CBM-120-UV-C14-GA365-21 数据手册
CBM-120-UV Product Datasheet
CBT-120 Product Datasheet
Preliminary
CBM-120
Mosaic Array Series
Ultraviolet Chip On Board LEDs
Table of Contents
Technology Overview. . . . . . 2
Ordering Information . . . . . . 3
Binning Structure. . . . . . . . . . 4
Ordering Bin Kits. . . . . . . . . . . 5
Optical & Electrical
Characteristics. . . . . . . . . . . . . 6
Typical Spectrum . . . . . . . . . . 8
Features:
•• Mosaic Array UV LED chipset with surface emitting area of 12 mm2, 4:3 aspect ratio
•• All the benefits of chip on board processing without the need for complicated
assembly process
•• Vertical chip UV LED technology for high power density and uniform emission
•• Wide Range of UVA Wavelengths
•• High thermal conductivity copper coreboard package
•• Low-profile window for efficient coupling into small-etendue systems
•• Can be operated at variable drive currents up to 18A
•• NIST traceable optical and electrical measurement testing
•• Environmentally friendly: RoHS and Halogen compliant
Thermal Resistance . . . . . . . . 9
Mechanical Dimensions Slim
Package (C14). . . . . . . . . . . . . 10
Mechanical Dimensions Square
Package (C31). . . . . . . . . . . . . 11
Shipping Tray Slim Package
(C14) . . . . . . . . . . . . . . . . . . . . . 12
Applications
•• Curing:
Shipping Tray Square Package
(C31) . . . . . . . . . . . . . . . . . . . . . 13
›› Inks
Packaging Specifications. . 14
›› Adhesives
Revision History. . . . . . . . . . . 15
•• Specialty Projection Systems for
Maskless Lithography:
›› Optically matched to TI 0.95”DMD
›› Coatings
•• Rapid Prototyping and 3D printing
•• Medical and Scientific
Instrumentation
•• Inspection
•• Machine Vision
•• Fiber-coupled illumination
1
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
Preliminary
Technology Overview
Luminus LEDs benefit from innovations in device technology, chip packaging and thermal management. This suite of technologies give
engineers and system designers the freedom to develop solutions both high in power and efficiency.
Luminus Mosaic Array LED Technology
Reliability
Luminus’ Devices vertical chip LED technology enables LED
chips with uniform brightness over the entire LED chip surface.
The optical power and brightness produced by these densely
packed arrays of devices enable solutions not possible with
single chip packages that be used to replace arc and halogen
lamps.
With designs based on years of chip and packaging
development experience, Luminus LEDs are one of the most
reliable light sources in the world today. Luminus LEDs pass a
rigorous suite of environmental and mechanical stress tests,
including mechanical shock, vibration, temperature cycling and
humidity, and have been fully qualified for use in extreme high
power and high current applications. With very low failure rates
and median lifetimes that typically exceed 30,000 hours,
Luminus UV LEDs are ready for even the most demanding
applications.
Packaging Technology
Thermal management is critical in high power LED applications.
With a thermal resistance from junction to heat sink of 0.6 ºC/W,
Luminus CBM-120 LEDs have the lowest thermal resistance of
any UV LED on the market. This will allow the LEDs to be driven
at higher current densities while maintaining a low junction
temperature, thereby resulting in brighter solutions and longer
lifetimes.
Environmental Benefits
Luminus LEDs help reduce power consumption and the amount
of hazardous waste entering the environment. All LED products
manufactured by Luminus are RoHS and Halogen compliant
and free of hazardous materials, including lead and mercury.
Understanding Mosaic Array UV LED Test Specifications
Every Luminus LED is fully tested to ensure that it meets the high quality standards expected from Luminus’ products.
Testing Temperature
Multiple Operating Points
Luminus core board products are typically measured in such a
way that the characteristics reported agree with how the
devices will actually perform when incorporated into a system.
This measurement is accomplished by mounting the devices on
a 40ºC heat sink and measuring the device while fully powered.
The tables on the following pages provide typical optical and
electrical characteristics for the standard drive conditions. Since
the LEDs can be operated over a wide range of drive
conditions(currents from 200 mA to 18 A, and duty cycle from
240 Hz, duty cycle =10%, t=1ms)
Maximum Junction Temperature8
407
Values
Absolute Minimum Current (CW or Pulsed)6
Absolute Maximum Current (CW) 7
403
Note 1:
Data verified using NIST traceable calibration standard.
Note 2:
All data are based on test conditions with a constant heat sink temperature Ths = 40°C under pulse testing conditions. Pulse conditions: 25%
duty-cycle, frequency of 720Hz , 3 second soak.
