ZB7412-00

RJ IN JO FI D EN TI A CO N L DOC No: ZB7412-00A-DTS-R04 Index 1. OVERVIEW ....................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................................ 3 1.2. APPLICATIONS ................................................................................................................................ 4 2. FUNCTIONAL FEATURES .................................................................................................................. 6 2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 6 2.2. BLOCK FUNCTIONAL FEATURE ........................................................................................................... 7 Microcontroller ............................................................................................................................ 7 FI D EN TI A L Ultra-Low Power Sensor Controller ............................................................................................ 7 Peripherals ................................................................................................................................... 7 RF Section .................................................................................................................................... 8 3. MODULE OUTLINE ........................................................................................................................... 9 3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 9 3.2. PIN DESCRIPTION ......................................................................................................................... 10 4. MODULE SPECIFICATIONS ............................................................................................................. 12 CO N 4.1. ABSOLUTE MAXIMUM RATINGS(1)(2)................................................................................................. 12 4.2. ESD RATINGS .............................................................................................................................. 12 4.3. RECOMMENDED OPERATING CONDITIONS ......................................................................................... 13 JO RJ IN 4.4. POWER CONSUMPTION SUMMARY .................................................................................................. 14 4.5. GENERAL CHARACTERISTICS ............................................................................................................ 15 4.6. 125-KBPS CODED (BLUETOOTH 5) – RX.......................................................................................... 15 4.7. 125-KBPS CODED (BLUETOOTH 5) – TX .......................................................................................... 16 4.8. 500-KBPS CODED (BLUETOOTH 5) – RX.......................................................................................... 17 4.9. 500-KBPS CODED (BLUETOOTH 5) – TX .......................................................................................... 18 4.10. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) – RX ............................................................................. 18 4.11. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) – TX ............................................................................. 20 4.12. 2-MBPS GFSK (BLUETOOTH 5) – RX ............................................................................................. 20 4.13. 2-MBPS GFSK (BLUETOOTH 5) – TX ............................................................................................. 21 4.14. INTERNAL 24-MHZ CRYSTAL OSCILLATOR (XOSC_HF)(1) .................................................................. 21 4.15. 32.768-KHZ CRYSTAL OSCILLATOR (XOSC_LF) ............................................................................... 22 4.16. 48-MHZ RC OSCILLATOR (RCOSC_HF) ........................................................................................ 22 4.17. 32-KHZ RC OSCILLATOR (RCOSC_LF) .......................................................................................... 22 4.18. ADC CHARACTERISTICS(1) ............................................................................................................ 23 4.19. TEMPERATURE SENSOR ................................................................................................................ 24 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 1 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.20. BATTERY MONITOR ..................................................................................................................... 25 4.21. CONTINUOUS TIME COMPARATOR ................................................................................................. 25 4.22. LOW-POWER CLOCKED COMPARATOR............................................................................................. 