree : Confidential 5 Measurement Circuit Term.1 (Power) CP Vs + 2.0V Filter Term.2 (Output) Amp OUTPUT C=10μF Term.3 (GND) MEMS Microphone GND 6 Test Setup Drawing Power Amplifier Free-field 1/2" Microphone 50cm Speaker Audio Analyzer MIC Input Output Power&Load Remote Control Turn Table Anechoic Room Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 6/15 Confidential Degree : Confidential 7 Mechanical Characteristics 7.1 Appearance Drawing (Unit: mm) 1.675 W 0.125 0.725 H 0.125 0.522 3.094 1.513 ⑤ L YLLL ⑤ ① ④ ② 0.300 ③ Ø1.025 Ø1.625 R0.25 2.244 AP 0.292 Identification Number 1.325 Top View Pin# Function Bottom View Dimention Tolerance Units Length(L) 3.50 ±0.10 mm Item 1 Output Width(W) 2.65 ±0.10 mm 2 GND Height(H) 0.98 ±0.10 mm 3 GND Acoustic Port (AP) 2-Ø0.2 ±0.05 mm 4 GND 5 Power Note: 1. Tolerance ±0.1 unless otherwise specified. 2. Identification Number Convention: Job Identification Number. Identification Number YLLL G : Goermicro Y : Year WW :Week D :Day L L L : Serial Number 2D Barcode 7.2 Weight The weight of the MIC is Less than 0.04g. Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 7/15 Confidential Degree : Confidential 8 Reliability Test 8.1 Vibration Test To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary within ±3dB from initial sensitivity(IEC 60068-2-6:2007). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) 8.2 Drop Test To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5 meter height in state of JIG,JIG weight of 100g, sensitivity should vary within ±3dB from initial sensitivity(IEC60068-2-31:2008). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dB from initial sensitivity(IEC 60068-2-1:2007). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) 8.3 Temperature b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dB from initial Test sensitivity(IEC 60068-2-1:2007). 　 (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) 8.4 Humidity Test After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary within ±3dB from initial sensitivity(IEC 60068-2-67:2019). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in 8.5 each direction (for six axes in total) along each of the three mutually perpendicular axes Mechanical for a total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity Shock Test (IEC60068-2-27:2008). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds) 8.6 32 cycles, sensitivity should vary within ±3dB from initial sensitivity(IEC 60068-2-14:2009). Thermal Shock Test (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) 8.7 Reflow Test Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dB from initial sensitivity(Refer to customer's request). (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%) 8.8 Under C=150pF, R=330ohm. Electrostatic Air discharge to case with±8kV and contact discharge to I/O terminals with±2kV , 10 times, Discharge Grounding. Sensitivity should vary within ±3dB from initial sensitivity(IEC61000-4-2:2008). Test Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 8/15 Confidential Degree : Confidential 9 Package 9.1 Tape Specification P0 P2 ØD0 E VDD A B W F A B ØD1 P1 B-B A-A T 10° 10° B0 A0 K0 The Dimensions as Follows: ITEM W E F ØD0 ØD1 DIM(mm) 12.0±0.30 1.75±0.10 5.5±0.05 1.50+0.10 0 0.50±0.10 ITEM P0 10P0 P1 DIM(mm) 4.00±0.10 40.00±0.20 8.00±0.10 ITEM K0 P2 T DIM(mm) 1.30±0.10 2.00±0.05 0.30±0.05 Version:5.0 A0 3.75±0.05 Confidential in Goermicro, shall not be spread if not be privileged. B0 2.95±0.05 page 9/15 Confidential Degree : Confidential 9.2 Reel Dimension 7'' reel for sample stage 13'' reel will be provided for the mass production stage The following is 13'' reel dimensions (unit:mm) 12.4±0.2 inner side DETAIL A A 1.9±0.4 Ø100±0.5 Ø330(max) Ø21±0.4 Ø13±0.2 120° 9.3 The Content of