E402KIT

Particle E402 User Manual Overview The Particle E402 is an IOT hardware platform for creating cellular-connected products. The E402 supports LTE M1 connectivity. It is specifically designed for mass scale manufacturing and integration. It comes with an affordable data plan for low-bandwidth applications. It also comes with Particle's development tools and cloud platform for managing and interacting with your new connected hardware. Features • U-blox SARA-R410M-02B cellular module • STM32F205RGT6 120MHz ARM Cortex M3 microcontroller • 1MB flash, 128KB RAM • BQ24195 power management unit and battery charger • MAX17043 fuel gauge • 30 mixed-signal GPIO and advanced peripherals • Open source design • Real-time operation system (RTOS) • FCC, CE and IC certified Power The E402 can be powered via the VIN (3.88V-12VDC) pin, over USB, or a LiPo battery. VIN The input voltage range on VIN pin is 3.88VDC to 12VDC. When powering from the VIN pin alone, make sure that the power supply is rated at 10W (for example 5 VDC at 2 Amp). If the power source is unable to meet this requirement, you'll need connect the LiPo battery as well. An additional bulk capacitance of 470uF to 1000uF should be added to the VIN input when the LiPo Battery is disconnected. The amount of capacitance required will depend on the ability of the power supply to deliver peak currents to the cellular modem. LIPO This pin serves two purposes. You can use this pin to connect a LiPo battery directly without having to use a JST connector or it can be used to connect an external DC power source (and this is where one needs to take extra precautions). When powering it from an external regulated DC source, the recommended input voltage range on this pin is between 3.6V to 4.4VDC. Make sure that the supply can handle currents of at least 1Amp. This is the most efficient way of powering the E402 since the PMIC bypasses the regulator and supplies power to the E402 via an internal FET leading to lower quiescent current. When powered from a LiPo battery alone, the power management IC switches off the internal regulator and supplies power to the system directly from the battery. This reduces the conduction losses and maximizes battery run time. The battery provided with the E402 is a Lithium-Ion Polymer battery rated at 3.7VDC 1,800mAh. You can substitute this battery with another 3.7V LiPo with higher current rating. Remember to never exceed this voltage rating and always pay attention to the polarity of the connector. Typical current consumption is around 180mA and up to 0.8A transients at 5VDC. In deep sleep mode, the quiescent current is 90uA (powered from the battery alone). VBUS This pin is internally connected to USB supply rail and will output 5V when the E402 is plugged into an USB port. It is intentionally left unpopulated. This pin will NOT output any voltage when the E402 is powered via VIN and/or the LiPo battery. Most USB ports can supply only a maximum of 500mA, but the u-blox module on the E402 alone can consume a peak of 800mA of current during transmission. In order to compensate of this deficit, one must connect the LiPo battery at all times when powering from a traditional USB port. The E402 will intelligently source power from the USB most of the time and keep the battery charged. During peak current requirements, the additional power will be sourced from the battery. This reduces the chargedischarge cycle load on the battery, thus improving its longevity. 