KB DELSS2.12-THUH-34-2686-20-R18

www.osram-os.com Produktdatenblatt | Version 1.1 KB DELSS2.12   KB DELSS2.12 TOPLED ® E1608 The TOPLED E1608 expands OSRAM Opto Semiconductors’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proved package concept. Its outstanding performance is suitable for a huge variety of applications especially automotive interior where a small package design with excellent reliability is needed. The TOPLED E1608 is available in different colors and brightness levels. Applications —Cluster, Button Backlighting —Interior Illumination (e.g. Ambient Map) —Electronic Equipment Features: —Package: white SMT package, colorless clear resin —Chip technology: InGaN on Sapphire —Typ. Radiation: 120°  —Color: λdom = 466 nm (● blue) —Corrosion Robustness Class: 2B —Qualifications: AEC-Q102 Qualified  —ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 1 Version 1.0 | 2021-09-21 KB DELSS2.12   Ordering Information  Type Luminous Intensity 1) IF = 20 mA Iv KB DELSS2.12-THUH-34-2686   2 Version 1.0 | 2021-09-21 330 ... 610 mcd Ordering Code Q65113A3855 KB DELSS2.12   Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 °C 110 °C Storage Temperature Tstg min. max. -40 °C 110 °C Junction Temperature Tj max. 125 °C Forward current TS = 25 °C IF min. max. 1 mA 30 mA Forward current pulsed D = 0.005 ; TS = 25 °C IF pulse max. 40 mA Surge current t ≤ 10 µs; D = 0.005 ; TS = 25 °C IFS max. 40 mA Reverse voltage 2) TS = 25 °C VR max. 5V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD   3 Version 1.0 | 2021-09-21 Values 2 kV KB DELSS2.12   Characteristics IF = 20 mA; TS = 25 °C Parameter Symbol Peak Wavelength λpeak typ. 461 nm Dominant Wavelength 3) IF = 20 mA λdom min. typ. max. 464 nm 466 nm 472 nm Viewing angle at 50% IV 2φ typ. 115 ° Forward Voltage 4) IF = 20 mA VF min. typ. max. 2.80 V 3.08 V 3.40 V Reverse current 2) VR = 5 V  IR typ. max. 0.01 µA 10 µA Real thermal resistance junction/ambient 5)6) RthJA real max. 570 K / W Real thermal resistance junction/solderpoint 5) RthJS real typ. max. 120 K / W 210 K / W   4 Version 1.0 | 2021-09-21 Values KB DELSS2.12   Brightness Groups  Group Luminous Intensity 1) IF = 20 mA min. Iv Luminous Intensity. 1) IF = 20 mA max. Iv Luminous Flux 7) IF = 20 mA typ. ΦV TH 330 mcd 390 mcd 1080 mlm TI 390 mcd 450 mcd 1260 mlm UG 450 mcd 520 mcd 1460 mlm UH 520 mcd 610 mcd 1700 mlm Forward Voltage Groups  Group Forward Voltage 4) IF = 20 mA min. VF Forward Voltage 4) IF = 20 mA max. VF 26 2.80 V 3.10 V 86 3.10 V 3.40 V Wavelength Groups  Group Dominant Wavelength 3) IF = 20 mA min. λdom  Dominant Wavelength 3) IF = 20 mA max. λdom 464 nm 468 nm 4 468 nm 472 nm  3 5 Version 1.0 | 2021-09-21 KB DELSS2.12   Group Name on Label  Example: TH-3-26 Brightness Wavelength TH 3   6 Version 1.0 | 2021-09-21 Forward Voltage 26 KB DELSS2.12   Relative Spectral Emission 7) Irel = f (λ); IF = 20 mA; TS = 25 °C I KB DELSS2.12 1.0 : Vλ : blue 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 λ/ Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C KB DELSS2.12 ϕ/  -40° -50° -20° -30° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1.0 : 0° : 90° 0.8 0.6 -60° -70° -80° -90°  -100° 7 Version 1.0 | 2021-09-21 0.4 0.2 0.0 I KB DELSS2.12   Forward current Relative Luminous Intensity 7) IF = f(VF); TS = 25 °C IF / mA 7), 8) Iv/Iv(20 mA) = f(IF); TS = 25 °C KB DELSS2.12 IV KB DELSS2.12 30 IV(20mA) 1.2 25 1.0 20 0.8 15 0.6 10 0.4 0.2 5 VF / V Dominant Wavelength 7) λdom = f(IF); TS = 25 °C ∆λ dom / nm KB DELSS2.12 10 8  6 4 2 0 -2 -4 30 25 20 15 10 5 1 -6  IF / mA 8 Version 1.0 | 2021-09-21 30 25 20 3.2 15 3.0 10 2.8 5 2.6 1 0.0 1 2.4 IF / mA KB DELSS2.12   Forward