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0402B102K500HI

0402B102K500HI

  • 厂商:

    NEXTGEN

  • 封装:

    0402

  • 描述:

    1000 pF ±10% 50V 陶瓷电容器 X7R 0402(1005 公制)

  • 数据手册
  • 价格&库存
0402B102K500HI 数据手册
PART CODE: 0402B102K500HI SPECIFICATION SHEET SPECIFICATION SHEET NO. Q0620- 0402B102K500HI DATE June 20, 2023 REVISION A3 DESCRIPITION Multilayer Ceramic Chip Capacitors 0402 (1005 Metric) Series, L1.00*W0.50*H0.50mm, Thickness: 0.70mm Max. Dielectric X7R, Capacitance 1000pF, Tolerance ±10%, Rated Voltage 50V Operating Temp. Range -55°C ~+125°C Package in Tape/Reel, 10,000pcs/Reel RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER Aillen 0402B102K500HI PART CODE 0402B102K500HI VENDOR APPROVE Issued/Checked/Approved DATE: June 20, 2023 CUSTOMER APPROVE DATE: 6/20/2023 NextGen Components, Inc. 1 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES MAIN FEATURE MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. MLCC is made by NP0, X7R, X6S, X5R and Y5V dielectric material and which provides product with high electrical precision, stability and reliability. MAIN FEATURE • RoHS III Compliant • Wide Operating Temperature Range -55~+125℃ • High capacitance in given case size • A wide selection of sizes is available (0201 to 1812) • Capacitor with lead-free termination (pure Tin) APPLICATION • General Digital Circuit • Power Supply by pass capacitors • Consumer Electronics • Telecommunication RFQ PART CODE GUIDE Request For Quotation Code Name Key Specification Option 0402 Size 0201 (0603): L0.60*W0.30mm; 0402 (1005): L1.00*W0.50mm 0603 (1608): L1.60*W0.80mm; 0805 (2012): L2.00*W1.25mm 1206 (3216:) L3.20*W1.60mm; 1210 (3225): L3.20*W2.50mm 1812 (4532): L4.50*W3.20mm B 102 Dielectric N: NP0 (C0G); B: X7R; Y: Y5V; W: X5R; S: X6S Capacitance Two significant digits followed by number of Zero, The 3rd digit signifies the multiplying factor, and letter R is decimal point. 0R5: 0.5pF; 3R3:3.3pF; 102: 1000pF; 100: 10pF K Tolerance A=±0.05pF; B=±0.1pF; C=±0.25pF; D=±0.5pF; F=±1%; G=±2%; J=±5%; K=±10% M=±20%; Z=-20/+80% 500 Rated Voltage Two significant digits followed by No. of zeros. “R” is in place of decimal point. 4R0=4 VDC; 6R3=6.3 VDC; 100=10 VDC; 160=16 VDC; 250=25 VDC; 500=50 VDC; 101 =100 VDC H Thickness H: 0.50±0.20mm, See Table 1 I Package K: 0.5 Kpcs/Reel; A: 1Kpcs/Reel; B: 2Kpcs/Reel; C: 3Kpcs/Reel; D: 4Kpcs/Reel; E: 15Kpcs/Reel; I: 10Kpcs/Reel; J: 2.5Kpcs/Reel; F: others Internal Control Internal Code: Letter + Number; Blank: N/A; 6/20/2023 NextGen Components, Inc. 2 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES DIMENSION (Unit: mm) Image for reference Table 1 Size L W T (Symbol ) Code 0201 Soldering MB Method 0.6±0.09 0.30±0.09 0.3±0.09 (L) R 0.15+0.1/-0.05 1.00±0.20 0.50±0.20 0.50±0.05 (N); 0.50±0.20 (H) R 0.25+0.05/-0.10 1.60±0.20 0.80±0.20 0.50±0.20 (H); 0.80±0.10 (S) R/W 0.40±0.15 0.50±0.20 (H); 0.60±0.10 (A) H & C: R 0.50±0.20 0.85±0.15 (B); 0.80±0.20 (X) A, X & B: R/W (0603) 0402 (1005) 0603 (1608) 0805 0.85±0.15 (B); 0.80±0.20 (X) 2.00±0.20 1.25±0.20 (2012) 1.25±0.20 (C) 1206 3.20±0.30 1.60±0.30 (3216) 0.85±0.15 (B); 0.95±0.10 (I) B: R/W 0.60±0.20 1.25±0.20 (C); 1.15±0.20 (J) C, D, I, J & P: R 0.50±0.25 R 0.75±0.25 R 0.75±0.25 1.60±0.20 (D); 1.60+0.30/-0.10 (P) 1210 3.20±0.40 2.50±0.30 (3225) 0.85±0.15 (B); 0.95±0.10 (I) 1.25±0.20 (C); 1.60±0.20 (D); 2.00±0.20 (K); 2.50±0.30 (M) 1812 4.50±0.40 3.20±0.40 (4532) 1.25±0.20 (C); 1.60±0.20 (D); 2.00±0.20 (K); 2.50±0.30 (M) 0.50±0.25* 2.80±0.30 (U) 6/20/2023 NextGen Components, Inc. 3 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES GENERAL ELECTRONICAL CHARACTERISTICS Dielectric NP0 X7R Size 0201, 0402, 0603, 0805, 1206, 1210, 1812 Capacitance 0.1pF to 0.1µF 100pF to range* Table 2 Y5V X5R X6S 0.01µF to 100µF 100pF to 0.1µF to 220µF 100µF 47µF Capacitance Cap.