PRODUCT
SPECIFICATION
DOCUMENT NO. ENS000108250
DESCRIPTION
DRAWN BY
DESIGNED BY
CHECKED BY
APPROVED BY
MOVS4032DG Series
Sandy
Hung Tsai
C.P. Huang
Shawn Yeh
10
INPAQ TECHNOLOGY CO., LTD.
MOVS4032DG Series Engineering Specification
1. Scope
(1).
(2).
(3).
(4).
(5).
SMD type Metal Oxide Varistor
High transient current capability
Encapsulation material according to UL94-V0
RoHS compliant
UL/cUL 1449 approved
Applications
(1).
(2).
(3).
(4).
Power supply
Home appliance
Industrial equipment
Telecommunication or telephone system
2. Explanation of Part Number
MOV S 4032 431 _DG_
(1)
(2)
(3)
(4)
(5)
(1). Metal oxide varistor
(2).
(3).
(4).
(5).
Type: S=single; A=array
Size
Varistor voltage
Inpaq Control code
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 1 of 9
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B
I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
3. Construction & Dimension
L
W
L
C1
W
T
C2
Bottom View
Unit : mm
4032
L
10.1 ± 0.2
W
8.2 ± 0.2
Note
3.2 ± 0.3
T
4.2 ± 0.3
reference table 4.1
5.6 ± 0.3
C1
7.4 ± 0.3
C2
1.6 ± 0.3
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 2 of 9
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I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
4. Part ratings and characteristics:
4.1. Rating
Working
voltage
Symbol
Units
VRMS
VDC
Volts
Volts
(Max.) (Max.)
Varistor
voltage
IL
Vc
imax
T
uA
Volts
Amps
mm
(Max.)
(Max.)
(Max.)
8/20s
8/20s
VV
Volts
1mA DC
Test Condition
Leakage Clamping Peak Component
Current Voltage current thickness
Vv*80%
(at initial state)
MOVS4032180DG
11
14
16.2~19.8
50
40(2.5A)
250
3.2
MOVS4032220DG
14
18
19.8~24.2
50
48(2.5A)
250
3.2
MOVS4032270DG
17
22
24.3~29.7
50
60(2.5A)
250
3.2
MOVS4032330DG
20
26
29.7~36.3
50
73(2.5A)
250
4.2
MOVS4032390DG
25
31
35.1~42.9
50
80(2.5A)
250
4.2
MOVS4032470DG
30
38
42.3~51.7
50
104(2.5A)
250
4.2
MOVS4032560DG
35
45
50.4~61.6
50
123(2.5A)
250
4.2
MOVS4032680DG
40
56
61.2~74.8
50
145(2.5A)
250
4.2
MOVS4032820DG
50
66
73.8~90.2
50
135(10A)
1200
3.2
MOVS4032101DG
60
85
90~110
50
165(10A)
1200
3.2
MOVS4032121DG
75
102
108~132
50
200(10A)
1200
4.2
MOVS4032151DG
95
127
135~165
50
250(10A)
1200
4.2
MOVS4032181DG
120
160
170~207
50
300(10A)
1200
4.2
MOVS4032201DG
130
175
185~225
50
340(10A)
1200
4.2
MOVS4032221DG
140
180
198~242
50
360(10A)
1200
4.2
MOVS4032241DG
150
200
216~264
50
395(10A)
1200
4.2
MOVS4032271DG
180
230
255~311
50
455(10A)
1200
4.2
MOVS4032301DG
195
250
270~330
50
500(10A)
1200
4.2
MOVS4032331DG
210
275
297~363
50
550(10A)
1200
4.2
MOVS4032361DG
230
300
324~396
50
595(10A)
1200
4.2
MOVS4032391DG
250
330
351~429
50
650(10A)
1200
4.2
MOVS4032431DG
275
370
387~473
50
710(10A)
1200
5.6
MOVS4032471DG
300
385
423~517
50
775(10A)
1200
5.6
MOVS4032511DG
320
420
459~561
50
845(10A)
1200
5.6
MOVS4032561DG
360
470
522~638
50
925(10A)
1200
5.6
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 3 of 9
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B
I-FM-04-41
10
INPAQ TECHNOLOGY CO., LTD.
Working
voltage
Symbol
Units
VRMS
VDC
Volts
Volts
(Max.) (Max.)
Varistor
voltage
IL
Vc
imax
T
uA
Volts
Amps
mm
(Max.)
(Max.)
(Max.)
