Confidential Degree：Confidential
Specification of SMD
Digital Microphone
(RoHS Compliance & Halogen Free)
Customer Name :
Customer Model :
Goermicro Model : SD18OB371-077
10644
ISO/TS16949:2009
013
013
2551
2728
ISO14001:2004
ISO9001:2008
Version：5.0
Tel : + 86 536 3051234
E- Mail : goermicro@goermicro.com
Website: http://www.goermicro.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
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Restricted
1 Security Warning
The information contained in this document is the exclusive property of Goermicro
Inc. and should not be disclosed to any third party without the written consent of
Goermicro Inc.
2 Publication History
Version
Description
Date
Author
Approved
1.0
New Design
2019.07.29
Hubery
Sunny
2.0
Update the interface information in 3.4
& Note3
2019.11.19
Update acoustic port protection in 12.3
Hubery
Sunny
3.0
Add low power mode characteristics
@1.024MHz in 3.2
Update Clock Rise/Fall Time in 3.4
2020.07.02
Zamp
Sunny
4.0
Update Document Template,
Update THD Performance
2021.06.08
Zamp
Jenny
5.0
Update the Logo to Goermicro
2021.08.25
Enoch
Roy
Version：5.0
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Contents
1 Introduction
2 Test Condition
3 Acoustic and Electrical Characteristics
3.1 Standard Mode
4
4
4
4
3.2 Low Power Mode
4
3.3 Frequency Response Curve and Limits
5
3.4 Microphone Interface Specifications
6
3.5 Genal Microphone Specifications
4 Measurement Circuit
5 Test Setup Drawing
6 Mechanical Characteristics
6.1 Appearance Drawing
6
8
8
9
9
9
6.2 Weight
7 Reliability Test
10
7.1 Vibration Test
10
7.2 Drop Test
10
7.3 Temperature Test
10
7.4 Humidity Test
10
7.5 Mechanical Shock Test
10
7.6 Thermal Shock Test
10
7.7 Reflow Test
10
7.8 Electrostatic Discharge Test
10
8 Package
11
8.1 Tape Specification
11
8.2 Reel Dimension
12
8.3 The Content of Box
12
8.4 Packing Explain
13
9 Storage and Transportation
13
10 Land Pattern Recommendation
14
10.1 Recommended Land Pattern
14
10.2 Recommended Solder Stencil Pattern
14
11 Soldering Recommendation
15
11.1 Soldering Machine Condition
15
11.2 The Drawing and Dimension of Nozzle
15
11.3 Reflow Profile
16
12 Cautions
17
12.1 Board Wash Restrictions
17
12.2 Ultrasonic Restrictions
17
12.3 Acoustic Port Protection
17
13 Output Inspection Standard
Version：5.0
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17
page 3/17
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1 Introduction
MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be
used in SMT process. It is widely used in telecommunication and electronics device such as
mobile phone, laptop computers, and other portable electronic devices etc.
2 Test Condition (VDD=1.8V, fCLK=2.4MHz/768kHz/1.024MHz, L=50 cm)
StandardConditions
(As IEC 60268-4)
Air pressure
Humidity
Temperature
Environment Conditions
+15℃～+35℃
25％RH～75%RH
86kPa～106kPa
Basic Test Conditions
+20℃±2℃
60％RH～70%RH
86kPa～106kPa
3 Acoustic and Electrical Characteristics
3.1 Standard Mode
（Test Condition：VDD=1.8V, fCLK=2.4MHz,Decimation=64X）
Item
Symbol
Sensitivity
S
Current Consumption
I
(Note 2)
Test Conditions
94dBSPL@1kHz
Min
Typ
Max
Unit
dBFS
-38
-37
-36
(Note 1)
-
800
1000
μA
fCLK=2.4MHz
