RF-WU0402DS-DD-B

TG-201611280036EP SPECIFICATION 产品规格书 REFOND P/N 产品型号 RF-WU0402DS-DD-B □R&D 研发 ■Mass Product 量产供货 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:1 TG-201611280036EP Contents 目录 1. Description 产品介绍 .................................................................................................................................. 3 1.1 General Description 产品描述 ................................................................................................................ 3 1.2 Features 产品特征 .................................................................................................................................... 3 1.3 Application 产品应用 ................................................................................................................................ 3 1.4 Package Dimension 封装尺寸 ................................................................................................................ 4 1.5 Product Parameters 产品参数 ................................................................................................................ 5 1.6 Bin Range Of Forward Voltage and Luminous Flux (IF=5mA)电压与流明分 BIN 范围(IF=5mA) 7 1.7 Typical Optical Characteristics Curves 典型光学特性曲线 ............................................................... 8 2. Packaging 产品包装 ................................................................................................................................. 12 2.1 Packaging Specification 包装规格 ....................................................................................................... 12 2.1.1 Carrier Tape Dimension 载带尺寸 ...................................................................................... 12 2.1.2 Reel Dimension 卷盘尺寸 .................................................................................................... 12 2.1.3 Label Form Specification 标签规格 .................................................................................... 13 2.2 Moisture Resistant Packing 防潮包装 ................................................................................................. 13 2.3 Cardboard Box 包装纸箱 ....................................................................................................................... 14 2.4 Reliability Test Items And Conditions 信赖性测试项目及条件 ........................................................ 14 2.5 Criteria For Judging Damage 失效判定标准...................................................................................... 15 3. SMT Reflow Soldering Instructions SMT 回流焊说明 ......................................................................... 16 3.1 SMT Reflow Soldering Instructions SMT 回流焊说明 ....................................................................... 16 4. Handling Precautions 产品使用注意事项 .............................................................................................. 18 4.1 Handling Precautions 产品使用注意事项 ............................................................................................ 18 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:2 TG-201611280036EP 1. Description 产品介绍 1.1 General Description 产品描述 The White LED which was fabricated by using a blue chip and the phosphor. Product Package:1.0mmX0.5mmX0.4mm. 