SD18OB261-050

Confidential Degree : Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : Goermicro Model : Goermicro ISO/TS16949:2009 DESIGN Zamp Wang 2022.12.16 CHKD Roy Wang 2022.12.16 STANDARD Angela Kong 2022.12.16 APVD Roy Wang 2022.12.16 013 2551 2728 ISO14001:2004 ISO9001:2008 Version：8.0 CUSTOMER APPROVAL Tel : + 86 536 8521234 E- Mail : goermicro@goermicro.com Website: http://www.goermicro.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C. 10644 013 SD18OB261-050 Confidential in Goermicro, shall not be spread if not be privileged. page 1/18 Confidential Degree : Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of Goermicro Inc. and should not be disclosed to any third party without the written consent of Goermicro Inc. 2 Publication History Version Description Date Author Approved 1.0 New Design 2018.08.31 Tyler Sunny 2.0 Update Product Appearance 2019.07.30 Tyler Sunny Update Acoustical&Electrical 2019.11.28 Characteristics &Package Information Tyler Sunny 3.0 4.0 Update Document Template 2021.03.31 Zamp Jenny 5.0 Update Acoustical Performance and Curve in Section 3 2021.06.01 Zamp Jenny 6.0 Update the Logo to Goermicro 2021.08.20 Pauline Roy 7.0 Add 1.536MHz Mode Performance 2021.09.23 Pauline Roy 8.0 Update Clock Range in Section 3.5 2022.12.16 Zamp Roy Version：8.0 Confidential in Goermicro, shall not be spread if not be privileged. page 2/18 Confidential Degree : Confidential Contents 1 Introduction 2 Test Condition 3 Acoustical and Electrical Characteristics 4 4 4 3.1 Standard Performance Mode 4 3.2 Frequency Response Curve and Limits 5 3.3 Low Power Mode 6 3.4 Performance Curve 6 3.5 General Microphone Specification 7 3.6 Micronphone Interface Specifications 7 4 Measurement Circuit 5 Test Setup Drawing 6 Mechanical Characteristics 9 9 10 6.1 Appearance Drawing 10 6.2 Weight 10 7 Reliability Test 11 7.1 Vibration Test 11 7.2 Drop Test 11 7.3 Temperature Test 11 7.4 Humidity Test 11 7.5 Mechanical Shock Test 11 7.6 Thermal Shock Test 11 7.7 Reflow Test 11 7.8 ESD Shock Test 8 Package 11 12 8.1 Tape Specification 12 8.2 Reel Dimension 13 8.3 The Content of Box 13 8.4 Packing Explain 14 9 Storage and Transportation 10 Land Pattern Recommendation 14 15 10.1 The Pattern of MIC Pad 15 10.2 Recommended Soldering Surface Land Pattern 15 11 Soldering Recommendation 16 11.1 Soldering Machine Condition 16 11.2 The Drawing and Dimension of Nozzle 16 11.3 Reflow Profile 17 12 Cautions When Using MEMS MIC 18 12.1 Board Wash Restrictions 18 12.2 Sound Hole Productions 18 12.3 Ultrasonic Restrictions 18 13 Output Inspection Standard 18 Version：8.0 Confidential in Goermicro, shall not be spread if not be privileged. page 3/18 Confidential Degree : Confidential 1 Introduction: MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, laptop computers, and other portable electronic devices etc. 2 Test Condition (L=50 cm) StandardConditions (As IEC 60268-4) Air pressure Humidity Temperature Environment Conditions +15℃～+35℃ 25％RH～75%RH 86kPa～106kPa Basic Test Conditions +20℃±2℃ 60％RH～70%RH 86kPa～106kPa 3 Acoustical and Electrical Characteristics 3.1 Standard Performance Mode (Test Condition: VDD=1.8V, fCLK =2.4MHz,Decimation=64X) Item Symbol Test Conditions Min Typ Max Unit Sensitivity S f=1kHz, Pin=1Pa -27 -26 -25 dBFS (Note 1) I No load - 560 650 μA S/N Ratio SNR f=1kHz, Pin=1Pa A-Weighted Curve - 65 - dB Distortion THD THD