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DEM23-32GIG1ECASH

DEM23-32GIG1ECASH

  • 厂商:

    INNODISK

  • 封装:

  • 描述:

    固态硬盘(SSD) FLASH - NAND(TLC) 32GB NVMe M.2 模块 3.3V

  • 数据手册
  • 价格&库存
DEM23-32GIG1ECASH 数据手册
Datasheet Datasheet M.2 (P30) M.2 (P30) 3TE7 series 3TE7 series - PCIe Gen. III x2, NVMe 1.3 - Excellent data transfer speed PCIe Gen. III x2, supported. NVMe 1.3 -- LDPC ECC engine DRAM-less Data Solution -- End-to-end Path Protection Hybrid Write Mode - Support Wide Temperature - LDPC ECC engine supported. - End-to-end Data Path Protection Introduction Innodisk M.2 (P30) 3TE7 is an NVM Express DRAM-less SSD designed as the standard M.2 form factor with PCIe interface. M.2 (P30) 3TE7 supports PCIe Gen III x2, and it is compliant with NVMe 1.3 providing excellent performance. Moreover, it adopts industrial 3D TLC NAND Flash providing high endurance and reliability. With sophisticated error detection and correction (ECC) functions, the module can ensure full End-to-end Data Path Protection that secures the data transmission between host system and NAND Flash. Innodisk M.2 (P30) 3TE7 is integrated with a PCIe Gen III x2, 4-channel controller, which support HMB making the SSD optimal for space-constrained IPCs and server boot-up applications. www.innodisk.com Contact us for more information about the M2 (P30) 3TE7. Innodisk is a service-driven provider of industrial embedded flash and DRAM storage products and technologies, with a focus on the cloud computing, industrial/embedded, and aerospace and defense industries. M.2 (P30) 3TE7 series Diagram 32GB-256GB Headquarters (Taiwan) 5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan Tel: +886-2-7703-3000 Email: sales@innodisk.com Branch Offices: USA usasales@innodisk.com +1-510-770-9421 Europe eusales@innodisk.com +31-40-3045-400 Japan jpsales@innodisk.com +81-3-6667-0161 China sales_cn@innodisk.com +86-755-21673689 www.innodisk.com © 2021 Innodisk Corporation. All right reserved. Specifications are subject to change without prior notice. 512GB 20211001 www.innodisk.com Specifications Interface Flash Type PCIe Gen. III x2 3D TLC P/E cycle 3,000 Capacity 32GB~512GB Max. Channels Sequential R/W (MB/sec, max.) Max. Power Consumption Thermal Sensor 4 1650/1350 1.6W(3.3V, 470mA) √ External DRAM buffer - H/W Write Protect - Dimension (WxLxH) 22.0 X 30.0 X 2.5* mm (*See detailed in mechanical draw ings) Vibration: 20G @7~2000Hz Environment Shock: 1500G @ 0.5ms Storage Temperature: -40°C ~ +85°C MTBF: 3,000,000 hour Ordering Information Operation Temp. Standard Grade Operation(0°C Temp. ~ +70°C) 32GB 64GB DEM2332GB 32GIG1ECASH 128GB DEM2364GB 64GIG1ECADH 256GB DEM23128GB A28IG1ECAQH 512GB DEM23256GB B56IG1ECAQH DEM23512GB C12IG1ECAQH Standard Grade DEM23DEM23DEM23DEM23DEM23Industrial Grade DEM23DEM23DEM23DEM23DEM23A28IG1ECADH B56IG1ECADH C12IG1ECADH 32GIG1ECADH 64GIG1ECADH (0°C ~ +70°C) A28IG1EWAQH B56IG1EWAQH C12IG1EWAQH 32GIG1ECASH 64GIG1EWADH (-40°C ~ +85°C) Industrial Grade (-40°C ~ +85°C) DEM2332GIG1ECADH DEM2364GIG1EWADH DEM23A28IG1EWADH DEM23B56IG1EWADH DEM23C12IG1EWADH Ordering Information www.innodisk.com
DEM23-32GIG1ECASH 价格&库存

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