Confidential Degree : Confidential
Specification of MEMS
Microphone
(RoHS Compliance & Halogen Free)
Customer
Name :
Customer
Model :
Goermicro Model : S18OB381-046
Goermicro
10644
Zamp Wang
CHKD
Hubery Zhang 2021.11.23
STANDARD
Angela Kong
2021.11.23
APVD
Roy Wang
2021.11.23
2021.11.23
013
2551
2728
ISO14001:2004
ISO9001:2008
Version: 6.0
DESIGN
Tel : + 86 536 3051234
E- Mail : Goermicro@Goermicro.com
Website: http://www.Goermicro.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
ISO/TS16949:2009
013
CUSTOMER APPROVAL
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Restricted
1 Security Warning
The information contained in this document is the exclusive property of Goermicro
Inc. and should not be disclosed to any third party without the written consent of
Goermicro Inc..
2 Publication History
Version
Description
Date
Author
1.0
New Design
2021.02.07
Ariel
Worden
2.0
Update 7.1&11.1
2021.02.23
Ariel
Worden
2021.07.07
Spring
Worden
3.0
Update 3 Electrical Characteristics
& 4 Frequency Response Curve
Approved
4.0
Update 3.1 Standard Mode
2021.07.26
Paul
Roy
5.0
Update 7.1 Appearance Drawing 2021.09.30
Yilse
Roy
Zamp
Roy
6.0
Version: 6.0
Update Document Template
2021.11.23
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Contents
1 Introduction
2 Test Condition
3 Electrical Characteristics
4
5
6
7
4
4
4
3.1 Standard Mode
4
3.2 Low Power Mode
5
Frequency Response Curve
Measurement Circuit
Test Setup Drawing
Mechanical Characteristics
5
7
7.1 Appearance Drawing
7
7.2 Weight
7
6
6
8 Reliability Test
8
8.1 Vibration Test
8
8.2 Drop Test
8
8.3 Temperature Test
8
8.4 Humidity Test
8
8.5 Mechanical Shock Test
8
8.6 Thermal Shock Test
8
8.7 Reflow Test
8
8.8 Electrostatic Discharge Test
8
9 Package
9
9.1 Tape Specification
9
9.2 Reel Dimension
10
9.3 The Content of Box
10
9.4 Packing Explain
11
10 Storage and Transportation
11 Land Pattern Recommendation
11
12
11.1 The Pattern of MIC Pad
12
11.2 Recommended Soldering Surface Land Pattern
12
12 Soldering Recommendation
13
12.1 Soldering Machine Condition
13
12.2 The Drawing and Dimension of Nozzle
13
12.3 Reflow Profile
14
13 Cautions
15
13.1 Board Wash Restrictions
15
13.2 Nozzle Restrictions
15
13.3 Blowing Restrictions
15
13.4 Ultrasonic Restrictions
15
13.5 Case Adaption to Pressure Restrictions
15
14 Output Inspection Standard
Version: 6.0
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15
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1 Introduction:
MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be
used in SMT process. It is widely used in telecommunication and electronics device such as
mobile phone, laptop computers, and other portable electronic devices etc.
2 Test Condition (VDD=2.7V/1.6V, L=50cm)
StandardConditions
(As IEC 60268-4)
Environment Conditions
Basic Test Conditions
Air pressure
Humidity
Temperature
+15℃～ +35℃
25％R.H.～75%R.H.
86kPa～106kPa
+20℃ ± 2℃
60％R.H.～70%R.H.
