B3SK3RGB-F6C0001HOU1930

Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 B3SK3RGB-F6C0001HOU1930 Features(產品特色) •Package: RGB 3 in 1 package/4pin Polarity (封裝方式：RGB三色封裝/4極性點) •Anti-Reflection resin 啞光膠體 •View angle : >=120ﾟ (min 50% brightness) 發光角度：大於等於120度﹝50%光強度﹞ •Component solder able surface finish is gold 元件可銲接表面為鍍金板 •High contrast 高對比性 Main Applications(主要應用) •Indoor display (室內顯示幕) •Full color display(全彩顯示幕) •Fine pitch application(細間距應用) ` Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 1/19 www.harvatek.com Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 DISCLAIMER 免責聲明 .................................................................................................................... 3 PRODUCT SPECIFICATIONS 產品規格 ............................................................................................... 4 ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION 靜電放電保護 ................................................. 5 LABEL SPECIFICATIONS 標籤規格 ..................................................................................................... 6 SPECIFICATIONS RANGE 規格範圍 ................................................................................................... 8 PRODUCT FEATURES 產品特色 ........................................................................................................ 9 ELECTRO-OPTICAL CHARACTERISTICS 光學特性.......................................................................................... 9 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW SOLDERING 封裝外形尺寸與建 議的焊盤尺寸 ..................................................................................................................................... 9 ABSOLUTE MAXIMUM RATINGS 絕對最大額定值 .................................................................................. 10 CHARACTERISTICS OF B3SK3RGB-F6 ..................................................................................................... 11 PRECAUTION FOR USE 使用注意事項 ............................................................................................ 13 PACKAGING 包裝........................................................................................................................... 14 TAPE DIMENSION 捲帶尺寸................................................................................................................ 14 REEL DIMENSION 捲盤尺寸 ................................................................................................................ 15 PACKING 包裝方式 .......................................................................................................................... 15 DRY PACK 乾燥包裝方法 ............................................................................................................... 16 BAKING 烘烤 ................................................................................................................................... 16 PRECAUTIONS 注意事項................................................................................................................ 17 REFLOW SOLDERING 迴流焊.......................................................................................................... 17 REWORKING 重工 ............................................................................................................................. 18 CLEANING 清潔 ................................................................................................................................ 18 REVISE HISTORY 修改記錄 ................................................................................................................. 19 Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 2/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 DISCLAIMER(免責聲明) HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. (宏齊不需任何通知並保留隨時更改任何產品的權利，包含提高可靠度、功能或設計。