MOVS2825101DG

PRODUCT SPECIFICATION DOCUMENT NO. ENS000108240 DESCRIPTION DRAWN BY DESIGNED BY CHECKED BY APPROVED BY MOVS2825DG Series Sandy Hung Tsai C.P. Huang Shawn Yeh 10 INPAQ TECHNOLOGY CO., LTD. MOVS2825DG Series Engineering Specification 1. Scope (1) (2) (3) (4) (5) SMD type Metal Oxide Varistor High transient current capability Encapsulation material according to UL94-V0 RoHS compliant UL/cUL 1449 approved Applications (1). (2). (3). (4). Power supply Home appliance Industrial equipment Telecommunication or telephone system 2. Explanation of Part Number MOV S 2825 101 _DG_ (1) (2) (3) (4) (5) (1). Metal oxide varistor (2). Type: S=single; A=array (3). Size (4). Varistor voltage (5). Inpaq Control code TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 1 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 3. Construction & Dimension L W L C1 W T C2 Bottom View Unit : mm 2825 L 7.2 ± 0.2 W 6.4 ± 0.2 Note 3.2 ± 0.3 T 4.2 ± 0.3 reference table 4.1 5.6 ± 0.3 C1 5.8 ± 0.3 C2 1.1 ± 0.3 TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 2 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 4. Part ratings and characteristics: 4.1. Rating Working voltage Symbol Units VRMS VDC Volts Volts (Max.) (Max.) Varistor voltage IL Vc imax T uA Volts Amps mm (Max.) (Max.) (Max.) VV Volts 1mA DC Test Condition Leakage Clamping Peak Component Current Voltage current thickness Vv*80% (at initial state) 8/20s 8/20s MOVS2825180DG 11 14 16.2~19.8 50 40(1A) 150 3.2 MOVS2825220DG 14 18 19.8~24.2 50 48(1A) 150 3.2 MOVS2825270DG 17 22 24.3~29.7 50 60(1A) 150 3.2 MOVS2825330DG 20 26 29.7~36.3 50 73(1A) 150 4.2 MOVS2825390DG 25 31 35.1~42.9 50 80(1A) 150 4.2 MOVS2825470DG 30 38 42.3~51.7 50 104(1A) 150 4.2 MOVS2825560DG 35 45 50.4~61.6 50 123(1A) 150 4.2 MOVS2825680DG 40 56 61.2~74.8 50 145(1A) 150 4.2 MOVS2825820DG 50 66 73.8~90.2 50 150(5A) 400 3.2 MOVS2825101DG 60 85 90~110 50 175(5A) 400 3.2 MOVS2825121DG 75 102 108~132 50 210(5A) 400 4.2 MOVS2825151DG 95 127 135~165 50 260(5A) 400 4.2 MOVS2825181DG 120 160 170~207 50 320(5A) 400 4.2 MOVS2825201DG 130 175 185~225 50 355(5A) 400 4.2 MOVS2825221DG 140 180 198~242 50 380(5A) 400 4.2 MOVS2825241DG 150 200 216~264 50 415(5A) 400 4.2 MOVS2825271DG 180 230 255~311 50 475(5A) 400 4.2 MOVS2825301DG 195 250 270~330 50 520(5A) 400 4.2 MOVS2825331DG 210 275 297~363 50 570(5A) 400 4.2 MOVS2825361DG 230 300 324~396 50 620(5A) 400 4.2 MOVS2825391DG 250 330 351~429 50 675(5A) 400 4.2 MOVS2825431DG 275 370 387~473 50 745(5A) 400 5.6 MOVS2825471DG 300 385 423~517 50 810(5A) 400 5.6 MOVS2825511DG 320 420 459~561 50 845(5A) 400 5.6 MOVS2825561DG 360 470 522~638 50 920(5A) 400 5.6 TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 3 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. Working voltage Symbol Units VRMS VDC Volts Volts (Max.) (Max.) Varistor voltage IL Vc imax T uA Volts Amps mm (Max.) (Max.) (Max.) VV Volts 1mA DC Test Condition Leakage Clamping Peak Component Current Voltage current thickness Vv*80% (at initial state) 8/20s 8/20s MOVS2825621DG 390 505 558~682 50 1025(5A) 400 5.6 MOVS2825681DG 420 560 612~748 50 1120(5A) 400 5.6 VDC –Maximum DC operating voltage the varistor can maintain VV – Voltage across the device measured at 1mA DC current. Equivalent to Vb, “Breakdown Voltage”. Vc – Maximum peak voltage across the varistor measured at 8/20us waveform . imax – Maximum peak current which may be applied with 8/20us waveform without device failure TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 4 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 5. General electrical specifications 5.1. General technical data (OTHER SPEC) Operating temperature -40 … +85oC Storage temperature (on board) -40 … +85oC Solderability 245±5oC, 3 ±1sec Solder leach resistance 260±5oC,10 ±1sec 5.2. Taping Package Storage Condition Storage Temperature: 5 to 40oC Relative Humidity: to 65% Storage Time: 12 months max 6. Taping Package and Label Marking 6.1. Carrier tape dimensions Type 2825 W E F D0 D1 P0 P0 x10 16.00 ±0.30 1.75 ±0.10 7.50 ±0.15 1.50 +0.10/-0.00 1.50 +0.10/-0.00 4.00 ±0.10 40.00 ±0.20 t A0 B0 K0 P1 P2 0.50 ±0.05 6.75 7.55 6.20(max) 12.00 ±0.10 2.00 ±0.15 +0.15/-0.05 +0.15/-0.05 TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 5 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 6.2. Taping reel dimensions 單位：(mm) Type A B C D E F G 13” 330 ±2.00 99 ±1.50 13.50 ±0.20 2.30 ±0.20 16.50 ±0.50 2.20 ±0.20 10.75 ±0.20 6.3. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 6.4. Label Marking The label specified as follows shall be put on the side of reel. (1)Part No. (2)Quantity (3)Lot No. Part No. And Quantity shall be marked on outer packaging. 6.5. Quantity of products in the taping package (1) Standard quantity: 900pcs/Reel for MOVS2825 T=5.6mm，1100pcs/Reel for MOVS2825 T=4.2mm，1400pcs/Reel for MOVS2825 T=3.2mm。 (2) Shipping quantity is a multiple of standard quantity. TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 6 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 7. Precautions for Handling 7.1. Solder cream in reflow soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 0.1mm L A C B Item Size(EIA) 2825 Unit: mm A B C L 6.8 1.5 4.6 7.6 7.2. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (Reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting another component. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend to using the machine or the jig to break it. 7.3. Precaution for soldering Note that rapid heating, rapid cooling or local heating will easily damage this product. Do not give heat shock over 100C in the process of soldering. We recommend taking preheating and gradual cooling. TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 7 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 7.4. Recommendable reflow soldering Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3° C/second max. Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (tsmin to tsmax) 150 °C 200 °C 60-180 seconds Time maintained above: – Temperature (TL) 217 °C – Time (tL) 60-150 seconds Peak/Classification Temperature (Tp) 250 °C Time within 5 °C of actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 6 °C/second max. Time 25 °C to Peak Temperature 8 minutes max. *According to J-STD-020C TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 8 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41 10 INPAQ TECHNOLOGY CO., LTD. 7.5. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 7.6. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. TITLE : MOVS2825DG series Engineering Specification DOCUMENT NO. ENS000108240 SPEC REV.: A1 Page 9 of 9 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-41