SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Integrated Transceiver Modules for ZigBee / 802.15.4 (900 MHz)
Development Kit Available
FEATURES
DESCRIPTION
750mW output power
Long range
Up to 1Mbps RF data rate
Miniature footprint: 0.9” x 1.63”
Multiple antenna options
Dual antennas
Agency Approvals: FCC and IC
Powerful Atmel 256k ATXMEGA256A3U
with 802.15.4 MAC or ZigBee Stack
LSR serial interface based on 802.15.4 MAC
Low power operation
RoHS compliant
Streamlined development with LSR design
services.
License options available to purchase
design or integrate design.
APPLICATIONS
Security
Lighting Control
HVAC Control
Sensor Networks
Medical
Industrial Automation
The SiFLEX02-R2-HP module is a high
performance 900MHz IEEE 802.15.4 radio
(AT86RF212B & RF
amplifier circuit) and
microcontroller
(ATXMEGA256A3U)
in a cost effective,
pre-certified
footprint.
The module comes preloaded with the LSR
host serial interface running on top of the Atmel
802.15.4 MAC.
Full debug and programming capabilities are
included to develop custom applications. Easily
load the ZigBee stack or 802.15.4 MAC onto
the module and create your own network.
Need to get to market quickly? Not an expert in
802.15.4 or ZigBee? Need a custom antenna?
Would you like to own the design? Would you
like a custom design*n? Not quite sure what
you need? Do you need help with your host
board? LS Research Design Services will be
happy to develop custom hardware or software,
integrate the design, or license the design so
you can manufacture yourself. Contact us at
sales@lsr.com or call us at 262-375-4400.
ORDERING INFORMATION
Order Number
Description
450-0127
SiFLEX02-R2-HP Module with U.FL connectors for external antennas
(Tray) SPQ = 25, MOQ = 50
450-0128
SiFLEX02-R2-HP Module with castellated RF traces for off board antenna. Note:
See Antenna Options section for more details.
(Tray) SPQ = 25, MOQ = 1,000
NOTE: Non-standard part. Contact LSR directly for more information.
450-0132
SiFLEX02-R2-HP U.FL Development Kit
Table 1 Orderable SiFLEX02-R2-HP Model Numbers
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
MODULE ACCESSORIES
Order Number
Description
001-0002
900 MHz Dipole Antenna with Reverse Polarity
SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
Table 2 Module Accessories
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Analog
TMR/PWM
BLOCK DIAGRAM
Antenna
RF Front End
ATXMEGA256A3U
(Microcontroller)
SPI
AT86RF212B
(802.15.4 Radio)
Power Amplifier /
LNA
Antenna
GPIO
PGM/DBG
Serial I/O
Figure 1 SiFLEX02-R2-HP Module Block Diagram – High-Level
DEVELOPMENT KIT
The SiFLEX02-R2-HP Development Kit can be
used out of the box to evaluate RF range
performance with the simple press of a button.
Users interested in further investigating the
performance and capabilities of the SiFLEX02R2-HP Module can use the ModFLEXTM Test
Tool. This PC-based software can demonstrate
just how easy it is to send & receive data,
collect performance data, change channels,
power levels, or addresses using the LSR
Serial Host Protocol with another
microcontroller.
