PART CODE:
0402B102K500HI
SPECIFICATION SHEET
SPECIFICATION SHEET NO.
Q0620- 0402B102K500HI
DATE
June 20, 2023
REVISION
A3
DESCRIPITION
Multilayer Ceramic Chip Capacitors 0402 (1005 Metric) Series,
L1.00*W0.50*H0.50mm, Thickness: 0.70mm Max.
Dielectric X7R, Capacitance 1000pF, Tolerance ±10%, Rated Voltage 50V
Operating Temp. Range -55°C ~+125°C
Package in Tape/Reel, 10,000pcs/Reel
RoHS/RoHS III compliant
CUSTOMER
CUSTOMER PART NUMBER
CROSS REF. PART NUMBER
ORIGINAL PART NUMBER
Aillen 0402B102K500HI
PART CODE
0402B102K500HI
VENDOR APPROVE
Issued/Checked/Approved
DATE: June 20， 2023
CUSTOMER APPROVE
DATE:
6/20/2023
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
MAIN FEATURE
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used. MLCC is made by NP0, X7R, X6S,
X5R and Y5V dielectric material and which provides product with high electrical precision, stability and reliability.
MAIN FEATURE
• RoHS III Compliant • Wide Operating Temperature Range -55~+125℃ • High capacitance in given case size
• A wide selection of sizes is available (0201 to 1812) • Capacitor with lead-free termination (pure Tin)
APPLICATION
• General Digital Circuit • Power Supply by pass capacitors • Consumer Electronics • Telecommunication
RFQ
PART CODE GUIDE
Request For Quotation
Code
Name
Key Specification Option
0402
Size
0201 (0603): L0.60*W0.30mm; 0402 (1005): L1.00*W0.50mm
0603 (1608): L1.60*W0.80mm; 0805 (2012): L2.00*W1.25mm
1206 (3216:) L3.20*W1.60mm; 1210 (3225): L3.20*W2.50mm
1812 (4532): L4.50*W3.20mm
B
102
Dielectric
N: NP0 (C0G); B: X7R; Y: Y5V; W: X5R; S: X6S
Capacitance
Two significant digits followed by number of Zero, The 3rd digit signifies the
multiplying factor, and letter R is decimal point.
0R5: 0.5pF; 3R3:3.3pF; 102: 1000pF; 100: 10pF
K
Tolerance
A=±0.05pF; B=±0.1pF; C=±0.25pF; D=±0.5pF; F=±1%; G=±2%; J=±5%; K=±10%
M=±20%; Z=-20/+80%
500
Rated Voltage
Two significant digits followed by No. of zeros. “R” is in place of decimal point.
4R0=4 VDC; 6R3=6.3 VDC; 100=10 VDC; 160=16 VDC; 250=25 VDC; 500=50 VDC;
101 =100 VDC
H
Thickness
H: 0.50±0.20mm, See Table 1
I
Package
K: 0.5 Kpcs/Reel; A: 1Kpcs/Reel; B: 2Kpcs/Reel; C: 3Kpcs/Reel; D: 4Kpcs/Reel;
E: 15Kpcs/Reel; I: 10Kpcs/Reel; J: 2.5Kpcs/Reel; F: others
Internal Control
Internal Code: Letter + Number; Blank: N/A;
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
DIMENSION (Unit: mm)
Image for reference
Table 1
Size
L
W
T (Symbol )
Code
0201
Soldering
MB
Method
0.6±0.09
0.30±0.09
0.3±0.09 (L)
R
0.15+0.1/-0.05
1.00±0.20
0.50±0.20
0.50±0.05 (N); 0.50±0.20 (H)
R
0.25+0.05/-0.10
1.60±0.20
0.80±0.20
0.50±0.20 (H); 0.80±0.10 (S)
R/W
0.40±0.15
0.50±0.20 (H); 0.60±0.10 (A)
H & C: R
0.50±0.20
0.85±0.15 (B); 0.80±0.20 (X)
A, X & B: R/W
(0603)
0402
(1005)
0603
(1608)
0805
0.85±0.15 (B); 0.80±0.20 (X)
2.00±0.20
1.25±0.20
(2012)
1.25±0.20 (C)
1206
3.20±0.30
1.60±0.30
(3216)
0.85±0.15 (B); 0.95±0.10 (I)
B: R/W
0.60±0.20
1.25±0.20 (C); 1.15±0.20 (J)
C, D, I, J & P: R
0.50±0.25
R
0.75±0.25
R
0.75±0.25
1.60±0.20 (D); 1.60+0.30/-0.10 (P)
1210
3.20±0.40
2.50±0.30
(3225)
0.85±0.15 (B); 0.95±0.10 (I)
1.25±0.20 (C); 1.60±0.20 (D);
2.00±0.20 (K); 2.50±0.30 (M)
1812
4.50±0.40
3.20±0.40
(4532)
1.25±0.20 (C); 1.60±0.20 (D);
2.00±0.20 (K); 2.50±0.30 (M)
0.50±0.25*
2.80±0.30 (U)
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
GENERAL ELECTRONICAL CHARACTERISTICS
Dielectric
NP0
X7R
Size
0201, 0402, 0603, 0805, 1206, 1210, 1812
Capacitance
0.1pF to 0.1µF
100pF to
range*
Table 2
Y5V
X5R
X6S
0.01µF to 100µF
100pF to
0.1µF to
220µF
100µF
47µF
Capacitance
Cap.≦5pF (Note #1):
J (±5%),
M (±20%),
K (±10%),
K (±10%),
Tolerance
A (±0.05pF), B (±0.1pF),
K (±10%),
Z (-20/+80%)
M (±20%)
M (±20%)
C (±0.25pF)
M (±20%)
-25 ~+85°C
-55 ~+85°C
-55~+105°C
+30/-80%
±15%
±22%
5pF0.1µF; 0805/X7R>0.47µF; 1206≧2.2µF; 1210≧10µF;
50V
≦ 2.5%
35V
≦ 3.5%
≦10%
0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF
25V
≦ 3.5%
≦5%
0201≧0.01µF; 0805≧1µF; 1210/X7R≧10µF
≦7%
0603≧0.33µF
≦10%
0201≧0.1µF; 0402/X7R≧0.056µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF;
1210≧22µF
16V
≦3.5%
≦12.5%
0402≧0.47µF
≦5%
0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF;
1210≧4.7µF
≦10%
0201/X7R≧0.022µF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF;
1206≧4.7µF; 1210≧22µF;
10V
≦ 5.0%
≦10%
0201≧0.012µF;0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF;
1206≧2.2µF;1210≧22µF
6.3V
≦ 10%
≦15%
0201≧0.1µF; 0402≧1µF
≦15%
0201≧0.1µF; 0402≧1µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF
1210 ≧100µF
4V
≦15%
≦20%
0402≧2.2µF
-
-
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
X5R
Table 4
Rated vol.