Note 3:
Unless otherwise noted, values listed are typical. Devices are production tested and specified at 9 A.
Note 4:
Listed drive conditions are typical for common applications. CBM120-UV devices can be driven at currents ranging from 200 mA to 120 A and at duty
cycles ranging from 1% to 100%. Drive current and duty cycle should be adjusted as necessary to maintain the junction temperature desired to meet
application lifetime requirements.
Note 5:
Typical total flux from emitting area at listed peak wavelength. Reported performance is included to show trends for a selected power level. For
specific minimum and maximum values, use bin tables. For product roadmap and future performance of devices, contact Luminus.
Note 6:
Special design considerations must be observed for operation under 1 A. Please contact Luminus for further information.
Note 7:
CBM-120-UV LEDs are designed for operation to an absolute maximum current as specified above. Product lifetime data is specified at recommended forward drive currents. Sustained operation at or beyond absolute maximum currents will result in a reduction of device life time compared to
recommended forward drive currents. Actual device lifetimes will also depend on junction temperature. Refer to the lifetime derating curves for
further information. In pulsed operation, rise time from 10-90% of forward current should be longer than 0.5 μseconds.
Note 8:
Lifetime dependent on LED junction temperature. Input power and thermal system must be properly managed to ensure lifetime.
6
PDS-002545 Rev 0B
© 2015 Luminus Devices, Inc. - All Rights Reserved
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
CBT-120 Product Datasheet
Preliminary
Optical & Electrical Characteristics
Relative Power vs Forward Current, Tj = 60°C
Relative Power vs Junc. Temperature, If = 9 A
Peak Wavelength vs Forward Current
Peak Wavelength vs Junction Temperature
Forward Voltage vs Forward Current
Forward Voltage vs Junction Temperature
7
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
CBT-120 Product Datasheet
Preliminary
Typical Spectrum9
Note 9: Typical spectrum at current of 9 A in continuous operation.
8
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
Preliminary
Thermal Resistance CBM-120-UV
Typical Thermal Resistance1 - C31
Tj = Die Junction Temp
Tb = Coreboard Temp
Ths = Heatsink Temp (3mm from surface)
Tref - Thermistor Temp
Rθj-b2
0.61 °C/W
Rθb-hs3
0.12 °C/W
Rθj-hs3
0.73 °C/W
Rθj-ref2
0.64 °C/W
Typical Thermal Resistance1 - C14
Rθj-b2
0.76 °C/W
Rθb-hs3
0.12 °C/W
Rθj-hs3
0.88 °C/W
Note 1: Real thermal resistance data - “Electrical”
thermal resistance values available upon
request
Tj = Die Junction Temp
Tb = Coreboard Temp
Ths = Heatsink Temp (3mm from surface)
Note 2: Thermal resistance values are based on
measured wavelength shift data.
Note 3: Thermal Resistance is based on eGraf
1205 Thermal interface.
Electrical Pinout - C31 Package
Temperature (° C)
125
1
100
75
50
25
0
2
0
5
10
15
20
Resistance (K ohm)
The thermistor used in CBT-120 devices mounted on coreboards is from Murata Manufacturing Co. The global part number is
NCP18XH103J03RB. Please see http://www.murata.com/ for details on calculating thermistor temperature.
For more information on use of the thermistor, please contact Luminus directly.
9
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
CBT-120 Product Datasheet
Preliminary
Mechanical Dimensions – CBM-120-UV-C14 Mosaic Array LED Emitter
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Recommended connector for Anode and Cathode: Panduit Disco Lok™ Series P/N: DNG14-250FL-C.
10
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
72/(5$1&(
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
CBT-120 Product Datasheet
Preliminary
Mechanical Dimensions – CBM-120-UV-C31 Mosaic Array LED Emitter
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Recommended connector for Anode and Cathode: Panduit Disco Lok™ Series P/N: DNG14-250FL-C.
Thermistor Connector: MOLEX P/N 53780-0270 or GCT P/N WTB08-021S-F.
Recommended Female: MOLEX P/N 51146-0200, GCT P/N WTB06-021S-F or equivalent
11
PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
72/(5$1&(
Luminus Devices, Inc. • T 978.528.8000 • www.luminus.com
175 New Boston Street • Woburn, MA 01801
CBM-120-UV Product Datasheet
Preliminary
Shipping Tray Outline - CBM-120-C14
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PDS-002545 Rev B
© 2015 Luminus Devices, Inc. - All Rights Reserved
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