3V3 Pin This pin is the output of the on-board 3.3V switching regulator that powers the microcontroller and the peripherals. This pin can be used as a 3.3V power source with a max load of 800mA. Unlike the Photon or the Core, this pin CANNOT be used as an input to power the E402. VDDA Unlike the Electron, the E402 exposes the VDDA pin of the STM32 microcontroller separately. This pin powers the ADC block of the microcontroller. A maximum difference of 300 mV between VDD (in this case, 3V3) and VDDA can be tolerated during power-up and power-down operation. Under normal operations, connect the VDDA to 3V3 pin of the E402 VBAT This is the supply to the internal RTC, backup registers and SRAM. You can connect a backup battery to it (1.65 to 3.6VDC), if you wish to retain RTC/RAM when 3V3 is absent or simply tie it up to 3V3. PMID This pin is the output of the internal boost regulator of the PMIC that can source 5.1VDC from the battery in OTG (On The Go) mode. This feature is useful when your circuitry needs a 5V source from the E402 when powered by the battery alone. The confusing bit about this pin is that it will continue to provide 5.1VDC but only when the input voltage (VIN) is between 3.6V to 5.1VDC. As soon as the input voltage exceeds this limit, the PMID starts tracking that voltage. For example, if VIN = 9VDC, the PMID will be 9VDC and NOT 5.1VDC. So, you need to be careful when using it as a source for powering your external circuitry. The max current draw on this pin is 2.1A but is not recommended due to thermal limitations of the circuit board. JTAG AND SWD Pin D3 through D7 are JTAG interface pins. These can be used to reprogram your E402 bootloader or user firmware image with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX ARM-USBTINI-H, and also the FTDI-based Particle JTAG Programmer. If you are short on available pins, you may also use SWD mode which requires less pins. E402 Pin JTAG SWD STM32F205RGT6 Pin Default Internal[1] D7 JTAG_TMS SWD/SWDIO PA13 ~40k pull-up D6 JTAG_TCK PA14 ~40k pull-down D5 JTAG_TDI PA15 ~40k pull-up D4 JTAG_TDO PB3 Floating D3 JTAG_TRST PB4 ~40k pull-up 3V3 Power GND Ground RST Reset CLK/SWCLK Notes: [1] Default state after reset for a short period of time before these pins are restored to GPIO (if JTAG debugging is not required, i.e. USE_SWD_JTAG=y is not specified on the command line.) Memory Map STM32F205RGT6 Flash Layout Overview • Bootloader (16 KB) • DCD1 (16 KB), stores keys, mfg info, system flags, etc. • DCD2 (16 KB), swap area for DCD1 • EEPROM emulation bank 1 (16 KB) • EEPROM emulation bank 2 (64 KB) [only 16k used] • Device OS (512 KB) [256 KB comms + 256 KB hal/platform/services] • Factory backup, OTA backup and user application (384 KB) [3 x 128 KB] DCD Layout The DCD area of flash memory has been mapped to a separate DFU media device so that we can incrementally update the application data. This allows one item (say, server public key) to be updated without erasing the other items. DCD layout as of v0.4.9 found here in firmware Region Offset Size system flags 0 32 version 32 2 device private key 34 1216 device public key 1250 384 ip config 1634 128 claim code 1762 63 claimed 1825 1 device id 1852 6 version string 1858 32 dns resolve 1890 128 reserved1 2018 64 Region Offset Size server public key 2082 768 padding 2850 2 flash modules 2852 100 product store 2952 24 cloud transport 2977 1 alt device public key 2978 128 alt device private key 3106 192 alt server public key 3298 192 alt server address 3490 128 reserved2 3618 1280 Note: Writing 0xFF to offset 3106 (DEFAULT key used on E402 ) will cause the device to re-generate a new private UDP/ECC key on the next boot. TCP keys are currently unsupported on the E402 but would be located at offset 34. You should not need to use this feature unless your keys are corrupted. Memory Map (Common) Region Start Address End Address Size Bootloader 0x8000000 0x8004000 16 KB DCD1 0x8004000 0x8008000 16 KB DCD2 0x8008000 0x800C000 16 KB EEPROM1 0x800C000 0x8010000 16 KB EEPROM2 0x8010000 0x8020000 64 KB Memory Map (Modular Firmware - default) Before 0.6.0 firmware Region Start Address End Address Size System Part 1 0x8020000 0x8040000 128 KB System Part 2 0x8040000 0x8060000 128 KB Application 0x8080000 0x80A0000 128 KB Factory Reset/Extended Application 0x80A0000 0x80C0000 128 KB OTA