D.F. ≦
Exception of D.F. ≦
≧100V
≦ 2.5%
≦3%
1206 ≧ 0.47µF
≦ 5%
0603 ≧ 0.068µF; 0805＞0.1µF; 1206 ≧ 1µF; 1210 ≧ 2.2µF;
≦10%
0805＞0.22µF; 1210 ≧ 3.3µF
≦3%
0201(50V); 0603≧0.047µF; 0805≧0.18µF; 1206≧0.47µF
≦5%
0201≧0.01uF; 1210≧4.7µF
≦10%
0402≧0.012µF; 0603>0.1µF; 0805≧1µF; 1206≧2.2µF;1210≧10µF;
50V
≦ 2.5%
35V
≦ 3.5%
≦10%
0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF
25V
≦ 3.5%
≦5%
0201≧0.01µF; 0805≧1µF; 1210/X5R≧10µF
≦7%
0603≧0.33µF
≦10%
0201≧0.1µF; 0402≧0.10µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF;
1210/X5R≧10µF;
16V
≦ 3.5%
≦12.5%
0402≧0.47µF
≦5%
0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF;
1210≧4.7µF
≦10%
0201≧0.1uF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF; 1206≧4.7µF;
1210≧22µF
10V
≦ 5.0%
≦10%
0201≧0.012µF; 0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF; 1206≧2.2µF;
1210≧22µF
6.3V
≦ 10%
≦15%
0201≧0.1µF; 0402≧1µF
≦15%
0201≧0.1µF; 0402≧1µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF
1210 ≧100µF
4V
≦15%
≦20%
0402≧2.2µF
-
-
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
Y5V
Table 5
Rated vol.
D.F. ≦
Exception of D.F. ≦
≧50V
≦5%
≦7%
0603≧0.1µF; 0805≧0.47µF; 1206≧4.7µF
≦12.5%
1210≧6.8µF
35V
≦7%
-
-
25V
≦5%
≦7%
0402≧0.047µF; 0603≧0.1µF; 0805≧0.33µF; 1206≧1µF; 1210≧4.7µF
≦9%
0402≧0.068µF; 0603≧0.47µF; 1206≧4.7µF; 1210≧22µF
≦9%
0402≧0.068µF; 0603≧0.68µF
≦12.5%
0402≧0.22µF
≦9%
≦12.5%
0603≧2.2µF; 0805≧3.3µF; 1206≧10µF; 1210≧22µF; 1812≧47µF
10V
≦12.5%
≦20%
0402≧0.47µF
6.3V
≦20%
-
-
16V
≦7%
(C0.1µF; 0805≧1µF; 1206≧2.2µF; 1210≧10µF;
50V
≦ 2.5%
35V
≦ 3.5%
≦10%
0603≧1µF; 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF
25V
≦ 3.5%
≦5%
0201≧0.01µF; 0805≧1µF; 1210/X6S≧10µF
≦7%
0603≧0.33µF
≦10%
0201≧0.1µF; 0402≧0.10µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF;
1210≧22µF;
16V
≦ 3.5%
≦12.5%
0402≧0.47µF
≦5%
0201≧0.01µF; 0402≧0.033µF; 0603≧0.15µF; 0805≧0.68µF; 1206≧2.2µF;
1210≧4.7µF
≦10%
0201≧0.1uF; 0402≧ 0.22uF; 0603>0.47µF; 0805≧2.2µF; 1206≧4.7µF;
1210≧22µF
10V
≦ 5.0%
≦10%
0201≧0.012µF; 0402≧0.22µF; 0603≧0.33µF; 0805≧2.2µF; 1206≧2.2µF;
1210≧22µF
6.3V
≦ 10%
≦15%
0201≧0.1µF; 0402≧1µF
≦15%
0201≧0.1µF; 0402/X6S≧0.47µF; 0603≧10µF; 0805≧4.7µF; 1206≧47µF
1210 ≧100µF
4V
≦15%
≦20%
0402≧2.2µF
-
-
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0201, 0402, 0603 SIZES
Size
0201
Table 7-A
0402
0603
VDC (V)
16
25
50
10
16
25
50
100
10
16
25
50
100
0.1pF (0R1)
L
L
L
H
H
H
H
0.2pF (0R2)
L
L
L
H
H
H
H
0.3pF (0R3)
L
L
L
H
H
H
H
0.4pF (0R4)
L
L
L
H
H
H
H
0.5pF (0R5)
L
L
L
H
H
H
H
H
S
S
S
S
S
0.6pF (0R6)
L
L
L
H
H
H
H
H
S
S
S
S
S
0.7pF (0R7)
L
L
L
H
H
H
H
H
S
S
S
S
S
0.8pF (0R8)
L
L
L
H
H
H
H
H
S
S
S
S
S
0.9pF (0R9)
L
L
L
H
H
H
H
H
S
S
S
S
S
1.0pF (1R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
1.2pF (1R2)
L
L
L
H
H
H
H
H
S
S
S
S
S
1.5pF (1R5)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
H
1.6pF (1R6)
1.8pF (1R8)
L
L
L
H
H
H
H
H
S
S
S
S
S
2.0pF (2R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
2.2pF (2R2)
L
L
L
H
H
H
H
H
S
S
S
S
S
2.7pF (2R7)
L
L
L
H
H
H
H
H
S
S
S
S
S
3.0pF (3R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
3.3pF (3R3)
L
L
L
H
H
H
H
H
S
S
S
S
S
3.9pF (3R9)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
4.0pF (4R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
4.7pF (4R7)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
5.0pF (5R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
5.6pF (5R6)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
6.0pF (6R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
6.8pF (6R8)
L
L
L
H
H
H
H
H
S
S
S
S
S
7.0pF (7R0)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
8.0pF (8R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
8.2pF (8R2)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
9.0pF (9R0)
L
L
L
H
H
H
H
H
S
S
S
S
S
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0201, 0402, 0603 SIZES
Size
0201
Table 7-B
0402
0603
VDC (V)
16
25
50
10
16
25
50
100
10
16
25
50
100
10pF (100)
L
L
L
H
H
H
H
H
S
S
S
S
S
12pF (120)
L
L
L
H
H
H
H
H
S
S
S
S
S