≦5pF (Note #1): J (±5%), M (±20%), K (±10%), K (±10%), Tolerance A (±0.05pF), B (±0.1pF), K (±10%), Z (-20/+80%) M (±20%) M (±20%) C (±0.25pF) M (±20%) -25 ~+85°C -55 ~+85°C -55~+105°C +30/-80% ±15% ±22% 5pF0.1µF; 0805/X7R>0.47µF; 1206≧2.2µF; 1210≧10µF; 50V ≦ 2.5% 35V ≦ 3.5% ≦10% 0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF 25V ≦ 3.5% ≦5% 0201≧0.01µF; 0805≧1µF; 1210/X7R≧10µF ≦7% 0603≧0.33µF ≦10% 0201≧0.1µF; 0402/X7R≧0.056µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧22µF 16V ≦3.5% ≦12.5% 0402≧0.47µF ≦5% 0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF; 1210≧4.7µF ≦10% 0201/X7R≧0.022µF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧22µF; 10V ≦ 5.0% ≦10% 0201≧0.012µF;0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF; 1206≧2.2µF;1210≧22µF 6.3V ≦ 10% ≦15% 0201≧0.1µF; 0402≧1µF ≦15% 0201≧0.1µF; 0402≧1µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF 1210 ≧100µF 4V ≦15% ≦20% 0402≧2.2µF - - 6/20/2023 NextGen Components, Inc. 5 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES X5R Table 4 Rated vol. D.F. ≦ Exception of D.F. ≦ ≧100V ≦ 2.5% ≦3% 1206 ≧ 0.47µF ≦ 5% 0603 ≧ 0.068µF; 0805>0.1µF; 1206 ≧ 1µF; 1210 ≧ 2.2µF; ≦10% 0805>0.22µF; 1210 ≧ 3.3µF ≦3% 0201(50V); 0603≧0.047µF; 0805≧0.18µF; 1206≧0.47µF ≦5% 0201≧0.01uF; 1210≧4.7µF ≦10% 0402≧0.012µF; 0603>0.1µF; 0805≧1µF; 1206≧2.2µF;1210≧10µF; 50V ≦ 2.5% 35V ≦ 3.5% ≦10% 0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF 25V ≦ 3.5% ≦5% 0201≧0.01µF; 0805≧1µF; 1210/X5R≧10µF ≦7% 0603≧0.33µF ≦10% 0201≧0.1µF; 0402≧0.10µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210/X5R≧10µF; 16V ≦ 3.5% ≦12.5% 0402≧0.47µF ≦5% 0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF; 1210≧4.7µF ≦10% 0201≧0.1uF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧22µF 10V ≦ 5.0% ≦10% 0201≧0.012µF; 0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧22µF 6.3V ≦ 10% ≦15% 0201≧0.1µF; 0402≧1µF ≦15% 0201≧0.1µF; 0402≧1µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF 1210 ≧100µF 4V ≦15% ≦20% 0402≧2.2µF - - 6/20/2023 NextGen Components, Inc. 6 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES Y5V Table 5 Rated vol. D.F. ≦ Exception of D.F. ≦ ≧50V ≦5% ≦7% 0603≧0.1µF; 0805≧0.47µF; 1206≧4.7µF ≦12.5% 1210≧6.8µF 35V ≦7% - - 25V ≦5% ≦7% 0402≧0.047µF; 0603≧0.1µF; 0805≧0.33µF; 1206≧1µF; 1210≧4.7µF ≦9% 0402≧0.068µF; 0603≧0.47µF; 1206≧4.7µF; 1210≧22µF ≦9% 0402≧0.068µF; 0603≧0.68µF ≦12.5% 0402≧0.22µF ≦9% ≦12.5% 0603≧2.2µF; 0805≧3.3µF; 1206≧10µF; 1210≧22µF; 1812≧47µF 10V ≦12.5% ≦20% 0402≧0.47µF 6.3V ≦20% - - 16V ≦7% (C0.1µF; 0805≧1µF; 1206≧2.2µF; 1210≧10µF; 50V ≦ 2.5% 35V ≦ 3.5% ≦10% 0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF 25V ≦ 3.5% ≦5% 0201≧0.01µF; 0805≧1µF; 1210/X6S≧10µF ≦7% 0603≧0.33µF ≦10% 0201≧0.1µF; 0402≧0.10µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧22µF; 16V ≦ 3.5% ≦12.5% 0402≧0.47µF ≦5% 0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF; 1210≧4.7µF ≦10% 0201≧0.1uF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧22µF 10V ≦ 5.0% ≦10% 0201≧0.012µF; 0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧22µF 6.3V ≦ 10% ≦15% 0201≧0.1µF; 0402≧1µF ≦15% 0201≧0.1µF; 0402/X6S≧0.47µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF 1210 ≧100µF 4V ≦15% ≦20% 0402≧2.2µF - - 6/20/2023 NextGen Components, Inc. 8 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0201, 0402, 0603 SIZES Size 0201 Table 7-A 0402 0603 VDC (V) 16 25 50 10 16 25 50 100 10 16 25 50 100 0.1pF (0R1) L L L H H H H 0.2pF (0R2) L L L H H H H 0.3pF (0R3) L L L H H H H 0.4pF (0R4) L L L H H H H 0.5pF (0R5) L L L H H H H H S S S S S 0.6pF (0R6) L L L H H H H H S S S S S 0.7pF (0R7) L L L H H H H H S S S S S 0.8pF (0R8) L L L H H H H H S S S S S 0.9pF (0R9) L L L H H H H H S S S S S 1.0pF (1R0) L L L H H H H H S S S S S 1.2pF (1R2) L L L H H H H H S S S S S 1.5pF (1R5) L L L H H H H H S S S S/B S H 1.6pF (1R6) 1.8pF (1R8) L L L H H H H H S S S S S 2.0pF (2R0) L L L H H H H H S S S S S 2.2pF (2R2) L L L H H H H H S S S S S 2.7pF (2R7) L L L H H H H H S S S S S 3.0pF (3R0) L L L H H H H H S S S S S 3.3pF (3R3) L L L H H H H H S S S S S 3.9pF (3R9) L L L H H H H H S S S S/B S 4.0pF (4R0) L L L H H H H H S S S S S 4.7pF (4R7) L L L H H H H H S S S S/B S 5.0pF (5R0) L L L H H H H H S S S S S 5.6pF (5R6) L L L H H H H H S S S S/B S 6.0pF (6R0) L L L H H H H H S S S S S 6.8pF (6R8) L L L H H H H H S S S S S 7.0pF (7R0) L L L H H H H H S S S S/B S 8.0pF (8R0) L L L H H H H H S S S S S 8.2pF (8R2) L L L H H H H H S S S S/B S 9.0pF (9R0) L L L H H H H H S S S S S 6/20/2023 NextGen Components, Inc. 9 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0201, 0402, 0603 SIZES Size 0201 Table 7-B 0402 0603 VDC (V) 