SD28OB341-015

Confidential Degree：Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : Goermicro Model : SD28OB341-015 Goermicro 10644 Pauline Zhao CHKD Hubery Zhang 2021.11.04 STANDARD Angela Kong 2021.11.04 APVD Roy Wang 2021.11.04 2021.11.04 013 2551 2728 ISO14001:2004 ISO9001:2008 Version：1.0 DESIGN Tel : + 86 536 3051234 E- Mail : goermicro@goermicro.com Website: http://www.goermicro.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C. ISO/TS16949:2009 013 CUSTOMER APPROVAL Confidential in Goermicro, shall not be spread if not be privileged page 1/17 Confidential Degree：Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of Goermicro Inc. and should not be disclosed to any third party without the written consent of Goermicro Inc.. 2 Publication History Version Description Date Author Approved 1.0 New Design 2021.11.04 Pauline Roy Version：1.0 Confidential in Goermicro, shall not be spread if not be privileged page 2/17 Confidential Degree：Confidential Contents 1 Introduction 2 Test Condition 3 Acoustic and Electrical Characteristics 4 4 4 4 3.1 Standard Mode 3.2 Low Power Mode 5 3.3 DC offset Performance 5 3.4 Frequency Response Curve and Limits 5 3.5 Performance Curve 6 3.6 Microphone Interface Specifications 6 3.7 Genal Microphone Specifications 7 4 Measurement Circuit 5 Test Setup Drawing 6 Mechanical Characteristics 6.1 Appearance Drawing 8 8 9 9 9 6.2 Weight 7 Reliability Test 10 7.1 Vibration Test 10 7.2 Drop Test 10 7.3 Temperature Test 10 7.4 Humidity Test 10 7.5 Mechanical Shock Test 10 7.6 Thermal Shock Test 10 7.7 Reflow Test 10 7.8 Electrostatic Discharge Test 10 8 Package 11 8.1 Tape Specification 11 8.2 Reel Dimension 12 8.3 The Content of Box 12 8.4 Packing Explain 13 9 Storage and Transportation 13 10 Land Pattern Recommendation 14 10.1 Recommended Land Pattern 14 10.2 Recommended Solder Stencil Pattern 14 11 Soldering Recommendation 15 11.1 Soldering Machine Condition 15 11.2 The Drawing and Dimension of Nozzle 15 11.3 Reflow Profile 16 12 Cautions 17 12.1 Board Wash Restrictions 17 12.2 Ultrasonic Restrictions 17 12.3 Acoustic Port Protection 13 Output Inspection Standard Version：1.0 Confidential in Goermicro, shall not be spread if not be privileged 17 17 page 3/17 Confidential Degree：Confidential 1 Introduction: MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, laptop computers, and other portable electronic devices etc. 2 Test Condition (VDD=1.8V, fCLK =3.072MHz/1.536MHz/768kHz, L=50 cm) StandardConditions (As IEC 60268-4) Air pressure Humidity Temperature Environment Conditions +15℃～+35℃ 25％RH～75%RH 86kPa～106kPa Basic Test Conditions +20℃±2℃ 60％RH～70%RH 86kPa～106kPa 3 Acoustic and Electrical Characteristics 3.1 Standard Mode （Test Condition：VDD=1.8V, fCLK=3.072MHz,Decimation=64X） Item Symbol Sensitivity Current Consumption (Note 2) Test Conditions Min Typ Max Unit dBFS S 94dBSPL@1kHz -35 -34 -33 (Note 1) I fCLK=3.072MHz - 800 1000 μA 69 - dB 122 - dB SPL S/N Ratio SNR 94dBSPL@1kHz A-Weighting Distortion THD THD