15pF (150)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
18pF (180)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
22pF (220)
L
L
L
H
H
H
H/N
H
S
S
S
S/B
S
27pF (270)
L
L
L
H
H
H
H
H
S
S
S
S
S
H
30pF (300)
33pF (330)
L
L
L
H
H
H
H
H
S
S
S/B
S/B
S
39pF (390)
L
L
L
H
H
H
H
H
S
S
S
S
S
47pF (470)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
56pF (560)
L
L
L
H
H
H
H
H
S
S
S
S
S
68pF (680)
L
L
L
H
H
H
H
H
S
S
S
S
S
82pF (820)
L
L
L
H
H
H
H
H
S
S
S
S
S
100pF (101)
L
L
L
H
H
H
H/N
H
S
S
S
S/B
S
120pF (121)
L
L
L
H
H
H
H
H
S
S
S
S/B
S
150pF (151)
L
L
L
H
H
H
H
H
S
S
S
S
S
180pF (181)
H
H
H
H
H
S
S
S
S
S
220pF (221)
H
H
H
H
H
S
S
S
S
S
270pF (271)
L
H
H
H
H
S
S
S
S/B
S
330pF (331)
L
H
H
H
H
S
S
S
S/B
S
390pF (391)
L
H
H
H
H
S
S
S
S
S
470pF (471)
L
H
H
H
H
S
S
S
S
S
560pF (561)
L
H
H
H
H
S
S
S
S
S
680pF (681)
H
H
H
H
S
S
S
S
S
820pF (821)
H
H
H
H
S
S
S
S
S
1,000pF (102)
H
H
H
H
S
S
S/B
S
S
1,200pF (122)
X
X
X
X
X
1,500pF (152)
X
X
X
X
X
1,800pF (182)
X
X
X
X
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0603 SIZES
Size
Table 7-C
0603
VDC (V)
10
16
25
50
2,200pF (222)
X
X
X
X/B
2,700pF (272)
X
X
X
X/B
3,300pF (332)
X
X
X
X
3,900pF (392)
X
X
X
X
4,700pF (472)
X
X
X
X
5,600pF (562)
X
X
X
X
6,800pF (682)
X
X
X
X
8,200pF (822)
X
X
X
X
0.010µF (103)
X
X
X
X
CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES
Size
Table 7-D
0805
1206
VDC (V)
10
16
25
50
100
0.5pF (0R5)
A
A
A
A
A
0.6pF (0R6)
A
A
A
A
A
0.7pF (0R7)
A
A
A
A
A
0.8pF (0R8)
A
A
A
A
A
0.9pF (0R9)
A
A
A
A
A
1.0pF (1R0)
A
A
A
A
A
1.2pF (1R2)
A
A
A
A
A
B
B
B
B
B
1.5pF (1R5)
A
A
A
A
A
B
B
B
B
B
1.8pF (1R8)
A
A
A
A
A
B
B
B
B
B
2.0pF (2R0)
A
A
A
A
A
2.2pF (2R2)
A
A
A
A
A
B
B
B
B
B
2.7pF (2R7)
A
A
A
A
A
B
B
B
B
B
3.0pF (3R0)
A
A
A
A
A
3.3pF (3R3)
A
A
A
A
A
B
B
B
B
B
3.9pF (3R9)
A
A
A
A
A
B
B
B
B
B
4.0pF (4R0)
A
A
A
A
A
6/20/2023
NextGen Components, Inc.
10
16
25
50
100
B
11
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES
Size
Table 7-E
0805
1206
VDC (V)
10
16
25
50
100
10
16
25
50
100
4.7pF (4R7)
A
A
A
A
A
B
B
B
B
B
5.0pF (5R0)
A
A
A
A
A
5.6pF (5R6)
A
A
A
A
A
B
B
B
B
B
6.0pF (6R0)
A
A
A
A
A
6.8pF (6R8)
A
A
A
A
A
B
B
B
B
B
7.0pF (7R0)
A
A
A
A
A
B
B
B
B
B
8.0pF (8R0)
A
A
A
A
A
8.2pF (8R2)
A
A
A
A
A
B
B
B
B
B
9.0pF (9R0)
A
A
A
A
A
10pF (100)
A
A
A
A
A
B
B
B
B
B
12pF (120)
A
A
A
A
A
15pF (150)
A
A
A
A
A
B
B
B
B
B
18pF (180)
A
A
A
A
A
B
B
B
B
B
22pF (220)
A
A
A
A
A
B
B
B
B
B
27pF (270)
A
A
A
A
A
B
B
B
B
B
33pF (330)
A
A
A
A
A
B
B
B
B
B
39pF (390)
A
A
A
A
A
B
B
B
B
B
47pF (470)
A
A
A
A
A
B
B
B
B
B
56pF (560)
A
A
A
A
A
B
B
B
B
B
68pF (680)
A
A
A
A
A
B
B
B
B
B
82pF (820)
A
A
A
A
A
B
B
B
B
B
100pF (101)
A
A
A
A
A
B
B
B
B
B
120pF (121)
A
A
A
A
A
B
B
B
B
B
150pF (151)
A
A
A
A
A
B
B
B
B
B
180pF (181)
A
A
A
A
A
B
B
B
B
B
220pF (221)
A
A
A
A
A
B
B
B
B
B
270pF (271)
A
A
A
A
A
B
B
B
B
B
330pF (331)
A
A
A
A
A
B
B
B
B
B
390pF (391)
B
B
B
B
B
B
B
B
B
B
470pF (471)
B
B
B
B
B
6/20/2023
NextGen Components, Inc.
12
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES
Size
Table 7-F
0805
1206
VDC (V)
10
16
25
50
100
10
16
25
50
100
560pF (561)
B
B
B
B
B
B
B
B
B
B
680pF (681)
B
B
B
B
B
B
B
B
B
B
820pF (821)
B
B
B
B
B
B
B
B
B
B
1,000pF (102)
B
B
B
B
B
B
B
B
B
B
1,200pF (122)
B
B
B
B
B
B
B
B
B
B
1,500pF (152)
B
B
B
B
B
B
B
B
B
B
1,800pF (182)
B
B
B
B
B
B
B
B
B
B
2,200pF (222)
B
B
B
B
B
B
B
B
B
B
2,700pF (272)
C
C
C
C
C
B
B
B
B
B
3,300pF (332)
C
C
C
C
C
B
B
B
B
B
CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES
Size
Table 7-G
0805
1206
VDC (V)
10
16
25
50
100
10
16
25
50
100
3,900pF (392)
C
C
C
C
C
B
B
B
B
B
4,700pF (472)
C
C
C
C
C
B
B
B
B
B
5,600pF (562)
C
C
C
C
C
B
B
B
B
B
6,800pF (682)
C
C
C
C
C
I
I
I
I
I
8,200pF (822)
C
C
C
C
C
C
C
C
C
0.010µF (103)
C
C
C
C
C
C
C
C
C
0.012µF (123)
B
B
B
B
P
P
P
P
P
P
P
P
P
P
0.015µF (153)
0.018µF (183)
C
C
C
C
P
P
P
P
P
0.022µF (223)
C
C
C
C
P
P
P
P
P
0.027µF (273)
P
P
P
P
0.033µF (333)
P
P
P
P
0.039µF (393)
P
P
P
P
0.047µF (473)
J
J
J
J
0.056µF (563)
J
J
J
J
0.068µF (683)
D
D
D
D
6/20/2023
NextGen Components, Inc.
