LZ1-00UBN0-00U5

www.osram-os.com L Z1- 0 0UBN 0 DATASHEET LZ1-00UBN0 Datasheet   Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All reserved | Version 1.0 | 2022-06-25 1 rights L Z1- 0 0UBN 0 DATASHEET LED ENGIN LuxiGen LZ1-00UBN0 Industry most robust high power ceramic package with glass lens for high performance over life. Applications - Electronic Equipment - Equipment Illumination (e.g. Curing, Endoscope) - Gaming, Amusement, Gambling - Horticulture Lighting  Features - Package: Ceramic package with integrated glass lens - Chip technology: UX:3 - Typ. Radiation: 60°  - Color: λpeak = 395 nm (● violet) 2 | Version 1.0 | 2022-06-25 - Industrial Automation (Machine Controls, Light Barriers, Vision Controls) - Photo Therapy - Smoke/Dust/Particle Sensing - Stage Lighting (LED & Laser) L Z1- 0 0UBN 0 DATASHEET Ordering Information  Type Total radiant flux 1) IF = 700 mA ΦE Ordering Code LZ1-00UBN0-00U4 1100 ... 2000 mW Q65113A4143 LZ1-00UBN0-00U5 1100 ... 2000 mW Q65113A4142 LZ1-00UBN0-00U8 1100 ... 2000 mW Q65113A4141   3 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -30 °C 100 °C Storage Temperature Tstg min. max. -40 °C 125 °C Junction Temperature 2) Tj max. 115 °C Forward Current 2) IF max. 700 mA Forward Current pulsed t ≤ 10 ms; D ≤ 0.1 ; TC = 25 °C IF pulse max. 700 mA ESD withstand voltage acc. ANSI/ESDA/JEDEC JS-001 (HBM, Class 0) VESD Reverse voltage 3) VR   4 | Version 1.0 | 2022-06-25 Values ESD sensitive device Not designed for reverse operation L Z1- 0 0UBN 0 DATASHEET Characteristics IF = 700 mA; TC = 25 °C Parameter Symbol Total radiant flux 4) ΦE typ. Peak Wavelength 5) IF = 700 mA λpeak min. typ. max. Viewing angle at 50% IV 2φ typ. Forward Voltage 6)4) IF = 700 mA VF min. typ. max. Reverse current 3) IR Electrical thermal resistance junction/case RthJC elec.   5 | Version 1.0 | 2022-06-25 Values 1450 mW 385 nm 395 nm 410 nm 70 ° 3.20 V 3.70 V 4.20 V Not designed for reverse operation typ. 2.0 K / W L Z1- 0 0UBN 0 DATASHEET Brightness Groups  Group Total radiant flux 1) IF = 700 mA min. ΦE Total radiant flux 1) IF = 700 mA max. ΦE M1 1100 mW 1375 mW N1 1375 mW 1760 mW P1 1760 mW 2000 mW Wavelength Groups  Group Peak Wavelength 5) IF = 700 mA min. λpeak Peak Wavelength 5) IF = 700 mA max. λpeak U4 385 nm 390 nm U5 390 nm 395 nm U8 405 nm 410 nm Group Name on Label  Example: M1-U4 Brightness Wavelength M1 U4   6 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Relative Spectral Emission 4) Irel = f (λ); IF = 700 mA; TC = 25 °C Irel LZ1-00UBN0 1,0 : Vλ : U8 : U5 : U4 0,8 0,6 0,4 0,2 0,0 350 400 Radiation Characteristics 450 500 550 600 650 700 750 800 λ / nm 4) Irel = f (ϕ); TC = 25 °C LZ1-00UBN0 ϕ/°  -40° -50° -20° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1,0 -30° 0,8 0,6 -60° -70° 0,4 -80° 0,2 -90° 0,0  -100° 7 | Version 1.0 | 2022-06-25 Irel L Z1- 0 0UBN 0 DATASHEET Forward current Relative Radiant Power 4) IF = f(VF); TC = 25 °C IF / A ΦE/ΦE(700 mA) = f(IF); TC = 25 °C LZ1-00UBN0 Φe LZ1-00UBN0 700 Φe(700A) 1,0 : U8 : U5 : U4 600 4), 7) : U8 : U5 : U4 0,8 500 0,6 400 300 0,4 200 0,2 100 Peak Wavelength 4) Δλpeak = λpeak - λpeak(25 °C) = f(Tj); IF = 700 mA LZ1-00UBN0 ∆λ peak / nm : U8 : U5 : U4 6 4  2 0 -2 70 0 60 0 50 0 40 0 30 0 20 0 10 0 20 -4  IF / A 8 | Version 1.0 | 2022-06-25 70 0 60 0 50 0 3,8 4,0 VF / V 40 0 3,6 30 0 3,4 20 0 3,2 10 0 0,0 20 20 2,93,0 IF / A L Z1- 0 0UBN 0 DATASHEET Forward Voltage Relative Radiant Power 4) ΔVF = VF - VF(25 °C) = f(Tj); IF = 700 mA ∆VF / V ΦE/ΦE(25 °C) = f(Tj); IF = 700 mA LZ1-00UBN0 0,20 Φe : U8 : U5 : U4 0,15 4) LZ1-00UBN0 1,2 Φe (25°C) 1,0 0,10 0,8 0,05 0,6 0,00 -0,05 0,4 -0,10 0,2 -0,15 -40 -20 0 Peak Wavelength 20 40 60 80 100 120 Tj / °C 4) Δλpeak = λpeak - λpeak(25 °C) = f(Tj); IF = 700 mA ∆λ peak / nm LZ1-00UBN0 10 8 : U8 : U5 : U4 6 4  2 0 -2 -4 -6 20 40 60 80 100 120 Tj / °C  -8 -40 -20 0 9 | Version 1.0 | 2022-06-25 : U8 : U5 : U4 0,0 -40 -20 0 20 40 60 80 100 120 Tj / °C L Z1- 0 0UBN 0 DATASHEET Max. Permissible Forward Current IF = f(T) IF / mA 800 all chips on LZ1-00UBN0 700 600 500 400 300 200 100 0 20 40 60   10 | Version 1.0 | 2022-06-25 80 100 TC / °C L Z1- 0 0UBN 0 DATASHEET Dimensional Drawing 8) Further Information: 93.9 mg Approximate Weight:   11 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Electrical Internal Circuit   12 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Recommended Solder Pad 8)   1. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. 2. Package not suitable for ultra sonic cleaning. 3. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 4. X-ray sample monitoring for solder voids underneath the emitter thermal slug is recommended. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. 13 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Reflow Soldering Profile Product complies to MSL Level 1 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  60 Maximum 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 250 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 4 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP  All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 14 | Version 1.0 | 2022-06-25 °C 480 s K/s s L Z1- 0 0UBN 0 DATASHEET Taping 8)   15 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Tape and Reel 9) Reel Dimensions A 180 mm W Nmin 12 + 0.3 / - 0.1 mm   16 | Version 1.0 | 2022-06-25 W1 60 mm W2 max 12.4 + 2 mm 18.4 mm Pieces per PU 500 L Z1- 0 0UBN 0 DATASHEET Barcode-Product-Label (BPL) 2     
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 ",$, -(((( 0  2   2  "#$ %#&'() '() "$ #&'() "$*+#&'   ! ))   17 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class high risk (exposure time less then 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. Tapes and reels are shipped in airtight bags in order to reduce the onset of silver tarnish. We recommend bags only be opened when ready to use emitters. Partially used reels or trays should be stored in airtight bags or in storage purged with nitrogen. Based on very short life cycle times in chip technology this component is subject to frequent adaption to the latest chip technology. Changes to the content of this datasheet may occur without further notification. JEDEC 46C constitutes the guideline of the change management for the device specified in this document. For further application related information please visit www.osram-os.com/appnotes   18 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.   19 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 10 ms and a tolerance of ±10 %. 2) Operating Conditions: Operating conditions according DC-derating (Max. Permissible Forward Current) 3) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause migration and damage of the device. 4) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 5) Peak Wavelength: Wavelengths are tested at a current pulse duration of 10 ms and a tolerance of ±2 nm. 6) Forward Voltage: Forward voltages are tested at a current pulse duration of 10 ms and a tolerance of ±0.1 V. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   20 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET Revision History Version Date Change 1.0 2022-06-25 Electro - Optical Characteristics (Diagrams) New Layout Derating (Diagrams) Maximum Ratings   21 | Version 1.0 | 2022-06-25 L Z1- 0 0UBN 0 DATASHEET   Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved 22 | Version 1.0 | 2022-06-25