TVN0201015VAA0DG

PRODUCT SPECIFICATION DOCUMENT NO. ENS000144630 DESCRIPTION DRAWN BY DESIGNED BY CHECKED BY APPROVED BY TVN 0201 01 5V AA0DG Eric Eric Anderson Shawn INPAQ TECHNOLOGY CO., LTD. TVN 0201 01 5V AA0DG Product Engineering Specification 1. Scope TVN 0201 01 5V AA0 is a TVS diode designed to protect one power/control line or one low speed signal line from overvoltage hazard of Electrostatic Discharge (ESD). These interfaces can be used in computer interfaces protection, microprocessors protection, serial and parallel ports protection, control signal lines protection, power lines on PCB protection, latch-up protection. The actual application examples are USB2.0, VBUS, and VGA, etc. The ESD protection of TVS meets the immunity standard of IEC 61000-4-2, level 4 (±20kV air, ±20kV contact discharge). 2. Explanation of Part Number TV N 0201 01 5V AA0 DG (1) (2) (3) (4) (5) (6) (7) (1) (2) (3) (4) (5) (6) (7) Product Type：TV=TVS Diode Capacitance Code：L=Low Capacitance Package Code Channel Code：01=1 Channels Working Voltage Special code Inpaq Control Code 3. Circuit Diagram & Dimension TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 Unit: mm 0201 L 0.60±0.05 W 0.30±0.04 T 0.30±0.04 C 0.20±0.06 SPEC REV.: A0 Page 1 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 4. Specifications 4.1. Absolute Maximum Ratings Parameter Symbol Rating Units Operating Supply Voltage VDC 5 V Peak Pulse Current (8/20 µs) IPP 8 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±20 ±20 kV Lead Soldering Temperature TSOL 260 (10 sec.) o C 4.2. Electrical Characteristics Parameter Symbol Conditions o Reverse Stand-Off Voltage VRWM T=25 C. Reverse Leakage Current ILeak VRWM = 5V, T=25 oC. Reverse Breakdown Voltage VBV IBV = 1mA, T=25 oC. Clamping Voltage VTLP Channel Input Capacitance CIN Min Typ -5 7 9 ITLP = 16A(100ns transmission line) 6.2 7.4 VR = 0V, f = 1MHz, T=25 oC. 18 ITLP = 1A (100ns transmission line) Max Units 5 V 1 μA 11.5 V pF 4.3. Typical Characteristics TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 2 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5. Taping Package and Label Marking 5.1. Packaging Method (Material: paper) Products shall be heat-sealed in the chip pocket, spacing pitch 4-mm of paper carrier tape with plastic cover tape, and the carrier tape shall be reeled to the reel. 5.2. Carrier Tape Dimensions Type 0201 A' B' W E F P0 P1 P2 D0 T K 0.35 0.67 8.0 1.75 3.5 4.0 2.0 2.0 1.55 0.42 0.35 ±0.02 ±0.02 ±0.1 ±0.05 ±0.05 ±0.03 ±0.03 ±0.03 ±0.05 ±0.03 ±0.02 5.3. Taping Reel Dimensions Unit: mm TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 3 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 5.4. Taping Specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 5.5. Label Marking The label specified as follows shall be put on the side of reel. (1)Part No. (2)Quantity (3)Lot No. *Part No. And Quantity shall be marked on outer packaging. 5.6. Quantity of Products in the Taping Package (1) Standard quantity：15000pcs/Reel for TVN0201 Series (2) Shipping quantity is a multiple of standard quantity. 5.7. Storage Condition with Package Storage Time: 12 months max Storage Temperature : 5 to 40℃ Relative Humidity: 0 to 60 % TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 4 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6. Precautions for Handling 6.1. Solder Cream in Reflow Soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 150 to 200 m. (2) Dimensions: millimeters (inches) 0201 c b b a Unit: mm Type a b c 0201 0.2~0.3 0.25~0.30 0.3~0.4 Notes: This LAND LAYOUT is for reference purposes only. Please consult your manufacturing partners to ensure your company’s PCB design guidelines are met. 6.2. Precaution for Handling of Substrate Do not exceed to bend the board after soldering this product extremely. (Reference examples)  Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.  Do not bend extremely the board, in mounting other components. If necessary, use back-up pin (support pin) to prevent from bending extremely.  Do not break the board by hand. We recommend using the machine or the jig to break it. 6.3. Precaution for Soldering Note that rapid heating, rapid cooling or local heating will easily damage this product. Do not give heat shock over 100C in the process of soldering. We recommend taking preheating and gradual cooling. TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 5 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6.4. Recommendable Reflow Soldering Profile Feature Pb free Assembly Average Ramp Rate (Ts max to Tp) 3℃/second max Preheat - Temperature Min (Tsmin) - 150℃ 200℃ Temperature Min (Tsmax) Time(tsmin to tsmin) 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 217℃ Peak Temperature (Tp) 260℃ +0/-5 ℃ 60-150 seconds Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature Max 10 seconds. 6℃/second max. 8 minutes max *According to J-STD-020C TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 6 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40 INPAQ TECHNOLOGY CO., LTD. 6.5. Soldering Gun Procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 330C for the period within 6 seconds by using soldering gun less than 30 W. (2) The soldering gun tip shall not touch this product directly. 6.6. Soldering Volume Note that excess of soldering volume will easily get crack the body of this product. 6.7. MSL Level: Level 1 TITLE : TVN 0201 01 5V AA0DG Specification Engineering DOCUMENT NO. ENS000144630 SPEC REV.: A0 Page 7 of 7 www.inpaq.com.tw ; www.inpaqgp.com B I-FM-04-40