IP4085CX4/LF/P,135

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia :/ &6 3 IP4085CX4; IP4385CX4; IP4386CX4; IP4387CX4 Integrated high-performance ESD protection diodes Rev. 2 — 14 December 2012 Product data sheet 1. Product profile 1.1 General description Integrated high-performance protection diodes protecting appliances against ElectroStatic Discharge (ESD) of 30 kV, far exceeding IEC 61000-4-2 level 4 standard, overvoltage and wrong polarity. Each device includes one high-level ESD protection diode in a 4-channel 0.4 mm (IP438xCX4) or 0.5 mm (IP4085CX4) pitch Wafer Level Chip-Size Package (WLCSP). The anode and the cathode of ESD protection diode are each connected to two solder balls. 1.2 Features and benefits     Single integrated high-performance ESD protection diode Surge immunity according to IEC 61000-4-5 (8/20 s) up to 60 A (IP4085CX4) ESD protection of >30 kV contact discharge, far exceeding IEC 61000-4-2, level 4 Small 2  2 solder ball WLCSP package with 0.4 mm or 0.5 mm pitch 1.3 Applications General-purpose ESD protection such as for charger interfaces in:  Mobile handsets  Portable devices  Wireless data systems IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 2. Pinning information Table 1. Pin Pinning Description Simplified outline Graphic symbol A1 and A2 cathode B1 and B2 anode A1 bump A1 index area 1 2 B1 A2 B2 006aad220 A B 008aaa236 transparent top view, solder balls facing down 3. Ordering information Table 2. Ordering information Type number IP4085CX4/LF/P Package Name Description WLCSP4 IP4385CX4/LF Version wafer level chip-size package: 4 bumps (2  2)[1] IP4085CX4/LF/P wafer level chip-size package: 4 bumps (2  2)[2] IP4385CX4/LF IP4386CX4/P IP4386CX4/P IP4387CX4/P IP4387CX4/P [1] Size: 0.91  0.91  0.65 mm [2] Size: 0.76  0.76  0.61 mm IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 2 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VRWM reverse standoff voltage IP4085CX4; IP4386CX4 0.5 +14 V IP4385CX4 0.5 +5.5 V IP4387CX4 0.5 +8.0 V VESD electrostatic discharge voltage all pins to ground contact discharge [1] 30 +30 kV air discharge [1] 15 +15 kV contact discharge 8 +8 kV air discharge 15 +15 kV IP4085CX4 60 - A IP4385CX4; IP4387CX4 33 - A IP4386CX4 28 - A IP4085CX4; IP4386CX4; tp = 2 ms 10 - A IP4085CX4; IP4386CX4; tp = 5 ms 8.5 - A IP4085CX4; IP4386CX4; tp = 100 ms 3.5 - A IP4385CX4; IP4387CX4; tp = 2 ms 11 - A IP4385CX4; IP4387CX4; tp = 5 ms 9 - A IP4385CX4; IP4387CX4; tp = 100 ms 5 - A IEC 61000-4-2, level 4; all pins to ground IEC 61000-4-5; tp = 8/20 s peak pulse current IPP IFSM non-repetitive peak forward current total power dissipation Ptot Tstg storage temperature Treflow(peak) peak reflow temperature Tamb ambient temperature 10 pulses; 1 pulse per second forward conducting [2] IP4085CX4 [3] - 1 W IP4385CX4; IP4386CX4; IP4387CX4 [3] - 0.7 W 55 +150 C - 260 C 30 +85 C tp  10 s [1] Device tested with over 1000 pulses of 30 kV contact discharges, according to the IEC 61000-4-2 model. [2] Severe self-heating demands a heat-dissipation optimized Printed-Circuit Board (PCB) to prevent the device from de-soldering. For ambient temperature above 50 C, the guaranteed life time is 48 hours at 0.7 W, assuming Rth to be 130 K/W as specified in Table 4. [3] Permanent operation at maximum power dissipation and above maximum junction temperature will result in a reduced life time. IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 3 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 5. Thermal characteristics Table 4. Symbol Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions [1] on a 2-layer PCB Typ Unit 130 K/W Depends on details of PCB layout. 6. Characteristics Table 5. Electrical characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions VBR breakdown voltage IR = 15 mA VCL IRM Cd VF clamping voltage Min Typ Max Unit IP4085CX4; IP4386CX4 16 - - V IP4385CX4 7.0 - - V IP4387CX4 10 - - V IP4085CX4 - - 20 V IP4385CX4 - - 10 V IP4386CX4 - - 20 V IP4387CX4 - - 13 V IP4085CX4; IP4385CX4 VR = +5 V - - 200 nA IP4386CX4; VR = +14 V - - 200 nA IP4387CX4; VR = +8 V - - 800 nA IP4085CX4 - 180 - pF IP4385CX4 - 450 - pF IP4386CX4 - 160 - pF IP4387CX4 - 290 - pF [1] - - 1.15 V [2] - - 1.3 V [1] - - 1.0 V [2] - - 1.1 V [1] - - 1.15 V [2] - - 1.3 V [1] - - 1.10 V [2] - - 1.25 V IR = 1 A; Tamb  85 C at surge peak pulse, according to IEC 61000-4-5 reverse leakage current diode capacitance forward voltage VR = 0 