16 25 50 10 16 25 50 100 10 16 25 50 100 10pF (100) L L L H H H H H S S S S S 12pF (120) L L L H H H H H S S S S S 15pF (150) L L L H H H H H S S S S/B S 18pF (180) L L L H H H H H S S S S/B S 22pF (220) L L L H H H H/N H S S S S/B S 27pF (270) L L L H H H H H S S S S S H 30pF (300) 33pF (330) L L L H H H H H S S S/B S/B S 39pF (390) L L L H H H H H S S S S S 47pF (470) L L L H H H H H S S S S/B S 56pF (560) L L L H H H H H S S S S S 68pF (680) L L L H H H H H S S S S S 82pF (820) L L L H H H H H S S S S S 100pF (101) L L L H H H H/N H S S S S/B S 120pF (121) L L L H H H H H S S S S/B S 150pF (151) L L L H H H H H S S S S S 180pF (181) H H H H H S S S S S 220pF (221) H H H H H S S S S S 270pF (271) L H H H H S S S S/B S 330pF (331) L H H H H S S S S/B S 390pF (391) L H H H H S S S S S 470pF (471) L H H H H S S S S S 560pF (561) L H H H H S S S S S 680pF (681) H H H H S S S S S 820pF (821) H H H H S S S S S 1,000pF (102) H H H H S S S/B S S 1,200pF (122) X X X X X 1,500pF (152) X X X X X 1,800pF (182) X X X X 6/20/2023 NextGen Components, Inc. 10 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0603 SIZES Size Table 7-C 0603 VDC (V) 10 16 25 50 2,200pF (222) X X X X/B 2,700pF (272) X X X X/B 3,300pF (332) X X X X 3,900pF (392) X X X X 4,700pF (472) X X X X 5,600pF (562) X X X X 6,800pF (682) X X X X 8,200pF (822) X X X X 0.010µF (103) X X X X CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES Size Table 7-D 0805 1206 VDC (V) 10 16 25 50 100 0.5pF (0R5) A A A A A 0.6pF (0R6) A A A A A 0.7pF (0R7) A A A A A 0.8pF (0R8) A A A A A 0.9pF (0R9) A A A A A 1.0pF (1R0) A A A A A 1.2pF (1R2) A A A A A B B B B B 1.5pF (1R5) A A A A A B B B B B 1.8pF (1R8) A A A A A B B B B B 2.0pF (2R0) A A A A A 2.2pF (2R2) A A A A A B B B B B 2.7pF (2R7) A A A A A B B B B B 3.0pF (3R0) A A A A A 3.3pF (3R3) A A A A A B B B B B 3.9pF (3R9) A A A A A B B B B B 4.0pF (4R0) A A A A A 6/20/2023 NextGen Components, Inc. 10 16 25 50 100 B 11 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES Size Table 7-E 0805 1206 VDC (V) 10 16 25 50 100 10 16 25 50 100 4.7pF (4R7) A A A A A B B B B B 5.0pF (5R0) A A A A A 5.6pF (5R6) A A A A A B B B B B 6.0pF (6R0) A A A A A 6.8pF (6R8) A A A A A B B B B B 7.0pF (7R0) A A A A A B B B B B 8.0pF (8R0) A A A A A 8.2pF (8R2) A A A A A B B B B B 9.0pF (9R0) A A A A A 10pF (100) A A A A A B B B B B 12pF (120) A A A A A 15pF (150) A A A A A B B B B B 18pF (180) A A A A A B B B B B 22pF (220) A A A A A B B B B B 27pF (270) A A A A A B B B B B 33pF (330) A A A A A B B B B B 39pF (390) A A A A A B B B B B 47pF (470) A A A A A B B B B B 56pF (560) A A A A A B B B B B 68pF (680) A A A A A B B B B B 82pF (820) A A A A A B B B B B 100pF (101) A A A A A B B B B B 120pF (121) A A A A A B B B B B 150pF (151) A A A A A B B B B B 180pF (181) A A A A A B B B B B 220pF (221) A A A A A B B B B B 270pF (271) A A A A A B B B B B 330pF (331) A A A A A B B B B B 390pF (391) B B B B B B B B B B 470pF (471) B B B B B 6/20/2023 NextGen Components, Inc. 12 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES Size Table 7-F 0805 1206 VDC (V) 10 16 25 50 100 10 16 25 50 100 560pF (561) B B B B B B B B B B 680pF (681) B B B B B B B B B B 820pF (821) B B B B B B B B B B 1,000pF (102) B B B B B B B B B B 1,200pF (122) B B B B B B B B B B 1,500pF (152) B B B B B B B B B B 1,800pF (182) B B B B B B B B B B 2,200pF (222) B B B B B B B B B B 2,700pF (272) C C C C C B B B B B 3,300pF (332) C C C C C B B B B B CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES Size Table 7-G 0805 1206 VDC (V) 10 16 25 50 100 10 16 25 50 100 3,900pF (392) C C C C C B B B B B 4,700pF (472) C C C C C B B B B B 5,600pF (562) C C C C C B B B B B 6,800pF (682) C C C C C I I I I I 8,200pF (822) C C C C C C C C C 0.010µF (103) C C C C C C C C C 0.012µF (123) B B B B P P P P P P P P P P 0.015µF (153) 0.018µF (183) C C C C P P P P P 0.022µF (223) C C C C P P P P P 0.027µF (273) P P P P 0.033µF (333) P P P P 0.039µF (393) P P P P 0.047µF (473) J J J J 0.056µF (563) J J J J 0.068µF (683) D D D D 6/20/2023 NextGen Components, Inc. 13 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES Size Table 7-H 0805 VDC (V) 10 16 1206 25 50 100 10 16 25 50 0.082µF (823) D D D D 0.1µF (104) D D D D CAPACITANCE RANGE - NP0 DIELECTRIC 1210, 1812 SIZES Size 100 Table 7-I 1210 1812 VDC (V) 10 16 25 50 100 16 50 100 10pF (100) I I I I I C C C 15pF (150) I I I I I C C C 18pF (180) I I I I I C C C 22pF (220) I I I I I C C C 27pF (270) I I I I I C C C 33pF (330) I I I I I C C C 39pF (390) I I I I I C C C 47pF (470) I I I I I C C C 56pF (560) I I I I I C C C 68pF (680) I I I I I C C C 82pF (820) I I I I I C C C 100pF (101) I I I I I C C C 120pF (121) I I I I I C C C 150pF (151) I I I I I C C C 180pF (181) I I I I I C C C 220pF (221) I I I I I C C C 270pF (271) I I I I I C C C 330pF (331) I I I I I C C C 390pF (391) I I I I I C C C 560pF (561) I I I I I C C C 680pF (681) I I I I I C C C 820pF (821) I I I I I C C C 1,000pF (102) I I I I I C C C 1,200pF (122) I I I I I C C C 6/20/2023 NextGen Components, Inc. 14 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE - NP0 DIELECTRIC 1210, 1812 SIZES Size Table 7-J 1210 1812 VDC (V) 10 16 25 50 100 16 50 100 1,500pF (152) I I I I I C C C 1,800pF (182) I I I I I C C C 2,200pF (222) I I I I I C C C 2,700pF (272) I I I I I C C C 3,300pF (332) I I I I I C C C 3,900pF (392) I I I I I C C C 4,700pF (472) I I I I I C C C 5,600pF (562) I I I I I C C C 6,800pF (682) I I I I I C C C 8,200pF (822) I I I I I C C C 0.010µF (103) I I I I I C C C 0.012µF (123) C C C C C C C C 0.015µF (153) C C C C C C C C 0.018µF (183) K K K K C C C 0.022µF (223) K K K K C C C 0.027µF (273) K K K K C C C 0.033µF (333) K K K K C C C 0.039µF (393) K K K K M M M 0.047µF (473) K K K K M M M 0.056µF (563) M M M 0.068µF (683) M M M 0.082µF (823) M M M 0.1µF (104) M M M Note: The letter in cell is expressed the symbol of product thickness. 6/20/2023 NextGen Components, Inc. 15 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 0201, 0402 SIZES Size Table 8-A 0201 0402 VDC (V) 6.3 10 16 25 50 6.3 10 16 25 50 100 100pF (101) L L L L L H H H H H H 120pF (121) L L L L L H H H H H H 150pF (151) L L L L L H H H H H H 180pF (181) L L L L L H H H H H H 220pF (221) L L L L L H H H H H H 270pF (271) L L L L L H H H H H H 330pF (331) L L L L L H H H H H H 390pF (391) L L L L L H H H H H H 470pF (471) L L L L L H H H H H H 560pF (561) L L L L L H H H H H H 680pF (681) L L L L L H H H H H H 820pF (821) L L L L L H H H H H H 1,000pF (102) L L L L L H H H H H H 1,200pF (122) L L L L H H H H H H 1,500pF (152) L L L L H H H H H H 1,800pF (182) L L L L H H H H H H 2,200pF (222) L L L L H H H H H H 2,700pF (272) L L L L H H H H H H 3,300pF (332) L L L L H H H H H H 3,900pF (392) L L L L H H H H H H 4,700pF (472) L L L L H H H H H H 5,600pF (562) L L L L H H H H H 6,800pF (682) L L L H H H H H 8,200pF (822) L L L H H H H H 0.010µF (103) L L L H H H H H 0.012µF (123) H H H H H 0.015µF (153) H H H H H 0.018µF (183) H H H H H 0.022µF (223) H H H H H 6/20/2023 NextGen Components, Inc. 16 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 0402 SIZES Size Table 8-B 0402 VDC (V) 6.3 10 16 25 50 0.027µF (273) H H H H H 0.033µF (333) H H H H H 0.039µF (393) H H H H H 0.047µF (473) H H H H H 0.056µF (563) H H H H H 0.068µF (683) H H H H H 0.082µF (823) H H H H H 0.10µF (104) H H H H H 0.22µF (224) H H H H 0.47µF (474) H H 1.0µF (105) H H CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES Size Table 8-C 0603 0805 VDC (V) 6.3 10 16 25 50 100 6.3 10 16 25 50 100 100pF (101) S S S S/B S/B S B B B B B B 120pF (121) S S S S S S B B B B B B 150pF (151) S S S S S S B B B B B B 180pF (181) S S S S S S/B B B B B B B 220pF (221) S S S S S/B S B B B B B B 270pF (271) S S S S S S B B B B B B 330pF (331) S S S S S S B B B B B B 390pF (391) S S S S S S B B B B B B 470pF (471) S S S S S/B S B B B B B B 560pF (561) S S S S S S B B B B B B 680pF (681) S S S S S S B B B B B B 820pF (821) S S S S S S B B B B B B 1,000pF (102) S S S S/B S/B S/B B B B B B B 1,200pF (122) S S S S S S B B B B B B 1,500pF (152 S S S S/B S S B B B B B B 6/20/2023 NextGen Components, Inc. 17 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES Size Table 8-D 0603 0805 VDC (V) 6.3 10 16 25 50 100 6.3 10 16 25 50 100 1,800pF (182) S S S S S S B B B B B B 2,200pF (222) S S S S S/B S B B B B B B 2,700pF (272) S S S S S/B S B B B B B B 3,300pF (332) S S S S S S B B B B B B 3,900pF (392) S S S S S S B B B B B B 4,700pF (472) S S S S S S B B B