08EM08-N3GML36-01B00

k i n g s t o n . c o m /e m c p eMCP The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various “Internet of Things” (IoT) devices. #KingstonIsWithYou more >> eMCP KEY BENEFITS • Managed NAND flash solution that simplifies design and product sustainment with an industry standard eMMC interface. This significantly reduces the design complexity and qualification cycle. • Low-Power DRAM reduces overall power consumption, making eMCP an optimal solution for many battery powered applications such as wearables and mobile IoT products. • The highly integrated memory and storage combination reduces space on system design, making eMCP an ideal solution for small form factor applications. • Reduced Bill Of Material complexity with component count reduction. MARKET SEGMENTS • Multiple firmware configurations available to best fit your application requirements for performance, power, and life span. eMCP PART NUMBERS AND SPECIFICATIONS LPDDR3 based eMCP Capacity Part Number Smartphones and Tablets NAND DRAM (GB) (Gb) Description Package eMMC DRAM (mm) FBGA Operating Temperature 04EM04-N3GM627 4 4 5.0 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 08EM08-N3GML36 8 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 16EM08-N3GTB29 16 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 16EM16-N3GTB29 16 16 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 32EM16-N3GTX29 32 16 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 32EM32-N3HTX29 32 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C 64EM32-N3HTX29 64 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C LPDDR4x based eMCP Wearables Capacity Part Number AI Accelerators NAND DRAM (GB) (Gb) Description eMMC DRAM Package (mm) Operating FBGA Temperature 04EM08-M4EM627 4 8 5.1 LPDDR4x 8x9.5x0.8 149 -25C to +85C 16EM16-M4CTB29 16 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25C to +85C 32EM16-M4CTX29 32 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25C to +85C 32EM32-M4DTX29 32 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25C to +85C 64EM32-M4DTX29 64 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C 128EM32-M4DTX29 128 32 5.1 LPDDR4x 11.5x13.0x1.1 254 -25°C ~ +85°C IoT THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. MKF-961US All trademarks and registered trademarks are the property of their respective owners.