该产品为白光 LED，是由蓝光芯片激发荧光粉而形成，产品尺寸：1.0mmX0.5mmX0.4mm。 1.2 Features 产品特征 ► Extremely wide viewing angle. 发光角度大 ► Suitable for all SMT assembly and solder process. 适用于所有的 SMT 组装和焊接工艺 ► Moisture sensitivity level: Level 3. 防潮等级 Level 3 ► RoHS compliant. 满足 RoHS 要求 1.3 Application 产品应用 ►Optical indicator. 光学指示 ►Switch and Symbol, Display. 开关和标识、显示器等 ►Household electrical appliances . 家电 ►General use. 其他应用 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:3 TG-201611280036EP 1.4 Package Dimension 封装尺寸 2 0.18 0.5 1 0.22 1 Fig.1-1 Top view 正面视图 Fig.1-2 Side view 侧面视图 0.5 0.25 0.25 LED 1 2 1 Fig.1-3 Bottom view 背面视图 Fig.1-4 Polarity 极性 0.5 0.6 0.6 2 Fig.1-5 Soldering patterns 推荐焊盘 Notes 备注： 1. All dimensions units are millimeters. 所有尺寸标注单位为毫米 2. All dimensions tolerances are 0.2mm unless otherwise noted.除特别标注外，所有尺寸公差为±0.2 毫米 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:4 TG-201611280036EP 1.5 Product Parameters 产品参数 Table 1-1 Electrical / Optical Characteristics at Ts=25°C 电性与光学特性 Item 项目 Forward Voltage 正向电压 Luminous Intensity 发光强度 Value Test Condition 测试条件 IF=5mA IF=5mA Symbol 符号 VF IV Unit 单位 Min. （最小值） Typ. (典型值) Max. (最大值) F1 2.6 -- 2.7 V F2 2.7 -- 2.8 V G1 2.8 -- 2.9 V G2 2.9 -- 3.0 V H1 3.0 -- 3.1 V H2 3.1 -- 3.2 V I1 3.2 -- 3.3 V H10 150 -- 180 mcd H20 180 -- 230 mcd I10 230 -- 280 mcd I20 280 -- 350 mcd J10 350 -- 430 mcd Viewing Angle 发光角度 IF=5mA 2θ1/2 -- 140 -- deg Reverse Current 漏电流 VR=5V/10ms IR -- -- 10 A Thermal Resistance. 热阻 IF=5mA RTHJ-S -- -- 450 ℃/W Notes 备注: VR=5V For test conditions. VR=5V 为测试分选条件。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:5 TG-201611280036EP Table 1-2 Absolute Maximum Ratings at Ts=25°C 绝对最大值 Parameter （参数） Symbol （符号） Rating （值） Units （单位） Power Dissipation （功耗） Pd 66 mW Forward Current （正向电流） IF 20 mA Peak Forward Current Of Pulse （脉冲峰值电流） IFP 60 mA Electrostatic Discharge (HBM)（静电） ESD 1000 V Operating Temperature （操作温度） Topr -40 ~ +85 ℃ Storage Temperature （储存温度） Tstg -40 ~ +85 ℃ Junction Temperature （结温） Tj 95 ℃ Notes 备注： 1. 1/10 Duty cycle, 0.1ms pulse width. 脉宽0.1ms,占空比1/10. 2. The above forward voltage measurement allowance tolerance is ±0.1V. 以上所示电压测量误差 ±0.1V. 3. The above color coordinates measurement allowance tolerance is ±0.005. 以上所示坐标测量误差±0.005. 4. The above luminous intensity measurement allowance tolerance ±10%. 上述发光强度的测试允许公差为±10%. 5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 使用 功率不能超过规定的最大值。 6. All measurements were made under the standardized environment of Refond. 所有测试都是基于瑞丰现有的 标准测试平台。 7.When the LEDs are in operation the maximum current should be decided after measuring the package temperature, junction temperature should not exceed the maximum rate. LED使用的最大电流需要根据散热条 件确定，结温不能超过最大值。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:6 TG-201611280036EP 1.6 Bin Range Of Forward Voltage and Luminous Flux (IF=5mA)电压与流明分 BIN 范围(IF=5mA) Fig. 1-6 The C.I.E Chromaticity Diagram CIE色度图 Table 1-3 Bin Date Bin数据 BIN CODE CIE-X1 CIE-Y1 CIE-X2 CIE-Y2 CIE-X3 CIE-Y3 CIE-X4 CIE-Y4 B11 0.2423 0.2225 0.2376 0.2249 0.2440 0.2349 0.2487 0.2325 B21 0.2471 0.2201 0.2423 0.2225 0.2487 0.2325 0.2535 0.2301 B12 0.2487 0.2325 0.2440 0.2349 0.2504 0.2449 0.2551 0.2425 B22 0.2535 0.2301 0.2487 