PRTR5V0U4Y,125

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia PRTR5V0U4Y Integrated quad ultra-low capacitance ESD protection Rev. 01 — 8 May 2008 Product data sheet 1. Product profile 1.1 General description The PRTR5V0U4Y is designed to protect Input/Output (I/O) ports that are sensitive to capacitive load, such as USB 2.0, Ethernet and DVI from destruction by ElectroStatic Discharge (ESD). It provides protection to downstream signal and supply components from ESD voltages as high as ±8 kV (contact discharge). The PRTR5V0U4Y incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD protection to be independent of supply voltage. The PRTR5V0U4Y is fabricated using thin film-on-silicon technology integrating four ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 6-lead SOT363 package. 1.2 Features n n n n n Pb-free and RoHS compliant ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge Four ultra-low input capacitance (1 pF typical) rail-to-rail ESD protection diodes Low-voltage clamping due to integrated Zener diode Small 6-lead SOT363 package 1.3 Applications n General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: u Cellular and PCS mobile handsets u PC-/notebook USB 2.0/IEEE 1394 ports u DVI/HDMI interfaces u Cordless telephones u Wireless data (WAN/LAN) systems u PDAs PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 2. Pinning information Table 1. Pinning Pin Description Simplified outline 1 ESD protection I/O 1 2 ground (GND) 3 ESD protection I/O 2 4 ESD protection I/O 3 5 supply voltage (VCC) 6 ESD protection I/O 4 6 5 4 1 2 3 Graphic symbol 6 5 4 1 2 3 001aag273 3. Ordering information Table 2. Ordering information Type number PRTR5V0U4Y Package Name Description Version SC-88 plastic surface-mounted package; 6 leads SOT363 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VI input voltage Vesd electrostatic discharge voltage Tstg Conditions Min Max Unit −0.5 +5.5 V all pins; IEC 61000-4-2; level 4 contact discharge −8 +8 kV air discharge −15 +15 kV −55 +125 °C storage temperature 5. Recommended operating conditions Table 4. Operating conditions Symbol Parameter Conditions Tamb ambient temperature PRTR5V0U4Y_1 Product data sheet Min Max Unit −40 +85 °C © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 2 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 6. Characteristics Table 5. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit C(I/O-GND) input/output to ground capacitance pins 1, 3, 4 and 6; VI = 0 V; f = 1 MHz; VCC = 3.0 V - 1.0 - pF ILR reverse leakage current pins 1, 3, 4 and 6 to ground; VI = 3.0 V - - 100 nA VBR breakdown voltage Zener diode; I = 1 mA 6 - 9 V VF forward voltage - 0.7 - V 7. Application information 7.1 IEEE 1394a/b protection The PRTR5V0U4Y is optimized to protect both the IEEE 1394 physical layer and the IEEE 1394 connector ports against ESD. TPBIAS Shld1 1 µF BUS PWR PWR 56 Ω 1 56 Ω TPA+ TPA+ TPA− TPA− IEEE 1394 PHYSICAL LAYER 7 1 6 5 6 1394 CONNECTOR 2 5 3 4 TPB+ TPB+ TPB− TPB− GND 56 Ω 56 Ω Shld2 220 pF 5 kΩ 1 nF 10 nF 4 3 2 8 1 MΩ 001aag050 Fig 1. Typical application for IEEE 1394a/b ESD protection PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 3 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 7.2 Universal serial bus 2.0 protection The PRTR5V0U4Y is optimized to protect USB 2.0 ports with or without OTG functionality against ESD. VBUS DAT+ DAT− to phone USB OTG RECEPTACLE CARKIT ID GND Shld GND mini B receptacle mini A receptacle 1 6 2 5 3 4 001aag051 The device is capable of protecting the USB data lines as well as VBUS supply and the ID pin. Fig 2. Typical application for USB OTG ESD protection 7.3 Universal SIM-card protection The PRTR5V0U4Y protects the SIM-card interfaces against ESD. I/O CLOCK RESET SIM VCC GND 1 6 2 5 3 4 001aag052 This device also protects VCC. Fig 3. Typical application for universal SIM-card ESD protection PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 4 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 7.4 Gigabit Ethernet transceiver protection The PRTR5V0U4Y protects the gigabit Ethernet transceiver against ESD. TPOPA R1 C1 C5 C2 C6 TPONA 1 6 2 5 3 4 TPOPB R2 TPONB GIGABIT ETHERNET TPOPC TRANSCEIVER QUAD TRANSFORMER R3 RJ45 C3 C7 C4 C8 TPONC 1 6 2 5 3 4 TPOPD R4 TPOND 001aag053 Fig 4. Typical application for gigabit Ethernet transceiver ESD protection PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 5 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 7.5 Universal microSD/TransFlash and SD-memory card protection The PRTR5V0U4Y protects each data line of the microSD/TransFlash device against ESD. DAT0 DAT1 DAT2 DAT3/CD TRANSFLASH CMD CLK VCC GND 1 6 1 6 2 5 2 5 3 4 3 4 001aag054 Fig 5. Typical application for universal microSD/TransFlash and SD-memory card ESD protection PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 6 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 8. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 Fig 6. JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Package outline SOT363 (SC-88) PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 7 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 9. Abbreviations Table 6. Abbreviations Acronym Description DVI Digital Video Interface ESD ElectroStatic Discharge HDMI High Definition Multimedia interface LAN Local Area Network OTG On-The-Go PCS Personal Computing System PDA Personal Digital Assistant RoHS Restriction of Hazardous Substances SIM Subscriber Identity Module USB Universal Serial Bus WAN Wide Area Network 10. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PRTR5V0U4Y_1 20080508 Product data sheet - - PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 8 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PRTR5V0U4Y_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 8 May 2008 9 of 10 PRTR5V0U4Y NXP Semiconductors Integrated quad ultra-low capacitance ESD protection 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Recommended operating conditions. . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 3 IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 3 Universal serial bus 2.0 protection . . . . . . . . . . 4 Universal SIM-card protection . . . . . . . . . . . . . 4 Gigabit Ethernet transceiver protection . . . . . . 5 Universal microSD/TransFlash and SD-memory card protection . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 May 2008 Document identifier: PRTR5V0U4Y_1