13
sales@NextGenComponent.com
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 0805, 1206 SIZES
Size
Table 7-H
0805
VDC (V)
10
16
1206
25
50
100
10
16
25
50
0.082µF (823)
D
D
D
D
0.1µF (104)
D
D
D
D
CAPACITANCE RANGE - NP0 DIELECTRIC 1210, 1812 SIZES
Size
100
Table 7-I
1210
1812
VDC (V)
10
16
25
50
100
16
50
100
10pF (100)
I
I
I
I
I
C
C
C
15pF (150)
I
I
I
I
I
C
C
C
18pF (180)
I
I
I
I
I
C
C
C
22pF (220)
I
I
I
I
I
C
C
C
27pF (270)
I
I
I
I
I
C
C
C
33pF (330)
I
I
I
I
I
C
C
C
39pF (390)
I
I
I
I
I
C
C
C
47pF (470)
I
I
I
I
I
C
C
C
56pF (560)
I
I
I
I
I
C
C
C
68pF (680)
I
I
I
I
I
C
C
C
82pF (820)
I
I
I
I
I
C
C
C
100pF (101)
I
I
I
I
I
C
C
C
120pF (121)
I
I
I
I
I
C
C
C
150pF (151)
I
I
I
I
I
C
C
C
180pF (181)
I
I
I
I
I
C
C
C
220pF (221)
I
I
I
I
I
C
C
C
270pF (271)
I
I
I
I
I
C
C
C
330pF (331)
I
I
I
I
I
C
C
C
390pF (391)
I
I
I
I
I
C
C
C
560pF (561)
I
I
I
I
I
C
C
C
680pF (681)
I
I
I
I
I
C
C
C
820pF (821)
I
I
I
I
I
C
C
C
1,000pF (102)
I
I
I
I
I
C
C
C
1,200pF (122)
I
I
I
I
I
C
C
C
6/20/2023
NextGen Components, Inc.
14
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE - NP0 DIELECTRIC 1210, 1812 SIZES
Size
Table 7-J
1210
1812
VDC (V)
10
16
25
50
100
16
50
100
1,500pF (152)
I
I
I
I
I
C
C
C
1,800pF (182)
I
I
I
I
I
C
C
C
2,200pF (222)
I
I
I
I
I
C
C
C
2,700pF (272)
I
I
I
I
I
C
C
C
3,300pF (332)
I
I
I
I
I
C
C
C
3,900pF (392)
I
I
I
I
I
C
C
C
4,700pF (472)
I
I
I
I
I
C
C
C
5,600pF (562)
I
I
I
I
I
C
C
C
6,800pF (682)
I
I
I
I
I
C
C
C
8,200pF (822)
I
I
I
I
I
C
C
C
0.010µF (103)
I
I
I
I
I
C
C
C
0.012µF (123)
C
C
C
C
C
C
C
C
0.015µF (153)
C
C
C
C
C
C
C
C
0.018µF (183)
K
K
K
K
C
C
C
0.022µF (223)
K
K
K
K
C
C
C
0.027µF (273)
K
K
K
K
C
C
C
0.033µF (333)
K
K
K
K
C
C
C
0.039µF (393)
K
K
K
K
M
M
M
0.047µF (473)
K
K
K
K
M
M
M
0.056µF (563)
M
M
M
0.068µF (683)
M
M
M
0.082µF (823)
M
M
M
0.1µF (104)
M
M
M
Note: The letter in cell is expressed the symbol of product thickness.
6/20/2023
NextGen Components, Inc.
15
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 0201, 0402 SIZES
Size
Table 8-A
0201
0402
VDC (V)
6.3
10
16
25
50
6.3
10
16
25
50
100
100pF (101)
L
L
L
L
L
H
H
H
H
H
H
120pF (121)
L
L
L
L
L
H
H
H
H
H
H
150pF (151)
L
L
L
L
L
H
H
H
H
H
H
180pF (181)
L
L
L
L
L
H
H
H
H
H
H
220pF (221)
L
L
L
L
L
H
H
H
H
H
H
270pF (271)
L
L
L
L
L
H
H
H
H
H
H
330pF (331)
L
L
L
L
L
H
H
H
H
H
H
390pF (391)
L
L
L
L
L
H
H
H
H
H
H
470pF (471)
L
L
L
L
L
H
H
H
H
H
H
560pF (561)
L
L
L
L
L
H
H
H
H
H
H
680pF (681)
L
L
L
L
L
H
H
H
H
H
H
820pF (821)
L
L
L
L
L
H
H
H
H
H
H
1,000pF (102)
L
L
L
L
L
H
H
H
H
H
H
1,200pF (122)
L
L
L
L
H
H
H
H
H
H
1,500pF (152)
L
L
L
L
H
H
H
H
H
H
1,800pF (182)
L
L
L
L
H
H
H
H
H
H
2,200pF (222)
L
L
L
L
H
H
H
H
H
H
2,700pF (272)
L
L
L
L
H
H
H
H
H
H
3,300pF (332)
L
L
L
L
H
H
H
H
H
H
3,900pF (392)
L
L
L
L
H
H
H
H
H
H
4,700pF (472)
L
L
L
L
H
H
H
H
H
H
5,600pF (562)
L
L
L
L
H
H
H
H
H
6,800pF (682)
L
L
L
H
H
H
H
H
8,200pF (822)
L
L
L
H
H
H
H
H
0.010µF (103)
L
L
L
H
H
H
H
H
0.012µF (123)
H
H
H
H
H
0.015µF (153)
H
H
H
H
H
0.018µF (183)
H
H
H
H
H
0.022µF (223)
H
H
H
H
H
6/20/2023
NextGen Components, Inc.
16
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 0402 SIZES
Size
Table 8-B
0402
VDC (V)
6.3
10
16
25
50
0.027µF (273)
H
H
H
H
H
0.033µF (333)
H
H
H
H
H
0.039µF (393)
H
H
H
H
H
0.047µF (473)
H
H
H
H
H
0.056µF (563)
H
H
H
H
H
0.068µF (683)
H
H
H
H
H
0.082µF (823)
H
H
H
H
H
0.10µF (104)
H
H
H
H
H
0.22µF (224)
H
H
H
H
0.47µF (474)
H
H
1.0µF (105)
H
H
CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES
Size
Table 8-C
0603
0805
VDC (V)
6.3
10
16
25
50
100
6.3
10
16
25
50
100
100pF (101)
S
S
S
S/B
S/B
S
B
B
B
B
B
B
120pF (121)
S
S
S
S
S
S
B
B
B
B
B
B
150pF (151)
S
S
S
S
S
S
B
B
B
B
B
B
180pF (181)
S
S
S
S
S
S/B
B
B
B
B
B
B
220pF (221)
S
S
S
S
S/B
S
B
B
B
B
B
B
270pF (271)
S
S
S
S
S
S
B
B
B
B
B
B
330pF (331)
S
S
S
S
S
S
B
B
B
B
B
B
390pF (391)
S
S
S
S
S
S
B
B
B
B
B
B
470pF (471)
S
S
S
S
S/B
S
B
B
B
B
B
B
560pF (561)
S
S
S
S
S
S
B
B
B
B
B
B
680pF (681)
S
S
S
S
S
S
B
B
B
B
B
B
820pF (821)
S
S
S
S
S
S
B
B
B
B
B
B
1,000pF (102)
S
S
S
S/B
S/B
S/B
B
B
B
B
B
B
1,200pF (122)
S
S
S
S
S
S
B
B
B
B
B
B
1,500pF (152
S
S
S
S/B
S
S
B
B
B
B
B
B
6/20/2023
NextGen Components, Inc.