S/N Ratio
SNR
94dBSPL@1kHz A-Weighting
-
66
-
dB
Distortion
THD
1%THD@1kHz
-
127
-
dB SPL
Acoustic Overload Point
AOP
10% THD@1kHz，S=Typ
-
132
-
dB SPL
Power Supply Rejection
PSR
100mVpp Squarewave
@217Hz A-weighting
-
-101
-
dBFS
Low Frequency Roll-off
LFRO
-3dB corner refrence to
1kHz sensitivity
25
35
45
Hz
Min
Typ
Max
Unit
-21
-20
dBFS
(Note 1)
-
-
300
μA
-
dB
3.2 Low Power Mode
（Test Condition：VDD=1.8V, fCLK=768kHz,Decimation=64X）
Item
Symbol
Sensitivity
Current Consumption
(Note 2)
Test Conditions
S
94dBSPL@1kHz
I
fCLK=768kHz
-22
S/N Ratio
SNR
94dBSPL@1kHz A-Weighting
-
66
Distortion
THD
1%THD@1kHz
-
112
Acoustic Overload Point
AOP
10% THD@1kHz，S=Typ
-
117
-
dB SPL
Power Supply Rejection
PSR
100mVpp Squarewave
@217Hz A-weighting
-
-83
-
dBFS
Version：5.0
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dB SPL
page 4/17
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（Test Condition：VDD=1.8V, fCLK=1.024MHz,Decimation=64X）
Item
Test Conditions
Min
Typ
Max
S
94dBSPL@1kHz
-22
-21
-20
(Note 1)
I
fCLK=1.024MHz
-
-
350
μA
Symbol
Sensitivity
Current Consumption
(Note 2)
Unit
dBFS
S/N Ratio
SNR
94dBSPL@1kHz A-Weighting
-
66
-
dB
Distortion
THD
1%THD@1kHz
-
112
dB SPL
Acoustic Overload Point
AOP
10% THD@1kHz，S=Typ
-
117
-
dB SPL
Power Supply Rejection
PSR
100mVpp Squarewave
@217Hz A-weighting
-
-83
-
dBFS
3.3
Frequency Response Curve and Limits
Typical Free Field Response
Normalized to 1kHz
Standard Mode VDD=1.8V, fCLK =2.4MHz, Decimation Rate=64x
Relative Response (dB)
+15
+10
+5
+3
+3
+3
+3
-3
-3
-3
-3
0
-5
-10
-15
-20
100
300
500
900 1k 1.1k
3k
Frequency (Hz)
5k
8k 10k
20k
Typical Free Field Response
Normalized to 1kHz
Low Power Mode VDD=1.8V, fCLK =768kHz, Decimation Rate=64x
Relative Response (dB)
+15
+10
+5
+3
+3 +3
-3
-3
+3
0
-5
-3
-3
-10
-15
-20
100
Version：5.0
200
300
500
1k 1.1k
Frequency (Hz)
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3k
5k
8k
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3.4 Microphone Interface Specifications
Typ
Max
Unit
0.65XVDD
-
VDD+0.3
V
VIL
-0.3
-
0.3XVDD
V
Output Logic High Level
VOH
0.65XVDD
-
VDD+0.3
V
Output Logic Low Level
VOL
-0.3
-
0.3XVDD
V
40
-
60
%
250
nS
50
nS
Item
Symbol
Input Logic High Level
VIH
Input Logic Low Level
Test Conditions
Clock Duty Cycle
Min
Clock Low Power Mode
Rise/Fall
Standard Mode
Time
tRF
Delay Time for Data
Driven, VDD = 1.8V
tDD
Delay time from CLOCK edge
to DATA driven.
18
-
50
nS
Delay Time for Data
High-Z, VDD = 1.8V
tHZ
Delay time from CLOCK edge
to DATA high impedance
state.
5
-
16
nS
tDV
Delay time from CLOCK edge
to DATA valid
(0.70 x VDD)
-
-
100
nS
Min
Typ
Max
Unit
1.62
-
3.6
V
0
-
150
kHz
0.25
0.768
1.2
MHz
1.45
-
4.8
MHz
Delay Time for Data
Valid
3.5 General Microphone Specifications
Item
Symbol
Supply Voltage
Test Conditions
VDD
Standby Mode
Clock
Frequency Low Power Mode
Range
Standard Mode
Omni-directional
Directivity
Increasing density of 1's
Increasing Sound
Polarity
Data Format
Short Circuit Current
Output Load
Capacitance on DATA
Start-up Time
Restart Time
Mode-Switch Time
Version：5.0
½ Cycle PDM 1bit
Grounded Data Pin
Cload
Time to start up in either modes
(Low Power- and Normal Mode)
after VDD and CLOCK have
been applied.