25 4.23. PROGRAMMABLE CURRENT SOURCE .............................................................................................. 26 4.24. DC CHARACTERISTICS .................................................................................................................. 26 4.25. TIMING REQUIREMENTS............................................................................................................... 27 4.26. SWITCHING CHARACTERISTICS ....................................................................................................... 28 4.27. TYPICAL CHARACTERISTICS............................................................................................................ 30 4.28. CHIP ANTENNA CHARACTERISTICS .................................................................................................. 31 5. DESIGN RECOMMENDATIONS ....................................................................................................... 33 L 5.1. MODULE LAYOUT RECOMMENDATIONS ............................................................................................ 33 FI D EN TI A 5.2. REFERENCE SCHEMATIC ................................................................................................................. 35 6. PACKAGE INFORMATION ............................................................................................................... 36 6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 36 6.2. ORDERING INFORMATION............................................................................................................... 37 6.3. PACKAGE MARKING ...................................................................................................................... 38 CO N 7. SMT AND BAKING RECOMMENDATION ....................................................................................... 40 7.1. BAKING RECOMMENDATION ........................................................................................................... 40 7.2. SMT RECOMMENDATION .............................................................................................................. 40 RJ IN 8. TAPE REEL INFROMATION ............................................................................................................. 42 8.1. COVER / CARRIER TAPE DIMENSION ................................................................................................. 42 JO 9. REGULATORY INFORMATION ........................................................................................................ 43 9.1. UNITED STATES ............................................................................................................................ 43 9.2. CANADA ..................................................................................................................................... 44 9.3. EUROPE ...................................................................................................................................... 45 9.4. JAPAN ........................................................................................................................................ 45 9.5. TAIWAN ...................................................................................................................................... 46 9.6. AUSTRALIA/NEW ZEALAND ............................................................................................................ 47 10. HISTORY CHANGE ........................................................................................................................ 48 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 2 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 1. OVERVIEW The certified ZB7412-00 module from JORJIN is a wireless MCU module targeting Bluetooth 4.2 and Bluetooth 5 low energy applications. This module is based on TI CC2640R2F wireless MCU QFN-32 package chip. The module is a cost-effective, ultralow power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications.     FI D EN TI A CO N Make More Flash Available for the Application No external component required. Low Power and Wide Supply Voltage Range: 1.8 to 3.8V - Internal DC-DC converter built-in 2.4-GHz RF Transceiver and Integrated Antenna. RoHS Compliance Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations - ETSI EN 300 328 (Europe) - FCC CFR47 Part 15 (US) - IC RSS-247 (Canada) - ARIB STD-T66 (Japan) RJ IN   TI CC2640R2F, 24MHz & 32.768KHz crystals, DC2DC, and chip antenna on a single module. Built-in TI CC2640R2F 5x5mm RHB VQFN32 (15 GPIOs) LGA 25pins package. Dimension 16.9mm(L) x 11mm(W) x 2.45mm(H) Powerful ARM® Cortex®-M3 Microcontroller Ultra-Low Power Sensor Controller Efficient Code Size Architecture, Placing Drivers, TI-RTOS, and Bluetooth® Software in ROM to JO        L 1.1. General Features - NCC LP0002 (Taiwan) - AS/NZS 4268 (Australia/New Zealand) - KN 301 489 (South Korea) Tools and Development Environment from TI - Full-Feature and Low-Cost Development Kits - Packet Sniffer PC Software ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 3 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 - Sensor Controller Studio SmartRF™ Studio SmartRF Flash Programmer 2 IAR Embedded Workbench® for ARM Code Composer Studio™ 1.2. Applications L Retail - Beacons - Advertising - ESL and Price Tags - Point of Sales and Payment Systems Health and Medical - Thermometers - Blood Glucose and Pressure Meters - Weight Scales - Hearing Aids   JO RJ IN  - Lighting - Locks - Gateways - Security Systems Industrial - Logistics - Production and Manufacturing Automation - Asset Tracking and Management - HMI and Remote Display - Access Control FI D EN TI A  Home and Building Automation - Connected Appliances CO N  Sports and Fitness - Activity Monitors and Fitness Trackers - Heart Rate Monitors - Running and Biking Sensors - Sports Watches - Gym Equipment - Team Sports Equipment ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 4 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04  HID Voice Remote Controls Gaming Keyboards and Mice JO RJ IN CO N FI D EN TI A L - ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 5 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 2. FUNCTIONAL FEATURES RJ IN GPIOs JO VDD CO N FI D EN TI A L 2.1. Module Block Diagram ZB7412-00 module ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 6 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 2.2. Block Functional Feature Microcontroller Powerful ARM® Cortex®-M3 EEMBC CoreMark® score: 142 Up to 48-MHz Clock Speed   275KB of Nonvolatile Memory Including 128KB of In-System Programmable Flash Up to 28KB of System SRAM, of Which 20KB is Ultra-Low Leakage SRAM    8-KB SRAM for Cache or System RAM Use 2-Pin cJTAG and JTAG Debugging Supports Over-The-Air Upgrade (OTA) FI D EN TI A Ultra-Low Power Sensor Controller L    Can run autonomous from the rest of the system  16-Bit Architecture  2-KB Ultra-Low Leakage SRAM for Code and Data CO N  RJ IN Peripherals All Digital Peripheral Pins can be routed to any GPIO.  15 GPIOs  4 General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timer, PWM Each)  12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX  Continuous Time Comparator  Ultra-Low Power Analog Comparator  Programmable Current Source  UART  2x SSI (SPI, MICROWIRE, TI)  I2C  I2S  Real-Time Clock (RTC) JO  ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 7 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04  AES-128 Security Module  True Random Number Generator (TRNG)  Support for 8 Capacitive Sensing Buttons  Integrated Temperature Sensor RF Section 2.4 GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.2 and 5 specifications  Excellent Receiver Sensitivity (–96 dBm for BLE), Selectivity, and Blocking Performance  Link budget of 101 dB for BLE.  Programmable Output Power up to +5 dBm  Integrated Antenna FI D EN TI A Pre-certified for Compliance With Worldwide Radio Frequency Regulations ETSI (Europe) IC (Canada) FCC (USA) ARIB STD-T66 (Japan) - NCC (Taiwan) RCM (Australia and New Zealand) KC (South Korea) RJ IN CO N - JO  L  ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 8 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 3. MODULE OUTLINE JO RJ IN CO N FI D EN TI A L 3.1. Signal Layout (Top View) ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 9 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 3.2. Pin Description Table 3-1. Pin Description Pin No. Pin Name Type Description 1 GND 2 NC 3 GND 4 DIO_0 Digital I/O GPIO, Sensor Controller 5 DIO_1 Digital I/O GPIO, Sensor Controller 6 DIO_2 Digital I/O GPIO, Sensor Controller, High drive capability 7 DIO_3 Digital I/O GPIO, Sensor Controller, High drive capability 8 DIO_4 Digital I/O 9 JTAG_TMSC Digital I/O 10 JTAG_TCKC Digital I/O 11 DIO_5 Digital I/O 12 DIO_6 Digital I/O 13 RESET_N 14 DIO_7 Digital/Analog I/O GPIO, Sensor Controller, Analog 15 DIO_8 Digital/Analog I/O GPIO, Sensor Controller, Analog GND NC GND FI D EN TI A L GND 17 DIO_10 GPIO, Sensor Controller, High drive capability JTAG_TMSC, High drive capability JTAG_TCKC GPIO, High drive capability, JTAG_TDO GPIO, High drive capability, JTAG_TDI CO N Digital Input RJ IN DIO_9 No connection. For internal test only. Digital/Analog I/O JO 16 GND Reset, active-low. No internal pullup. Built-in 0.1uF capacitor to GND. GPIO, Sensor Controller, Analog. In -04 module, DIO_9 pin is connected to CS# pin of internal serial SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, Digital/Analog I/O DIO_10 pin is connected to SCLK pin of internal serial SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, 18 DIO_11 Digital/Analog I/O DIO_11 pin is connected to SI pin of internal serial SPI Flash. GPIO, Sensor Controller, Analog. In -04 module, 19 DIO_12 Digital/Analog I/O DIO_12 pin is connected to SO pin of internal Serial SPI Flash. 