SU CZHEF1.VC-U1U2-L0-V2-250-R18

www.osram-os.com SU CZHEF1.VC DATASHEET SU CZHEF1.VC Datasheet   Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All reserved | Version 1.2 | 2022-08-18 1 rights SU CZHEF1.VC DATASHEET OSLON® UV 6060 SU CZHEF1.VC This compact UV-C LED is part of the OSLON UV Series. It offers high efficiency in high power class. It allows a flexible design for any application which requires UV-C radiation. Applications - Agriculture & Horticulture - UV-C Treatment Features - Package: Ceramic package with lens - Chip technology: AlGaN based flip chip - Typ. Radiation: 150°  - Color: λpeak = 265 nm (● ultraviolet (UV-C)) - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM) - Radiant Flux: typ. 100 mW  - Radiant Efficiency: typ. 5.7 % 2 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Ordering Information  Type Total radiant flux 1) IF = 250 mA ΦE SU CZHEF1.VC-U1U2-L0-V2
  
  90.0 ... 130.0 mW Ordering Code Q65113A4719  


      


  
  

          
  3 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Maximum Ratings Parameter Symbol Operating Temperature Top min. max. 10 °C 60 °C Storage Temperature Tstg min. max. -30 °C 75 °C Junction Temperature Tj max. 75 °C Forward current TS = 25 °C IF min. max. 100 mA 350 mA Surge Current TS = 25 °C IFS max. 500 mA ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM) VESD   4 | Version 1.2 | 2022-08-18 Values 2 kV SU CZHEF1.VC DATASHEET Characteristics IF = 250 mA; TS = 25 °C Parameter Symbol Peak Wavelength 2) λpeak min. typ. max. Viewing angle at 50% IV 2φ typ. 150 ° Forward Voltage  VF min. typ. max. 6.50 V 7.00 V 7.50 V Real thermal resistance junction/solderpoint 4) RthJS real typ. 4.4 K / W Electrical thermal resistance junction/solderpoint with efficiency ηe = 5.7 % RthJS elec. typ. 4.1 K / W 3) Note : typical optical output at 250mA = 100 mW typical optical output at 350mA = 142 mW   5 | Version 1.2 | 2022-08-18 Values 260 nm 265 nm 270 nm SU CZHEF1.VC DATASHEET Brightness Groups  Group Total radiant flux 1) IF = 250 mA min. ΦE Total radiant flux 1) IF = 250 mA max. ΦE U1 90.0 mW 110.0 mW U2 110.0 mW 130.0 mW Wavelength Groups  Group L0 Peak Wavelength 2) min. λpeak 260 nm Peak Wavelength 2) max. λpeak 270 nm Forward Voltage Groups  Group Forward Voltage 3) IF = 250 mA min. VF Forward Voltage 3) IF = 250 mA max. VF 6.50 V 7.50 V V2   6 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Group Name on Label  Example: U1-L0-V2 Brightness Wavelength Forward Voltage U1 L0 V2   7 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Relative Spectral Emission 5) Irel = f (λ); IF = 250 mA; TS = 25 °C Irel SU CZHEF1.VC 1,0 : ultra violet 0,8 0,6 0,4 0,2 0,0 200 210 220 230 240 250 260 270 280 290 300 310 320 330 340 350 λ / nm Radiation Characteristics 5) Irel = f (ϕ); TS = 25 °C SU CZHEF1.VC ϕ/°  -40° -50° -20° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1,0 -30° 0,8 0,6 -60° -70° 0,4 -80° 0,2 -90° 0,0  -100° 8 | Version 1.2 | 2022-08-18 Irel SU CZHEF1.VC DATASHEET Forward current Relative Radiant Power 5) IF = f(VF); TS = 25 °C IF / mA 5), 6) ΦE/ΦE(250 mA) = f(IF); TS = 25 °C SU CZHEF1.VC Φe SU CZHEF1.VC 350 Φe(250mA) 1,4 300 1,2 250 1,0 0,8 200 0,6 150 Peak Wavelength 7,6 7,8 VF / V 5) λpeak = f(Tj); IF = 250 mA SU CZHEF1.VC ∆λ peak / nm 4  2 0 -2 35 0 30 0 25 0 20 0 15 0 10 0 -4  IF / mA 9 | Version 1.2 | 2022-08-18 35 0 7,4 30 0 7,2 25 0 7,0 20 0 6,8 15 0 100 6,6 10 0 0,4 IF / mA SU CZHEF1.VC DATASHEET Forward Voltage Relative Radiant Power 5) ΔVF = VF - VF(25 °C) = f(Tj); IF = 250 mA SU CZHEF1.VC ΦE/ΦE(25 °C) = f(Tj); IF = 250 mA Φe ∆VF / V 5) SU CZHEF1.VC 1,2 Φe (25°C) 0,4 1,0 0,2 0,8 0,6 0,0 0,4 -0,2 0,2 -0,4 10 20 Peak Wavelength 30 40 50 60 Tj / °C 5) λpeak = f(Tj); IF = 250 mA ∆λ peak / nm SU CZHEF1.VC 6  4 2 0 -2 -4 20 30  10 10 | Version 1.2 | 2022-08-18 40 50 60 Tj / °C 0,0 10 20 30 40 50 60 Tj / °C SU CZHEF1.VC DATASHEET Max. Permissible Forward Current IF = f(T) SU CZHEF1.VC IF / mA 350 300 250 200 150 100 50 0 10 20 30 40   11 | Version 1.2 | 2022-08-18 50 60 Ts / °C SU CZHEF1.VC DATASHEET Dimensional Drawing 7) Further Information: Approximate Weight: 75.0 mg Package marking: Cathode   12 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Electrical Internal Circuit   13 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Recommended Solder Pad 7) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further information can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.   