Time to start up in either modes
(Low Power- and Normal Mode)
after VDD has been off for more
than 10ms, while CLOCK
remained on.
Time to switch between modes
(Clock off- Low Power-, and
Normal Mode). VDD remains on
during the mode switch.
-
-
20
mA
-
-
140
pF
-
-
50
ms
-
-
50
ms
-
-
50
ms
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Note 1. dBFS = 20xlog (A/B) where A is the level of the signal, B is the level that corresponds
to Full-scale level.
Note 2. The current consumption depends on the applied Clock Frequency and the load on
the DATA output.
Note 3. Timing
tEDGE
VIH MIN
CLOCK
VIL MAX
DATA 1
L/R=GND
DATA 1
VALID
tHZ
tDV
tDD
HIGH Z
DATA 1
VALID
tDD
DATA 2
L/R=VDD
Version：5.0
HIGH Z
DATA 2
VALID
HIGH Z
HIGH Z
tDV
DATA 2
VALID
DATA 1
VALID
tHZ
HIGH Z
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4 Measurement Circuit
Term.5
VDD +
Term.2
L/R
Amp
ΣΔ
Modulator
Term.1
DATA
Select
Term.4
CLK
Charge
Pump
1μF
ASIC
Term.3
GND
MEMS MIC
5 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
AP525
50cm Speaker
MIC
Input
Output
Remote Control
PDM Line Driver
Turn Table
Anechoic Room
Version：5.0
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6 Mechanical Characteristics
6.1 Appearance Drawing (Unit: mm)
W
H
Mark
0.125
4*0.725
4*0.522
0.950
L
1.040 1.513
G W W D
Y L L L
AP
R0.28
5
1
4
2
0.300
Ø1.025
3
Ø1.625
1.325
Identification
Number
Side View
Top View
Pin Output
1
2
DATA
L/R
3
4
GND
CLK
5
VDD
Bottom View
ITEM
Function
Pin#
AP
DIMENSION TOLERANCE UNTIS
LENGTH(L)
3.50
±0.10
mm
WIDTH(W)
2.65
±0.10
mm
HEIGHT(H)
0.98
±0.10
mm
ACOUSTIC PORT(AP)
Ø0.325
±0.05
mm
Note: 1. Tolerance ±0.1 unless otherwise specified.
2. Identification Number Convention: Job Identification Number.
Identification
Number
GWWD
Y LLL
G : Goermicro W W :Week
Y
:Year
L L L
D
:Day
: Serial Number
2D Code
6.2 Weight
The weight of the MIC is Less than 0.05g.
Version：5.0
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7 Reliability Test
7.1
Vibration
Test
7.2
Drop
Test
To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each
direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary
within ±3dBFS from initial sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5
meter height in state of JIG,JIG weight of 100g, sensitivity should vary within ±3dBFS from
initial sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dBFS from initial
sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.3
Temperature
b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dBFS from initial
Test
sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.4
Humidity
Test
After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary
within ±3dBFS from initial sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in
7.5
each
direction (for six axes in total) along each of the three mutually perpendicular axes
Mechanical
for a total of 18 shocks, sensitivity should vary within ±3dBFS from initial sensitivity.
Shock Test
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds)
7.6
32
cycles, sensitivity should vary within ±3dBFS from initial sensitivity.
Thermal
(The
measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
Shock Test
7.7
Reflow
Test
Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within
±2dBFS from initial sensitivity.
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.8
Under C=150pF, R=330ohm.
Electrostatic Air discharge to case with±8kV and contact discharge to I/O terminals with±2kV , 10 times,
Discharge Grounding. Sensitivity should vary within ±3dBFS from initial sensitivity.