V; f = 1 MHz IF = 850 mA IP4085CX4 IP4385CX4 IP4386CX4 IP4387CX4 [1] Tamb  +25 C [2] 30 C  Tamb  +85 C IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 4 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 7. Application information 7.1 Forward current DC clamping voltage The forward current DC clamping voltage is an indicator of protection level of circuit from voltage sources with the wrong polarity. Figure 1 shows basic measurement setup. VCL IF V 006aad221 Fig 1. Measuring DC clamping voltage with forward current 001aaj241 1.1 VCL (V) 001aaj242 1.1 VCL (V) (1) 1.0 1.0 (1) (2) (2) 0.9 0.9 (3) (3) 0.8 0.8 0.7 0.7 0 0.2 0.4 0.6 0.8 1.0 0 0.2 IF (A) (1) Tamb = +25 C (2) Tamb = +85 C (2) Tamb = +85 C (3) Tamb = 30 C (3) Tamb = 30 C IP4085CX4: DC clamping voltage as a function of forward current 0.6 0.8 1.0 IF (A) (1) Tamb = +25 C Fig 2. 0.4 Fig 3. IP4385CX4: DC clamping voltage as a function of forward current IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 5 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 001aaj243 1.1 VCL (V) VCL (V) (1) 1.0 001aaj244 1.1 (1) 1.0 (2) (2) (3) 0.9 0.9 (3) 0.8 0.8 0.7 0.7 0 0.2 0.4 0.6 0.8 1.0 0 0.2 IF (A) (1) Tamb = +25 C (2) Tamb = +85 C (2) Tamb = +85 C (3) Tamb = 30 C (3) Tamb = 30 C IP4386CX4: DC clamping voltage as a function of forward current 0.6 0.8 1.0 IF (A) (1) Tamb = +25 C Fig 4. 0.4 Fig 5. IP4387CX4: DC clamping voltage as a function of forward current IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 6 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 7.2 Peak clamping voltage The peak clamping voltage for forward and reverse current pulses of 8/20 s (IEC 61000-4-5) is an indicator of protection level of circuits from power surges due to voltage discharges. The current pulse shape over time is shown in Figure 7. The basic measurement setup for forward current and reverse current pulses respectively are shown in Figure 6 and Figure 12. VCL V IPP 006aad227 Fig 6. Measuring peak clamping voltage with forward current 001aaj558 120 100 % IPP; 8 μs IPP (%) 80 e−t 50 % IPP; 20 μs 40 0 0 10 20 30 40 t (μs) Fig 7. 8/20 s current pulse waveform according to IEC 61000-4-5 IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 7 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 006aad222 17 VCL (V) 006aad223 20 VCL (V) 15 (3) 16 (1) 13 (3) (2) 11 12 9 (1) (2) 8 7 20 28 36 44 20 28 36 IF (A) (1) Tamb = +25 C (1) Tamb = +25 C (2) Tamb = +85 C (2) Tamb = +85 C (3) Tamb = 30 C (3) Tamb = 30 C Fig 8. IP4085CX4: peak clamping voltage as a function of forward current 006aad224 20 (3) (2) (1) VCL (V) 44 IF (A) Fig 9. IP4385CX4: peak clamping voltage as a function of forward current 006aad225 20 VCL (V) 16 16 12 12 (2) (3) (1) 8 8 20 28 36 44 20 IF (A) 28 36 44 IF (A) (1) Tamb = +25 C (1) Tamb = +25 C (2) Tamb = +85 C (2) Tamb = +85 C (3) Tamb = 30 C (3) Tamb = 30 C Fig 10. IP4386CX4: peak clamping voltage as a function of forward current Fig 11. IP4387CX4: peak clamping voltage as a function of forward current IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 8 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes VCL V IPP 006aad226 Fig 12. Measuring peak clamping voltage with reverse current 006aad228 19 VCL (V) (2) VCL (V) 006aad229 8.75 8.50 (2) 18 8.25 (1) (1) 8.00 (3) 17 (3) 7.75 16 0.2 0.4 0.6 0.8 1.0 1.2 1.4 IR (A) 1.6 7.50 0.4 0.8 1.2 1.6 IR (A) (1) Tamb = +25 C (1) Tamb = +25 C (2) Tamb = +85 C (2) Tamb = +85 C (3) Tamb = 30 C (3) Tamb = 30 C Fig 13. IP4085CX4: peak clamping voltage as a function of reverse current Fig 14. IP4385CX4: peak clamping voltage as a function of reverse current IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 9 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 006aad230 19 VCL (V) 006aad231 12.2 (2) VCL (V) (2) 18 11.8 (1) (1) 17 11.4 (3) (3) 16 0.3 0.7 1.1 1.5 11.0 0.4 0.8 IR (A) 1.2 1.6 IR (A) (1) Tamb = +25 C. (1) Tamb = +25 C. (2) Tamb = +85 C. (2) Tamb = +85 C. (3) Tamb = 30 C. (3) Tamb = 30 C. Fig 15. IP4386CX4: peak clamping voltage as a function of reverse current Fig 16. IP4387CX4: peak clamping voltage as a function of reverse current Measurements are done on a heat-dissipation optimized PCB with massive copper area under the Device Under Test (DUT). IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 10 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 8. Package outline WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) D bump A1 