86kPa～106kPa
3 Acoustic and Electrical Characteristics
3.1 Standard Mode
（Test Condition：VDD=2.3V~3V）
Symbol
Test Conditions
Min
Typ
Max
Unit
S
f=1KHz, Pin=1pa
-39
-38
-37
dB
Output Impedance
Zout
f=1KHz, Pin=1pa
400
Ω
Directivity
D(θ)
200
μA
Item
Sensitivity
Current Consumption
S/N Ratio
Power Supply Rejection
Decreasing Voltage Characteristic
I
Operating Voltage Range
S/N(A)
f=1kHz, Pin=1Pa
A-Weighted Curve
70
dB
PSR
Measured with 217Hz,
100mVpp square wave
-106
dB
f=1kHz, Pin=1Pa
Vs=3.0 --2.3V
No Change
dB
S
Operating Voltage Range
Vs
Total Harmonic Distortion
THD
Acoustic Overload Point
AOP
Load Resistor
RL
Load Capacitance
CL
VDD ramp up time
tVDDup
Corner Frequency
Version: 6.0
Omnidirectional
100
155
2.7
3.0
V
94dB SPL@1 kHz
0.2
0.5
%
10% THD @1 kHz
137
2.3
dBSPL
25
VDD reaches its final value
within +/- 10 % tolerance
KΩ
0.001
LFRO
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45
150
pF
5
ms
Hz
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3.2 Low Power Mode
（Test Condition：VDD=1.5V~1.9V）
Symbol
Item
Operating Voltage Range
Test Conditions
I
VDD=1.6V
Sensitivity
S
f=1kHz, Pin=1Pa
S/N Ratio
SNR
f=1kHz, Pin=1Pa
A-Weighted Curve
Total Harmonic Distortion
THD
110dB SPL@ f=1kHz
Acoustic Overload Point
AOP
10%THD@1kHz,S=Typ,
VDD=1.6V,Rload>2kΩ
Power Supply Rejection
PSR
100mVpp square wave@217Hz,
VDD=1.6V A-Weighted
PSRR
200mVpp sine wave@1KHz,
VDD=1.6V,Rload>2kΩ
Output Impedance
Zout
f=1kHz, Pin=1Pa
Decreasing Voltage Characteristic
S
f=1kHz, Pin=1Pa
VDD=1.9 --1.5V
Directivity
Typ
Max
Unit
1.5
1.6
1.9
V
80
μA
-37
dB
VDD
Current Consumption
Power Supply Rejection Ratio
Min
-39
-38
dB
68.5
1
%
132
dB SPL
-106
dBV
88
dB
Ω
400
dB
No Change
Omnidirectional
D(θ)
4 Frequency Response Curve and Limits
Typical Free Field Response
Normalized to 1kHz
Standard Mode
Relative Response (dB)
+15
+11.0
+10
+6.0
+5
0
-5
+0.5
-2.5
+1.5
+1.5 +1.5
+1.5
+2.5
5
-1.5
-1.5 -1.5
-1.5
200
900 1k 1.1k
3k
-0.5
0
6k
10k
-10
-15
-20
100
Version: 6.0
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16k
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Typical Free Field Response
Normalized to 1kHz
Low Power Mode
Relative Response (dB)
+15
+11.0
+10
+6.0
+5
0
-5
+0.5
-2.5
+1.5
+1.5 +1.5
+1.5
+2.5
5
-1.5
-1.5 -1.5
-1.5
200
900 1k 1.1k
3k
-0.5
0
6k
10k
-10
-15
-20
100
16k
5 Measurement Circuit
Term.1 (Power)
CP
Vs + 2.7V
Term.2 (Output +)
Filter
OUTPUT +
C=10μF
Term.3 (Output -)
Amp
OUTPUT C=10μF
Term.4&Term.5 (GND)
MEMS
Microphone
GND
6 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
50cm
Speaker
Audio Analyzer
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
Version: 6.0
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7 Mechanical Characteristics
7.1 Appearance Drawing (Unit: mm)
4-0.725
W
0.950
H
4-0.522
Ø1.625
Ø1.025
(3.28)
L
YLLL
1
2
4
3
0.300
5
0.991
(2.43)
AP
1.055
(R0.27)
1.325
Identification
Number
Top View
Pin#
Bottom View
Dimention
Tolerance
Units
Length(L)
3.50
±0.10
mm
Item
Function
1
VDD
Width(W)
2.65
±0.10
mm
2
Output +
Height(H)
1.0
±0.10
mm
3
Output -
Acoustic Port
(AP)
0.325
±0.05
mm
4
GND
5
GND
Note: 1. Tolerance ±0.1 unless otherwise specified.
2. Identification Number Convention: Job Identification Number.
Identification
Number
YLLL
G : Goermicro WW :Week D :Day
Y : Year
L L L : Serial Number
2D Barcode
7.2 Weight
The weight of the MIC is Less than 0.04g.
Version: 6.0
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8 Reliability Test
8.1
Vibration
Test
To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each
direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary
within ±3dB from initial sensitivity(IEC 60068-2-6:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
8.2
Drop
Test
To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5
meter height in state of JIG,JIG weight of 100g, sensitivity should vary within ±3dB from
initial sensitivity(IEC60068-2-31:2008).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dB from initial
sensitivity(IEC 60068-2-1:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
8.3
Temperature
b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dB from initial
Test
sensitivity(IEC 60068-2-1:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
8.4
Humidity
Test
After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary
within ±3dB from initial sensitivity(IEC 60068-2-67:2019).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in
8.5
each direction (for six axes in total) along each of the three mutually perpendicular axes
Mechanical for a total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity
Shock Test (IEC60068-2-27:2008).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds)
8.6
32 cycles, sensitivity should vary within ±3dB from initial sensitivity(IEC 60068-2-14:2009).
Thermal
Shock Test (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
8.7
Reflow
Test
Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dB
from initial sensitivity(Refer to customer's request).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
8.8
Under C=150pF, R=330ohm.