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES
Size
Table 8-D
0603
0805
VDC (V)
6.3
10
16
25
50
100
6.3
10
16
25
50
100
1,800pF (182)
S
S
S
S
S
S
B
B
B
B
B
B
2,200pF (222)
S
S
S
S
S/B
S
B
B
B
B
B
B
2,700pF (272)
S
S
S
S
S/B
S
B
B
B
B
B
B
3,300pF (332)
S
S
S
S
S
S
B
B
B
B
B
B
3,900pF (392)
S
S
S
S
S
S
B
B
B
B
B
B
4,700pF (472)
S
S
S
S
S
S
B
B
B
B
B
B
5,600pF (562)
S
S
S
S
S
S
B
B
B
B
B
B
6,800pF (682)
S
S
S
S/B
S
S
B
B
B
B
B
B
8,200pF (822)
S
S
S
S
S
S
B
B
B
B
B
B
0.010µF (103)
S
S
S
S/B
S/B
S
B
B
B
B
B
B
0.012µF (123)
S
S
S
S
S
X
B
B
B
B
B
B
0.015µF (153)
S
S
S
S/B
S/B
X
B
B
B
B
B
B
0.018µF (183)
S
S
S
S
S
X
B
B
B
B
B
B
0.022µF (223)
S
S
S
S
S/B
X
B
B
B
B
B
B
0.027µF (273)
S
S
S
S
S/B
X
B
B
B
B
B
C
0.033µF (333)
S
S
S
S
X/B
X
B
B
B
B
B
C
0.039µF (393)
S
S
S
S
X
X
B
B
B
B
B
C
0.047µF (473)
S
S
S
S
X
X
B
B
B
B
B
C
0.056µF (563)
S
S
S
S
X
X
B
B
B
B
B
C
0.068µF (683)
S
S
S
S
X/B
X
B
B
B
B
B
C
0.082µF (823)
S
S
S
S
X
X
B
B
B
B
B
C
0.10µF (104)
S
S
S/B
S/B
X
X
B
B
B
B
B
C
0.12µF (124)
S
S
S
X
B
B
B
B
C
C
0.15µF (154)
S
S
S/B
X
C
C
C
C
C
C
0.18µF (184)
S
S
S
X
C
C
C
C
C
C
0.22µF (224)
S
S
S/B
X/B
C
C
C
C
C
C
0.27µF (274)
X
X
X
X
C
C
C
C
C
0.33µF (334)
X
X
X
X
C
C
C
C
C
0.39µF (394)
X
X
X
X
C
C
C
C
C
X
6/20/2023
NextGen Components, Inc.
18
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 0603, 0805 SIZES
Size
Table 8-E
0603
0805
VDC (V)
6.3
10
16
25
50
6.3
10
16
25
50
100
0.47µF (474)
X
X
X/B
X/B
X
C
C
C
C
C
C
0.56µF (564)
X
X
X
C
C
C
C
0.68µF (684)
X
X
X
C
C
C
C
0.82µF (824)
X
X
X
C
C
C
C
1.0µF (105)
X
X
X
C
C
C
C
C
C
C
C
X
X
1.5µF (155)
2.2µF (225)
X
X/B
X
C
C
C
C
4.7µF (475)
X
X
X
C
C
C
C
C*
C*
C*
10µF (106)
C
C
CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES
Size
Table 8-F
1206
1210
VDC (V)
6.3
10
16
25
50
100
10
16
25
50
100
150pF (151)
B
B
B
B
B
B
180pF (181)
B
B
B
B
B
B
220pF (221)
B
B
B
B
B
B
270pF (271)
B
B
B
B
B
B
330pF (331)
B
B
B
B
B
B
390pF (391)
B
B
B
B
B
B
470pF (471)
B
B
B
B
B
B
560pF (561)
B
B
B
B
B
B
680pF (681)
B
B
B
B
B
B
820pF (821)
B
B
B
B
B
B
1,000pF (102)
B
B
B
B
B
B
I
I
I
I
I
1,200pF (122)
B
B
B
B
B
B
I
I
I
I
I
1,500pF (152
B
B
B
B
B
B
I
I
I
I
I
1,800pF (182)
B
B
B
B
B
B
I
I
I
I
I
2,200pF (222)
B
B
B
B
B
B
I
I
I
I
I
2,700pF (272)
B
B
B
B
B
B
I
I
I
I
I
3,300pF (332)
B
B
B
B
B
B
I
I
I
I
I
6/20/2023
NextGen Components, Inc.
19
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES
Size
Table 8-G
1206
1210
VDC (V)
6.3
10
16
25
50
100
10
16
25
50
100
3,900pF (392)
B
B
B
B
B
B
I
I
I
I
I
4,700pF (472)
B
B
B
B
B
B
I
I
I
I
I
5,600pF (562)
B
B
B
B
B
B
I
I
I
I
I
6,800pF (682)
B
B
B
B
B
B
I
I
I
I
I
8,200pF (822)
B
B
B
B
B
B
I
I
I
I
I
0.010µF (103)
B
B
B
B
B
B
I
I
I
I
I
0.012µF (123)
B
B
B
B
B
B
I
I
I
I
I
0.015µF (153)
B
B
B
B
B
B
I
I
I
I
I
0.018µF (183)
B
B
B
B
B
B
I
I
I
I
I
0.022µF (223)
B
B
B
B
B
B
I
I
I
I
I
0.027µF (273)
B
B
B
B
B
B
I
I
I
I
I
0.033µF (333)
B
B
B
B
B
B
I
I
I
I
I
0.039µF (393)
B
B
B
B
B
B
I
I
I
I
I
0.047µF (473)
B
B
B
B
B
B
I
I
I
I
I
0.056µF (563)
B
B
B
B
B
B
I
I
I
I
I
0.068µF (683)
B
B
B
B
B
B
I
I
I
I
I
0.082µF (823)
B
B
B
B
B
C
I
I
I
I
I
0.10µF (104)
B
B
B
B
B
C
I
I
I
I
I
0.12µF (124)
B
B
B
B
B
C
I
I
I
I
I
0.15µF (154)
I
I
I
I
I
D
I
I
I
I
C
0.18µF (184)
I
I
I
I
I
D
I
I
I
I
C
0.22µF (224)
I
I
I
I
I/B
D
I
I
I
I
C
0.27µF (274)
I
I
I
I
C
D
I
I
I
I
D
0.33µF (334)
I
I
I
I
C
D
I
I
I
C
D
0.39µF (394)
I
I
I
J
P
D
I
I
I
C
M
0.47µF (474)
J
J
J
J
P
D
I
I
I
C
M
0.56µF (564)
J
J
J
J
P
P
C
C
C
C
M
0.68µF (684)
J
J
J
J
P
P
C
C
C
C
K
0.82µF (824)
J
J
J
J
P
P
C
C
C
C
K
6/20/2023
NextGen Components, Inc.