More advanced users can use the development
board to create and debug their own software
for the SiFLEX02-R2-HP module using the
802.15.4 MAC or ZigBee stack from Atmel.
Part Number
Description
450-0132
SiFLEX02-R2-HP Dev Kit
Figure 2 SiFLEX02-R2-HP Development Board
Kit Contents
ModFLEX Development Board with
SiFLEX02-R2-HP Module with external
antennas (x2)
USB Cable (x2)
AA Batteries (x4)
Software & Technical Information CD
TM
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 1
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
DEVELOPMENT KIT............................................................................................................ 3
Kit Contents ................................................................................................................................................. 3
MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 6
MODULE OVERVIEW ........................................................................................................ 10
Microcontroller .......................................................................................................................................... 10
Radio .......................................................................................................................................................... 12
RF Front End (Power Amplifier and LNA) ............................................................................................... 13
Antenna Options ....................................................................................................................................... 14
OPERATING MODES TRUTH TABLE .............................................................................. 15
MODES OF OPERATION .................................................................................................. 16
Host Microcontroller ................................................................................................................................. 16
Software Stacks ........................................................................................................................................ 16
DEVELOPMENT TOOLS ................................................................................................... 18
AVR Studio................................................................................................................................................. 18
WinAVR ...................................................................................................................................................... 18
AVR JTAGICE mkII .................................................................................................................................... 18
AVRISP mkII ............................................................................................................................................... 18
IAR Embedded Workbench for Atmel AVR ............................................................................................ 18
ELECTRICAL SPECIFICATIONS ...................................................................................... 19
Absolute Maximum Ratings ..................................................................................................................... 19
Recommended Operating Conditions .................................................................................................... 19
General Characteristics ............................................................................................................................ 20
RF Characteristics .................................................................................................................................... 21
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
SOLDERING RECOMMENDATIONS ................................................................................ 24
Recommended Reflow Profile for Lead Free Solder ............................................................................. 24
CLEANING ......................................................................................................................... 25
OPTICAL INSPECTION ..................................................................................................... 25
REWORK ........................................................................................................................... 25
SHIPPING, HANDLING, AND STORAGE ......................................................................... 25
Shipping ..................................................................................................................................................... 25
Handling ..................................................................................................................................................... 25
Moisture Sensitivity Level (MSL) ............................................................................................................. 25
Storage ....................................................................................................................................................... 25
Repeating Reflow Soldering .................................................................................................................... 26
AGENCY STATEMENTS ................................................................................................... 27
MECHANICAL DATA......................................................................................................... 33
PCB Footprint ............................................................................................................................................ 33