宏齊於此 不需承擔任何在應用面或是任何產品或是設計電路上的責任，即便是表達任何專利權或是其他權 責) Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 3/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Product Specifications(產品規格) Specification Material Quantity (規格) (材質) (數量) Luminous Red : 28 mcd typical Intensity(Iv) Green : 37 mcd typical (發光強度) Blue : 7 mcd typical O R@5mA;G/B@2mA/ Ts= 25 C; Tolerance ±10% Wavelength Red : 621 nm typical (波長) Green : 531 nm typical Blue : 470 nm typical O R@5mA;G/B@2mA/ Ts= 25 C;Tolerance ± 0.5nm Vf Red : 2.4 V maximum (順向電壓) Green : 3.1 V maximum Blue : 3.1 V maximum O R@5mA;G/B@2mA/ Ts= 25 C;Tolerance ± 0.05V Ir < =1 µA @ VR = 5 V (逆向電流) Resin Dark Epoxy (樹脂) (黑) (環氧樹脂) Carrier tape EIA 481-1A specs (EIA 481-1A 規格) Conductive black tape 24000pcs/reel (黑色導電捲帶) (24000 顆/捲) (載帶) Reel EIA 481-1A specs (EIA 481-1A 規格) (捲帶) Conductive black (黑色導電帶) Label HT standard Paper (標籤) (宏齊規範) (紙) Packing bag 250x230mm Aluminum laminated One reel per bag bag/Zipper (每一包裝袋一捲) (包裝袋) (鋁箔帶/有拉鍊) Carton HT standard Paper Non-specified (紙箱) (宏齊規範) (紙) 無指定 Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 4/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Others: Each immediate box consists of 28 reels. The 28 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label. (每一中箱有 28 捲捲帶，28 捲的捲帶不一定有一致的亮度、波長、順向偏壓或是批號。每一份捲帶都有其標籤定 義出規格) Note :This is shipped test conditions (註：此為出廠檢驗條件) ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. (※備註：產品應於順向偏壓下操作，假如長期使用於逆向偏壓下可能形成電致遷移導致 LED 損壞。) ATTENTION: Electrostatic Discharge (ESD) protection (注意！！靜電放電保護) The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. (左圖為須做靜電保護標誌。晶片中磷化鎵和砷化鋁鎵即便是在有相當安全的靜電放電的措施下，對於 ESD 的 保護還是必要的。建構於磷化鋁銦鎵、氮化鎵或氮化銦鎵的晶片都是靜電敏感元件。在設計與組件中作的靜電保 護都是必須的。 假設人工作業程序是必須的，須確保設備製程是擁有靜電保護的程序) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 5/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Label Specifications(標籤規格) 日期 數量 客戶品號 宏齊品號 批次 光強度 波長 順向電壓 ■Harvatek P/N: (宏齊品名) B 3SK 3 Product Dice PCB 3:Tri RGB- F6C 0001 HO Current U1930 Taping R:5mA 1.Taping style 2. Q’ty G/B:2mA Package Color Series Number 0.95(L)x0.95(W)x0.65(H) mm RGB(Full Color) X001~XZZZ Customer Code Customer Product Code X0001~XZZZZ Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 6/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930  Lot No.(批次) 1 2 3 4 5 6 7 8 9 10 1 7 N E 4 1 L N 1 1 Code 3 Code 4 Code 5 Code 6 Code 7 Code 8 Code 9 Code 10 Code 1 2 Mfg.Year Mfg.Month Consecutive number Internal Tracing Code Mixing Lot No. 2010-A 2011-B 2012-C 2013-D 2014-E . 1:Jan 2:Feb …… A:Oct B:Nov . C:Dec Special code 01~ZZ 000~ZZZ . Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 7/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Specifications Range(規格範圍) ■Luminous Intensity (Iv) Bin:(發光強度分級) Luminous Intensity (Iv) Bin: R@5mA;G/B @2mA HT-B3SK3RGB Series IV Red Green Blue HF2 19 24 HG1 24 30 HB2 4.8 6 HF3 21.3 26.7 HG2 26.7 33.5 HB3 5.4 6.8 HG1 24 30 HG3 30 37.5 HC1 6 7.5 HG2 26.7 33.5 HH1 33.5 42 HC2 6.8 8.5 HG3 30 37.5 HH2 37.5 47 HC3 7.5 9.4 HH1 33.5 42 HH3 42 52.5 HD1 8.5 10.7 Note: It maintains a tolerance of ±10% on Luminous Intensity (註：存有 10%的發光強度公差) Dominant Wavelength (λD) Bin:(主波長分級) HT-B3SK3RGB Series WD Red Green Blue RH2 618 623 GH1 526 530 BH1 464 468 RH3 623 628 GH2 528 532 BH2 466 470 RH4 628 633 GH3 530 534 BH3 468 472 GH4 532 536 BH4 470 474 GH5 534 538 Note: It maintains a tolerance of ±0.5nm on Color Bin (註：存有±0.5nm 的公差) Forward Voltage (Vf) Bin:(順向偏壓分級) HT-B3SK3RGB Series Vf Red E18 Green 1.6 2.4 F2A 2.1 Blue 3.1 F2A 2.1 3.1 Note: It maintains a tolerance of ±0.05V on forward voltage measurements (註：存有±0.05V 的公差) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 8/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Product Features(產品特色) Electro-Optical Characteristics(光學特性) ( TSoldering , 25 ℃)(焊接溫度 25 度) Emitting Part number Color (品號) (發光色) B3SK3RGB-F6C0001HOU1930 Forward Wavelength Voltage(VF) (nm) typ. (順向偏壓) (波長) * I V(mcd) Viewing 光強度 Angle 2θ1/2 (發光角) typ. max. λD λp Δλ typ. Ultra Bright Red 1.9 2.4 621 630 11 28 140 Green 2.5 3.1 530 521 28 37 140 Blue 2.5 3.1 471 467 16 7 140 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (封裝外形尺寸與建議的焊盤尺寸) Unit: mm Tolerance: +/-0.1 (單位：誤差為+/-0.1 毫米) Outline Dim.