index area A2 A E A1 detail X e b B e A 1 2 X European projection wlcsp4_2x2_po Fig 17. Package outline WLCSP4 Table 6. Package outline dimensions of IP4085CX4 (WLCSP4) Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A1 0.22 0.24 0.26 mm A2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm D 0.86 0.91 0.96 mm E 0.86 0.91 0.96 mm e 0.5 0.5 0.5 mm IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 11 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes Table 7. Package outline dimensions of IP438xCX4 (WLCSP4) Symbol Min Typ Max Unit A 0.56 0.61 0.66 mm A1 0.18 0.20 0.22 mm A2 0.38 0.41 0.44 mm b 0.21 0.26 0.31 mm D 0.71 0.76 0.76 mm E 0.71 0.76 0.81 mm e 0.4 0.4 0.4 mm 9. Design and assembly recommendations 9.1 PCB design guidelines For optimum performance, use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. Refer to Table 8 for the recommended PCB design parameters. Table 8. Recommended PCB design parameters Parameter Value or Specification PCB pad diameter 200 m Micro-via diameter 100 m (0.004 inch) Solder mask aperture diameter 370 m Copper thickness 20 m to 40 m Copper finish AuNi PCB material FR4 9.2 PCB assembly guidelines for Pb-free soldering Table 9. Assembly recommendations Parameter Value or Specification Solder screen aperture diameter 330 m Solder screen thickness 100 m (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) Solder to flux ratio 50 : 50 Solder reflow profile see Figure 18 IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 12 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes T (°C) Treflow(peak) 250 230 cooling rate 217 preheat t1 t (s) t2 t3 t4 t5 001aai943 The device is capable of withstanding at least three reflows of this profile. Fig 18. Pb-free solder reflow profile Table 10. Symbol Reflow soldering process characteristics Parameter Conditions Treflow(peak) peak reflow temperature Min Typ Max Unit 230 - 260 C - 180 s t1 time 1 soak time 60 t2 time 2 time during T  250 C - - 30 s t3 time 3 time during T  230 C 10 - 50 s t4 time 4 time during T > 217 C 30 - 150 s t5 time 5 - - 540 s dT/dt rate of change of temperature cooling rate - - 6 C/s pre-heat 2.5 - 4.0 C/s IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 13 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 10. Soldering D e c (4×) e solder resist E solder paste = solderland f (4×) occupied area Dimensions in mm wlcsp4_2x2_fr Fig 19. Reflow soldering footprint WLCSP4 Table 11. Soldering dimensions of IP4085CX4 (WLCSP4) Symbol Min Typ Max Unit c - 0.31 - mm D 0.86 0.91 0.96 mm E 0.86 0.91 0.96 mm e - 0.5 - mm f - 0.385 - mm Table 12. Soldering dimensions of IP438xCX4 (WLCSP4) Symbol Min Typ Max Unit c - 0.25 - mm D 0.71 0.76 0.81 mm E 0.71 0.76 0.81 mm e - 0.4 - mm f - 0.325 - mm IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 14 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 11. Revision history Table 13. Revision history Document ID Release date Data sheet status Change Supersedes notice IP4085_4385_4386_4387_CX4 v.2 20121214 Product data sheet - Modifications: IP4085_4385_4386_4387_CX4 v.1 • • • • • • • • • • • • IP4085_4385_4386_4387_CX4 v.1 Basic type IP4085CX4/LF removed Section 1 “Product profile”: updated Section 2 “Pinning information”: updated Functional diagram: removed Table 3 “Limiting values”: updated Table 5 “Electrical characteristics”. updated Section 7 “Application information”. updated Figure 1, 6, 8 to 16: updated Marking: removed Section 8 “Package outline”: updated Section 10 “Soldering”: added Section 12 “Legal information”: updated 20090326 Product data sheet - IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 - © NXP B.V. 2012. All rights reserved. 15 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 12. 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All rights reserved. 16 of 18 IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 14 December 2012 © NXP B.V. 2012. All rights reserved. 17 of 18 NXP Semiconductors IP4085/4385/4386/4387/CX4 Integrated high-performance ESD protection diodes 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Forward current DC clamping voltage . . . . . . . 5 Peak clamping voltage . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Design and assembly recommendations . . . 12 PCB design guidelines . . . . . . . . . . . . . . . . . . 12 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 December 2012 Document identifier: IP4085_4385_4386_4387_CX4