B B B 5,600pF (562) S S S S S S B B B B B B 6,800pF (682) S S S S/B S S B B B B B B 8,200pF (822) S S S S S S B B B B B B 0.010µF (103) S S S S/B S/B S B B B B B B 0.012µF (123) S S S S S X B B B B B B 0.015µF (153) S S S S/B S/B X B B B B B B 0.018µF (183) S S S S S X B B B B B B 0.022µF (223) S S S S S/B X B B B B B B 0.027µF (273) S S S S S/B X B B B B B C 0.033µF (333) S S S S X/B X B B B B B C 0.039µF (393) S S S S X X B B B B B C 0.047µF (473) S S S S X X B B B B B C 0.056µF (563) S S S S X X B B B B B C 0.068µF (683) S S S S X/B X B B B B B C 0.082µF (823) S S S S X X B B B B B C 0.10µF (104) S S S/B S/B X X B B B B B C 0.12µF (124) S S S X B B B B C C 0.15µF (154) S S S/B X C C C C C C 0.18µF (184) S S S X C C C C C C 0.22µF (224) S S S/B X/B C C C C C C 0.27µF (274) X X X X C C C C C 0.33µF (334) X X X X C C C C C 0.39µF (394) X X X X C C C C C X 6/20/2023 NextGen Components, Inc. 18 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES Size Table 8-E 0603 0805 VDC (V) 6.3 10 16 25 50 6.3 10 16 25 50 100 0.47µF (474) X X X/B X/B X C C C C C C 0.56µF (564) X X X C C C C 0.68µF (684) X X X C C C C 0.82µF (824) X X X C C C C 1.0µF (105) X X X C C C C C C C C X X 1.5µF (155) 2.2µF (225) X X/B X C C C C 4.7µF (475) X X X C C C C C* C* C* 10µF (106) C C CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES Size Table 8-F 1206 1210 VDC (V) 6.3 10 16 25 50 100 10 16 25 50 100 150pF (151) B B B B B B 180pF (181) B B B B B B 220pF (221) B B B B B B 270pF (271) B B B B B B 330pF (331) B B B B B B 390pF (391) B B B B B B 470pF (471) B B B B B B 560pF (561) B B B B B B 680pF (681) B B B B B B 820pF (821) B B B B B B 1,000pF (102) B B B B B B I I I I I 1,200pF (122) B B B B B B I I I I I 1,500pF (152 B B B B B B I I I I I 1,800pF (182) B B B B B B I I I I I 2,200pF (222) B B B B B B I I I I I 2,700pF (272) B B B B B B I I I I I 3,300pF (332) B B B B B B I I I I I 6/20/2023 NextGen Components, Inc. 19 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES Size Table 8-G 1206 1210 VDC (V) 6.3 10 16 25 50 100 10 16 25 50 100 3,900pF (392) B B B B B B I I I I I 4,700pF (472) B B B B B B I I I I I 5,600pF (562) B B B B B B I I I I I 6,800pF (682) B B B B B B I I I I I 8,200pF (822) B B B B B B I I I I I 0.010µF (103) B B B B B B I I I I I 0.012µF (123) B B B B B B I I I I I 0.015µF (153) B B B B B B I I I I I 0.018µF (183) B B B B B B I I I I I 0.022µF (223) B B B B B B I I I I I 0.027µF (273) B B B B B B I I I I I 0.033µF (333) B B B B B B I I I I I 0.039µF (393) B B B B B B I I I I I 0.047µF (473) B B B B B B I I I I I 0.056µF (563) B B B B B B I I I I I 0.068µF (683) B B B B B B I I I I I 0.082µF (823) B B B B B C I I I I I 0.10µF (104) B B B B B C I I I I I 0.12µF (124) B B B B B C I I I I I 0.15µF (154) I I I I I D I I I I C 0.18µF (184) I I I I I D I I I I C 0.22µF (224) I I I I I/B D I I I I C 0.27µF (274) I I I I C D I I I I D 0.33µF (334) I I I I C D I I I C D 0.39µF (394) I I I J P D I I I C M 0.47µF (474) J J J J P D I I I C M 0.56µF (564) J J J J P P C C C C M 0.68µF (684) J J J J P P C C C C K 0.82µF (824) J J J J P P C C C C K 6/20/2023 NextGen Components, Inc. 20 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES Size Table 8-H 1206 1210 VDC (V) 6.3 10 16 25 50 100 10 16 25 50 100 1.0µF (105) J J J J P P C C C C K 1.5µF (155) J J J P D D M M 2.2µF (225) J J J P D D M M 3.3µF (475) P P P P D D M 4.7µF (475) P P P P K K K M 10µF (106) P P P P K K K M 22µF (226) P* P* P* M M M P P P M M 47µF (476) CAPACITANCE RANGE – X7R DIELECTRIC 1812 SIZES Table 8-I Size 1812 VDC (V) 6.3 10 16 25 50 100 1,000pF (102) C C C C C C 1,200pF (122) C C C C C C 1,500pF (152 C C C C C C 1,800pF (182) C C C C C C 2,200pF (222) C C C C C C 2,700pF (272) C C C C C C 3,300pF (332) C C C C C C 3,900pF (392) C C C C C C 4,700pF (472) C C C C C C 5,600pF (562) C C C C C C 6,800pF (682) C C C C C C 8,200pF (822) C C C C C C 0.010µF (103) C C C C C C 0.012µF (123) C C C C C C 0.015µF (153) C C C C C C 0.018µF (183) C C C C C C 6/20/2023 NextGen Components, Inc. 21 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X7R DIELECTRIC 1812 SIZES Table 8-J Size 1812 VDC (V) 6.3 10 16 25 50 100 0.022µF (223) C C C C C C 0.027µF (273) C C C C C C 0.033µF (333) C C C C C C 0.039µF (393) C C