General Module Dimensions .................................................................................................................... 34
COMPATIBILITY ................................................................................................................ 35
TRAY PACKAGING (MM) .................................................................................................. 36
MODULE REVISION HISTORY ......................................................................................... 37
Rev 1.0 ........................................................................................................................................................ 37
CONTACTING LS RESEARCH ......................................................................................... 38
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
MODULE PINOUT AND PIN DESCRIPTIONS
MCU#
10
11
12
13
56
57
62
64
63
5
2
3
4
7
8
9
-
GND
GND
GND
NC
NC
VPA
VPA
NC
JTAG TMS
JTAG TDI
JTAG TCK
JTAG TDO
1
69
2
68
3
67
4
66
5
65
6
64
7
63
8
62
9
61
10
60
11
59
12
58
SiFLEX02-R2-HP
(Atmel ATXMEGA256A3U)
JTAG/PDI/JRST 13
nRESET
PA0
NC
PA2
PA1
PA7
PA4
PA5
PA6
PB1
PB2
PB3
VCC - 3V3DC
14
57
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
GND
GND
GND
NC
NC
NC
NC
NC
PC5
PC6
PC7
PC4
PE0
PE1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND
MCU#
21
22
23
20
36
37
-
NC
PF7
PF6
PF5
PC0
PC1/CTS
PC2/UART RX
PC3/UART TX
PE2
PE3
PE4
PE5
PF0
PF1
49 48 47 46 41 40 39 38 19 18 17 16 51 54 55
PA3
MCU#
PF2
PF3
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
1
-
MCU#
Figure 3 Module Pinout
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Module
Pin
Name
MCU
Pin
Type
1
GND
N/A
GND
Ground
2
GND
N/A
GND
Ground
3
GND
N/A
GND
Ground
4
NC
N/A
NC
No Connect
5
NC
N/A
NC
No Connect
6
VPA
N/A
PWR
RF Power Amplifier Supply Voltage
For 750mW output power provide 4.0VDC
For .5W output power provide 3.3VDC
7
VPA
N/A
PWR
RF Power Amplifier Supply Voltage
For 750mW output power provide 4.0VDC
For .5W output power provide 3.3VDC
8
NC
N/A
NC
No Connect
9
JTAG TMS
10
I/O
General-purpose digital I/O (PB4), Analog input, JTAG TMS
10
JTAG TDI
11
I/O
General-purpose digital I/O (PB5), Analog input, JTAG TDI
11
JTAG TCK
12
I/O
General-purpose digital I/O (PB6), Analog input, JTAG TCK
12
JTAG TDO
13
I/O
General-purpose digital I/O (PB7), Analog input, JTAG TDO
13
JTAG/PDI/JRST
56
I/O
PDI/PDI_DATA
14
nRESET
57
Input
15
PA0
62
I/O
General-purpose digital I/O, Analog input, Analog REF A
16
NC
N/A
NC
No Connect
17
PA2
64
I/O
General-purpose digital I/O, Analog input, Analog comparator
2
18
PA1
63
I/O
General-purpose digital I/O, Analog input, Analog comparator
1
19
PA7
5
I/O
General-purpose digital I/O, Analog input, Analog comparator
output
20
PA4
2
I/O
General-purpose digital I/O, Analog input
21
PA5
3
I/O
General-purpose digital I/O, Analog input
22
PA6
4
I/O
General-purpose digital I/O, Analog input
23
PB1
7
I/O
General-purpose digital I/O, Analog input
24
PB2
8
I/O
General-purpose digital I/O, Analog input
25
PB3
9
I/O
General-purpose digital I/O, Analog input
26
VCC - 3V3DC
VCC
VCC
27
PF3
49
I/O
General-purpose digital I/O, Output Compare, UART Tx
28
PF2
48
I/O
General-purpose digital I/O, Output Compare, UART Rx
29
PF1
47
I/O
General-purpose digital I/O, Output Compare, UART XCK0
Description
RESET/PDI_CLOCK
Supply Voltage
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Module
Pin
Name
MCU
Pin
Type
30
PF0
46
I/O
General-purpose digital I/O, Output Compare
31
PE5
41
I/O
General-purpose digital I/O, Output Compare, UART XCK1,
SPI MOSI
32
PE4
40
I/O
General-purpose digital I/O, Output Compare, SPI SS
33
PE3
39
I/O
General-purpose digital I/O, Output Compare, UART Tx
34
PE2
38
I/O
General-purpose digital I/O, Output Compare, UART Rx
35
PC3, UART TX
19
I/O
General-purpose digital I/O, Output Compare, UART Tx
36
PC2, UART RX
18
I/O
General-purpose digital I/O, Output Compare, UART Rx
37
PC1
17
I/O
General-purpose digital I/O, Output Compare, IIC SCL
38
PC0
16
I/O
General-purpose digital I/O, Output Compare, IIC SDA
39
PF5
51
I/O
General-purpose digital I/O
40
PF6
54
I/O
General-purpose digital I/O
41
PF7
55
I/O
General-purpose digital I/O
42
PA3
1
I/O
General-purpose digital I/O, Analog input
43
NC
N/A
NC
No Connect
44
GND
N/A
GND
45
NC
N/A
NC
No Connect
46
NC
N/A
NC
No Connect
47
NC
N/A
NC
No Connect
48
NC
N/A
NC
No Connect
49
NC
N/A
NC
No Connect
50
NC
N/A
NC
No Connect
51
NC
N/A
NC
No Connect
52
NC
N/A
NC
No Connect
53
NC
N/A
NC
No Connect
54
NC
N/A
NC
No Connect
55
NC
N/A
NC
No Connect
56
PE1
37
I/O
General-purpose digital I/O, Output Compare, IIC SCL
57
PE0
36
I/O
General-purpose digital I/O, Output Compare, IIC SDA
58
PC4
20
I/O
General-purpose digital I/O, Output Compare, SPI SS
59
PC7
23
I/O
General-purpose digital I/O, Output Compare, UART Tx, SPI
SCK
60
PC6
22
I/O
General-purpose digital I/O, Output Compare, UART Rx, SPI
MISO
Description
Ground
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Module
Pin
Name
MCU
Pin
Type
61
PC5
21
I/O
General-purpose digital I/O, Output Compare, UART XCK1,
SPI MOSI
62
NC
N/A
NC
No Connect
63
NC
N/A
NC
No Connect
64
NC
N/A
NC
No Connect
65
NC
N/A
NC
No Connect
66
NC
N/A
NC
No Connect
67
GND
N/A
GND
Ground
68
GND
N/A
GND
Ground
69
GND
N/A
GND
Ground
Description
Table 3 SiFLEX02-R2-HP Module Pin Descriptions
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
MODULE OVERVIEW
Figure 4 shows the internal interconnects of the ICs on the SiFLEX02-R2-HP module. Consult the
respective IC datasheets for details, or contact LSR sales to purchase the SiFLEX02-R2-HP module
schematics as part of LSR’s ModFLEX™ design program. For a high-level block diagram of the
SiFLEX02-R2-HP module, see Figure 1.