Box(13'' reel) Packing (5,000PCS) Antistatic Bag (5,000PCS) Two Inner Box(50,000PCS) Version:5.0 5 Antistatic Bags (25,000PCS) Inner Box(25,000PCS) (340mm 135mm 355mm) Outer Box(50,000PCS) (370mm 300mm 390mm) Confidential in Goermicro, shall not be spread if not be privileged. page 10/15 Confidential Degree : Confidential 9.4 Packing Explain 9.4.1 The Label Content of the Reel xx xx x xx xx xxxx x xx x x xx xxx xxx x x xx xxx x xx The Content Includes: Product type, Lot, Customer P/N; and other essential information such as Quantity, Date etc. 9.4.2 The RoHS Label RoHS RoHS HF Compliance Mark 10 Storage and Transportation 10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden temperature change, acid air, any other harmful air or strong magnetic field. Recommend storage period no more than 1 year and floor life(out of bag) at factory no more than 4 weeks. 10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please protect products against moist, shock, sunburn and pressure during transportation. 10.3 Storage Temperature Range：-40℃～+70℃ 10.4 Operating Temperature Range：-40℃～+100℃ Note1: MSL(moisture sensitivity level) Class 1(IPC/JEDEC-J-STD-020 Revision C) Note2: Static sensitive device Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 11/15 Confidential Degree : Confidential 11 Land Pattern Recommendation 11.1 The Pattern of MIC Pad(Unit:mm) 1.675 0.725 0.522 1.513 0.300 Ø1.025 Ø1.625 11.2 Recommended Soldering Surface Land Pattern 1.675 1.513 0.725 0.522 0.300 Ø1.025 Ø1.625 Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 12/15 Confidential Degree : Confidential 12 Soldering Recommendation 12.1 Soldering Machine Condition 8 zones Temperature Control Heater Type Hot Air Solder Type Lead-free 12.2 The Drawing and Dimension of Nozzle Nozzle Diameter: Ø1.0mm; Please don't blow the acoustic port directly. Ø1.0 Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 13/15 Confidential Degree : Confidential 12.3 Reflow Profile Temp. °C Tp Max. Ramp-up rate = 3℃/s Max. Ramp-down rate = 6℃/s TL tp tL Tsmax Preheat area Tsmin ts 25 time 25℃ to peak Time. sec Key Features of The Profile: Average Ramp-up rate(Tsmax to Tp) 3℃/s max. Preheat : Temperature Min(Tsmin) Temperature Max(Tsmax) Time(Tsmin to Tsmax)(ts) 150℃ 200℃ 60~180s Time maintained above : Tempreature(TL) Time(tL) 217℃ 60~150s Peak Temperature(Tp) 260℃ Time within 5℃ of actual Peak Temperature(tp) : 30~40s Ramp-down rate(Tp to Tsmax) 6℃/s max Time 25℃ to Peak Temperature 8min max When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste and the thickness of PCB etc. Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 14/15 Confidential Degree : Confidential 12.4 Rework (1) 250°C～270°C, maximum 30 sec，Peak temperature 330°C. (2) Wind speed: 15L/m. (3) It is very important not to put a heatgun over the acoustic port of the microphone. 13 Cautions 13.1 Board Wash Restrictions It is very important not to wash the PCBA after reflow process, otherwise this could damage the microphone. 13.2 Nozzle Restrictions It is very important not to be put a nozzle over the acoustic hole of the microphone, otherwise this could damage the microphone. 13.3 Blowing Restrictions It is very important not to blow the acoustic port of the microphone directly,otherwise this could damage the microphone. 13.4 Ultrasonic Restrictions It is very important not to use ultrasonic process. otherwise this could damage the microphone. 13.5 Case Adaption to Pressure Restrictions It is very important not to press the case with a force larger than 2.5kgf, otherwise this would damage the microphone. 14 Output Inspection Standard Output inspection standard is executed according to . Version:5.0 Confidential in Goermicro, shall not be spread if not be privileged. page 15/15