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TVL0201015VAA0DG

TVL0201015VAA0DG

  • 厂商:

    INPAQ(台湾佳邦)

  • 封装:

    0201

  • 描述:

    11.5V(标准) 夹子 6A(8/20µs) Ipp TVS - 二极管 表面贴装型 0201

  • 数据手册
  • 价格&库存
TVL0201015VAA0DG 数据手册
PRODUCT SPECIFICATION DOCUMENT NO. ENS000126960 DESCRIPTION DRAWN BY DESIGNED BY CHECKED BY APPROVED BY TVL 0201 01 5V AA0DG Owen Owen Anderson Shawn INPAQ TECHNOLOGY CO., LTD. TVL0201 01 5V AA0DG Product Engineering Specification 1. Scope TVL 0201 01 5V AA0 is a TVS diode designed to protect one power/control line or one low speed signal line from overvoltage hazard of Electrostatic Discharge (ESD). These interfaces can be used in computer interfaces protection, microprocessors protection, serial and parallel ports protection, control signal lines protection, power lines on PCB protection, latch-up protection. The actual application examples are USB2.0, VBUS, and VGA, etc. The ESD protection of TVS meets the immunity standard of IEC 61000-4-2, level 4 (±15kV air, ±15kV contact discharge). 2. Explanation of Part Number TV L 0201 01 5V AA0 DG (1) (2) (3) (4) (5) (6) (7) (1) Product Type:TV=TVS Diode (2) Capacitance Code:L=Low Capacitance (3) Package Code (4) Channel Code:01=1 Channels (5) Working Voltage (6) Special code (7) Inpaq Control Code 3. Circuit Diagram & Dimension TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 Unit: mm 0201 L 0.60±0.05 W 0.30±0.04 T 0.30±0.04 C 0.20±0.06 SPEC REV.: A0 Page 1 of 1 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. 4. Specifications 4.1. Absolute Maximum Ratings Parameter Symbol Rating Units Operating Supply Voltage VDC 5 V Peak Pulse Current (8/20 µs) IPP 6 A Peak Pulse Power(8/20 µs) PPP 90 W ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±15 ±15 kV Lead Soldering Temperature TSOL 260 (10 sec.) o C 4.2. Electrical Characteristics Parameter Symbol Conditions Min o Max Units 5 5.5 V 1 μA 13 V Reverse Stand-Off Voltage VRWM Reverse Leakage Current ILeak VRWM = 5V, T=25 oC. Reverse Breakdown Voltage VBV IBV = 1mA, T=25 oC. VCL IPP = 1A, tp=8/20us, T=25 oC. 11 ITLP = 1A (100ns transmission line) 7.5 11.5 Clamping Voltage T=25 C. Typ VTLP Channel Input ITLP = 16A(100ns transmission line) VR = 0V, f = 1MHz, T=25 oC. CIN Capacitance 7 10 V 5 pF 4.3. Typical Characteristics TVL 0201 01 5V AA0 24 TLP Current (A) 20 16 12 8 4 0 -4 0 2 4 6 8 10 12 14 TLP Voltage(V) TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 SPEC REV.: A0 Page 2 of 2 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5. Taping Package and Label Marking 5.1. Packaging Method (Material: paper) Products shall be heat-sealed in the chip pocket, spacing pitch 4-mm of paper carrier tape with plastic cover tape, and the carrier tape shall be reeled to the reel. 5.2. Carrier Tape Dimensions Type 0201 A' B' W E F P0 P1 P2 D0 T K 0.35 0.67 8.0 1.75 3.5 4.0 2.0 2.0 1.55 0.42 0.35 ±0.02 ±0.02 ±0.1 ±0.05 ±0.05 ±0.03 ±0.03 ±0.03 ±0.05 ±0.03 ±0.02 5.3. Taping Reel Dimensions Unit: mm TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 SPEC REV.: A0 Page 3 of 3 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5.4. Taping Specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 5.5. Label Marking The label specified as follows shall be put on the side of reel. (1)Part No. (2)Quantity (3)Lot No. *Part No. And Quantity shall be marked on outer packaging. 5.6. Quantity of Products in the Taping Package (1) Standard quantity:15000pcs/Reel for TVL0201 Series (2) Shipping quantity is a multiple of standard quantity. 5.7. Storage Condition with Package Storage Time: 12 months max Storage Temperature : 5 to 40℃ Relative Humidity: 0 to 60 % 6. Precautions for Handling 6.1. Solder Cream in Reflow Soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 150 to 200 m. (2) Dimensions: millimeters (inches) 0201 c b b a Unit: mm Type a b c 0201 0.2~0.3 0.25~0.30 0.3~0.4 Notes: This LAND LAYOUT is for reference purposes only. Please consult your manufacturing partners to ensure your company’s PCB design guidelines are met. TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 SPEC REV.: A0 Page 4 of 4 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6.2. Precaution for Handling of Substrate Do not exceed to bend the board after soldering this product extremely. (Reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting other components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend using the machine or the jig to break it. 6.3. Precaution for Soldering Note that rapid heating, rapid cooling or local heating will easily damage this product. Do not give heat shock over 100C in the process of soldering. We recommend taking preheating and gradual cooling. 6.4. Recommendable Reflow Soldering TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 SPEC REV.: A0 Page 5 of 5 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40 INPAQ TECHNOLOGY CO., LTD. Profile Feature Pb free Assembly Average Ramp Rate (Ts max to Tp) 3℃/second max Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) 150℃ 200℃ Time maintained above: - Temperature (TL) - Time (tL) 217℃ Peak Temperature (Tp) 260℃ +0/-5 ℃ 60-180 seconds 60-150 seconds Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature Max 10 seconds. 6℃/second max. 8 minutes max *According to J-STD-020C 6.5. Soldering Gun Procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 350C for the period within 5 seconds by using soldering gun less than 30 W. (2) The soldering gun tip shall not touch this product directly. 6.6. Soldering Volume Note that excess of soldering volume will easily get crack the body of this product. TITLE : TVL 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000126960 SPEC REV.: A0 Page 6 of 6 www.inpaq.com.tw ; www.inpaqgp.com B I -FM-04-40
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