Test
Version：5.0
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8 Package
8.1 Tape Specification
P0
ØD0
E
P2
A
W
F
A
B
G W W D
Y L L L
B
P1
Pin 1#
(DATA)
ØD1
B-B
A-A
T
10°
10°
B0
A0
K0
The Dimensions as Follows:
ITEM
W
E
F
ØD0
K0
DIM(mm)
12.0±0.30
1.75±0.10
5.5±0.05
1.50+0.10
0
1.30±0.10
ITEM
P0
10P0
P1
A0
B0
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
2.85±0.05
3.75±0.05
ITEM
P2
T
DIM(mm)
2.00±0.05
0.30±0.05
Version：5.0
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8.2 Reel Dimension
7'' reel for sample stage
13'' reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
inner side
DETAIL A
A
1.9±0.4
Ø100±0.5
Ø330(max)
Ø21±0.4
Ø13±0.2
120°
8.3 The Content of Box(13'' reel)
Packing (5,000PCS)
Antistatic Bag
(5,000PCS)
Two Inner Box(50,000PCS)
Version：5.0
5 Antistatic Bags
(25,000PCS)
Inner Box(25,000PCS)
(340mm 135mm 355mm)
Outer Box(50,000PCS)
(370mm 300mm 390mm)
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8.4 Packing Explain
8.4.1 The Label Content of the Reel
xx
xx x
xx
xx xxxx x
xx
x
x
xx xxx xxx
x
x
xx xxx
x
xx
The Content Includes:
Product type, Lot, Customer P/N;
and other essential information such as
Quantity, Date etc.
8.4.2 The RoHS Label
RoHS
RoHS HF
Compliance Mark
9 Storage and Transportation
9.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden
temperature change, acid air, any other harmful air or strong magnetic field.
Recommend storage period no more than 1 year and floor life(out of bag) at factory
no more than 4 weeks.
9.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please
protect products against moist, shock, sunburn and pressure during transportation.
9.3 Storage Temperature Range：-40℃～+70℃
9.4 Operating Temperature Range：-40℃～+70℃
Version：5.0
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10 Land Pattern Recommendation
10.1 Recommended Land Pattern(Unit:mm)
4-0.725
4-0.522
0.950
1.51
0.300
Ø1.025
Ø1.625
10.2 Recommended Solder Stencil Pattern(Unit:mm)
4-0.725
1.513
4-0.522
4-0.200
Version：5.0
0.950
0.300
Ø1.025
Ø1.625
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11 Soldering Recommendation
11.1 Soldering Machine Condition
8 zones
Temperature Control
Heater Type
Hot Air
Solder Type
Lead-free
11.2 The Drawing and Dimension of Nozzle
Inside Diameter: Ø1.0mm;
Acoustic Port：Ø0.325mm；
Vacuum Degree of Nozzle：-80k~-90kPa；
Please don't vacuum over the acoustic port directly.
Please don't blow the acoustic port directly.
0.500（Typ）
0.500（Typ）
PICK AREA
Ø1.0
Version：5.0
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11.3 Reflow Profile
Temp. °C
Tp
Max. Ramp-up rate = 3°C/s
Max. Ramp-down rate = 6°C/s
TL
tp
tL
Tsmax
Preheat area
Tsmin
ts
25
time 25°C to peak
Time. sec
Key Features of The Profile:
Average Ramp-up rate(Tsmax to Tp)
3°C/s max.
Preheat :
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(Tsmin to Tsmax)(ts)
150°C
200°C
60~180s
Time maintained above :
Tempreature(TL)
Time(tL)
217°C
60~150s
Peak Temperature(Tp)
260°C
Time within 5°C of actual Peak Temperature(tp) :
30~40s
Ramp-down rate(Tp to Tsmax)
6°C/s max
Time 25°C to Peak Temperature
8min max
When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
Version：5.0
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12 Cautions
12.1 Board Wash Restrictions
It is very important not to wash this microphone, otherwise this could damage the
microphone.
12.2 Ultrasonic Restrictions
It is very important not to use ultrasonic process. otherwise this could damage the
microphone.
12.3 Acoustic Port Protection
It is very important not to operate vacuum and air blow into acoustic port(without any
covering over acoustic port), otherwise this could damage the microphone.
And it is necessary to be careful about foreign substances into acoustic port .Please
add protection material (e.g. PET ) on the acoustic hole to protect it after SMT , refer
to below pictures, take it away before test, then attach it again until the end of
assembly.
It is very important to keep the distance between MIC and cutting area as far as
possible to avoid the cutting stive entering into MEMS, otherwise this could
contaminate the microphone.
Protection Material
PCBA
Solder
MIC
Acoustic Hole
13 Output Inspection Standard
Output inspection standard is executed according to .
Version：5.0
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