20
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 1206, 1210 SIZES
Size
Table 8-H
1206
1210
VDC (V)
6.3
10
16
25
50
100
10
16
25
50
100
1.0µF (105)
J
J
J
J
P
P
C
C
C
C
K
1.5µF (155)
J
J
J
P
D
D
M
M
2.2µF (225)
J
J
J
P
D
D
M
M
3.3µF (475)
P
P
P
P
D
D
M
4.7µF (475)
P
P
P
P
K
K
K
M
10µF (106)
P
P
P
P
K
K
K
M
22µF (226)
P*
P*
P*
M
M
M
P
P
P
M
M
47µF (476)
CAPACITANCE RANGE – X7R DIELECTRIC 1812 SIZES
Table 8-I
Size
1812
VDC (V)
6.3
10
16
25
50
100
1,000pF (102)
C
C
C
C
C
C
1,200pF (122)
C
C
C
C
C
C
1,500pF (152
C
C
C
C
C
C
1,800pF (182)
C
C
C
C
C
C
2,200pF (222)
C
C
C
C
C
C
2,700pF (272)
C
C
C
C
C
C
3,300pF (332)
C
C
C
C
C
C
3,900pF (392)
C
C
C
C
C
C
4,700pF (472)
C
C
C
C
C
C
5,600pF (562)
C
C
C
C
C
C
6,800pF (682)
C
C
C
C
C
C
8,200pF (822)
C
C
C
C
C
C
0.010µF (103)
C
C
C
C
C
C
0.012µF (123)
C
C
C
C
C
C
0.015µF (153)
C
C
C
C
C
C
0.018µF (183)
C
C
C
C
C
C
6/20/2023
NextGen Components, Inc.
21
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X7R DIELECTRIC 1812 SIZES
Table 8-J
Size
1812
VDC (V)
6.3
10
16
25
50
100
0.022µF (223)
C
C
C
C
C
C
0.027µF (273)
C
C
C
C
C
C
0.033µF (333)
C
C
C
C
C
C
0.039µF (393)
C
C
C
C
C
C
0.047µF (473)
C
C
C
C
C
C
0.056µF (563)
C
C
C
C
C
C
0.068µF (683)
C
C
C
C
C
C
0.082µF (823)
C
C
C
C
C
C
0.10µF (104)
C
C
C
C
C
C
0.12µF (124)
C
C
C
C
C
C
0.15µF (154)
C
C
C
C
C
C
0.18µF (184)
C
C
C
C
C
C
0.22µF (224)
C
C
C
C
C
C
0.27µF (274)
C
C
C
C
C
C
0.33µF (334)
C
C
C
C
C
C
0.39µF (394)
C
C
C
C
C
C
0.47µF (474)
C
C
C
C
C
K
0.56µF (564)
C
C
C
C
C
K
0.68µF (684)
C
C
C
C
K
K
0.82µF (824)
C
C
C
C
K
K
1.0µF (105)
C
C
C
C
K
K
1.5µF (155)
K
K
2.2µF (225)
M
M
Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M
tolerance" ( 20% ) only
6/20/2023
NextGen Components, Inc.
22
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – Y5V DIELECTRIC 0402, 0603 SIZES
Size
VDC (V)
Table 9-A
0402
6.3
0603
10
16
25
50
0.010µF (103)
H
H
H
0.015µF (153)
H
H
0.022µF (223)
H
0.033µF (333)
6.3
10
16
25
50
H
S
S
S/B
S/B
H
H
S
S
S
S
H
H
H
S
S
S
S
H
H
H
H
S
S
S
S
0.047µF (473)
H
H
H
S
S
S
S
0.068µF (683)
H
H
H
S
S
S
S
0.10µF (104)
H
H
H
S
S
S/B
S/B
0.15µF (154)
H
H
S
S
S
S
S
S
S
S
0.22µF (224)
H
H
H
H
0.33µF (334)
H
H
H
S
S
S
0.47µF (474)
H
H
H
S
S
X
0.68µF (684)
H
S
X
1.0µF (105)
H
S
X
H
S
1.5µF (155)
2.2µF (225)
S
S
4.7µF (475)
X
X
CAPACITANCE RANGE – Y5V DIELECTRIC 0805, 1206 SIZES
Size
Table 9-B
0805
1206
VDC (V)
10
16
25
50
100
10
16
25
50
100
0.010µF (103)
A
A
A
A
B
B
B
B
B
B
0.015µF (153)
A
A
A
A
B
B
B
B
B
B
0.022µF (223)
A
A
A
A
B
B
B
B
B
B
0.033µF (333)
A
A
A
A
B
B
B
B
B
B
0.047µF (473)
A
A
A
A
B
B
B
B
B
B
0.068µF (683)
A
A
A
A
B
B
B
B
B
B
0.10µF (104)
A
A
A
A
B
B
B
B
B
B
0.15µF (154)
A
A
A
A
B
B
B
B
I
0.22µF (224)
A
A
A
A
B
B
B
B
I
0.33µF (334)
B
B
B
B
B
B
B
B
6/20/2023
NextGen Components, Inc.
23
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – Y5V DIELECTRIC 0805, 1206 SIZES
Size
VDC (V)
Table 9-C
0805
6.3
1206
10
16
25
50
10
16
25
50
0.47µF (474)
B
B
B
B
B
B
B
B
0.68µF (684)
B
B
C
C
B
B
B
B
1.0µF (105)
B
B
C
C
I
I
I
I
1.5µF (155)
C
C
I
I
I
2.2µF (225)
C
C
I
I
I
3.3µF (335)
C
C
J
J
J
4.7µF (475)
C
C
J
J
J
6.8µF (685)
C
J
J
J
J
C
10µF (106)
C
C
P
22µF (226)
CAPACITANCE RANGE – Y5V DIELECTRIC 1210, 1812 SIZES
Size
VDC (V)
Table 9-D
1210
10
16
25
1812
35
50
100
10
16
25
50
100
0.010µF (103)
I
C
0.015µF (153)
I
C
0.022µF (223)
I
C
0.033µF (333)
I
C
0.047µF (473)
I
C
0.068µF (683)
I
C
0.10µF (104)
I
I
I
I
I
C
C
C
C
C
0.15µF (154)
I
I
I
I
I
C
C
C
C
C
0.22µF (224)
I
I
I
I
I
C
C
C
C
C
0.33µF (334)
I
I
I
I
I
C
C
C
C
C
0.47µF (474)
I
I
I
I
C
C
C
C
C
0.68µF (684)
I
I
I
I
C
C
C
C
C
1.0µF (105)
I
I
I
I
C
C
C
C
C
1.5µF (155)
I
I
I
C
C
C
C
2.2µF (225)
I
I
I
C
C
C
C
3.3µF (335)
I
I
I
C
C
C
C
D
6/20/2023
NextGen Components, Inc.
24
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – Y5V DIELECTRIC 1210, 1812 SIZES
Size
VDC (V)
Table 9-E
1210
6.3
1812
10
16
25
50
10
16
25
50
4.7µF (475)
I
I
C
D
C
C
C
C
6.8µF (685)
I
I
C
C
C
C
C
10µF (106)
C
C
D
C
C
C
22µF (226)
K
K
47µF (476)
K
100µF (107)
M
D
K
M
Note: The letter in cell is expressed the symbol of product thickness.