Backup 0x80C0000 0x80E0000 128 KB Decompress region 0x80E0000 0x8100000 128 KB Since 0.6.0 firmware Region Start Address End Address Size System Part 2 0x8020000 0x8040000 128 KB System Part 3 0x8040000 0x8060000 128 KB System Part 1 0x8060000 0x8080000 128 KB Application 0x8080000 0x80A0000 128 KB Region Start Address End Address Size Factory Reset/Extended Application 0x80A0000 0x80C0000 128 KB OTA Backup 0x80C0000 0x80E0000 128 KB Decompress region 0x80E0000 0x8100000 128 KB Memory Map (Monolithic Firmware - optional) Region Start Address End Address Size Firmware 0x8020000 0x8080000 384 KB Factory Reset 0x8080000 0x80E0000 384 KB Unused (factory reset modular) 0x80E0000 0x8100000 128 KB Pin and button definition Pin markings: LED Status Charge status LED State Description ON Charging in progress OFF Charging complete Blink at 1Hz Fault condition[1] Rapid blinking Battery disconnected[2] Notes: [1] A fault condition can occur due to several reasons, for example, battery over/under voltage, temperature fault or safety timer fault. You can find the root cause by reading the fault register of the power management IC in firmware. [2] You can stop this behavior by either plugging in the LiPo battery or by disabling the charging using the appropriate firmware command. System RGB LED Unlike the Electron, the E402 does not have an on-board RGB status LED. We have provided its individual control pins for you to connect an LED of your liking. This will allow greater flexibility in the end design of your products. For a detailed explanation of different color codes of the RGB system LED, please take a look here. Pin description # PIN FUNCTION DESCRIPTION 1 VIN POWER This pin can be used as an input or output. As an input, supply 5VDC to 12VDC to power the Electron. When the Electron is powered via the USB port, this pin will output a voltage of approximately 4.8VDC due to a reverse polarity protection series Schottky diode between VBUS and VIN. When used as an output, the max load on VIN is 1Amp. 2 GND POWER System ground. 3 VBUS POWER This is connected to the VBUS power pin of the USB port. 4 GND POWER System ground. 5 LIPO POWER This is connected to the +LiPo connector. 6 NC 7 TBD Do not connect. GND POWER System ground. 8 PMID POWER This is connected to the PMID pin of the PMIC. 9 3V3 POWER This is the output of the 3V3 regulator on the E0. 10 VDDA POWER This is the input to the analog block of the STM32. 11 VBAT POWER Supply to the internal RTC, backup registers and SRAM when 3V3 is not present (1.65 to 3.6VDC). 12 GND POWER System ground. 13 USB+ IO Data+ pin of the USB port. 14 USB- IO Data- pin of the USB port. 15 GND POWER System ground. 16 TX IO Primarily used as UART TX, but can also be used as a digital GPIO or PWM. 17 RX IO Primarily used as UART RX, but can also be used as a digital GPIO or PWM. 18 GND POWER 19 WKP IO System ground. Active-high wakeup pin, wakes the from sleep/standby modes. When not used as a WAKEUP, this pin can also be used as a digital GPIO, ADC input or PWM. Can be referred to as A7 when used as an ADC. # PIN FUNCTION DESCRIPTION 20 DAC IO 12-bit Digital-to-Analog (D/A) output (0-4095), referred to as DAC or DAC1 in software. Can also be used as a digital GPIO or ADC. Can be referred to as A6 when used as an ADC. 21 A5 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 22 A4 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 23 A3 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 24 A2 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 25 A1 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 26 A0 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 27 GND POWER System ground. 28 B5 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 29 B4 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. 30 B3 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), PWM and also digital GPIOs. 