www.osram-os.com
Produktdatenblatt | Version 1.1
SFH 2704
SFH 2704
CHIPLED ®
Silicon PIN Photodiode
Applications
——Health Monitoring (Heart Rate Monitoring, Pulse
Oximetry)
Features:
——Package: clear epoxy
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
——Suitable for reflow soldering
——Especially suitable for applications from 400 nm to 1100 nm
——Small package (LxWxH): 2.0 mm x 1.8 mm x 0.6 mm (WxDxH)
Ordering Information
Type
Photocurrent
Ee = 0.1 mW/cm²; λ = 535 nm
IP
≥ 0.35 µA
Preliminary datasheet version
SFH 2704
1 Version 0.0 | 2018-09-12
Photocurrent
typ.
Ee = 0.1 mW/cm²; λ = 535 nm
IP
0.51 µA
Ordering Code
Q65112A7214
SFH 2704
Maximum Ratings
TA = 25 °C
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
85 °C
Storage temperature
Tstg
min.
max.
-40 °C
85 °C
Reverse voltage
VR
max.
6V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD
max.
2 kV
Preliminary datasheet version
2 Version 0.0 | 2018-09-12
Values
SFH 2704
Characteristics
Preliminary datasheet version
TA = 25 °C
Parameter
Symbol
Photocurrent
Ee = 0.1 mW/cm²; λ = 535 nm; VR = 5 V
IP
min.
typ.
0.35 µA
0.51 µA
Photocurrent
Ee = 0.1 mW/cm²; λ = 940 nm; VR = 5 V
IP
min.
typ.
0.85 µA
1.22 µA
Wavelength of max sensitivity
λS max
typ.
900 nm
Spectral range of sensitivity
λ10%
typ.
400 ... 1100
nm
Radiant sensitive area
A
typ.
1.51 mm²
Dimensions of active chip area
LxW
typ.
1.23 x 1.23
mm x mm
Half angle
φ
typ.
60 °
Dark current
VR = 5 V
IR
typ.
max.
Spectral sensitivity of the chip
λ = 535 nm
Sλ
typ.
0.34 A / W
Quantum yield of the chip
λ = 535 nm
η
typ.
0.79 Electrons
/ Photon
Open-circuit voltage
Ee = 0.1 mW/cm²; λ = 535 nm; VR = 5 V
VO
min.
typ.
490 mV
510 mV
Rise time
VR = 5 V; RL = 50 Ω; λ = 525 nm; IP = 600 µA
tr
typ.
47 ns
Fall time
VR = 5 V; RL = 50 Ω; λ = 525 nm; IP = 600 µA
tf
typ.
67 ns
Forward voltage
IF = 10 mA; E = 0
VF
typ.
0.95 V
Capacitance
VR = 0 V; f = 1 MHz; E = 0
C0
typ.
13.4 pF
Noise equivalent power
VR = 5 V; λ = 535 nm
NEP
typ.
0.017 pW /
Hz1/2
Detection limit
VR = 5 V; λ = 535 nm
D*
typ.
7.4e12 cm x
Hz1/2 / W
3 Version 0.0 | 2018-09-12
Values
0.1 nA
25 nA
SFH 2704
Relative Spectral Sensitivity
1), 2)
Srel = f (λ)
[ ]
100
80
60
40
20
0
400
Directional Characteristics
600
800
1000
λ[
]
1), 2)
Srel = f (φ)
Φ[ ]
-20°
-40°
-50°
-60°
-70°
-30°
-10°
0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Preliminary datasheet version
0.3
-80°
0.2
0.1
-90°
4 Version 0.0 | 2018-09-12
0.0
SFH 2704
Dark Current
1), 2)
IR = f (VR); E = 0
[ ]
100
90
80
70
60
50
0
Capacitance
2
4
6
[ ]
1), 2)
C = f (VR); f = 1 MHz; E = 0;
[ ]
14
12
10
8
Preliminary datasheet version
6
4
2
10-3
0.01
0.1
1
[ ]
5 Version 0.0 | 2018-09-12
10
SFH 2704
Dark Current
1)
IR = f (TA); E = 0; VR = 5 V
[ ] 100
10
1
0.1
0
20
40
Preliminary datasheet version
6 Version 0.0 | 2018-09-12
60
80
[ ]
SFH 2704
Dimensional Drawing
3)
Approximate Weight:
4.4 mg
Package marking:
Cathode
Preliminary datasheet version
7 Version 0.0 | 2018-09-12
SFH 2704
Recommended Solder Pad
3)
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
150
tL
tS
Preliminary datasheet version
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
8 Version 0.0 | 2018-09-12
SFH 2704
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
60
Ramp-up rate to peak*)
TSmax to TP
2
3
100
120
2
3
Unit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
°C
3)
Preliminary datasheet version
9 Version 0.0 | 2018-09-12
s
K/s
s
SFH 2704
Tape and Reel
4)
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
Reel dimensions [mm]
A
W
Nmin
W1
W2 max
Pieces per PU
180 mm
8 + 0.3 / - 0.1
60
8.4 + 2
14.4
3000
Preliminary datasheet version
10 Version 0.0 | 2018-09-12
SFH 2704
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
3)
Moisture-sensitive label or print
Barcode label
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
Preliminary datasheet version
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
11 Version 0.0 | 2018-09-12
SFH 2704
Transportation Packing and Materials
3)
DE
R
18
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Barcode label
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5 mm
195 ± 5 mm
30 ± 5 mm
Preliminary datasheet version
12 Version 0.0 | 2018-09-12
OHA02044
SFH 2704
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
Preliminary datasheet version
13 Version 0.0 | 2018-09-12
SFH 2704
Disclaimer
OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including, but not limited to, for any design in activities based on this preliminary draft version. OSRAM OS may
e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any time.
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.
Preliminary datasheet version
14 Version 0.0 | 2018-09-12
SFH 2704
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
2)
Testing temperature: TA = 25°C
3)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
4)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
Preliminary datasheet version
15 Version 0.0 | 2018-09-12
SFH 2704
Preliminary datasheet version
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
16 Version 0.0 | 2018-09-12