CAPACITANCE RANGE – X5R DIELECTRIC 0201 SIZES
Size
VDC (V)
Table 10-A
0201
10
16
25
50
100pF (101)
L
L
L
120pF (121)
L
L
L
150pF (151)
L
L
L
180pF (181)
L
L
L
220pF (221)
L
L
L
270pF (271)
L
L
L
330pF (331)
L
L
L
390pF (391)
L
L
L
470pF (471)
L
L
L
560pF (561)
L
L
L
680pF (681)
L
L
L
820pF (821)
L
L
L
L
1,000pF (102)
L
L
L
1,200pF (122)
L
L
L
1,500pF (152
L
L
L
2,200pF (222)
L
L
L
2,700pF (272)
L
L
L
3,300pF (332)
L
L
L
4,700pF (472)
L
L
L
6/20/2023
NextGen Components, Inc.
25
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X5R DIELECTRIC 0201 0402 SIZES
Size
VDC (V)
Table 10-B
0201
6.3
6,800µF (682)
0402
10
16
25
L
L
L
L
L
50
6.3
10
16
25
50
0.010µF (103)
L
L
0.015µF (153)
L
L
H
0.022µF (223)
L
L
H
0.027µF (273)
L
L
H
H
0.033µF (333)
L
L
H
H
0.039µF (393)
L
L
H
H
0.047µF (473)
L
L
H
H
H
H
0.056µF (563)
L
L
H
H
H
H
0.068µF (683)
L
L
H
H
H
H
0.082µF (823)
L
L
H
H
H
H
0.10µF (104)
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H/E
H
4.7µF (475)
H
H
H*
10µF (106)
H*
H*
L
L
L
0.15µF (154)
0.22µF (224)
L
L
0.33µF (334)
L*
L*
0.47µF (474)
L
L*
0.68µF (684)
1.0µF (105)
L*
L*
2.2µF (225)
L*
L*
L*
CAPACITANCE RANGE – X5R DIELECTRIC 0603 SIZES
Size
Table 10-C
0603
VDC (V)
6.3
10
16
25
0.22µF (224)
X
X
X
X
X
X
X
X
X
X
0.39µF (394)
X
X
X
0.47µF (474)
X
X/B
X
0.27µF (274)
0.33µF (334)
X
6/20/2023
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H/E
50
X
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X5R DIELECTRIC 0603 0805 SIZES
Size
Table 10-D
0603
0805
VDC (V)
6.3
10
16
25
0.68µF (684)
X
X
X
X
0.82µF (824)
X
X
X
X
1.0µF (105)
X
X
X
X/B
1.5µF (155)
X
2.2µF (225)
X/B
X
10
16
25
50
C
C
C
C
C
C
C
C
C
C
C
C
3.3µF (335)
X
X
C
C
C
C
4.7µF (475)
X
X
X
X
C
C
C
C
C
10µF (106)
X/B
X
X
X*
C
C
C
C
C
22µF (226)
X*
X*
C
C*
C*
C*
47µF (476)
C*
C*
100µF (107)
C*
X
50
6.3
X/B
X
X
CAPACITANCE RANGE – X5R DIELECTRIC 1206, 1210 SIZES
Size
VDC (V)
Table 10-E
1206
6.3
1210
10
16
1.5µF (155)
J
J
2.2µF (225)
J
J
P
3.3µF (335)
P
P
P
25
10
16
K
K
P
K
K
P
P
P
K
K
K
P
K
K
K
K
M
M
M
M
M
M*
M*
M*
4.7µF (475)
P
P
6.8µF (685)
P
P
10µF (106)
P
P
P
P/D
22µF (226)
P
P
P
P
47µF (476)
P
P
P*
100µF (107)
P*
220µF (227)
C
50
4
M*
6.3
25
50
M
M*
Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M
tolerance" ( 20% ) only
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
CAPACITANCE RANGE – X6S DIELECTRIC 0201, 0402, 0603 SIZES
Size
0201
Table 11-A
0402
VDC (V)
4
6.3
0.10µF (104)
L
L
6.3
0603
10
16
25
H
H
H
H
H
H
H
4
6.3
10
16
25
X
X
L
0.22µF (224)
H
0.47µF (474)
L*
1.0µF (105)
2.2µF (225)
4.7µF (475)
X
10µF (106)
X*
X*
22µF (226)
X*
X*
X*
CAPACITANCE RANGE – X6S DIELECTRIC 0805, 1206, 1210 SIZES
Size
VDC (V)
0805
4
6.3
10
Table 11-B
1206
16
25
50
C
C
6.3
10
1210
16
25
6.3
10
16
25
0.10µF (104)
0.22µF (224)
0.47µF (474)
1.0µF (105)
2.2µF (225)
4.7µF (475)
10µF (106)
C
22µF (226)
47µF (476)
C
C
C
C*
C*
C*
C*
C
D
P
P
P*
M
M
M
M
M*
100µF (107)
Note: 1) The letter in cell is expressed the symbol of product thickness. 2) The letter in cell with “ * ” mark is for “M
tolerance" ( 20% ) only
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
INSULATION RESISTANCE – Requirement - Class II (X7R, X5R, X6S, Y5V)
Table 12
Rated Voltage
IR
100V: All X7R
10GΩ or RxC≧100 Ω-F
50V: 0402>0.01uF; 0603≧1µF; 0805≧1µF; 1206≧4.7µF; 1210≧4.7µF
whichever is smaller
35V: 0805≧2.2µF; 1206≧2.2µF; 1210≧10µF
25V: 0402≧1µF; 0603≧2.2µF; 0805≧2.2µF; 1206≧10µF; 1210≧10µF
16V: 0201≧0.1µF; 0402≧0.22µF; 0603≧1µF; 0805≧2.2µF; 1206≧10µF; 1210≧47µF
10V: 0201≧47nF; 0402≧0.47µF; 0603≧0.47µF; 0805≧2.2µF; 1206≧4.7µF; 1210≧47µF
6.3V; 4V; Size ≧1812
All X6S items
RxC≧50 Ω-F.
100V: 1210≧3.3µF
50V: 0402≧0.1µF; 0603≧2.2µF; 0805≧10µF; 1206≧10µF
35V: 0603≧1µF
25V: 0201≧0.1µF; 0402≧0.22µF; 0603≧10µF; 0805≧10µF; 1206≧22µF
16V: 0201≧0.22µF; 0402≧1µF; 0603≧10µF
10V: 0201>0.1µF; 0402≧1µF; 0603≧10µF; 0805≧47µF
6.3V: 0201≧0.1µF; 0603≧4.7µF; 0805≧47µF; 1206≧10µF
4V: 0603≧22µF; 0805≧47µF; 1206≧100µF
TEMPERATURE COEFFICIENT- Test Condition Measurement voltage for Class II:
Measurement Voltage
Size
Cap≤0.01µF: 0.5V; Cap.> 0.01µF: 0.2V
01005
Cap 0.01µF
10-25V
C≥0.22µF
Y5V
16V
C≥4.7µF
Y7R
50V
C>1.0µF
25V
C=1.0µF
X5R
50V
C≥1.0µF
X5R/X7R/X6S
10V, 16V
C≥1.0µF
Y5V
16V
C≥2.2µF
X5R/X7R/X6S
100V
C≥0.47µF
50V
C≥1.0µF
35V
C≥2.2µF
10-25V
C≥4.7µF
Y5V
16V
C≥4.7µF
X7R
100V
C≥1.0µF
50V
C=4.7µF
100V
C>1.0µF
50V
C=4.7µF
50-100V
C≥2.2µF
0402
0603
0805
1206
X5R/X6S
1210
X5R/X7R/X6S
6/20/2023
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Table 16
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
RELIABILITY TEST CONDITIONS AND REQUIREMENTS
Item
Test Condition
Requirements
Visual and
-
* No remarkable defect.
