B3DJ3BGR-05C000113U1930

Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 Harvatek Surface Mount CHIP LEDs Data Sheet B3DJ3BGR-05C000113U1930 (Preliminary) Features •Support control circuit to be integrated with RGB chips into a single package •Support signal reshaping to pass control waveforms to next adjacent ALED. •Cascading port transmission by a single data line •Support BI backup input data line to prevent data input failure from malfunction DI line •Optional- Optional maximal drive current: 5mA •256-step gray-scale output to allow 16,777,216 color display •Support 18-level current gain control for R/G/B channels •Support sleep and wake up mode (patent granted) •Built-in power-on-reset (1.7V) (@VDD=5V) •Built-in brown-out reset (1.8V) (@VDD=5V) •Operating voltage 3.3~5.5V Applications •Gaming keyboard •Decorative LED lighting •LED video display 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 1/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 DISCLAIMER ......................................................................................................................................... 3 LIFE SUPPORT POLICY ............................................................................................................. 3 PRODUCT SPECIFICATIONS............................................................................................................. 4 ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ............................................... 4 LABEL SPECIFICATIONS ................................................................................................................... 5 SPECIFICATIONS RANGE .................................................................................................................. 6 PRODUCT FEATURES ......................................................................................................................... 7 ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 7 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW SOLDERING ............................................................................................................................. 7 ELECTRICAL CHARACTERISTICS ................................................................................................. 8 APPLICATION CIRCUIT ............................................................................................................................... 8 DATA TRANSFER PROTOCOL ..................................................................................................................... 9 PRECAUTION FOR USE .................................................................................................................... 10 PACKAGING .........................................................................................................................................11 TAPE DIMENSION ................................................................................................................... 11 REEL DIMENSION ................................................................................................................... 12 PACKING ............................................................................................................................... 12 DRY PACK ............................................................................................................................ 13 BAKING................................................................................................................................. 13 PRECAUTIONS ....................................................................................................................... 13 REFLOW SOLDERING ...................................................................................................................... 14 REWORKING .......................................................................................................................... 14 CLEANING ............................................................................................................................. 14 CAUTIONS OF PICK AND PLACE .............................................................................................. 15 REVISE HISTORY ................................................................................................................... 15 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 2/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 3/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 Product Specifications Item Specification Luminous Red : 40~120 mcd Intensity(Iv) Green : 60~180 mcd Material Quantity Blue : 15~60 mcd IC@5V, R/G/B@5mA O Ts= 25 C; Tolerance ±10% Red : 618~630 nm Wavelength Green : 518~535 nm Blue : 460~472 nm IC@5V, R/G/B@5mA O Ts= 25 C; Tolerance ±10% Applied voltage 5V_DC View angle 120 Resin Clear o Epoxy Carrier tape Conductive black tape Reel Conductive black 3000 ea/reel Label HT standard Paper Packing bag 250x230mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 4/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 Label Specifications ■Harvatek P/N: B 3DJ 3 BGR- 05C- 0001 Product Package Dice Q’ty Color Current Series Number PCB 2.0(L)x2.0(W)x0.9(H) mm 3:Tri RGB R/G/B:5mA X001~XZZZ 13 Taping 1.Taping style 2. Q’ty RGB(Full Color) ■ Lot No.: 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 5/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 Specifications Range ■Luminous Intensity (Iv) : Color Spec. Range R 40-120 mcd G 60-180 mcd B 15-60 mcd Note: It maintains a tolerance of ±10% on luminous intensity ■Wavelength : Color Spec. Range R 618-630 nm G 518-535 nm B 460-472 nm Note: It maintains a tolerance of ±0.5nm on Wavelength Bin 7 Official Product HT Part No. B3DJ3BGR-05C000113U1930 Tentative Product **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. **************** 04/12/2022 Preliminary Page 6/15 Top view IC+RGB Chip LED B3DJ3BGR-05C000113U1930 Product Features Electro-Optical Characteristics o (TSoldering , 25 C) Wavelength λ(nm) Series Emitting Color B3DJ3GRB Material IV(mcd) λD λP △λ Typical Viewing Angle R AllnGaP 620 629 18 65 120 G InGaN 523 518 35 85 120 B InGaN 464 460 25 20 120 2 1 2 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/-0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction. Absolute Maximum Ratings ( TSoldering 25 ℃) Characteristic Symbol Rating Unit VDD 6.5 V PD