PEMI6CSP/RW,135

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia PEMIxCSP family Integrated 4-, 6- and 8-channel passive filter network with ESD protection Rev. 2 — 27 January 2012 Product data sheet 1. Product profile 1.1 General description The devices are a family of 4-, 6- and 8-channel RC low pass filters which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition the devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 20 kV. The PEMIxCSP family is fabricated using monolithic silicon technology and integrates up to eight resistors and 16 protection diodes in a single Wafer Level Chip-Size Package (WLCSP). These features make the devices ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits  Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)  Integrated 4-, 6- and 8-channel -type RC filter network  Channel series resistance Rs(ch) = 100   Channel capacitance Cch = 23 or 30 pF at Vbias(DC) = 2.5 V  Channel capacitance Cch = 41 or 54 pF at Vbias(DC) = 0 V  Available in 10, 15 and 20-ball WLCSP  ESD protection up to 20 kV contact discharge according to IEC 61000-4-2, far exceeding level 4 1.3 Applications General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for:  Cellular phone and Personal Communication Systems (PCS) mobile handsets  Cordless telephones  Wireless data (WAN/LAN) systems PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 2. Pinning information 2.1 Pinning bump A1 index area bump A1 index area 1 3 2 4 1 A 2 3 4 5 A B2 B1 B B2 B1 B C B3 C 001aak062 001aak063 transparent top view, solder balls facing down Fig 1. 6 transparent top view, solder balls facing down PEMI4CSP: pin configuration Fig 2. PEMI6CSP: pin configuration bump A1 index area 1 3 2 4 5 6 7 8 A B2 B1 B B3 B4 C 001aak064 transparent top view, solder balls facing down Fig 3. PEMI8CSP: pin configuration 2.2 Pin description Table 1. Pinning Pin PEMIXCSP_FAM Product data sheet Description PEMI4CSP PEMI6CSP PEMI8CSP A1 and C1 A1 and C1 A1 and C1 filter channel 1 A2 and C2 A2 and C2 A2 and C2 filter channel 2 A3 and C3 A3 and C3 A3 and C3 filter channel 3 A4 and C4 A4 and C4 A4 and C4 filter channel 4 - A5 and C5 A5 and C5 filter channel 5 - A6 and C6 A6 and C6 filter channel 6 - - A7 and C7 filter channel 7 - - A8 and C8 filter channel 8 B1 and B2 B1, B2 and B3 B1, B2, B3 and B4 ground (GND) All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 2 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 3. Ordering information Table 2. Ordering information Type number Package Name Description Version PEMI4CSP/RT WLCSP10 wafer level chip-size package; 10 bumps; 1.56  1.05  0.61 mm PEMI4CSP/RT PEMI4CSP/RW WLCSP10 wafer level chip-size package; 10 bumps; 1.56  1.05  0.61 mm PEMI4CSP/RW PEMI6CSP/RT WLCSP15 wafer level chip-size package; 15 bumps; 2.36  1.05  0.61 mm PEMI6CSP/RT PEMI6CSP/RW WLCSP15 wafer level chip-size package; 15 bumps; 2.36  1.05  0.61 mm PEMI6CSP/RW PEMI8CSP/RT/P WLCSP20 wafer level chip-size package; 20 bumps; 3.16  1.05  0.61 mm PEMI8CSP/RT/P PEMI8CSP/RW/P WLCSP20 wafer level chip-size package; 20 bumps; 3.16  1.05  0.61 mm PEMI8CSP/RW/P 4. Functional diagram Rs(ch) Rs(ch) A1 to A4 C1 to C4 A1 to A6 Cch 2 Cch 2 GND Cch 2 GND 018aaa077 Fig 4. C1 to C6 Cch 2 018aaa078 PEMI4CSP: schematic diagram Fig 5. PEMI6CSP: schematic diagram Rs(ch) A1 to A8 C1 to C8 Cch 2 Cch 2 GND 018aaa079 Fig 6. PEMI8CSP: schematic diagram PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 3 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VESD Conditions electrostatic discharge voltage Min Max Unit 0.5 +5.6 V contact discharge - 20 kV air discharge - 30 kV contact discharge - 8 kV air discharge - 15 kV - 33 mA [1] all pins to ground IEC 61000-4-2, level 4 all pins to ground Tamb = 70 C Ich channel current (DC) Pch channel power dissipation continuous power; Tamb = 70 C - 60 mW Ptot total power dissipation - 250 mW Tstg storage temperature 55 +150 C Tamb ambient temperature 40 +85 C [1] continuous power; Tamb = 70 C Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). 6. Characteristics Table 4. