MIP20122R2MBEDG

PRODUCT SPECIFICATION DOCUMENT NO.ENS000023130 DESCRIPTION DRAWN BY DESIGNED BY CHECKED BY APPROVED BY MIP Series 陳曉慧 Sharon Chen 賴柏志 Kidd Lai 賴柏志 Kidd Lai 吳維政 Albert Wu INPAQ TECHNOLOGY CO., LTD. RoHS Pb Multilayer Power Inductor (MIP Series) Engineering Spec. This product belongs to the industrial grade standard, not the vehicle gauge product! Can not use auto parts, if the customer is not expressly informed and privately used to auto parts, produce any consequences, the original is not responsible for after-sales service, thank you!  Features  The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic leakage and interference .  Allow for higher mounting density.  Low DC resistance.  Applications Suitable for DVD , DSC , PND , PC , NB , Power Line  Shapes and Dimensions TYPE L W T E Unit 2012 (EIA0805) 2.000.20 1.250.20 0.900.10 0.500.30 mm TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 1 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD.  Part Number Code MIP 2012 2R2 1 2 3 M 4 B 5 E 6 DG 7 1 Series Name 2 Size Code : The first two digitals: length(mm)，the last two digitals: width(mm) 3 Inductance : R = Decimal point，Unit = μH 4 Tolerance : M = ±20% 5 Soldering : Green Parts，B= Lead-Free for whole chip 6 Packaging : E = Embossed plastic tape, 7" reel 7 INPAQ internal code  Part Number and Characteristics Table Part Number. MIP20122R2MBEDG Inductance±20% (μH) 2.20 Test Freq. (MHz) 1 SRF (MHz) 70 DCR±25% () 0.170 Rated Current (mA) 900 HP4291B-RF Impedance / Material Analyzer Test Instruments and HP4338A/B Milliohm meter Conditions Test Frequency : 1 MHz / OSC Level : 100mV *1：For special part number which is not shown in the above table, please refer to appendix. *2：Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 2 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD.  Tape and Reel Specifications Plastic Carrier (E) Taping Dimensions (mm) Symbol W P E F D D1 Po 10Po P2 Ao Bo Ko(T) t 2012 E 8.00 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 3.50 ± 0.10 1.55 ± 0.05 1.00 ± 0.05 4.00 ± 0.10 40.0 ± 0.20 2.00 ± 0.10 1.40 ± 0.10 2.30 ± 0.10 1.13 ± 0.10 0.22 ± 0.05 TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 3 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD.  Reel Dimensions Unit:mm 7” Reel Packaging Quantity Qty.(pcs) 2012 (0805) 3,000 BOX 5 reels / inner box PART SIZE (EIA SIZE)  Recommended Soldering Conditions TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 4 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD.  Land Patterns for Reflow Soldering Solder land information： Size(mm) A B C 2012 1.0 ~ 1.2 3.0 ~ 4.0 0.8 ~ 1.1  Reliability and Test Condition Test item Test condition Criteria 1. More than 95 % of terminal electrode should be covered with new solder 1. Solder temperature : 260 ± 5℃ Resistance to Solder Heat 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 2. No mechanical damage 3. Inductance value should be within ± 20 % of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. 1. More than 95 % of terminal Solderability 1. Solder temperature : 235 ± 5℃ 2. Flux : Rosin 3. DIP time : 5 ± 1 sec electrode should be covered with new solder 2. No mechanical damage TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 5 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. Test item Test condition Criteria 1. Reflow temperature : 245℃ It shall be Soldered on the substrate applying direction parallel to the substrate 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. No mechanical damage 2. Soldering the products on PCB after the pulling test force > 5 N Temperature Cycle 1. Temperature:-40 ~ 85℃ For 30 minutes each 2. Cycle: 100 cycles 3. Measurement:At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. High Temperature Resistance 1. Temperature: 85 ± 5℃ 2. Testing time: 1000 hrs 3. Measurement: at ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. 1. Temperature: 40℃ ± 2℃ 2. Humidity: 90-95 % RH 3. Testing time: 1000 hrs 4. Measurement:At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. At ambient temperature & humidity Testing time:5 minutes ( under full rated current ) MIP product surface temp： below room temperature plus 40℃ Adhesive Test Humidity Rated Current  General Technical Data Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time : 12 months Max. Soldering method : Reflow TITLE : MIP Series Engineering Specification DOCUMENT NO. ENS000023130 SPEC REV.: A7 Page 6 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40