(外形尺寸) Soldering Pattern(焊接圖面) Soldering terminals may shift in the x, y direction.(焊點可能會隨 x ,y 方向偏移) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 9/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Absolute Maximum Ratings(絕對最大額定值) o (TS 25 C) o o Series PD (mW) IF (mA) IFP (mA) VR TOP ( C) TST ( C) (系列) (消耗功率) (順向電流) (脈衝順向電流) (反向電壓) (操作溫度) (儲存溫度) Color Pulse Forward Current Reverse Voltage Storage Forward Current Operation Power Dissipation Temperature Temperature 20 5 -30~+80 -40~+85 Red Blue/Green 24.4 5 2 ** Condition for IFP is pulse of 1/10 duty and 0.1msec width (IFP 的脈衝條件為 1/10 占空比與 0.1m 秒脈衝寬度) Remarks:This product should be operated in forward bias.If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. 此產品應於正向操作，若連續施加反向電壓或電流，易造成 LED 損壞 Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 10/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Characteristics of B3SK3RGB-F6 Relative Intensity vs. Forward Current (相對光強度與順向電流變化圖) Forward Voltage vs. Forward Current (順向偏壓與順向電流對應圖) Forward Current vs. Ambient Temperature (順向電流與環境溫度變化圖) Wavelength vs. Forward Current (波長與順向電流變化圖) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 11/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Radiation Diagram(發光角度圖) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 12/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Precaution for Use(使用注意事項) 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc.(晶片不可被直接用於任何液體，例如水、油、有機溶劑等等) 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation.(使用此 LED 前，應在操作前先確認環境的最高溫度) 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. (LEDS 應存於一個乾淨的環境。如使用後要保存超過三個月的時間，需在有氮氣中的密閉空 間下) 4. The LEDs must be used within seven days after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. (LED 必須在開封後七天內使用。未使用的產品必須被重新包裝在防靜電包裝內，折疊封閉任 何開口，並存放在乾燥、陰涼的空間) 5. The appearance and specifications of the products may be modified for improvement without further notice. (產品的外觀和規格可能被修改或改善，恕不另行通知。) 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs. If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current. (LED 對靜電敏感。強烈建議在處理 LED 時要使用接地手環，防靜電手套。當電壓超過絕對 最大額定值，會損壞 LED。損壞的 LED 會顯示一些異常特徵，如漏電流顯著增加，較低的導 通電壓，並在低電流下不亮。) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 13/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Packaging(包裝) Tape Dimension(捲帶尺寸) Dim. A (尺寸 A) Dim. B (尺寸 B) Dim. C (尺寸 C) Q’ty/Reel (數量/1 捲) 1.10±0.05 1.12±0.05 0.75±0.05 24K Unit: mm(單位：毫米) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 14/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Reel Dimension(捲盤尺寸) Packing(包裝方式) 28 28 boxes per carton is available depending on shipment quantity. (裝貨量每一紙箱可裝載 28 袋) Official Product HT Part No. B3SK3RGB-F6C0001HOU1930 Customer Part No. Tentative Product **************** **************** Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 01/09/2020 Version 1.0 Data Sheet No. Page 15/19 Top Mount RGB Chip LED B3SK3RGB-F6C0001HOU1930 Dry Pack(乾燥包裝方法) All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. (表面黏著光學元件是對濕氣敏感的。每個捲軸被包裝在防潮保護的防靜電袋裡，每袋發貨前需 密封，避免在任何時候運輸或儲存過程中接觸濕氣。) Upon request, a humidity indicator will be included in the moisture protected anti-static bag prior to shipment. (根據要求，會在出貨前將濕度指示卡裝入被受保護的防靜電袋裡) The packaging sequence is as follows: (包裝順序如下) Baking(烘烤) Baking before soldering is recommended when the package has been unsealed for 4weeks. (當包裝已開封四週,在焊接時建議先烘烤) The conditions are as followings: MBB open≤672hrs, 50±3℃×(3hrs) MBB open>672hrs, 60±3℃×(8~12hrs)and