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) Conditions PEMIxCSP/RT PEMIxCSP/RW PEMIXCSP_FAM Product data sheet Typ Max Unit 80 100 120  Vbias(DC) = 0 V 33 41 49 pF Vbias(DC) = 2.5 V - 23 - pF Vbias(DC) = 0 V 43 54 65 pF Vbias(DC) = 2.5 V - 30 - pF channel series resistance channel capacitance Cch Min for the total channel; f = 100 kHz [1] VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V VF forward voltage negative clamp; IF = 1 mA 1.5 - 0.4 V ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 A Rdyn dynamic resistance I=1A positive transient - 0.3 -  negative transient - 0.85 -  [1] Guaranteed by design. [2] According to IEC 61000-4-5 and IEC 61000-4-9. All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 [2] © NXP B.V. 2012. All rights reserved. 4 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection Table 5. Frequency characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit il Rsource = 50 ; RL = 50  800 MHz < fi < 3 GHz 25 30 - dB fi = 1.7 GHz - 35 - dB PEMIxCSP/RW 800 MHz < fi < 3 GHz 27 32 - dB fi = 1.7 GHz - 37 - dB ct crosstalk attenuation Rsource = 50 ; RL = 50 ; 800 MHz < fi < 3 GHz - 30 - dB f3dB cut-off frequency Rsource = 50 ; RL = 50  PEMIxCSP/RT - 128 - MHz PEMIxCSP/RW - 98 - MHz insertion loss PEMIxCSP/RT 7. Application information 7.1 Insertion loss The devices are designed as EMI/RFI filters for multichannel interfaces. All measurements were performed in a typical 50  NetWork Analyzer (NWA) setup as shown in Figure 7. The measured insertion loss in a 50  system is depicted in Figure 8. DUT IN OUT 50 Ω 50 Ω Vgen 018aaa074 Fig 7. PEMIXCSP_FAM Product data sheet Frequency response setup All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 5 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 018aaa080 0 S21 (dB) (1) −20 (2) −40 −60 10−1 1 10 102 103 104 f (MHz) (1) PEMIxCSP/RT (2) PEMIxCSP/RW Fig 8. Frequency response curves 7.2 Use cases The selection of one of the filter device has to be performed in dependence of the maximum clock frequency, the driver strength, the capacitive load of the sink and the maximum applicable rise and fall times. 7.3 LCD interfaces, medium-speed interfaces For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of the sink load, the clock speed, the driver strength and the rise and fall time requirements. The minimum EMI filter requirements may be an important factor, too. 7.4 Keypad, low-speed interfaces Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and low-speed control signals, the PEMIxCSP family offers a very robust ESD protection and strong suppression of unwanted frequencies (EMI filtering). Due to their small size the devices can easily be spread on a Printed-Circuit Board (PCB) in order to move the ESD and EMI protection close to the part of the design which shall be protected. PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 6 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 8. Marking All dies are laser-marked with the following information (see Figure 9 and 10): • A marker indicating the pin A1 position. • Two lines of characters or numbers: – The first line (placeholder ) indicates the marking code. Mapping of product type numbers to marking codes is given in Table 6. – The second line (placeholder ) indicates the production lot. This information enable to track a device down to a particular production date. pin A1 marker 018aaa081 Fig 9. PEMI4CSP and PEMI6CSP: outline of the marking pin A1 marker 018aaa082 Fig 10. PEMI8CSP: outline of the marking Table 6. PEMIXCSP_FAM Product data sheet Marking codes Type number Marking code Type number Marking code PEMI4CSP/RT RT PEMI6CSP/RW RW PEMI4CSP/RW RW PEMI8CSP/RT/P RT PEMI6CSP/RT RT PEMI8CSP/RW/P RW All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 7 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 9. Package outline WLCSP10: wafer level chip-size package; 10 bumps (4-2-4) D bump A1 index area A2 E A A1 detail X e b C e1 B1 B B2 e2 A 1 3 2 4 e3 X 1/2 e European projection wlcsp10_4-2-4_po Fig 11. Package outline PEMI4CSP (WLCSP10) Table 7. Package outline dimensions of PEMI4CSP Symbol Min Typ Max Unit A 0.57 0.61 0.65 mm A1 0.18 0.20 0.22 mm A2 0.39 0.41 0.43 