Antenna 1
26
27
/RST
RX_START
28
IRQ
29
Atmel
ATXMEGA256A3U
SLP_TR
30
/SEL
31
MOSI
32
MISO
33
59
6
SCLK
8
10
1
24
2
11
9
23
22
DIG3 (TX EN)
DIG4 (RX EN)
DIG1 (ANT_SW)
Atmel
AT86RF212B
RF
Power Amplifier /
LNA /
TX/RX Switches
Antenna 2
20
19
50
ANT_SEL
VPA_AD
VGE
PA/LNA
Power Supply
Supply Voltage
Figure 4 SiFLEX02-R2-HP Module Block Diagram – Internal Interconnects
Microcontroller
The AVR XMEGA A3U is a family of low power, high performance and peripheral rich CMOS 8/16-bit
microcontrollers based on the AVR® enhanced RISC architecture. By executing powerful instructions
in a single clock cycle, the XMEGA A3U achieves throughputs approaching 1 Million Instructions Per
Second (MIPS), thus allowing the system designer to optimize power consumption versus processing
speed. Figure 5 shows a block diagram of the ATXMEGA256A3U.
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Figure 5 ATXMEGA256A3U Block Diagram
The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32
registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers
to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is
more code efficient while achieving throughputs many times faster than conventional singleaccumulator or CISC based microcontrollers.
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
The AVR XMEGA A3U devices have five software selectable power saving modes. The Idle mode
stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and all
peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but
stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In
Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to
maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator
Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from
external crystal combined with low power consumption. In Extended Standby mode, both the main
Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the
peripheral clock for each individual peripheral can optionally be stopped in Active mode and Idle sleep
mode.
Radio
The AT86RF212B is a low-power, low-voltage 900 MHz transceiver specially designed for low-cost
IEEE 802.15.4, ZigBee™, and high data rate ISM applications. For the sub-1 GHz bands, it supports a
low data rate of 40kbps of the IEEE 802.15.4-2003 standard and provides an optional data rate
250kbps using O-QPSK, according to IEEE 802.15.4-2006. Furthermore hardware accelerators
improve overall system power efficiency and timing.
The receiver path is based on a low-IF architecture. After channel filtering and down conversion the
low-IF signal is sampled and applied to the digital signal processing part. Communication between
transmitter and receiver is based on direct sequence spread spectrum with different modulation
schemes and spreading codes. The AT86RF212B supports the IEEE 802.15.4-2006 standard
mandatory BPSK modulation and optional O-QPSK modulation in the 900 MHz band. For applications
not necessarily targeting IEEE compliant networks the radio transceiver supports proprietary High Data
Rate Modes based on O-QPSK.
The AT86RF212B features hardware supported 128 bit security operation. The standalone AES
encryption/decryption engine can be accessed in parallel to all PHY operational modes. Configuration
of the AT86RF212, reading, and writing of data memory as well as the AES hardware engine are
controlled by the SPI interface and additional control signals.
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Figure 6 AT86RF212B Block Diagram
RF Front End (Power Amplifier and LNA)
The SiFLEX02-R2-HP module contains a high performance RF Front End, containing both a RF Power
Amplifier as well as a LNA. It is capable of 750mW output power, providing miles of range in outdoor
applications.
The signals DIG3 and DIG4 from the RF212B radio are used for transmit enable (TXEN) and receive
enable (RXEN) respectively. When transmitting the DIG3 signal will be high and DIG4 will be low,
which is controlled by the RF212. When receiving DIG3 will be low and DIG4 is high. In order to
configure this functionality, the PA_EXT_EN bit in register TRX_CTRL_1 (0x04) of the RF212B needs
to be set as a one. In addition the bits PA_LT[1] and PA_LT[0] in register RF_CTRL_0 (0x16) should
both be set to one to maximize the PA lead time to 8usec.
When putting the module to sleep the PA_EXT_EN bit should be set as zero. Upon wakeup the
PA_EXT_EN should be set back to one.
