RE50M00000S300

PART CODE: RE50M00000S300 SPECIFICATION SHEET SPECIFICATION SHEET NO. Q0120-RE50M00000S300 DATE Jan. 20, 2023 REVISION A1 DESCRIPITION SMD Oscillator, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads, COM32 series 50.0000MHz, 3.3V, +/-50ppm, Symmetry 45/55, Operating Temp. Range -40°C ~+85°C, Reflow Profile Condition 260 °C Max. HCMOS//15pF, Supply Current 30mA Max, Tristate function - Enable via Pad 1, Packed in Tape/Reel, 3000pcs/Reel RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER TGS COM3231BGI01 TLF-50M000 PART CODE RE50M00000S300 VENDOR APPROVE Issued/Checked/Approved DATE: Jan. 207, 2023 CUSTOMER APPROVE DATE: 1/20/2023 NextGen Components, Inc. 1 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMDSMD OSCILLATOR CRYSTAL 3225 2520 TYPE 4 PADS MAIN FEATURE • SMD Package, Seam Sealed, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads • Low noise and Low current • Industry standard • Reflow Profile Condition 260 °C Max. • Cross more competitors part • RoHS/RoHS III compliant APPLICATION • PDA, PND, DSC, Smart phone, WiLAN, Bluetooth and more • Communication Electronics RFQ PART CODE GUIDE Request For Quotation RE 50M00000 S 300 1 2 3 4 1) RE: Part family Code for SMD Oscillator 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads, COM32 series 2) 50M00000: Frequency range code for 50.00000MHz 3) S: SMD type, Package Tape/Reel, 3000pcs/Reel 4) 300: Specification code for original part No.: TGS COM3231BGI01 TLF-50M000 1/20/2023 NextGen Components, Inc. 2 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS DIMENSION (Unit: mm, Tol. +/-0.15mm) Image for reference Marking 1 Line 1: 50.000 Line 2: Special Code COM32 Pin Function #1 Enable (Tri-State) #2 Ground #3 Output #4 VDD Recommend Pad Layout Circuit Principle 1/20/2023 NextGen Components, Inc. 3 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS ELECTRICAL PARAMETERS Parameter Part No. Symbol Units Value Min. Original Manufacturer Holder Type Typical Condition Max. TGS TGS Crystals COM32 SMD Oscillator, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads Supply Voltage 3 Enable/Disable Function 1 Overall Freq. Tolerance B ppm -50 +50 Operating Temp. Range G °C -40 +85 °C -55 +125 % 45 55 V OH V 90% V OL V Load pF Storage Temp. Range Symmetry Output I Output Waveform V 3.3 +/-10% Tristate function - Enable @ Control via pin 1 @25°C High (Logic “1”) 10% Low (Logic “0”) 15 01 HCMOS @OutputLoad 15pF Startup Time ms 10 Supply Current mA 30 Rise/ Fall time ns 10 Phase Jitter ps 1.0 @12KHz~20MHz ppm/year ±3 @1st year Aging Others Package T Tape/Reel RoHS Status LF RoHS III compliant Add Value N/A Internal Control Code * N/A Frequency Range -50M000 50.0000MHz Note: 1) Original Part Number: TGS COM3231BGI01 TLF-50M000 2) * Internal Control Code- 2 letter or digits; Blank: N/A 1/20/2023 NextGen Components, Inc. 4 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS RELIABILITY Test Items Test Method And Conditions Reference Documents High Temperature High Humidity Storage Temperature: 85℃±3℃ Relative Humidity:85%RH Time: 1000 Hours JIS C5023 High Temperature Storage Temperature: 125℃±3℃ Time: 1000+/-12 Hours. MIL-STD-883 Low Temperature Storage Temperature: -40℃±3℃ Time: 1000+/-12 Hours MIL-STD-883 Thermal Shock Temperature 1: -125℃±3℃ Temperature 2: -55℃±3 ℃ Temperature change between T1 and T2 10 min 100 cycles maintain T1 and T2 for 10 Min. each cycle MIL-STD-883 Resistance to Solder Heat Solder Temperature: 260℃±5℃ Time: 10±1 Seconds MIL-STD-202 Solderability The solder pot temperature is 245±5℃ Immersing Depth: 0.5nm Min. Immersion Time: 5 ± 1 sec. Flux: Rosin resin methyl alcohol solvent (1:4) MIL-STD-883 Drop Test 3 Times Free Fall from 75cm height table to 3cm thickness hard wood board JIS C6701 Mechanical Shock Half sine wave,1000 G 3 Times for all 3 directions(X,Y Z) MIL STD 202 Vibration Frequency Range: 10Hz～2000Hz Amplitude: 1.52m/20G Sweep time: 20 minutes 4 Hours in each direction, total 12 Hours MIL-STD-883 Leakage Test Gross leak: standard sample for automatic gross leak detector, test pressure: 2 kg/cm² Fine leak: Helium Bomging 4.5kgf/cm² for 2 hours MIL-STD-883 Pressure cooker storage 121℃±3℃, RH 100%; 2 bar, 240 hours JIS C6701 1/20/2023 NextGen Components, Inc. 5 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS SUGGESTED REFLOW PROFILE (For Reference Only) Total time: 200 Sec. Max. Solder melting point: 220℃ Profile Feature Pb-Free Assembly Average Ramp-up Rate (Ts Max to Tp) 3℃/second Max Preheat Temperature Min (Ts Min.) 125℃ Temperature Max (Ts Max.) 200℃ Time (ts Min. to ts Max.) 60～180 seconds Temperature (TL) 217℃ Time (tL) 60～150 seconds Time maintained above Peak/Classification Temperature (Tp) 260 ℃ Time within 5℃ of actual Peak Temperature (tp) 20～40 seconds Ramp-down rate 6 ℃ /Second Max. Time 25 ℃ to Peak Temperature 8 minutes Max. Suggest reflow times 3 Times Max. 1/20/2023 NextGen Components, Inc. 6 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE50M00000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS TAPE/REEL (Unit: mm) All Devices are packed in accordance with EIA standard RS-481-2 and specifications, 3000pcs/Reel DISCLAIMER NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information 1/20/2023 NextGen Components, Inc. 7 sales@NextGenComponent.com www.NextGenComponent.com