C C C C 0.047µF (473) C C C C C C 0.056µF (563) C C C C C C 0.068µF (683) C C C C C C 0.082µF (823) C C C C C C 0.10µF (104) C C C C C C 0.12µF (124) C C C C C C 0.15µF (154) C C C C C C 0.18µF (184) C C C C C C 0.22µF (224) C C C C C C 0.27µF (274) C C C C C C 0.33µF (334) C C C C C C 0.39µF (394) C C C C C C 0.47µF (474) C C C C C K 0.56µF (564) C C C C C K 0.68µF (684) C C C C K K 0.82µF (824) C C C C K K 1.0µF (105) C C C C K K 1.5µF (155) K K 2.2µF (225) M M Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M tolerance" ( 20% ) only 6/20/2023 NextGen Components, Inc. 22 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – Y5V DIELECTRIC 0402, 0603 SIZES Size VDC (V) Table 9-A 0402 6.3 0603 10 16 25 50 0.010µF (103) H H H 0.015µF (153) H H 0.022µF (223) H 0.033µF (333) 6.3 10 16 25 50 H S S S/B S/B H H S S S S H H H S S S S H H H H S S S S 0.047µF (473) H H H S S S S 0.068µF (683) H H H S S S S 0.10µF (104) H H H S S S/B S/B 0.15µF (154) H H S S S S S S S S 0.22µF (224) H H H H 0.33µF (334) H H H S S S 0.47µF (474) H H H S S X 0.68µF (684) H S X 1.0µF (105) H S X H S 1.5µF (155) 2.2µF (225) S S 4.7µF (475) X X CAPACITANCE RANGE – Y5V DIELECTRIC 0805, 1206 SIZES Size Table 9-B 0805 1206 VDC (V) 10 16 25 50 100 10 16 25 50 100 0.010µF (103) A A A A B B B B B B 0.015µF (153) A A A A B B B B B B 0.022µF (223) A A A A B B B B B B 0.033µF (333) A A A A B B B B B B 0.047µF (473) A A A A B B B B B B 0.068µF (683) A A A A B B B B B B 0.10µF (104) A A A A B B B B B B 0.15µF (154) A A A A B B B B I 0.22µF (224) A A A A B B B B I 0.33µF (334) B B B B B B B B 6/20/2023 NextGen Components, Inc. 23 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – Y5V DIELECTRIC 0805, 1206 SIZES Size VDC (V) Table 9-C 0805 6.3 1206 10 16 25 50 10 16 25 50 0.47µF (474) B B B B B B B B 0.68µF (684) B B C C B B B B 1.0µF (105) B B C C I I I I 1.5µF (155) C C I I I 2.2µF (225) C C I I I 3.3µF (335) C C J J J 4.7µF (475) C C J J J 6.8µF (685) C J J J J C 10µF (106) C C P 22µF (226) CAPACITANCE RANGE – Y5V DIELECTRIC 1210, 1812 SIZES Size VDC (V) Table 9-D 1210 10 16 25 1812 35 50 100 10 16 25 50 100 0.010µF (103) I C 0.015µF (153) I C 0.022µF (223) I C 0.033µF (333) I C 0.047µF (473) I C 0.068µF (683) I C 0.10µF (104) I I I I I C C C C C 0.15µF (154) I I I I I C C C C C 0.22µF (224) I I I I I C C C C C 0.33µF (334) I I I I I C C C C C 0.47µF (474) I I I I C C C C C 0.68µF (684) I I I I C C C C C 1.0µF (105) I I I I C C C C C 1.5µF (155) I I I C C C C 2.2µF (225) I I I C C C C 3.3µF (335) I I I C C C C D 6/20/2023 NextGen Components, Inc. 24 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – Y5V DIELECTRIC 1210, 1812 SIZES Size VDC (V) Table 9-E 1210 6.3 1812 10 16 25 50 10 16 25 50 4.7µF (475) I I C D C C C C 6.8µF (685) I I C C C C C 10µF (106) C C D C C C 22µF (226) K K 47µF (476) K 100µF (107) M D K M Note: The letter in cell is expressed the symbol of product thickness. CAPACITANCE RANGE – X5R DIELECTRIC 0201 SIZES Size VDC (V) Table 10-A 0201 10 16 25 50 100pF (101) L L L 120pF (121) L L L 150pF (151) L L L 180pF (181) L L L 220pF (221) L L L 270pF (271) L L L 330pF (331) L L L 390pF (391) L L L 470pF (471) L L L 560pF (561) L L L 680pF (681) L L L 820pF (821) L L L L 1,000pF (102) L L L 1,200pF (122) L L L 1,500pF (152 L L L 2,200pF (222) L L L 2,700pF (272) L L L 3,300pF (332) L L L 4,700pF (472) L L L 6/20/2023 NextGen Components, Inc. 25 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X5R DIELECTRIC 0201 0402 SIZES Size VDC (V) Table 10-B 0201 6.3 6,800µF (682) 0402 10 16 25 L L L L L 50 6.3 10 16 25 50 0.010µF (103) L L 0.015µF (153) L L H 0.022µF (223) L L H 0.027µF (273) L L H H 0.033µF (333) L L H H 0.039µF (393) L L H H 0.047µF (473) L L H H H H 0.056µF (563) L L H H H H 0.068µF (683) L L H H H H 0.082µF (823) L L H H H H 0.10µF (104) L L H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H/E H 4.7µF (475) H H H* 10µF (106) H* H* L L L 0.15µF (154) 0.22µF (224) L L 0.33µF (334) L* L* 0.47µF (474) L L* 0.68µF (684) 1.0µF (105) L* L* 2.2µF (225) L* L* L* CAPACITANCE RANGE – X5R DIELECTRIC 0603 SIZES Size Table 10-C 0603 VDC (V) 6.3 10 16 25 0.22µF (224) X X X X X X X X X X 0.39µF (394) X X X 0.47µF (474) X X/B X 0.27µF (274) 0.33µF (334) X 6/20/2023 NextGen