mm b 0.21 0.26 0.31 mm D 1.51 1.56 1.61 mm E 1.00 1.05 1.10 mm e - 0.4 - mm e1 - 0.346 - mm e2 - 0.692 - mm e3 - 0.8 - mm PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 8 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) D bump A1 index area A2 E A A1 detail X e 1/2 e b C e1 B2 B1 B B3 e2 A 1 2 3 4 5 6 e3 X European projection wlcsp15_6-3-6_po Fig 12. Package outline PEMI6CSP (WLCSP15) Table 8. Package outline dimensions of PEMI6CSP Symbol Min Typ Max Unit A 0.57 0.61 0.65 mm A1 0.18 0.20 0.22 mm A2 0.39 0.41 0.43 mm b 0.21 0.26 0.31 mm D 2.31 2.36 2.41 mm E 1.00 1.05 1.10 mm e - 0.4 - mm e1 - 0.346 - mm e2 - 0.692 - mm e3 - 0.8 - mm PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 9 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection WLCSP20: wafer level chip-size package; 20 bumps (8-4-8) D bump A1 index area A2 E A A1 detail X e 1/2 e b C e1 B1 B B2 B3 B4 e2 A 1 2 3 4 5 6 7 8 e3 X European projection wlcsp20_8-4-8_po Fig 13. Package outline PEMI8CSP (WLCSP20) Table 9. Package outline dimensions of PEMI8CSP Symbol Min Typ Max Unit A 0.57 0.61 0.65 mm A1 0.18 0.20 0.22 mm A2 0.39 0.41 0.43 mm b 0.21 0.26 0.31 mm D 3.11 3.16 3.21 mm E 1.00 1.05 1.10 mm e - 0.4 - mm e1 - 0.346 - mm e2 - 0.692 - mm e3 - 0.8 - mm PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 10 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 10. Design and assembly recommendations 10.1 PCB design guidelines It is recommended, for optimum performance, to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. Refer to Table 10 for the recommended Printed-Circuit Board (PCB) design parameters. Table 10. Recommended PCB design parameters Parameter Value or specification PCB pad diameter 250 m Micro-via diameter 100 m (0.004 inch) Solder mask aperture diameter 325 m Copper thickness 20 m to 40 m Copper finish AuNi PCB material FR4 10.2 PCB assembly guidelines for Pb-free soldering Table 11. PEMIXCSP_FAM Product data sheet Assembly recommendations Parameter Value or specification Solder screen aperture diameter 290 m Solder screen thickness 100 m (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) Solder to flux ratio 50 : 50 Solder reflow profile see Figure 14 All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 11 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection T (°C) Treflow(peak) 250 230 cooling rate 217 preheat t1 t (s) t2 t3 t4 t5 001aai943 The device is capable of withstanding at least three reflows of this profile. Fig 14. Pb-free solder reflow profile Table 12. Symbol Characteristics Parameter Conditions Treflow(peak) peak reflow temperature Product data sheet Typ Max Unit 230 - 260 C 60 - 180 s t1 time 1 soak time t2 time 2 time during T  250 C - - 30 s t3 time 3 time during T  230 C 10 - 50 s t4 time 4 time during T > 217 C 30 - 150 s t5 time 5 - - 540 s dT/dt rate of change of temperature cooling rate - - 6 C/s 2.5 - 4.0 C/s pre-heat PEMIXCSP_FAM Min All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 12 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 11. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes PEMIXCSP_FAM v.2 20120127 Product data sheet - PEMIXCSP_FAM v.1 PEMIXCSP_FAM v.1 20110203 Product data sheet - - PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 13 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PEMIXCSP_FAM Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 14 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PEMIXCSP_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 27 January 2012 © NXP B.V. 2012. All rights reserved. 15 of 16 PEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 14. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 7.1 7.2 7.3 7.4 8 9 10 10.1 10.2 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCD interfaces, medium-speed interfaces . . . . 6 Keypad, low-speed interfaces. . . . . . . . . . . . . . 6 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Design and assembly recommendations . . . 11 PCB design guidelines . . . . . . . . . . . . . . . . . . 11 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 January 2012 Document identifier: PEMIXCSP_FAM