20 DIO_13 Digital/Analog I/O GPIO, Sensor Controller, Analog ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 10 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 21 DIO_14 Digital/Analog I/O 22 VDDS Power 1.8 V to 3.8 V main chip and DC/DC supply 23 VDDS2 Power 1.8 V to 3.8 V GPIO supply 24 NC 25 GND GND Ground G1~G4 GND GND Ground No connection. JO RJ IN CO N FI D EN TI A L NC GPIO, Sensor Controller, Analog ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 11 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4. MODULE SPECIFICATIONS 4.1. Absolute Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) Parameter Conditions MIN MAX Unit Supply voltage, VDDS(3) -0.3 4.1 V Voltage on any digital pin(4) -0.3 VDDS+0.3 V Max 4.1 -0.3 L Voltage scaling enabled FI D EN TI A Voltage on ADC input (Vin) VDDS V Internal reference, voltage scaling disabled -0.3 1.49 V VDDS as reference, voltage scaling disabled -0.3 VDDS/2.9 V +5 dBm +85 °C Input RF level Storage temperature range -40 (1) All voltage values are with respect to ground, unless otherwise noted. CO N (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated RJ IN conditions for extended periods may affect device reliability. (3) VDDS2 must be at the same potential as VDDS. JO (4) Including analog capable DIO. 4.2. ESD Ratings Parameter Electrostatic Human Body Model (HBM), per ANSI/ESDA/JEDEC discharge JS001(1) performance (VESD) Charged Device Model (CDM), per JESD22-C101(2) Value Unit All pins ±2500 V RF pins ±750 V Non-RF pins ±750 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 12 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.3. Recommended Operating Conditions Parameter Conditions Ambient temperature range Operating supply voltage (VDDS) For operation in battery-powered and MIN MAX Unit -40 85 °C 1.8 3.8 V JO RJ IN CO N FI D EN TI A L 3.3 V systems ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 13 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.4. Power Consumption Summary Tc = 25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. Test Conditions Parameter Min Typ Reset. RESET_N pin asserted or VDDS below Max Units 100 nA Shutdown. No clocks running, no retention 150 nA Standby. With RTC, CPU, RAM and (partial) 1.1 μA 1.3 μA Power-on-Reset threshold register retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) Core current Standby. With Cache, RTC, CPU, RAM and consumption (partial) register retention. RCOSC_LF FI D EN TI A Icore L register retention. XOSC_LF Standby. With Cache, RTC, CPU, RAM and 2.8 μA 3.0 μA 550 μA (partial) register retention. XOSC_LF Idle. Supply Systems and RAM powered. Active. Core running CoreMark 1.45mA + Radio RX CO N 31uA/MHz 6.2 Radio TX, 0 dBm output power 6.8 Radio TX, 5 dBm output power 9.4 mA mA Peripheral Delta current with domain enabled Serial power RF Core Iperi (1) 20 μA Delta current with domain enabled 13 μA Delta current with power domain enabled, 237 μA JO power domain domain RJ IN Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1) clock enabled, RF Core Idle μDMA Delta current with clock enabled, module idle 130 μA Timers Delta current with clock enabled, module idle 113 μA I2C Delta current with clock enabled, module idle 12 μA I2S Delta current with clock enabled, module idle 36 μA SSI Delta current with clock enabled, module idle 93 μA UART Delta current with clock enabled, module idle 164 μA Iperi is not supported in standby or shutdown modes. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 14 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.5. General Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Typ Max Units FLASH MEMORY Supported flash erase cycles 100 K before failure Cycles Flash page/sector erase current Flash page/sector erase time Average delta current (1) Average delta current, 4 bytes at a time Flash write time(1) 4 bytes at a time FI D EN TI A Flash write current L Flash page/sector size Flash page/sector erase time(1) 12.6 mA 8 ms 4 KB 8.15 mA 8 μs 8 ms (1) This number is dependent on Flash aging and will increase over time and erase cycles 4.6. 