Components, Inc. H/E 50 X 26 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X5R DIELECTRIC 0603 0805 SIZES Size Table 10-D 0603 0805 VDC (V) 6.3 10 16 25 0.68µF (684) X X X X 0.82µF (824) X X X X 1.0µF (105) X X X X/B 1.5µF (155) X 2.2µF (225) X/B X 10 16 25 50 C C C C C C C C C C C C 3.3µF (335) X X C C C C 4.7µF (475) X X X X C C C C C 10µF (106) X/B X X X* C C C C C 22µF (226) X* X* C C* C* C* 47µF (476) C* C* 100µF (107) C* X 50 6.3 X/B X X CAPACITANCE RANGE – X5R DIELECTRIC 1206, 1210 SIZES Size VDC (V) Table 10-E 1206 6.3 1210 10 16 1.5µF (155) J J 2.2µF (225) J J P 3.3µF (335) P P P 25 10 16 K K P K K P P P K K K P K K K K M M M M M M* M* M* 4.7µF (475) P P 6.8µF (685) P P 10µF (106) P P P P/D 22µF (226) P P P P 47µF (476) P P P* 100µF (107) P* 220µF (227) C 50 4 M* 6.3 25 50 M M* Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M tolerance" ( 20% ) only 6/20/2023 NextGen Components, Inc. 27 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES CAPACITANCE RANGE – X6S DIELECTRIC 0201, 0402, 0603 SIZES Size 0201 Table 11-A 0402 VDC (V) 4 6.3 0.10µF (104) L L 6.3 0603 10 16 25 H H H H H H H 4 6.3 10 16 25 X X L 0.22µF (224) H 0.47µF (474) L* 1.0µF (105) 2.2µF (225) 4.7µF (475) X 10µF (106) X* X* 22µF (226) X* X* X* CAPACITANCE RANGE – X6S DIELECTRIC 0805, 1206, 1210 SIZES Size VDC (V) 0805 4 6.3 10 Table 11-B 1206 16 25 50 C C 6.3 10 1210 16 25 6.3 10 16 25 0.10µF (104) 0.22µF (224) 0.47µF (474) 1.0µF (105) 2.2µF (225) 4.7µF (475) 10µF (106) C 22µF (226) 47µF (476) C C C C* C* C* C* C D P P P* M M M M M* 100µF (107) Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M tolerance" ( 20% ) only 6/20/2023 NextGen Components, Inc. 28 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES INSULATION RESISTANCE – Requirement - Class II (X7R, X5R, X6S, Y5V) Table 12 Rated Voltage IR 100V: All X7R 10GΩ or RxC≧100 Ω-F 50V: 0402>0.01uF; 0603≧1µF; 0805≧1µF; 1206≧4.7µF; 1210≧4.7µF whichever is smaller 35V: 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF 25V: 0402≧1µF; 0603≧2.2µF; 0805≧2.2µF; 1206≧10µF; 1210≧10µF 16V: 0201≧0.1µF; 0402≧0.22µF; 0603≧1µF; 0805≧2.2µF; 1206≧10µF; 1210≧47µF 10V: 0201≧47nF; 0402≧0.47µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧47µF 6.3V; 4V; Size ≧1812 All X6S items RxC≧50 Ω-F. 100V: 1210≧3.3µF 50V: 0402≧0.1µF; 0603≧2.2µF; 0805≧10µF; 1206≧10µF 35V: 0603≧1µF 25V: 0201≧0.1µF; 0402≧0.22µF; 0603≧10µF; 0805≧10µF; 1206≧22µF 16V: 0201≧0.22µF; 0402≧1µF; 0603≧10µF 10V: 0201>0.1µF; 0402≧1µF; 0603≧10µF; 0805≧47µF 6.3V: 0201≧0.1µF; 0603≧4.7µF; 0805≧47µF; 1206≧10µF 4V: 0603≧22µF; 0805≧47µF; 1206≧100µF TEMPERATURE COEFFICIENT- Test Condition Measurement voltage for Class II: Measurement Voltage Size Cap≤0.01µF: 0.5V; Cap.> 0.01µF: 0.2V 01005 Cap 0.01µF 10-25V C≥0.22µF Y5V 16V C≥4.7µF Y7R 50V C>1.0µF 25V C=1.0µF X5R 50V C≥1.0µF X5R/X7R/X6S 10V, 16V C≥1.0µF Y5V 16V C≥2.2µF X5R/X7R/X6S 100V C≥0.47µF 50V C≥1.0µF 35V C≥2.2µF 10-25V C≥4.7µF Y5V 16V C≥4.7µF X7R 100V C≥1.0µF 50V C=4.7µF 100V C>1.0µF 50V C=4.7µF 50-100V C≥2.2µF 0402 0603 0805 1206 X5R/X6S 1210 X5R/X7R/X6S 6/20/2023 NextGen Components, Inc. Table 16 31 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES RELIABILITY TEST CONDITIONS AND REQUIREMENTS Item Test Condition Requirements Visual and - * No remarkable defect. Mechanical * Dimensions to conform to individual spec. sheet. Capacitance Q/D.F (Dissipation Factor) Class I: (NP0) * Shall not exceed the limits ≦1000pF, 1.0±0.2Vrms, 1MHz±10% given in the detailed spec. >1000pF, 1.0±0.2Vrms,1KHz±10% Class II: (X7R, X6S, X5R,Y5V) C≦10µF, 1.0±0.2Vrms, 1KHz±10% ** C>10µF, 0.5±0.2Vrms, 120Hz±20% ** Test condition: 0.5±0.2Vrms, 1KHz±10% X7R: 0805=106(6.3V), 0603/475(6.3V) X5R: 0201≧ 224 (6.3V,10V,16V)*, 0402≧475 (6.3V,16V), NP0: Cap≧30pF, Q≧1000; Cap0603); removal of the terminations. Termination * Test time: 10±1 sec. Vibration Vibration frequency: 10~55 Hz/min. * No remarkable damage or Resistance * Total amplitude: 1.5mm removal of the terminations. * Test time: 6 hrs. (Two hrs each inthree * No remarkable damage. * mutually perpendicular directions.) * Cap change and Q/D.F.: * Before initial measurement (Class II only): To meet initial spec. To apply de-aging at 150°C for 1hr then set for 24±2 hrs at room temp. * Cap./DF(Q) Measurement