VGAP-CLP-AS-A1

Contact: INPAQ USA -James Lee Email: jameslee@inpaqusa.com TEL: 267-265-4079 Title: Business Manager VGAP-CLP-AS-A1 Specification Product Name Series/PN Size INPAQ RF Chip Antenna VGAP-CLP-AS-A1 EIAJ 5036 PN：VGAP-CLP-AS-A1 Specification 1. Features and Application： (1) This product is manufactured in ISO/TS16949 certified production factory. (2) This product is qualified according to AEC-Q200. (3) This product is for 6 GHz to 9 GHz, 2. Explanation of Part Number： VGAP - (1) (2) (3) (4) (5) C LP - A S - A1 (1) (3) (4) (5) (2) Product Type：Chip Antenna Center Frequency/Band Code：6 GHz to 9 GHz Size Code：5.0*3.6 mm (Length * Width) Special Code：RoHS Compliant Design Revision Code：Rev.1 3. Electrical Specification： Item Specification Frequency Band 6000 ~ 9000 MHz Polarization Linear Impedance 50 ohm Typ. VSWR Less than 2.5 *Peak Gain 3.71 dBi Typ. *Peak Efficiency 91.31 % Typ. * Test condition：Test board size 50*40 mm Matching circuit may be required VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 1 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 4. Physical Dimension： L 5.20 ± 0.30 W 3.70 ± 0.30 H 0.70 ± 0.15 A 0.45 ± 0.25 B 0.45 ± 0.25 L1 1.55 ± 0.20 W1 0.55 ± 0.20 X 0.85 ± 0.25 Y 0.12 ± 0.06 (Unit: mm) VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 2 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 5. Recommend PCB Layout： Contact: INPAQ USA -James Lee Email: jameslee@inpaqusa.com TEL: 267-265-4079 Title: Business Manager 6. Electrical Characteristics： VSWR Mark Frequency (MHz) VSWR 1 6000 1.554 2 7000 2.480 3 8000 1.755 4 9000 2.412 VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 3 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com Radiation Pattern The Gain pattern is measured in INPAQ’s FAR-field chamber. DUT is placed on the table of rotator, a standard horn antenna and Vector Network Analyzer is used to collect data. 3D Chamber Definition VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 4 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 2D Gain Pattern Z X Y XY-Plane X Unit: dBi Y VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 5 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com YZ-Plane Z Unit: dBi Y XZ-Plane Z Unit: dBi X VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 6 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com Efficiency Peak Gain Frequency (MHz) Efficiency (%) Peak Gain (dBi) 6000 80.48 3.17 7000 77.92 3.04 8000 77.62 2.93 9000 64.14 2.22 VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 7 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 7. Taping Package and Label Marking： (1) Quantity/Reel：2000pcs/Reel (2) Carrier tape dimensions (Unit：mm) Symbol Spec. Po 4.00±0.1 P1 8.00±0.1 P2 2.00±0.05 Do 1.55±0.05 D1 1.50(MIN) A0 = 4.10±0.10 mm E 1.75±0.1 B0 = 5.60±0.10 mm F 5.50±0.05 K0 = 1.02±0.10 mm 10Po 40.00±0.2 W 12.00±0.1 T 0.25±0.05 (3) Taping reel dimensions VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 8 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 8. Environmental Characteristics： This product is qualified according to AEC-Q200. (1) Reliability Test Item Condition Specification High Temperature Storage 150℃，1000hours No Damaged Temperature Cycling -55℃ 30min/125℃ 30min，1000 cycle No Damaged Biased Humidity 85℃、85﹪RH，1000hours No Damaged Resistance to Solvent Add Aqueous wash chemical OKEMCLEAN for 5 min No Damaged Mechanical Shock 1500G 0.5 ms , X,Y,Z axis 3 time No Damaged 1. Frequency：10 to 2000 Hz Vibration 2. 5g's for 20 min No Damaged 3. Duration time：2hr for each in X ,Y,Z Resistance to Soldering Heat Brush flux and put the board into solder bath 260℃ , 10sec. No Damaged 1. 8 hours ± 15 min. steam conditioning Solderability Test 2. Put the sample on board by tape. 3. Brush flux and put the board into solder bath 260±5℃ , 5±1 sec No Damaged Board Flex 2mm for 60sec. No Damaged Termination strength (SMD) 1.8Kgf，60sec No Damaged (2) Storage condition (a) At warehouse： The temperature should be within 0 ~ 30°C and humidity should be less than 60% RH. The product should be used within 1 year from the time of delivery. (b) On board： The temperature should be within -40 ~ 85°C and humidity should be less than 85% RH. (3) Operating temperature range Operating temperature range：-40 ~ +125°C. VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 9 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com 9. Recommended reflow soldering： Reference：J-STD-020C (1) Soldering gun procedure Note the follows, in case of using solder gun for replacement. (a) The tip temperature must be less than 350C for the period within 3 seconds by using soldering gun under 30 W. (b) The soldering gun tip shall not touch this product directly. (2) Soldering volume Note that excess of soldering volume will easily get crack the body of this product. VGAP-CLP-AS-A1 Engineer Specification Version: A0 Page 10 of 10  All Specifications are subject to change without notice. www.inpaq.com.tw ; www.inpaqgp.com