125-kbps Coded (Bluetooth 5) – RX CO N RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter BER = 10–3 Receiver saturation tolerance -102 dBm >5 dBm kHz Difference between incoming data rate and the -260 260 ppm -140 150 ppm and the internally generated carrier frequency JO Data rate error Units 310 –3 Difference between the incoming carrier frequency tolerance Max -260 BER = 10 Frequency error Typ RJ IN Receiver sensitivity Min internally generated data rate (37-byte packets) Data rate error Difference between incoming data rate and the tolerance Co-channel rejection internally generated data rate (255-byte packets) (1) Wanted signal at –79 dBm, modulated interferer in -3 dB 9 / 5(2) dB 43/32(2) dB 47/42(2) dB channel, BER = 10–3 Selectivity, ±1 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±1 MHz, BER = 10–3 Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2 MHz, BER = 10–3 Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3 MHz, BER = 10 –3 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 15 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at 46/47(2) dB 49/46(2) dB 50/47(2) dB 32 dB 5/32(2) dB ±4 MHz, BER = 10–3 Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±6 MHz, BER = 10–3 Alternate channel Wanted signal at –79 dBm, modulated interferer at rejection, ±7 MHz(1) ≥ ±7 MHz, BER = 10–3 Selectivity, Image Wanted signal at -79 dBm, modulated interferer at frequency (1) –3 image frequency, BER = 10 Selectivity, Image Note that Image frequency +1 MHz is the frequency ±1 MHz (1) Co-channel -1 MHz. Wanted signal at –79 dBm, L modulated interferer at ±1 MHz from image Blocker rejection, ±8 FI D EN TI A frequency, BER = 10–3 Wanted signal at -79 dBm, modulated interferer at >46 –3 ±8 MHz and above, BER = 10 Out-of-band blocking(3) 30 MHz to 2000 MHz Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz Intermodulation Wanted signal at 2402 MHz, -76 dBm. Two -40 dBm -19 dBm -22 dBm -42 dBm CO N MHz and above (1) interferers at 2405 and 2408 MHz respectively, at the given power level (1) Numbers given as I/C dB RJ IN (2) X / Y, where X is +N MHz and Y is –N MHz JO (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification 4.7. 125-kbps Coded (Bluetooth 5) – TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units 3.2 4.8 5.6 dBm Output power, highest setting Delivered to a single-ended 50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load -21 dBm Spurious emission conducted f < 1 GHz, outside restricted bands -43 dBm measurement(1) f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 16 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.8. 500-kbps Coded (Bluetooth 5) – RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter Min Typ Max Units Receiver sensitivity BER = 10–3 -101 dBm Receiver saturation BER = 10–3 >5 dBm Frequency error Difference between the incoming carrier frequency tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the tolerance internally generated data rate (37-byte packets) Data rate error Difference between incoming data rate and the tolerance internally generated data rate (255-byte packets) Co-channel rejection(1) Wanted signal at -72 dBm, modulated interferer in Wanted signal at -72 dBm, modulated interferer at CO N Selectivity, ±1 MHz(1) L -500 FI D EN TI A channel, BER = 10–3 -240 -310 240 kHz 500 ppm 330 ppm -5 dB 9 / 5(2) dB 41/31(2) dB 44/41(2) dB 44/44(2) dB 44/44(2) dB 44/44(2) dB 31 dB 5/41(2) dB ±1 MHz, BER = 10–3 Selectivity, ±2 MHz(1) Wanted signal at -72 dBm, modulated interferer at ±2 MHz, BER = 10–3 Wanted signal at -72 dBm, modulated interferer at RJ IN Selectivity, ±3 MHz(1) ±3 MHz, BER = 10–3 Wanted signal at -72 dBm, modulated interferer at JO Selectivity, ±4 MHz(1) ±4 MHz, BER = 10–3 Selectivity, ±6 MHz(1) Wanted signal at -72 dBm, modulated interferer at ±6 MHz, BER = 10 Alternate channel rejection, ±7 MHz Wanted signal at -72 dBm, modulated interferer at (1) ≥ ±7 MHz, BER = 10 Selectivity, Image frequency –3 Wanted signal at -72 dBm, modulated interferer at (1) –3 image frequency, BER = 10 Selectivity, Image frequency ±1 MHz –3 Note that Image frequency +1 MHz is the (1) Co-channel -1 MHz. Wanted signal at -72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 Blocker rejection, ±8 Wanted signal at -72 dBm, modulated interferer at 44 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 17 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 MHz and above(1) ±8 MHz and above, BER = 10–3 Out-of-band blocking(3) 30 MHz to 2000 MHz --35 dBm Out-of-band blocking 2003 MHz to 2399 MHz -19 dBm Out-of-band blocking 2484 MHz to 2997 MHz -19 dBm Intermodulation Wanted signal at 2402 MHz, -69 dBm. Two -37 dBm interferers at 2405 and 2408 MHz respectively, at the given power level (1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz FI D EN TI A 4.9. 500-kbps Coded (Bluetooth 5) – TX L (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter Output power, highest setting Delivered to a single-ended 50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load Spurious emission conducted Typ Max Units 3.2 4.8 5.6 dBm dBm f < 1 GHz, outside restricted bands -43 dBm f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm CO N -21 RJ IN measurement (1) Min (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 JO 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.10. 