IP4047CX6/LF,135

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia IP4047CX6 Dual channel integrated passive filter network with ESD protection Rev. 2 — 1 September 2014 Product data sheet 1. Product profile 1.1 General description The IP4047CX6 is a low ohmic, dual-channel RC low-pass filter array which is designed to provide filtering of undesired RF signals. In addition, the IP4047CX6 incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV contact, according to the IEC 61000-4-2 standard, far exceeding the level 4. The IP4047CX6 is fabricated using monolithic silicon technology and integrates two resistors and four pairs of back-to-back diodes in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4047CX6 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits  2-channel integrated -type RC-filter network  Downstream ESD protection of 15 kV contact according to IEC 61000-4-2 ESD model, far exceeding level 4  0.95  series resistance; 280 pF channel capacitance  WLCSP with 0.5 mm pitch 1.3 Applications Audio line EMI-filtering and ESD protection in:  Cellular and PCS mobile handsets  Cordless telephones 2. Pinning information 2.1 Pinning    $ % DDD Fig 1. Pin configuration IP4047CX6 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 2.2 Pin description Table 1. Pinning Pin Description A1 filter channel 1 input A2 ground A3 filter channel 2 input B1 filter channel 1 output B2 ground B3 filter channel 2 output 3. Ordering information Table 2. Ordering information Type number IP4047CX6/LF Package Name Description Version WLCSP6 wafer level chip-size package; 6 bumps (3  2) - 4. Marking IP4047CX6 is laser-marked with the following information (see Figure 2): • A marker indicating the pin A1 position. • Two lines of characters or numbers: – The first line (placeholder ) indicates the marking code. Mapping of product type number to marking code is given in Table 3. – The second line (placeholder ) indicates the production lot. This information enables tracking a device down to a particular production date. SLQ$PDUNHU PDUNLQJFRGH! ORW,'! DDD Fig 2. Table 3. IP4047CX6 Product data sheet IP4047CX6: outline of marking Marking code Type number Marking code IP4047CX6/LF 47 All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 5. Functional diagram 5 $ % & & $ % & & 5 $ % DDD Fig 3. Schematic diagram IP4047CX6 6. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VI input voltage Conditions VESD electrostatic discharge voltage Min Max Unit 6 +6 V 15 +15 kV IEC 61000-4-2, level 4; all pins to ground contact discharge [1] 15 +15 kV Pch channel power dissipation Tamb = 85 C - 70 mW Ptot total power dissipation Tamb = 85 C - 150 mW Tstg storage temperature 65 +150 C Treflow(peak) peak reflow temperature - 260 C Tamb ambient temperature 40 +85 C air discharge [1] 10 s maximum Device is tested with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). IP4047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 7. Characteristics Table 5. Electrical characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) channel series resistance Cch channel capacitance VBR breakdown voltage ILR Conditions reverse leakage current Min Typ Max Unit 0.76 0.95 1.14  V = 0 V; f = 100 kHz 224 280 336 pF positive direction; Itest = +1 mA 6 - 12 V negative direction; Itest = 1 mA 12 - 6 V per channel; V = +3 V - - +1 A per channel; V = 3 V 1 - - A Conditions Min Typ Max Unit Rgen = 50 ; RL = 50 ; 800 MHz < fI < 2 GHz 28 - - dB Rgen = 50 ; RL = 5 ; 800 MHz < fI < 2 GHz 19 - - dB Table 6. Frequency response Tamb = 25 C; unless otherwise specified. Symbol Parameter il insertion loss 8. Application information 8.1 Insertion loss The setup for measuring insertion loss in a 50  system is shown in Figure 4. The insertion loss in a 50  system for the two channels of the IP4047CX6 is shown in Figure 5. The insertion loss is measured on a single die mounted on an RF PCB. Unused pins are connected to ground with 50 . DDD  6 G%   ,1 '87  287 ȍ ȍ  7(67%2$5' 9JHQ   Fig 4. Frequency response measurement configuration IP4047CX6 Product data sheet     I0+] DDL Fig 5. Measured insertion loss magnitude All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 9. Package outline :/&63ZDIHUOHYHOFKLSVL]HSDFNDJHEXPSV[ ' EXPS$ LQGH[DUHD $ ( $ $ GHWDLO; H H E % H $    (XURSHDQ SURMHFWLRQ ; ZOFVSB[BSR Fig 6. Table 7. Package outline WLCSP6 Dimensions for Figure 6 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A1 0.22 0.24 0.26 mm A2 - 0.41 - mm b 0.27 0.32 0.37 mm D 1.39 1.44 1.49 mm E 0.94 0.99 1.04 mm e - 0.5 - mm e1 - 1.0 - mm IP4047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 10. Soldering 10.1 PCB assembly guidelines for Pb-fee soldering Table 8. Assembly recommendations Parameter Value or specification Solder screen aperture diameter 330 m Solder screen thickness 100 m (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %) Solder to flux ratio 50 : 50 Solder reflow profile see Figure 7 7 ƒ& 7UHIORZSHDN   FRROLQJUDWH  SUHKHDW W WV W W W W DDL The device can withstand at least three reflows of this profile. Fig 7. IP4047CX6 Product data sheet Pb-free solder reflow profile Table 9. Characteristics Symbol Parameter Treflow(peak) peak reflow temperature t1 time 1 t2 t3 Conditions Min Typ Max Unit 230 - 260 C soak time 60 - 180 s time 2 time during T  250 C - - 30 s time 3 time during T  230 C 10 - 50 s t4 time 4 time during T > 217 C 30 - 150 s t5 time 5 - - 540 s dT/dt rate of change of temperature cooling rate - - 6 C/s preheat 2.5 - 4.0 C/s All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 6 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 11. Mounting 11.1 PCB design guidelines For the optimum performance, a PCB Non-Solder Mask Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer is recommended. This connection results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, the following are the recommended PCB design parameters. Table 10. Recommended PCB design parameters Parameter Value or specification PCB pad diameter 200 m Micro-via diameter 100 m (0.004 inch) Solder mask aperture diameter 370 m Copper thickness 20 m to 40 m Copper finish AuNi PCB material FR4 12. Abbreviations Table 11. IP4047CX6 Product data sheet Abbreviations Acronym Description EMI ElectroMagnetic Interference ESD ElectroStatic Discharge FR4 Flame Retard 4 NSMD Non-Solder Mask Design PCB Printed-Circuit Board PCS Personal Communication System WLCSP Wafer-Level Chip-Scale Package All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 7 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 13. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4047CX6 v.2 20140901 Product data sheet - IP4047CX6_LF v.1 - - Modifications: IP4047CX6_LF v.1 IP4047CX6 Product data sheet • Package dimensions D and E corrected 20080606 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 8 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. IP4047CX6 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4047CX6 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 11 IP4047CX6 NXP Semiconductors Dual channel integrated passive filter network with ESD protection 16. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 8 8.1 9 10 10.1 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PCB assembly guidelines for Pb-fee soldering. 6 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PCB design guidelines . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 September 2014 Document identifier: IP4047CX6