The information in this document is subject to change without notice.
330-0153-R1.1
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Antenna Options
The SiFLEX02-R2-HP module includes multiple antenna options. The module’s regulatory certification
has been completed with the following antenna:
LS Research 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LS
Research 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable (105mm in length)
The SiFLEX02-R2-HP RF castellations for off board antennas are not covered in the modular
certification. If a host board is designed that will utilize off board antennas via the RF castellated
antenna connections, an additional certification will be required. LS Research is equipped with a
certification lab and can assist in getting this done at a very reasonable cost in a short period of time.
An adequate ground plane is necessary to provide good efficiency. The ground plane of the host board
on which the module is mounted increases the effective antenna ground plane size and improves the
antenna performance.
The environment the module is placed in will dictate the range performance The non-ideal
characteristics of the environment will result in the transmitted signal being reflected, diffracted, and
scattered. All of these factors randomly combine to create extremely complex scenarios that will affect
the link range in various ways.
It is also best to keep some clearance between the antennas and nearby objects. This includes how
the module is mounted in the product enclosure. Unless the items on the following list of
recommendations are met, the radiation pattern can be heavily distorted.
Whichever antenna is used, it is best to keep a few things in mind when determining its location.
Never place ground plane or copper trace routing underneath the antenna.
LSR recommends keeping metal objects as far away from the antenna as possible. At a very minimum
keep the antenna at least 5 cm from any metallic objects, components, or wiring. The farther the antenna
is placed from these interferers, the less the radiation pattern and gain will be perturbed.
Do not embed the antenna in a metallic or metalized plastic enclosure.
If located within a plastic enclosure, keep the enclosure at least 1 cm from the antenna.
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
OPERATING MODES TRUTH TABLE
Mode
VGE
LNA_EN
ANT_SW
ANT_SEL
Sleep
0
0
0
0
Transmit – Ant J3, RF1
1
X
1
X
Transmit – Ant J4, RF2
1
X
0
X
Receive with LNA Disabled – Ant J3, RF1
1
1
X
1
Receive with LNA Disabled – Ant J4, RF2
1
1
X
0
Receive with LNA Enabled – Ant J3, RF1
1
0
X
1
Receive with LNA Enabled – Ant J4, RF2
1
0
X
0
Note: X = Don’t Care
Table 4 Operating Modes Truth Table
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
MODES OF OPERATION
With a host microcontroller
With the Atmel 802.15.4 MAC
With the Atmel ZigBee stack
Host Microcontroller
PC
LSR Test Tool
Software
Figure 8 ModFLEX™ Test Tool Communications
Log
UART
Si-FLEX Module on
Evaluation Board
-OR-
Your Microcontroller
(Host) of Choice
UART
Si-FLEX Module on
Your Board
Some examples of serial commands that can
be used with the SiFLEX02-R2-HP Module:
Set/Query RF channel
Set/Query RF power
Set/Query device address
Transmit RF data or notification RF data
received
Go to Sleep
Software Stacks
Figure 7 Host Microcontroller Modes of
Operation
Out of the box the SiFLEX02-R2-HP module
contains an 802.15.4 based application that
uses a host serial processor. This allows
features of the module to be explored with the
LSR PC based test tool, or controlled with a
host microcontroller. The advantage of this
method is simplicity; all major features of using
the radio are simplified into a simple serial
message, taking the burden of becoming a
radio expert off the developer.
Use the Communications Log in the
ModFLEX™ Test Tool software and serial host
protocol documents to see the messages in
action. It will help you become familiar with the
serial commands and how to implement them
on your own microcontroller.
There are two software stacks provided by
Atmel to streamline development:
MAC (802.15.4)
Atmel ZigBee Stack
Overall Complexity and Development Effort
Figure 9 SiFLEX02-R2-HP Compatible Stacks
802.15.4 MAC
Use for applications requiring point-topoint or star network topology.
Advantages: Quick learning curve,
minimize software development, easy to
deploy in the field
Disadvantages: No mesh networking
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Application Software
(to control switches,
LED’s, serial ports
and so on)
Software
Interface
Disadvantages: Large learning curve, more
software development, complexity
802.15.4 MAC
(To Tx/Rx RF data)
Application Software
(to control switches,
LED’s, serial ports
and so on)
Software
Interface
ZigBee Stack
(To Tx/Rx RF data)
Figure 10 SiFLEX02-R2-HP with 802.15.4 MAC
Atmel ZigBee Stack
Use when mesh networking is required.