1-Mbps GFSK (Bluetooth Low Energy) – RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter Min Typ Max Units Receiver sensitivity BER = 10–3 -96 dBm Receiver saturation BER = 10–3 4 dBm Frequency error Difference between the incoming carrier frequency tolerance and the internally generated carrier frequency Data rate error Difference between incoming data rate and the tolerance internally generated data rate -350 350 kHz -750 750 ppm ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 18 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in -6 dB 7 / 3(2) dB 34/25(2) dB 38/26(2) dB 42/29(2) dB 32 dB 25 dB 3/26(2) dB -20 dBm -5 dBm channel, BER = 10–3 Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10 Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10 Selectivity, ±5 MHz or (1) –3 –3 Wanted signal at –67 dBm, modulated interferer at L Selectivity, ±3 MHz(1) –3 ≥ ±5 MHz, BER = 10 Selectivity, Image Wanted signal at –67 dBm, modulated interferer at frequency(1) image frequency, BER = 10–3 Selectivity, Image Wanted signal at –67 dBm, modulated interferer at frequency ±1 MHz (1) ±1 MHz from image frequency, BER = 10–3 Out-of-band blocking(3) 30 MHz to 2000 MHz Out-of-band blocking 2003 MHz to 2399 MHz Out-of-band blocking 2484 MHz to 2997 MHz -8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz -8 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two -34 dBm -71 dBm -62 dBm RSSI dynamic range 70 dB RSSI accuracy ±4 dB CO N FI D EN TI A more RJ IN interferers at 2405 and 2408 MHz respectively, at the given power level 30 to 1000 MHz Conducted measurement in a 50-Ω single-ended JO Spurious emissions, load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Spurious emissions, Conducted measurement in a 50-Ω single-ended 1 to 12.75 GHz load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 (1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 19 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.11. 1-Mbps GFSK (Bluetooth Low Energy) – TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter Min Typ Max Units 3.2 4.8 5.6 dBm Output power, highest setting Delivered to a single-ended 50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load -21 dBm Spurious emission conducted f < 1 GHz, outside restricted bands -43 dBm f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm L measurement (1) FI D EN TI A (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.12. 2-Mbps GFSK (Bluetooth 5) – RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS CO N = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Receiver sensitivity BER = 10–3 Receiver saturation BER = 10–3 Frequency error RJ IN Parameter Difference between the incoming carrier frequency tolerance Typ Max Units -92 dBm 4 dBm -300 500 kHz -1000 1000 ppm and the internally generated carrier frequency Difference between incoming data rate and the JO Data rate error tolerance Min internally generated data rate Co-channel rejection (1) Wanted signal at –67 dBm, modulated interferer in -7 dB 8/4(2) dB 31/26(2) dB 37/38(2) dB 37/36(2) dB 4 dB channel, BER = 10–3 Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10 Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10 Alternate channel rejection, ±7 MHz Selectivity, Image –3 –3 Wanted signal at –67 dBm, modulated interferer at (1) ≥ ±7 MHz, BER = 10 –3 Wanted signal at –67 dBm, modulated interferer at ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 20 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 frequency(1) image frequency, BER = 10–3 Selectivity, Image Note that Image frequency +2 MHz is the frequency ±2 MHz (1) 3/26(2) dB Co-channel. Wanted signal at -67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 Out-of-band blocking(3) 30 MHz to 2000 MHz -33 dBm Out-of-band blocking 2003 MHz to 2399 MHz 15 dBm Out-of-band blocking 2484 MHz to 2997 MHz -12 dBm Out-of-band blocking 3000 MHz to 12.75 GHz -10 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two -34 dBm L interferers at 2405 and 2408 MHz respectively, at (1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz FI D EN TI A the given power level (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification CO N 4.13. 2-Mbps GFSK (Bluetooth 5) – TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Test Conditions Parameter Delivered to a single-ended 50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load Error vector magnitude At maximum output power JO RJ IN Output power, highest setting Min Typ Max Units 3.2 4.8 5.6 dBm -21 dBm 2 % Spurious emission conducted f < 1 GHz, outside restricted bands -43 dBm measurement (1) f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.14. Internal 24-MHz Crystal Oscillator (XOSC_HF)(1) over operating free-air temperature range (unless otherwise noted) Parameter Crystal frequency Test Conditions Min Typ 24 Max Units MHz ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 21 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 Crystal frequency tolerance(2) -40 +40 Start-up time(3) 150 ppm μs (1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth specification (3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 4.15. 