Mechanical
* Dimensions to conform to
individual spec. sheet.
Capacitance
Q/D.F
(Dissipation
Factor)
Class I: (NP0)
* Shall not exceed the limits
≦1000pF, 1.0±0.2Vrms, 1MHz±10%
given in the detailed spec.
＞1000pF, 1.0±0.2Vrms,1KHz±10%
Class II: (X7R, X6S, X5R,Y5V)
C≦10µF, 1.0±0.2Vrms, 1KHz±10%
** C＞10µF, 0.5±0.2Vrms, 120Hz±20%
** Test condition: 0.5±0.2Vrms, 1KHz±10%
X7R: 0805=106(6.3V), 0603/475(6.3V)
X5R: 0201≧ 224 (6.3V,10V,16V)*, 0402≧475 (6.3V,16V),
NP0:
Cap≧30pF, Q≧1000;
Cap0603);
removal of the terminations.
Termination
* Test time: 10±1 sec.
Vibration
Vibration frequency: 10~55 Hz/min.
* No remarkable damage or
Resistance
* Total amplitude: 1.5mm
removal of the terminations.
* Test time: 6 hrs. (Two hrs each inthree
* No remarkable damage.
* mutually perpendicular directions.)
* Cap change and Q/D.F.:
* Before initial measurement (Class II only):
To meet initial spec.
To apply de-aging at 150°C for 1hr then set for 24±2
hrs at room temp.
* Cap./DF(Q) Measurement to be made after de-aging
a 150°C for 1hr then set for 24±2 hrs at room temp.
Bending Test
* The middle part of substrate shall be pressurized by
* No remarkable damage.
means of the pressurizing rod at a rate of about 1 mm
* Cap change：
per second until the deflection becomes 1 mm and
NP0: within ±5% or 0.5pF
then the pressure shall be maintained for 5±1 sec.
whichever is larger X7R, X5R, X6S:
*Before initial measurement (Class II only):
within ±12.5%
To apply de-aging at 150°C for 1hr then set for 24±2
Y5V: within ±30%
hrs at room temp.
(This capacitance change means
Measurement to be made after keeping at room temp.
the change of capacitance under
for 24±2 hrs.
specified flexure of substrate
from the capacitance measured
before the test.)
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
RELIABILITY TEST CONDITIONS AND REQUIREMENTS
Item
Test Condition
Requirements
Resistance to
* Solder temperature: 260±5°C
* No remarkable damage.
Soldering Heat
* Dipping time: 10±1 sec
* Cap change:
* Preheating: 120 to 150°C for 1 minute before
NP0: within ±2.5% or 0.25pF
immerse the capacitor in a eutectic solder.
whichever is larger X7R, X5R, X6S:
* Before initial measurement (Class II only): To apply
within ±7.5%
de-aging at 150°C for 1hr then set for 24±2 hrs at
Y5V: within ±20%
room temp.
* Q/D.F., I.R. and dielectric
* Cap. / DF(Q) / I.R. Measurement to be made after
strength: To meet initial
de-aging at 150°C for 1hr then set for 24±2 hrs at
requirements.
room
* 25% max. leaching on each
edge.
Temperature
*Conduct the five cycles according to the temperatures
* No remarkable damage.
Cycle
and time.
* Cap change：
Time (min.): 30±3 @ Min. operating temp.+0/-3 °C
NP0: within ±2.5% or 0.25pF
Time (min.): 2~3 @ Room temperture
whichever is larger X7R, X5R, X6S:
Time (min.): 30±3 @ Max. operating temp.+3/-0 °C
within ±7.5%
Time (min.): 2~3 @ Room temperture
Y5V: within ±20%
* Before initial measurement (Class II only):
* Q/D.F., I.R. and dielectric
Perform150+0/-10°C for 1 hr and then set for 24±2
strength: To meet initial
hrs at room temp.
requirements.
* Cap. / DF(Q) / I.R. Measurement to be made after deaging at 150°C for 1hr then set for 24±2 hrs at room.
Solder ability
* Solder temperature: 235±5°C
95% min. coverage of all
* Dipping time: 2±0.5 sec.
metalized area
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
RELIABILITY TEST CONDITIONS AND REQUIREMENTS
Item
Test Condition
Requirements
Humidity
* Test temp.: 40±2°C
* No remarkable damage.
(Damp Heat)
* Humidity: 90~95% RH
* Cap change:
Steady State
* Test time: 500+24/-0hrs.
NP0: within ±5% or 0.5pF
•
whichever is larger
Before initial measurement (Class II only):
Perform 150+0/-10°C for 1 hr and then set for 24±2
X7R, X5R, X6S: ≧10V**,within
hrs at room temp.
±12.5%; 6.3V within ±25%;
* Cap. / DF(Q) / I.R. Measurement to be made after de-
** 10V: 0603≧4.7µF; 0402≧1µF;
aging at 150°C for 1hr then set for 24±2 hrs at room
0201 ≧0.1µF, within ±25%;
temp.
Y5V: ≧10V, within ±30%;
6.3V, within +30/≦ -40%
* Q/D.F. value:
NP0: More than 30pF Q≧350,
10pF≦C≦30pF, Q≧275+2.5C Less
than 10pF Q≧200+10C
X7R: See
X5R: See
Y5V: See
X6S: See
*I.R.: ≧10V, 1GΩ or 50 Ω-F
whichever is smaller.
Class II (X7R, X5R, X6S, Y5V)
See Table 14
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PART CODE:
0402B102K500HI
MULTILAYER CERAMIC CHIP CAPACITORS 0402 SERIES
RELIABILITY TEST CONDITIONS AND REQUIREMENTS
Item
Test Condition
Requirements
Humidity
*Test temp.: 40±2°C
* No remarkable damage.
(Damp Heat) Load
* Humidity: 90~95%RH
Cap change:
* Test time: 500+24/-0 hrs.
NP0: ±7.5% or 0.75pF
* To apply voltage： rated voltage.
whichever is larger.
* Before initial measurement (Class II only): To apply
X7R, X5R, X6S: ≧10V**,within
de-aging at 150°C for 1hr then set for 24±2 hrs at
±12.5%; ≦ 6.3V within ±25%;
room temp.
**10V: 0603 4.7≧µF; 0402 ≧1µF;
* Cap. / DF(Q) / I.R. Measurement to be made after de-
0201≧0.1 µF, within ±25%;
aging at 150°C for 1hr.then set for 24±2 hrs at room
Y5V: ≧10V, within ±30%; ≦ 6.3V,
temp
within +30/-40% Q/D.F. value:
NP0: C≧30pF, Q≧200; C
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