MCI1608HQR22JHBPDG

PRODUCT SPECIFICATION DOCUMENT NO.000330XXXXXX DESCRIPTION MCI Series DRAWN BY DESIGNED BY CHECKED BY APPROVED BY 陳曉慧 陳宏銘 林庭煒 吳維政 Sharon Chen Addking Chen Tim Lin Albert Wu INPAQ TECHNOLOGY CO., LTD. RoHS Pb High Frequency Chip Ceramic Inductor (MCI Series) Engineering Specification This product belongs to the 3C and industrial grade standard, not for automotive application. If customer privately uses to automotive parts and results in any consequences, INPAQ is not responsible for after-sales service, thank you!  FEATURES     Particular ceramic material and coil structure provide high frequency application range up to 10GHz. Small size and low profile. Available in various sizes. Excellent solderability and heat resistance.  APPLICATIONS RF and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and low-voltage power supply modules.  SHAPES AND DIMENSIONS TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX TYPE 100505 (EIA 0402) L 1.000.10 W 0.500.10 T 0.500.10 E 0.10~0.30 Unit mm SPEC REV.: A13 Page 1 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD.  PART NUMBER CODE MCI 1005 1 2 1 2 3 4 5 HQ 3 22N 4 J 5 H 6 B 7 P 8 DG 9 Series Name Dimensions L*W HQ：material code Inductance(nH)：N means Decimal point , ex：1.0 nH = 1N0 Tolerance : B = ±0.1nH，C = ±0.2nH，S = ±0.3nH，G = ±2%，H = ±3%，J = ±5% 6 Mark：H = 1/8 Mark，M = 1/4 Mark，N = No Mark 7 Soldering : Green Parts，B= Lead-Free for whole chip 8 Packaging : P - Paper tape, 7" reel 9 INPAQ internal code  GENERAL TECHNICAL DATA Operating temperature range: - 55℃~ +125℃ Storage Condition: Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow  TEST INSTRUMENTS CONDITIONS Agilent E4991A/B RF Impedance Material Analyzer or equivalent with fixture 16197A or equivalent Agilent 4338B Milliohm meter Test Level：500mV TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 2 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD.  PART NUMBER AND CHARACTERISTICS TABLE Part No. MCI1005HQ22NJHBPDG Inductance Inductance Q Freq. (nH) Tolerance (Min.) (MHz) 22 ±5% 8 100 DCR S.R.F Rated () (MHz) Current Max. Min. (mA) Max. 0.70 1,900 300 ** For special part number which is not shown in the above table, please refer to appendix.  TYPICAL ELECTRICAL CHARACTERISTIC TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 3 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD.  PACKAGING SPECIFICATIONS  Type：Paper Carrier  Taping Dimension Unit：mm TYPE 1005 Symbol PAPER W 8.00±0.10 P 2.00±0.05 E 1.75±0.05 F 3.50±0.05 D 1.55±0.05 Po 4.00±0.10 P2 2.00±0.05 Ao 0.60±0.03 Bo 1.12±0.03 T 0.60±0.03 TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 4 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD.  REEL DIMENSION Type 7" A(mm) 10±1.5 B(mm) 50 or more C(mm) 13.2±1.0 D(mm) 178±2.0 7” Reel Packaging Quantity PART SIZE (EIA SIZE) 1005 (0402) Qty.(pcs) 10,000 BOX 5 reels / inner box  RECOMMENDED SOLDERING CONDITIONS TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 5 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD.  LAND PATTERNS REFLOW SOLDERING Solder land information： TYPE (mm) 1005 (EIA 0402) A B C 0.4 1.4 ～ 1.5 0.5 ～ 0.6 (0.016) (0.055 ～ 0.059) (0.020 ～ 0.024)  RELIABILITY AND TEST CONDITION Item Test Condition Requirements Temperature Cycle 1. Temperature : -55 ~ +125℃ 2. Cycle : 100 cycles 3. Dwell time : 30minutes 4. Measurement : at ambient temperature 24 hrs after test completion 1. No mechanical damage 2. Inductance value should be within ± 10 % of the initial value 3. Q value should be within ± 20% of the initial value Operational Life 1. Temperature: 85 ± 5℃ 2. Testing time: 1000 hrs 3. Applied current: Full rated current 4. Measurement: At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance value should be within ± 10 % of the initial value 3. Q value should be within ± 20% of the initial value TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 6 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. Item Test Condition Requirements Biased Humidity 1. Temperature : 40℃ ± 2℃ 2. Humidity : 90 ~ 95 % RH 3. Test time : 1000 hrs 4. Apply current : full rated current 5. Measurement : at ambient temperature 24 hrs after test completion 1. No mechanical damage 2. Inductance value should be within ± 10 % of the initial value 3. Q value should be within ± 20% of the initial value Resistance to Solder Heat 1. Solder temperature : 260 ± 5℃ 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. Inductance value should be within ± 10 % of the initial value 3. Q value should be within ± 20% of the initial value Solderability 1. Solder temperature : 235 ± 5℃ 2. Flux : Rosin 3. DIP time : 5 ± 1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage 1. Solder the chip to test jig then apply a force in the direction shown in below. 2. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. No mechanical damage Bending Strength Amplitude 2 mm  NOTE The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected. TITLE :MCI Series Engineering Specification DOCUMENT NO. 000330XXXXXX SPEC REV.: A13 Page 7 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40