GH CSBRM4.24-V7V9-1-1-700-R33

www.osram-os.com Produktdatenblatt | Version 1.1 GH CSBRM4.24   GH CSBRM4.24 OSLON ® Square OSLON® Square Hyper Red with the best value for highest PPF/W, is now available with a unique innovative radiation pattern, evenly illuminates plants for uniform growth while reducing number of luminaires and lowering overall cost. Additionally, this high-power LED provides excellent reliability, long lifetime and low thermal resistance in a compact footprint. Applications —Architecture —Horticulture Lighting Features: —Package: SMT ceramic package with silicone lens —Typ. Radiation: 150° —Corrosion Robustness Class: 3B —ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) —Radiant Flux: typ. 1040 mW @ 700mA ; typ. 526 mW @ 350mA —Radiant Efficiency: typ. 74% @ 700mA; typ. 80% @ 350mA  —Photosynthetic Photon Flux: typ. 5.69 μmol/s @ 700mA ; typ. 2.88 μmol/s @ 350mA  —Photon Flux Efficacy: typ 5,72 μmol/J @ 700mA ; typ 2.89 μmol/J @ 350mA 1 Version 1.0 | 2021-09-22 GH CSBRM4.24   Ordering Information  Type Total radiant flux 1) IF = 700 mA ΦE Ordering Code GH CSBRM4.24-V6V9-1-1 960 ... 1120 mW Q65113A3730 GH CSBRM4.24-V7V9-1-1 995 ... 1120 mW Q65113A3945   2 Version 1.0 | 2021-09-22 GH CSBRM4.24   Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 °C 125 °C Storage Temperature Tstg min. max. -40 °C 125 °C Junction Temperature Tj max. 135 °C Forward current IF min. max. 100 mA 1400 mA Surge Current t ≤ 10 µs; D = 0.005 ; TJ = 25 °C IFS max. 1500 mA Reverse voltage 2) VR ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) VESD   3 Version 1.0 | 2021-09-22 Values Not designed for reverse operation 8 kV GH CSBRM4.24   Characteristics IF = 700 mA; TJ = 25 °C Parameter Symbol Peak Wavelength λpeak typ. 660 nm Centroid Wavelength 3) IF = 700 mA λcentroid min. typ. max. 646 nm 657 nm 666 nm Dominant Wavelength 3) IF = 700 mA λdom typ. 640 nm Spectral Bandwidth at 50% Irel,max ∆λ typ. 20 nm Viewing angle at 50% IV 2φ typ. 140 ° Forward Voltage 4) IF = 700 mA VF min. typ. max. 1.80 V 2.00 V 2.20 V Reverse current 2) IR Electrical thermal resistance junction/solderpoint with efficiency ηe = 74 % RthJS elec.   4 Version 1.0 | 2021-09-22 Values Not designed for reverse operation typ. 1.3 K / W GH CSBRM4.24   Brightness Groups  Group Total radiant flux 1) IF = 700 mA min. ΦE Total radiant PPF * flux 1) IF = 700 mA max. min. ΦE Φp PPF * PPF/W * PF ** PF ** PF/W ** max. Φp typ. min. Φp,b max. Φp,b typ. V6 960 mW 995 mW 5.25 µmol/s 5.44 µmol/s 3.82 µmol/J 5.28 µmol/s 5.47 µmol/s 3.84 µmol/J V7 995 mW 1035 mW 5.44 µmol/s 5.66 µmol/s 3.96 µmol/J 5.47 µmol/s 5.69 µmol/s 3.99 µmol/J V8 1035 mW 1075 mW 5.66 µmol/s 5.88 µmol/s 4.12 µmol/J 5.69 µmol/s 5.91 µmol/s 4.14 µmol/J V9 1075 mW 1120 mW 5.88 µmol/s 6.12 µmol/s 4.29 µmol/J 5.91 µmol/s 6.16 µmol/s 4.31 µmol/J Note: [*] Photosynthetic Photon Flux includes wavelengths between 400 and 700 nm Note: [**] Photon Flux includes wavelengths between 280 and 800 nm Note: PPF and PF values are for reference only Forward Voltage Groups  Group Forward Voltage 4) IF = 700 mA min. VF Forward Voltage 4) IF = 700 mA max. VF E1 1.80 V 1.90 V E2 1.90 V 2.00 V F1 2.00 V 2.10 V 2.10 V 2.20 V F2  Centroid Wavelength  Group 646 nm  1 Centroid Wavelength 3) IF = 700 mA min. λcentroid 5 Version 1.0 | 2021-09-22 Centroid Wavelength 3) IF = 700 mA max. λcentroid 666 nm GH CSBRM4.24   Group Name on Label  Example: V6-1-E1 Brightness Wavelength V6 1   6 Version 1.0 | 2021-09-22 Forward Voltage E1 GH CSBRM4.24   Relative Spectral Emission 5) Irel = f (λ); IF = 700 mA; TJ = 25 °C Irel GH CSBRM4.24 1,0 : Vλ : hyper red 0,8 0,6 0,4 0,2 0,0 350 400 Radiation Characteristics 450 500 550 600 650 700 750 800 λ / nm 5) Irel = f (ϕ); TJ = 25 °C GH CSBRM4.24 ϕ/°  -40° -50° -20° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1,0 -30° 0,8 0,6 -60° -70° 0,4 -80° 0,2 -90° 0,0  -100° 7 Version 1.0 | 2021-09-22 Irel GH CSBRM4.24   Forward current Relative Radiant Power 5) IF = f(VF); TJ = 25 °C IF / mA 5), 6) ΦE/ΦE(700 mA) = f(IF); TJ = 25 °C GH CSBRM4.24 Φe GH CSBRM4.24 1400 Φe(700mA) 2,0 1200 1,5 1000 800 1,0 600 0,5 400 200 Centroid Wavelength 2,2 2,3 VF / V 5) λcentr = f(IF); TJ = 25 °C ∆λ centr / nm GH CSBRM4.24 10  5 0 -5 14 00 10 00 80 0 60 0 40 0 10 0 -10  IF / mA 8 Version 1.0 | 2021-09-22 14 00 2,1 10 00 2,0 80 0 1,9 60 0 1,8 40 0 0,0 10 0 100 1,7 IF / mA GH CSBRM4.24   Forward Voltage Relative Radiant Power 5) ΔVF = VF - VF(25 °C) = f(Tj); IF = 700 mA ∆VF / V 0,3 GH CSBRM4.24 ΦE/ΦE(25 °C) = f(Tj); IF = 700 mA Φe 1,2 GH CSBRM4.24 Φe (25°C) 0,2 1,0 0,1 0,8 0,0 0,6 -0,1 0,4 -0,2 0,2 -0,3 -40 -20 0 20 40 60 80 100 120 Tj / °C 0,0 -40 -20 0 20 40 60 80 100 120 Tj / °C Centroid Wavelength 5) λcentr = f(Tj); IF = 700 mA ∆λ centr / nm 5) 20 10 GH CSBRM4.24  0 -10  -20 -40 -20 0 20 40 60 80 100 120 Tj / °C 9 Version 1.0 | 2021-09-22 GH CSBRM4.24   Max. Permissible Forward Current IF = f(T) IF / mA GH CSBRM4.24 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Do not use below 100 mA 0 20 40 60   10 Version 1.0 | 2021-09-22 80 100 120 Ts / °C GH CSBRM4.24   Dimensional Drawing 7) Further Information: Approximate Weight: 28.0 mg Package marking: Anode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.   11 Version 1.0 | 2021-09-22 GH CSBRM4.24   Recommended Solder Pad IRRWSULQW 7) &XDUHD VROGHUUHVLVW VROGHUVWHQFLO For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further information can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”.   12 Version 1.0 | 2021-09-22 GH CSBRM4.24   Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP  All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.0 | 2021-09-22 °C 480 s K/s s GH CSBRM4.24   Taping 7)   14 Version 1.0 | 2021-09-22 GH CSBRM4.24   Tape and Reel 8) Reel Dimensions A 330 mm W Nmin 12 + 0.3 / - 0.1 mm   15 Version 1.0 | 2021-09-22 W1 60 mm W2 max 12.4 + 2 mm 18.4 mm Pieces per PU 3000 GH CSBRM4.24   Barcode-Product-Label (BPL) Dry Packing Process and Materials 7) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539  Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.0 | 2021-09-22 GH CSBRM4.24   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class low risk (exposure time 100 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. This device is designed for specific/recommended applications only. Please consult OSRAM Opto Semiconductors Sales Staff in advance for detailed information on other non-recommended applications (e.g. automotive). Change management for this component is aligned with the requirements of the lighting market. For further application related information please visit www.osram-os.com/appnotes   17 Version 1.0 | 2021-09-22 GH CSBRM4.24   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.   18 Version 1.0 | 2021-09-22 GH CSBRM4.24   Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 10 ms, with a tolerance of +/- 7%. 2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause migration and damage of the device. 3) Wavelength: The wavelength is measured at a current pulse of typically 10 ms, with a tolerance of ± 0.5 nm. 4) Forward Voltage: The Forward voltage is measured during a current pulse duration of typically 1 ms with a tolerance of ± 0.05V . 5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 6) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 8) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   19 Version 1.0 | 2021-09-22 GH CSBRM4.24   Revision History Version Date Change 1.0 2021-09-22 Initial Version   20 Version 1.0 | 2021-09-22 GH CSBRM4.24     Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 21 Version 1.0 | 2021-09-22