Advantages: Covers a large area with a
ZigBee network.
Figure 11 SiFLEX02-R2-HP with Atmel ZigBee
Stack
The information in this document is subject to change without notice.
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SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
DEVELOPMENT TOOLS
AVR Studio
AVR Studio® is an Integrated Development
Environment (IDE) for writing and debugging
AVR® applications. AVR Studio includes an
assembler, simulator, and in-circuit debugger.
AVR Studio is the Integrated Development
Environment (IDE) developed by Atmel for
writing and debugging Atmel AVR applications.
Figure 12 JTAGICE mkII
WinAVR
WinAVR is a suite of executable, open source
software development tools for the Atmel AVR
series of RISC microprocessors hosted on the
Windows platform. It includes the GNU GCC
compiler for C/C++.
WinAVR contains all the tools for developing on
AVR family microcontrollers from Atmel. This
includes avr-gcc (compiler), avrdude
(programmer), avr-gdb (debugger), and more.
AVRISP mkII
Another option for in-circuit programming is the
AVRISP mkII from Atmel, Figure 13. The
AVRISP mkII combined with AVR Studio® can
program new AVR 8-bit RISC microcontrollers
with ISP Interface.
AVR JTAGICE mkII
Custom firmware development can be done on
the SiFLEX02-R2-HP module using
development tools available through Atmel.
Shown inError! Reference source not found.,
JTAGICE mkII interface is required. It plugs
into the ModFLEX™ Development Board, and
can easily be adapted to other hardware. See
the Atmel website for more information and
ordering options.
Figure 13 AVRISP mkII
IAR Embedded Workbench for Atmel
AVR
Another option is IAR Embedded Workbench
for Atmel AVR. IAR Embedded Workbench for
AVR is an integrated development environment
for building and debugging embedded
applications. Visit the IAR Systems website for
additional information.
The information in this document is subject to change without notice.
330-0153-R1.1
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Page 18 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on the use of the Atmel IEEE 802.15.4 MAC loaded
with the generic application firmware written by LSR. Custom firmware may require these values to be
re-characterized by the customer.
Absolute Maximum Ratings
Rating
Min
Max
Unit
Power supply voltage (VCC)
0
3.6
V
Power Amplifier supply voltage (VPA)
0
4.5
V
-0.3
Vcc + 0.3
V
+10
dBm
+85
ºC
+150
ºC
Voltage on any pin with respect to ground
RF input power
Operating temperature range
-40
Storage temperature
-50
Table 5 Absolute Maximum Ratings
1
Recommended Operating Conditions
Characteristic
Min
Typ
Max
Unit
Power supply voltage (VCC)
2.5
3.3
3.50
Vdc
Power Amplifier supply voltage (VPA)
3.0
4.0
4.25
Vdc
Ambient temperature range
-40
25
85
ºC
Table 6 Recommended Operating Conditions
Operation of Vcc below 3.0v will result in a significant reduction in RF output power.
Module will NOT transmit, if VPA > 4.25V.
1
Under no circumstances should exceeding the maximum ratings specified in the Absolute Maximum Ratings
section be allowed. Stressing the module beyond these limits may result permanent damage to the module that
is not covered by the warranty.
The information in this document is subject to change without notice.
330-0153-R1.1
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Page 19 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
General Characteristics
Parameter
Min
RF frequency range (Note 1, 2)
Typ
Max
Unit
906
924
MHz
RF data rate
40
1000
kbps
Host data rate
1.2
921.6
kbps
19.2
Flash memory
256
kBytes
RAM
16
kBytes
EEPROM
4
kBytes
Table 7 General Characteristics
Note 1: The frequency range needs to be restricted to 915 to 924 MHz (channels 6-10) to meet
Australian/New Zealand standards.
Note 2:Due to the band pass filter, receiver sensitivity is reduced by approximately 1dB on channels 1,
2, 8, 9, and 10 (906MHz, 908MHz, 920MHz, 922MHz, and 924MHz). This improves receiver
performance in the presence of interferers on channels 3, 4, 5, 6, and 7 (910MHz, 912MHz,
914MHz, 916MHz, and 918MHz).