14 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Reflow Soldering Profile Symbol Profile Feature Low Melting (Sn42Bi57Ag) Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 130 °C Time tS TSmin to TSmax (90 °C to 130 °C) Ramp-up rate to peak*) TSmax to TP Liquidus temperature  tS 30 TL 2 3 100 120 2 3 140 Unit °C/s s °C/s °C Time above liquidus temperature tL 30 60 100 s Peak temperature TP 160 165 175 °C 20 30 3 6 Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C tP  All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range One time reflow soldering only. 15 | Version 1.2 | 2022-08-18 s °C/s SU CZHEF1.VC DATASHEET Taping 7)   16 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Tape and Reel 8) Reel Dimensions A 180 mm W Nmin 16 + 0.3 / - 0.1 mm   17 | Version 1.2 | 2022-08-18 60/100 mm W1 W2 max 16.4 + 2 mm 22.4 mm Pieces per PU 500 SU CZHEF1.VC DATASHEET Barcode-Product-Label (BPL) Dry Packing Process and Materials 7) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539  Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 18 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Cautions: • Refer to JEDEC Moisture Sensitivity Level 5 in JEDEC-STD-033 for storage and packaging requirement. • LEDs should be stored at or below 30°C and at an RH of 60% or lower. This LED has a floor life of 48 hours, once opened from its original packaging • If only a partial reel is used, the reel should be packaged, with silica-gel desiccants, and sealed within an hour of opening the bag. • Baking of LEDs is required per JEDEC J-STD-033 prior to soldering if LEDs are left open, exceeding floor life mentioned above. • If LED packages exceed the storage limiting time since opened, recommend baking the LED according to JEDEC J-STD-033 prior to soldering. • Packing materials, including Tapes, Reels, Trays, and Tubes, can only withstand temperatures up to 50°C. Exceeding this temperature limit can cause them to deform.   19 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into high risk group – RG 3. WARNING - UV emitted from this product. Avoid eye and skin contact to unshielded product. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes   20 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. An entire (100%) testing shall be performed after assembly of our product to the final product. Our products are not qualified at module and system level for such application. Customer is fully responsible and accountable for detection capability in case of sudden changes in electro-optical characteristics at component level. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and/or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer. Please carefully read the below instructions.  WARNING: Each user bears full responsibility for making their own determination as to the suitability of our products, recommendations or advice for its own end use. Each user must identify and perform all tests and analyses necessary to ensure that its finished application incorporating our products will be safe and suitable for use under end-use conditions. We make no warranty or guarantee, express or implied, as to results obtained in end-use, nor of any design incorporating its products, recommendations or advice. WARNING: High intensity ultraviolet-C (UV-C) radiation is emitted from this product, which is harmful to skin and eyes. Take appropriate protective measures to avoid any exposure to direct or reflected UV-C radiation.  WARNING: During operating lifetime of our UV-C product different aging mechanisms can cause failures. This may lead to a significant deviation of the function in the final product and application. Please contact us in advance for further information. 21 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 10 ms and a tolerance of ±10 %. 2) Peak Wavelength: Wavelengths are tested at a current pulse duration of 10 ms and a tolerance of ±3 nm. 3) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±3 %. 4) Thermal Resistance: Rth max is based on statistic values (6σ). 5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 6) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 8) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   22 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET Revision History Version Date Change 1.0 2022-05-10 Initial Version 1.1 2022-05-23 Characteristics Taping 1.2 2022-08-18 Applications   23 | Version 1.2 | 2022-08-18 SU CZHEF1.VC DATASHEET   Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved 24 | Version 1.2 | 2022-08-18