XF24M00000S101

PART CODE: XF24M00000S101 SPECIFICATION SHEET SPECIFICATION SHEET NO. Q0131- XF24M00000S101 DATE Jan. 31, 2023 REVISION A1 DESCRIPITION MHz SMD Crystal, L3.2*W2.5*H0.7mm, Seam Seal, 4 Pads, CM32 series 24.0000000MHz, Tolerance +/-10ppm, Load Capacitor 18pF, Frequency stability +/-10ppm @Operating Temp. Range -20°C ~+75°C, ESR 40 ohm Max, Reflow Profile Condition 260 °C Max. Tape/Reel, 3000pcs/Reel RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER TGS CM32 24M0A10-18-10-20/75-40 TLF PART CODE XF24M00000S101 VENDOR APPROVE Issued/Checked/Approved DATE: Jan. 31, 2023 CUSTOMER APPROVE DATE: 1/31/2023 NextGen Components, Inc. 1 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS MAIN FEATURE • SMD Crystal, Seam Seal, L3.2*W2.5*H0.7mm, 4 pads • Low cost, High precision, High frequency stability • Reflow Profile Condition 260 °C Max. • Cross more competitors part • RoHS/RoHS III compliant APPLICATION • Bluetooth, wireless communication set • Communication Electronics RFQ PART CODE GUIDE Request For Quotation XF 24M00000 S 101 1 2 3 4 1) XF: Part family Code for SMD Crystal, Seam Seal, L3.2*W2.5*H0.7mm, 4 pads (CM32) 2) 24M00000: Frequency range code for 24.000000MHz 3) S: SMD type, Package Tape/Reel, 3000pcs/Reel 4) 101: Specification code for original part No.: TGS CM32 24M0A10-18-10-20/75-40 TLF 1/31/2023 NextGen Components, Inc. 2 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS DIMENSION (Unit: mm) Image for reference CM32 Marking Frequency Range Connection #1 Crystal #2 Ground #3 Crystal #4 Ground Recommend Pad Layout 1/31/2023 NextGen Components, Inc. 3 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS ELECTRICAL PARAMETERS Parameter Part No. Symbol Units Value Min. Original Manufacturer Typical Condition Max. TGS TGS Crystals Holder Type CM32 SMD Crystal, Seam Seal, L3.2*W2.5*H0.7mm, 4 pads Frequency Range 24M0 MHz 24.00 Mode of Oscillation A Frequency Tolerance 10 ppm Load Capacitance -18 pF Stability over Operation Temperance -10 ppm -10 +10 Operation Temperance -20/75 °C -20 +75 °C -55 +105 Storage Temperance Equivalent Series Resistance (ESR) -40 AT Fundamental -10 +10 18 Ω 40 Drive Level μW 300 Shunt Capacitance (C0) pF 5.0 Motional Capacitance (C1) fF N/A DLD2 Ω N/A FLD2 ppm N/A RDL2 Ω N/A SPDB dB N/A Aging ppm/year Insulation Resistance Others MΩ @25°C ±3 500 @1st year @100VDC ± 15VDC Package T Tape/Reel RoHS Status LF RoHS III compliant Add Value N/A Internal Control Code * N/A Note: 1) Original Part Number: TGS CM32 24M0A10-18-10-20/75-40 TLF 2) * Internal Control Code- 2 letter or digits; Blank: N/A 1/31/2023 NextGen Components, Inc. 4 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS RELIABILITY Test Items Test Method And Conditions Reference Documents High Temperature High Humidity Storage Temperature: 85℃±3℃ Relative Humidity:85%RH Time: 96 Hours JIS C5023 High Temperature Storage Temperature: 125℃±3℃ Time: 96 Hours. MIL-STD-883E Method 1005.8 Low Temperature Storage Temperature: -40℃±3℃ Time: 96 Hours. MIL-STD-883E Method 1013 Thermal Shock Temperature 1: -55℃±5℃ Temperature 2: 85℃±5 ℃ Temperature change between T1 and T2 5 min 10cycles maintain T1 and T2 for 30 minutes each cycle MIL-STD-202F Method 107 Condition A Resistance to Solder Heat Solder Temperature: 260℃±5℃ Time: 10±1 Seconds MIL-STD-202F Method 210E Solderability The solder pot temperature is 245±5℃ , dwell time 5±0.5sec J-STD-002B Drop Test 3 Times Free Fall from 50cm height table to 3cm thickness hard wood board J-STD-002B Mechanical Shock Half sine wave,1000 G 3 Times for all 3 directions(X,Y Z) MIL STD 202F Method 213B Vibration Frequency Range: 10Hz～55Hz Amplitude: 0.75mm 2 Hours in each direction, total 6 Hours MIL-STD-883E Method 2007.3 Leakage Test Take measurements with a helium Leakage detector Leakage Rate≤1×10ˉ³Pa cm³/s MIL-STD-883E 1/31/2023 NextGen Components, Inc. 5 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS SUGGESTED REFLOW PROFILE (For Reference Only) Total time: 200 Sec. Max. Solder melting point: 220℃ Profile Feature Pb-Free Assembly Average Ramp-up Rate (Ts Max to Tp) 3℃/second Max Preheat Temperature Min (Ts Min.) 125℃ Temperature Max (Ts Max.) 200℃ Time (ts Min. to ts Max.) 60～180 seconds Temperature (TL) 217℃ Time (tL) 60～150 seconds Time maintained above Peak/Classification Temperature (Tp) 260 ℃ Time within 5℃ of actual Peak Temperature (tp) 20～40 seconds Ramp-down rate 6 ℃ /Second Max. Time 25 ℃ to Peak Temperature 8 minutes Max. Suggest reflow times 3 Times Max. 1/31/2023 NextGen Components, Inc. 6 sales@NextGenComponent.com www.NextGenComponent.com PART CODE: XF24M00000S101 SMD CRYSTAL 3225 TYPE 4 PADS TAPE/REEL (Unit: mm) All Devices are packed in accordance with EIA standard RS-481-2 and specifications., 3000pcs/Reel DISCLAIMER NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information 1/31/2023 NextGen Components, Inc. 7 sales@NextGenComponent.com www.NextGenComponent.com