31 B2 IO 12-bit Analog-to-Digital (A/D) inputs (0-4095), PWM and also digital GPIOs. 32 B1 IO Digital only GPIO, and PWM. 33 B0 IO Digital only GPIO, and PWM. 34 GND POWER System ground. 35 D7 IO Digital only GPIO. 36 D6 IO Digital only GPIO. 37 D5 IO Digital only GPIO. 38 D4 IO Digital only GPIO. # PIN FUNCTION DESCRIPTION 39 D3 IO Digital only GPIO, and PWM. 40 D2 IO Digital only GPIO, and PWM. 41 D1 IO Digital only GPIO, and PWM. 42 D0 IO Digital only GPIO, and PWM. 43 GND POWER System ground. 44 C5 IO Digital only GPIO, and PWM. 45 C4 IO Digital only GPIO, and PWM. 46 C3 IO Digital only GPIO. 47 C2 IO Digital only GPIO. 48 C1 IO Digital only GPIO. 49 C0 IO Digital only GPIO. 50 NC TBD Do not connect. 51 GND POWER System ground. 52 BLU IO Blue pin of the RGB LED. 53 GRN IO Green pin of the RGB LED. 54 RED IO Red pin of the RGB LED. 55 MODE IO Connected to the MODE button input. 56 RST I Active-low reset input. 57 STAT O Connected to the charge status pin of the PMIC. 58 GND POWER System ground. 59 GND POWER System ground. 60 GND POWER System ground. 61 UB_USB+ IO Data+ pin of the ublox USB port. 62 UB_USB- IO Data- pin of the ublox USB port. 63 UB_VUSB_DET IO USB detect pin of the ublox USB port. 5V on this pin enables the ublox's USB interface. [1] PWM is available on D0, D1, D2, D3, B0, B1, B2, B3, A4, A5, WKP, RX, TX with a caveat: PWM timer peripheral is duplicated on two pins (A5/D2) and (A4/D3) for 11 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as a GPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independently controlled PWM outputs at the same time. I/O Characteristics These specifications are based on the STM32F205RGT6 datasheet, with reference to E402 pin nomenclature. Parameter Symbol Standard I/O input low level voltage VIL I/O FT[1] input low level voltage Conditions Min Typ Max Unit -0.3 0.28*(V3V32)+0.8 V VIL -0.3 0.32*(V3V32)+0.75 V Standard I/O input high level voltage VIH 0.41*(V3V32)+1.3 V3V3+0.3 V I/O FT[1] input high level voltage VIH V3V3 > 2V 0.42*(V3V32)+1 5.5 V VIH V3V3 ≤ 2V 0.42*(V3V32)+1 5.2 V Standard I/O Schmitt trigger voltage hysteresis[2] Vhys 200 mV I/O FT Schmitt trigger voltage hysteresis[2] Vhys 5% V3V3[3] mV Input leakage current[4] Ilkg GND ≤ Vio ≤ V3V3GPIOs Input leakage current[4] Ilkg RPU Vio = 5V, I/O FT Weak pull-up equivalent resistor[5] RPU Vio = GND 30 Weak pull-down equivalent resistor[5] RPD Vio = V3V3 30 I/O pin capacitance CIO ±1 µA 3 µA 40 50 kΩ 40 50 kΩ 5 pF Parameter Symbol Conditions Min DAC output voltage (buffers enabled by default) VDAC 0.2 DAC output resistive load (buffers enabled by default) RDAC 5 DAC output capacitive load (buffers enabled by default) CDAC Typ Max Unit V3V3-0.2 V kΩ 50 pF Notes: [1] FT = Five-volt tolerant. In order to sustain a voltage higher than V3V3+0.3 the internal pull-up/pull- down resistors must be disabled. [2] Hysteresis voltage between Schmitt trigger switching levels. Based on characterization, not tested in production. [3] With a minimum of 100mV. [4] Leakage could be higher than max. if negative current is injected on adjacent pins. [5] Pull-up and pull-down resistors are designed with a true resistance in series with switchable PMOS/NMOS. This PMOS/NMOS contribution to the E402 resistance is minimum (~10% order). Mechanical Specifications Dimensions and Weight • Width = 36 mm • Height = 43 mm • Thickness = 4.6 mm • Weight = 8 gms Soldering We recommend no clean solder paste over water soluble as it does not require additional cleaning processes. Alloy specification • 95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper) • 95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting temperature: 217 °C Stencil thickness: 150 micrometer Reflow We recommend a three phase convection reflow oven process. Please refer to IPC-7530 guidelines for in depth details on reflow temperature profiles. Typical reflow profile for a Pb free solder paste: Recommended PCB land pattern