32.768-kHz Crystal Oscillator (XOSC_LF) Test Conditions Crystal frequency Min Typ Max FI D EN TI A Parameter L over operating free-air temperature range (unless otherwise noted) Units 32.768 Initial crystal frequency tolerance, Bluetooth low energy applications Crystal aging Tc = 25°C KHz -20 20 ppm -3 3 ppm/year CO N 4.16. 48-MHz RC Oscillator (RCOSC_HF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Min RJ IN Parameter Max Units 48 MHz Uncalibrated frequency accuracy ±1 % Calibrated frequency accuracy(1) ±0.25 % 5 μs Start-up time JO Frequency Typ (1) Accuracy relatively to the calibration source (XOSC_HF). 4.17. 32-kHz RC Oscillator (RCOSC_LF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Calibrated frequency Temperature coefficient Test Conditions Min Typ Max Units 32.8 KHz 50 ppm/°C ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 22 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.18. ADC Characteristics(1) Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. Test Conditions Parameter Min Input voltage range Typ 0 Resolution Max Units VDDS V 12 Sample rate Bits 200 Internal 4.3-V equivalent reference(2) Offset Gain error Internal 4.3-V equivalent reference (2) DNL(3) - ksps 2 LSB 2.4 LSB >-1 LSB ±3 LSB 9.8 Bits 10 Bits 11.1 Bits -65 dB -69 dB -71 dB 60 dB INL Integral nonlinearity FI D EN TI A L Differential nonlinearity ENOB - Internal 4.3-V equivalent reference(2), 200 ksps, Effective number of bits 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, CO N 32 samples average, 200 ksps, 300-Hz input tone THD - Internal 4.3-V equivalent reference(2), Total harmonic 9.6-kHz input tone distortion VDDS as reference, 200 ksps, 9.6-kHz input tone RJ IN 200 ksps, Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, JO SINAD / SNDR Signal-to-noise and 9.6-kHz input tone distortion ratio VDDS as reference, 200 ksps, 9.6-kHz input tone 63 dB Internal 1.44-V reference, voltage scaling disabled, 69 dB 67 dB 32 samples average, 200 ksps, 300-Hz input tone SFDR – Internal 4.3-V equivalent reference(2), 200 ksps, Spurious-free dynamic 9.6-kHz input tone range VDDS as reference, 200 ksps, 9.6-kHz input tone 72 dB Internal 1.44-V reference, voltage scaling disabled, 73 dB 50 Clock 32 samples average, 200 ksps, 300-Hz input tone Conversion time Serial conversion, time-to-output, 24-MHz clock cycles Current consumption Internal 4.3-V equivalent reference(2) 0.66 mA ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 23 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 Current consumption VDDS as reference 0.75 mA Reference voltage Equivalent fixed internal reference (input voltage 4.3 V scaling enabled). For best accuracy, the ADC (2)(4) conversion should be initiated through the TI-RTOS™ API to include the gain or offset compensation factors stored in FCFG1. Reference voltage Fixed internal reference (input voltage scaling 1.48 V VDDS V VDDS/ V disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API to include the gain or offset compensation factors / 4095 Reference voltage FI D EN TI A scaled value (4.3 V) as follows: Vref = 4.3 V × 1408 L stored in FCFG1. This value is derived from the VDDS as reference (Also known as RELATIVE) (input voltage scaling enabled) Reference voltage VDDS as reference (Also known as RELATIVE) (input voltage scaling disabled) Input Impedance 200 ksps, voltage scaling enabled. Capacitive input, 2.82(4) >1 MΩ CO N Input impedance depends on sampling frequency and sampling time (1) Using IEEE Std 1241™-2010 for terminology and test methods. RJ IN (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device JO (4) Applied voltage must be within absolute maximum ratings (Section 4.1) at all times. 4.19. Temperature Sensor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Resolution Range Typ Max 4 -40 Units °C +85 °C Accuracy ±5 °C Supply voltage coefficient(1) 3.2 °C/V (1) Automatically compensated when using supplied driver libraries. ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2017 24 http://WWW.JORJIN.COM.TW DOC No: ZB7412-00A-DTS-R04 4.20. Battery Monitor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Parameter Min Typ Resolution Max 50 Range Units mV 1.8 3.8 Accuracy V mV 13 4.21. Continuous Time Comparator L Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Test Conditions Min Typ Max Units 0 VDDS V 0 VDDS V FI D EN TI A Parameter Input voltage range External reference voltage Internal reference voltage DCOUPL as reference Offset Hysteresis Step from –10 mV to +10 mV Current consumption when enabled(1) CO N Decision time 1.27 V 3 mV