8/20s
8/20s
VV
Volts
1mA DC
Test Condition
Leakage Clamping Peak Component
Current Voltage current thickness
Vv*80%
(at initial state)
MOVS4032621DG
390
505
558~682
50
1025(10A) 1200
5.6
MOVS4032681DG
420
560
612~748
50
1120(10A) 1200
5.6
MOVS4032751DG
460
615
675~825
50
1240(10A) 1200
5.6
MOVS4032781DG
485
640
702~858
50
1290(10A) 1200
5.6
MOVS4032821DG
510
670
738~902
50
1355(10A) 1200
5.6
VDC –Maximum DC operating voltage the varistor can maintain
VV – Voltage across the device measured at 1mA DC current.
Equivalent to Vb, “Breakdown Voltage”.
Vc – Maximum peak voltage across the varistor measured at 8/20us waveform.
imax – Maximum peak current which may be applied with 8/20us waveform without device
failure
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 4 of 9
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B
I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
5. General electrical specifications
5.1. General technical data (OTHER SPEC)
Operating temperature
-40 … +85oC
Storage temperature (on board)
-40 … +85oC
Solderability
245±5oC, 3 ±1sec
Solder leach resistance
260±5oC,10 ±1sec
5.2. Taping Package Storage Condition
Storage Temperature: 5 to 40oC
Relative Humidity: to 65%
Storage Time: 12 months max
6. Taping Package and Label Marking
6.1. Carrier tape dimensions
Type
4032
W
E
F
D0
D1
P0
P0 x10
16.00
±0.30
1.75
±0.10
7.50
±0.15
1.50
+0.10/-0.00
1.50
+0.10/-0.00
4.00
±0.10
40.00
±0.20
t
A0
B0
K0
P1
P2
6.20(max)
12.00
±0.10
2.00
±0.15
0.50
±0.05
8.55
10.45
+0.15/-0.05 +0.15/-0.05
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 5 of 9
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B
I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
6.2. Taping reel dimensions
單位:(mm)
Type
A
B
C
D
E
F
G
13”
330
±2.00
99
±1.50
13.50
±0.20
2.30
±0.20
16.50
±0.50
2.20
±0.20
10.75
±0.20
6.3. Taping specifications
There shall be the portion having no product in both the head and the end of taping,
and there shall be the cover tape in the head of taping.
6.4. Label Marking
The label specified as follows shall be put on the side of reel.
(1)Part No.
(2)Quantity
(3)Lot No.
Part No. And Quantity shall be marked on outer packaging.
6.5. Quantity of products in the taping package
(1) Standard quantity: 900pcs/Reel for MOVS4032 T=5.6mm ,1100pcs/Reel for
MOVS4032 T=4.2mm ,1400pcs/Reel for MOVS4032 T=3.2mm 。
(2) Shipping quantity is a multiple of standard quantity.
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 6 of 9
www.inpaq.com.tw ; www.inpaqgp.com
B
I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
7. Precautions for Handling
7.1. Solder cream in reflow soldering
Refer to the recommendable land pattern as printing mask pattern for solder cream.
(1) Print solder in a thickness of 0.1mm
L
A
C
B
Item
Size(EIA)
4032
Unit: mm
A
B
C
L
8.6
2.2
6.2
10.5
7.2. Precaution for handling of substrate
Do not exceed to bend the board after soldering this product extremely.
(Reference examples)
Mounting place must be as far as possible from the position, which is close to the
break line of board, or on the line of large holes of board.
Do not bend extremely the board, in mounting another component.
If necessary, use back-up pin (support pin) to prevent from bending extremely.
Do not break the board by hand. We recommend to using the machine or the jig to
break it.
7.3. Precaution for soldering
Note that rapid heating, rapid cooling or local heating will easily damage this
product.
Do not give heat shock over 100C in the process of soldering. We recommend
taking preheating and gradual cooling.
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 7 of 9
www.inpaq.com.tw ; www.inpaqgp.com
B
I-FM-04-41
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INPAQ TECHNOLOGY CO., LTD.
7.4. Recommendable reflow soldering
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate
(Tsmax to Tp)
3° C/second max.
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (tsmin to tsmax)
150 °C
200 °C
60-180 seconds
Time maintained above:
– Temperature (TL)
217 °C
– Time (tL)
60-150 seconds
Peak/Classification Temperature (Tp)
250 °C
Time within 5 °C of actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.
*According to J-STD-020C
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 8 of 9
www.inpaq.com.tw ; www.inpaqgp.com
B
I-FM-04-41
10
INPAQ TECHNOLOGY CO., LTD.
7.5. Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
(1) The tip temperature must be less than 280C for the period within 3 seconds by
using soldering gun under 30 W.
(2) The soldering gun tip shall not touch this product directly.
7.6. Soldering volume
Note that excess of soldering volume will easily get crack the body of this product.
TITLE : MOVS4032DG Series Engineering
Specification
DOCUMENT NO.
ENS000108250
SPEC REV.:A1
Page 9 of 9
www.inpaq.com.tw ; www.inpaqgp.com
B
I-FM-04-41
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