Power Consumption
(TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924MHz, Rload = 50Ω)
Parameter
Transmit mode - VPA
Test Conditions
Min
Maximum power step
Transmit mode - VCC
Typ
Max
Unit
450
600
mA
50
Receive mode - VPA
Receive mode - VCC
27
1
uA
48
mA
1
µA
2
5
uA
Typ
Max
Unit
39
Sleep mode - VPA
Sleep mode - VCC
mA
Table 8 Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
Logic input low
-0.3
0.2 * Vcc
V
Logic input high
0.8 * Vcc
Vcc + 0.3
V
Logic output low
IOUT = 15mA
Vcc = 3.3V
0.4
V
Logic output high
IOUT = -8mA
Vcc = 3.3V
2.9
V
Table 9 DC Characteristics – General Purpose I/O
The information in this document is subject to change without notice.
330-0153-R1.1
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Page 20 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
RF Characteristics
Transmitter Characteristics
(TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924 MHz)
Parameter
Test Conditions
Min
Typ
Max
Unit
Nominal max output power
(40kbps)
750mW (Notes: 1, 2)
26
27
29
dBm
Nominal max output power
(250kbps and higher)
750mW (Notes: 1, 2)
27
28
29
dBm
Programmable output power range
22 Steps
15
28
dBm
Harmonics (2fo)
-50
dBm
Harmonics (3fo)
-55
dBm
Error vector magnitude
10
35
% rms
Table 10 Transmitter RF Characteristics
Note 1: In accordance with FCC Part 15.247(e) and RSS 210 A8.2(b), the peak power spectral density
should not exceed +8 dBm in any 3 KHz band.
Note 2: In accordance with Australian/New Zealand 4268 : 2008, the peak power spectral density
should not exceed +14dBm in any 3 KHz band in the 915 to 928 MHz frequency band.
The information in this document is subject to change without notice.
330-0153-R1.1
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Page 21 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
RF Output Power and Transmit Current
(TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 914 MHz)
Host Protocol
RF Power
Level
AT86RF212
PHY_TX_PWR
Register Value
21
BPSK into 50 ohms at U.FL
RF Output
Power (dBm)
Typical Current
Consumption (mA)
0xE7
27.9
465
20
0xE7
27.9
454
19
0xE7
27.8
442
18
0xE8
27.6
425
17
0xE8
27.2
393
16
0x42
26.5
365
15
0x43
26.2
346
14
0x23
26.0
338
13
0x23
25.5
318
12
0x24
25.1
304
11
0x66
24.3
281
10
0x04
24.3
277
9
0x05
23.3
254
8
0x06
22.4
236
7
0x07
21.5
219
6
0x08
20.6
207
5
0x08
19.9
198
4
0x09
18.9
188
3
0x0A
18.0
181
2
0x0B
17.2
177
1
0x0C
16.2
173
0
0x0D
15.3
171
Table 11 RF Power Settings
The information in this document is subject to change without notice.
330-0153-R1.1
Copyright © 2014 LS Research, LLC
Page 22 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
Receiver Characteristics
(TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924 MHz)
Parameter
Test Conditions
Min
Typ
Max
Unit
Receiver Sensitivity
@ 1% PER
BPSK 40kbit/s
< -104
dBm
Saturation Level
@ 1% PER
BPSK 40kbit/s
-2
dBm
Table 12 Receiver RF Characteristics
For additional details regarding the electrical specifications, refer to the ATXMEGA256A3U and
AT86RF212B datasheets on the Atmel website.
The information in this document is subject to change without notice.
330-0153-R1.1
Copyright © 2014 LS Research, LLC
Page 23 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
The information in this document is subject to change without notice.
330-0153-R1.1
Copyright © 2014 LS Research, LLC
Page 24 of 38
SiFLEX02-R2-HP TRANSCEIVER MODULE
DATASHEET
CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module
itself,
e.g.
replacing
individual components. Such actions
will terminate warranty coverage.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the SiFLEX02-R2-HP modules
are delivered in trays of 25.
Handling
The SiFLEX02-R2-HP modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (
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