M00601

Technical Data Sheet MF200 November-2009 PRODUCT DESCRIPTION MF200 provides the following product characteristics: Technology Product Benefits Application Liquid flux • No clean • Halide-free • Resin-free • Low residue Wave soldering flux MF200 is recommended for consumer electronics and general electrical lead-free soldering applications, particularly where there has been a high level of mid-pad solder balling. It may also be used with standard lead containing alloys. FEATURES AND BENEFITS ● Developed to complement Pb-free wave soldering. ● Micro solder balling reduced or eliminated. ● Excellent process window and sustained activity. ● High speed soldering on conventional leaded and SMD components. ● Good through hole penetration. ● Minimal residues - reduced contamination of ATE probes. ● Compatible with rosin and OSP based surface preservatives. ● Spray application. TYPICAL PROPERTIES Liquid Flux Typical Properties Solids Content, % Halide Content, % Acid Value, mg KOH, g Specific Gravity @ 25°C EN 29454 classification ANSI/JSTDclassification 6.4