Electrostatic Air discharge to case with±8kV and contact discharge to I/O terminals with±2kV , 10 times,
Discharge Grounding. Sensitivity should vary within ±3dB from initial sensitivity(IEC61000-4-2:2008).
Test
Version: 6.0
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9 Package
9.1 Tape Specification
P0
P2
ØD0
E
VDD
A
B
W
F
A
B
ØD1
P1
B-B
A-A
T
10°
10°
B0
A0
K0
The Dimensions as Follows:
ITEM
W
E
F
ØD0
ØD1
DIM(mm)
12.0±0.30
1.75±0.10
5.5±0.05
1.50+0.10
0
0.50±0.10
ITEM
P0
10P0
P1
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
ITEM
K0
P2
T
DIM(mm)
1.30±0.10
2.00±0.05
0.30±0.05
Version: 6.0
A0
3.75±0.05
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B0
2.85±0.05
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9.2 Reel Dimension
7'' reel for sample stage
13'' reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
inner side
DETAIL A
A
1.9±0.4
Ø100±0.5
Ø330(max)
Ø21±0.4
Ø13±0.2
120°
9.3 The Content of Box(13'' reel)
Packing (5,000PCS)
Antistatic Bag
(5,000PCS)
Two Inner Box(50,000PCS)
Version: 6.0
5 Antistatic Bags
(25,000PCS)
Inner Box(25,000PCS)
(340mm 135mm 355mm)
Outer Box(50,000PCS)
(370mm 300mm 390mm)
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9.4 Packing Explain
9.4.1 The Label Content of the Reel
xx
xx x
xx
xx xxxx x
xx
x
x
xx xxx xxx
x
x
xx xxx
x
xx
The Content Includes:
Product type, Lot, Customer P/N;
and other essential information such as
Quantity, Date etc.
9.4.2 The RoHS Label
RoHS HF
Compliance Mark
RoHS
10 Storage and Transportation
10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden
temperature change, acid air, any other harmful air or strong magnetic field.
Recommend storage period no more than 1 year and floor life(out of bag) at factory
no more than 4 weeks.
10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please
protect products against moist, shock, sunburn and pressure during transportation.
10.3 Storage Temperature Range：-40℃～+70℃
10.4 Operating Temperature Range：-40℃～+100℃
Note1: MSL(moisture sensitivity level) Class 1(IPC/JEDEC-J-STD-020 Revision C)
Note2: Static sensitive device
Version: 6.0
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11 Land Pattern Recommendation
11.1 The Pattern of MIC Pad(Unit:mm)
4-0.725
0.950
4-0.522
0.300
Ø1.625
Ø1.025
0.991
1.055
1.325
11.2 Recommended Soldering Surface Land Pattern
4-0.725
0.950
4-0.522
Ø1.625
Ø1.025
0.300
0.991
Version:6.0
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12 Soldering Recommendation
12.1 Soldering Machine Condition
Temperature Control
8 zones
Heater Type
Hot Air
Solder Type
Lead-free
12.2 The Drawing and Dimension of Nozzle
Nozzle Diameter: Ø1.0mm;
Please don't blow the acoustic port directly.
Ø1.0
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12.3 Reflow Profile
Temp. °C
Tp
Max. Ramp-up rate = 3℃/s
Max. Ramp-down rate = 6℃/s
TL
tp
tL
Tsmax
Preheat area
Tsmin
ts
25
time 25℃ to peak
Time. sec
Key Features of The Profile:
Average Ramp-up rate(Tsmax to Tp)
3℃/s max.
Preheat :
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(Tsmin to Tsmax)(ts)
150℃
200℃
60~180s
Time maintained above :
Tempreature(TL)
Time(tL)
217℃
60~150s
Peak Temperature(Tp)
260℃
Time within 5℃ of actual Peak Temperature(tp) :
30~40s
Ramp-down rate(Tp to Tsmax)
6℃/s max
Time 25℃ to Peak Temperature
8min max
When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
Version: 6.0
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13 Cautions
13.1 Board Wash Restrictions
It is very important not to wash the PCBA after reflow process, otherwise this could
damage the microphone.
13.2 Nozzle Restrictions
It is very important not to be put a nozzle over the acoustic hole of the microphone,
otherwise this could damage the microphone.
13.3 Blowing Restrictions
It is very important not to blow the acoustic port of the microphone directly,otherwise
this could damage the microphone.
13.4 Ultrasonic Restrictions
It is very important not to use ultrasonic process. otherwise this could damage the
microphone.
13.5 Case Adaption to Pressure Restrictions
It is very important not to press the case with a force larger than 2.5kgf, otherwise
this would damage the microphone.
14 Output Inspection Standard
Output inspection standard is executed according to .
Version: 6.0
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