to be made after de-aging a 150°C for 1hr then set for 24±2 hrs at room temp. Bending Test * The middle part of substrate shall be pressurized by * No remarkable damage. means of the pressurizing rod at a rate of about 1 mm * Cap change: per second until the deflection becomes 1 mm and NP0: within ±5% or 0.5pF then the pressure shall be maintained for 5±1 sec. whichever is larger X7R, X5R, X6S: *Before initial measurement (Class II only): within ±12.5% To apply de-aging at 150°C for 1hr then set for 24±2 Y5V: within ±30% hrs at room temp. (This capacitance change means Measurement to be made after keeping at room temp. the change of capacitance under for 24±2 hrs. specified flexure of substrate from the capacitance measured before the test.) 6/20/2023 NextGen Components, Inc. 33 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES RELIABILITY TEST CONDITIONS AND REQUIREMENTS Item Test Condition Requirements Resistance to * Solder temperature: 260±5°C * No remarkable damage. Soldering Heat * Dipping time: 10±1 sec * Cap change: * Preheating: 120 to 150°C for 1 minute before NP0: within ±2.5% or 0.25pF immerse the capacitor in a eutectic solder. whichever is larger X7R, X5R, X6S: * Before initial measurement (Class II only): To apply within ±7.5% de-aging at 150°C for 1hr then set for 24±2 hrs at Y5V: within ±20% room temp. * Q/D.F., I.R. and dielectric * Cap. / DF(Q) / I.R. Measurement to be made after strength: To meet initial de-aging at 150°C for 1hr then set for 24±2 hrs at requirements. room * 25% max. leaching on each edge. Temperature *Conduct the five cycles according to the temperatures * No remarkable damage. Cycle and time. * Cap change: Time (min.): 30±3 @ Min. operating temp.+0/-3 °C NP0: within ±2.5% or 0.25pF Time (min.): 2~3 @ Room temperture whichever is larger X7R, X5R, X6S: Time (min.): 30±3 @ Max. operating temp.+3/-0 °C within ±7.5% Time (min.): 2~3 @ Room temperture Y5V: within ±20% * Before initial measurement (Class II only): * Q/D.F., I.R. and dielectric Perform150+0/-10°C for 1 hr and then set for 24±2 strength: To meet initial hrs at room temp. requirements. * Cap. / DF(Q) / I.R. Measurement to be made after deaging at 150°C for 1hr then set for 24±2 hrs at room. Solder ability * Solder temperature: 235±5°C 95% min. coverage of all * Dipping time: 2±0.5 sec. metalized area 6/20/2023 NextGen Components, Inc. 34 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES RELIABILITY TEST CONDITIONS AND REQUIREMENTS Item Test Condition Requirements Humidity * Test temp.: 40±2°C * No remarkable damage. (Damp Heat) * Humidity: 90~95% RH * Cap change: Steady State * Test time: 500+24/-0hrs. NP0: within ±5% or 0.5pF • whichever is larger Before initial measurement (Class II only): Perform 150+0/-10°C for 1 hr and then set for 24±2 X7R, X5R, X6S: ≧10V**,within hrs at room temp. ±12.5%; 6.3V within ±25%; * Cap. / DF(Q) / I.R. Measurement to be made after de- ** 10V: 0603≧4.7µF; 0402≧1µF; aging at 150°C for 1hr then set for 24±2 hrs at room 0201 ≧0.1µF, within ±25%; temp. Y5V: ≧10V, within ±30%; 6.3V, within +30/≦ -40% * Q/D.F. value: NP0: More than 30pF Q≧350, 10pF≦C≦30pF, Q≧275+2.5C Less than 10pF Q≧200+10C X7R: See X5R: See Y5V: See X6S: See *I.R.: ≧10V, 1GΩ or 50 Ω-F whichever is smaller. Class II (X7R, X5R, X6S, Y5V) See Table 14 6/20/2023 NextGen Components, Inc. 35 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: 0402B102K500HI MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES RELIABILITY TEST CONDITIONS AND REQUIREMENTS Item Test Condition Requirements Humidity *Test temp.: 40±2°C * No remarkable damage. (Damp Heat) Load * Humidity: 90~95%RH Cap change: * Test time: 500+24/-0 hrs. NP0: ±7.5% or 0.75pF * To apply voltage: rated voltage. whichever is larger. * Before initial measurement (Class II only): To apply X7R, X5R, X6S: ≧10V**,within de-aging at 150°C for 1hr then set for 24±2 hrs at ±12.5%; ≦ 6.3V within ±25%; room temp. **10V: 0603 4.7≧µF; 0402 ≧1µF; * Cap. / DF(Q) / I.R. Measurement to be made after de- 0201≧0.1 µF, within ±25%; aging at 150°C for 1hr.then set for 24±2 hrs at room Y5V: ≧10V, within ±30%; ≦ 6.3V, temp within +30/-40% Q/D.F. value: NP0: C≧30pF, Q≧200; C
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