Voltage Relative Luminous Intensity 7) ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA ∆VF / V Iv/Iv(25 °C) = f(Tj); IF = 20 mA KB DELSS2.12 0.3 7) Iv KB DELSS2.12 1.2 Iv(25°C) 0.2 1.0 0.1 0.8 0.0 0.6 -0.1 0.4 -0.2 0.2 -0.3 -40 -20 0 20 40 60 80 100 120 Tj / °C Dominant Wavelength 7) λdom = f(Tj); IF = 20 mA ∆λ dom / nm KB DELSS2.12 8 6  4 2 0 -2 -4 -6 -8 -40 -20 0 20 40 60 80 100 120  Tj / °C 9 Version 1.0 | 2021-09-21 0.0 -40 -20 0 20 40 60 80 100 120 Tj / °C KB DELSS2.12   Max. Permissible Forward Current IF = f(T) IF / mA 30 25 20 : Ts 15 10 5 0 0 20 40 60 80 100 T / °C Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TS = 25 °C KB DELSS2.12 IF / A 0.050 TS = 0°C ... 106°C  0.045 : D = 1.0 : D = 0.5 : D = 0.2 : D = 0.1 : D = 0.05 : D = 0.02 : D = 0.01 : D = 0.005 0.040 0.035 0.030 10-6 10-5 10-4 10-3 0.01 0.1 1 10  / 10 Version 1.0 | 2021-09-21 KB DELSS2.12   Dimensional Drawing 9) Further Information: Approximate Weight: 2.0 mg Package marking: Anode Corrosion test: Class: 2B Test condition: 25°C / 75 % RH / 10 ppm H2S / 21 days (IEC 60068-2-43)   11 Version 1.0 | 2021-09-21 KB DELSS2.12   Recommended Solder Pad 9) All products are packed in a dry pack bag (Moisture Barrier Bag, MBB) according MIL-PRF-81705, after opening the MBB the products should go to reflow soldering process. Unused remaining LEDs should be protected from environment due to silver plated soldering terminal. In order to maintain solderability it is recommended to protect the silver plated solder terminals from corrosive environment before soldering. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.   12 Version 1.0 | 2021-09-21 KB DELSS2.12   Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP  All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.0 | 2021-09-21 °C 480 s K/s s KB DELSS2.12   Taping 9)   14 Version 1.0 | 2021-09-21 KB DELSS2.12   Tape and Reel 10) Reel Dimensions A 180 mm W Nmin 8 + 0.3 / - 0.1 mm   15 Version 1.0 | 2021-09-21 W1 60 mm W2 max 8.4 + 2 mm 14.4 mm Pieces per PU 9000 KB DELSS2.12   Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539  Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.0 | 2021-09-21 KB DELSS2.12   Type Designation System Emission Color O: orange (606 nm) Y: yellow (587 nm) P: pure green (560 nm) T: true green (528 nm) S: super red (633 nm) K: Automotive and Industry Product K Color coordinates according CIE 1931/Emission color: W: white D: O Package Type Top emitting device Leadframe based White reflector package D E Lead / Package Properties TOPlooker: E: 1608 Sidelooker: E: 5515 Ceramic packages: E: 1915  Encapsulant Type / Lens Properties L: No lens (Lambertian)  Chip Technology: Standard power class P: Q: Elevated power class M: Medium performance S: Highest power class 17 Version 1.0 | 2021-09-21 Technology Concept S: Silicone encapsulation (casted) Platform: pre-molded L Product version P S 1 . 2 Special Characteristic 1: InGaN saturated colors 2: INGaAlP or AlGaAs saturated colors F: Full conversion (color depending on color description) R: standard cold white Binning Informat ion: 2: mcd A: Automotive interior binning: FK0PM0 P: COD Puregreen 2 KB DELSS2.12   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes   18 Version 1.0 | 2021-09-21 KB DELSS2.12   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.   19 Version 1.0 | 2021-09-21 KB DELSS2.12   Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   20 Version 1.0 | 2021-09-21 KB DELSS2.12   Revision History Version Date Change 1.0 2021-09-21 Initial Version   21 Version 1.0 | 2021-09-21 KB DELSS2.12     Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 22 Version 1.0 | 2021-09-21