0.2325 0.2551 0.2425 0.2599 0.2401 B51 0.2551 0.2425 0.2504 0.2449 0.2568 0.2549 0.2615 0.2525 B52 0.2599 0.2401 0.2551 0.2425 0.2615 0.2525 0.2663 0.2501 K21 0.2615 0.2525 0.2568 0.2549 0.2632 0.2649 0.2679 0.2625 K31 0.2663 0.2501 0.2615 0.2525 0.2679 0.2625 0.2727 0.2601 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:7 TG-201611280036EP 1.7 Typical Optical Characteristics Curves 典型光学特性曲线 30 Forward Current (mA) 25 20 15 10 5 0 0 1 2 3 4 Forward Voltage (v) Fig. 1-7 Forward Voltage Vs Forward Current 伏安特性曲线 1.2 1 Relative Intensity 0.8 0.6 0.4 0.2 0 0 2.5 5 7.5 Forward Current (mA) Fig 1-7 Forward Current Vs Relative Intensity 正向电流与相对光强特性曲线 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:8 TG-201611280036EP 1.1 Relative Intensity 1 0.9 0.8 0.7 0 25 50 75 100 Ambient Temperature (℃) Fig 1-8 Pin Temperature Vs Relative Intensity 引脚温度与相对光强特性曲线 30 Forward Current (mA) 25 20 15 10 5 0 0 20 40 60 80 100 120 Pin Temperature (℃) Fig 1-9 Pin Temperature Vs Forward Current 引脚温度与正向电流特性曲线 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:9 TG-201611280036EP 0.26 0.25 1mA 0.24 5mA 0.23 Y 10mA 20mA 0.22 0.21 0.2 0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 X Fig. 1-11 Forward Current Vs Dominate Wavelength (Ta=25℃) 正向电流与主波长关系曲线 1.2 Relative Intensity 1 0.8 0.6 0.4 0.2 0 400 450 500 550 600 Wavelength (nm) 650 700 Fig. 1-12 Relative Intensity Vs Wavelength (Ta=25℃) 相对光强与波长关系曲线 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:10 TG-201611280036EP 40° 20° 0° 1.0 0.8 50° 0.6 0.4 70° 0.2 90° 0° 20° 40° 60° 80° 100° Fig. 1-13 Diagram characteristics of radiation 辐射特性曲线 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:11 TG-201611280036EP 2. Packaging 产品包装 2.1 Packaging Specification 包装规格 Package:4000pcs/reel.包装每卷 4000pcs。 2.1.5 Carrier Tape Dimension 载带尺寸 FEEDINGDIRECTIO N 2.00 [0.079] 4.00 [0.157] 1.75 [0.069] 8.00 [0.315] 5.25 [0.207] 1.55 [0.061] Top Tape 1.80 [0.071] 0.95 [0.037] 0.35 [0.014] Backpart drawing Fig.2-1 Carrier Tape Dimension 载带尺寸 2.1.2 Reel Dimension 卷盘尺寸 B A 8.0±0.1mm B 178±1mm C 60±1mm D 13.0±0.5mm D C Table 2-1 Dimension 尺寸 A Label 标签 Fig.2-2 Reel Dimension 卷盘尺寸 Notes 备注： The tolerances unless mentioned ±0.1mm. Unit : mm 注：未注公差为±0.1毫米，尺寸单位：毫米。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:12 TG-201611280036EP 2.1.3 Label Form Specification 标签规格 Table 2-2 Parameter 参数 PART NO. SPEC NO. LOT NO. BIN CODE Ф XY VF WLD QTY DATE Part Number 品名 Spec Number 规格 Lot Number 批次号 Bin Code 参数代码 Luminous flux 光通量 Chromaticity Bin 色区 Forward Voltage 正向电压 Wavelength 波长代码 Packing Quantity 数量 Made Date 生产日期 Fig. 2-3 Label Form Specification 标签规格 2.2 Moisture Resistant Packing 防潮包装 Label 标签 Moisture Barrier Bag 防潮袋 Reel 卷盘 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Label 标签 Fig.2-4 Moisture Resistant Packing 防潮包装 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:13 TG-201611280036EP 2.3 Cardboard Box 包装纸箱 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO. Fig.2-5 Cardboard Box 包装纸箱 2.4 Reliability Test Items And Conditions 信赖性测试项目及条件 Table 2-3 Reliability Test Items And Conditions 信赖性测试项目及条件 Test Items 项目 Ref.Standard 参考标准 Test Condition 测试条件 Time 时间 Quantity 数量 Ac/Re 接收/拒收 Reflow 回流焊 JESD22-B106 Temp:260℃max T=10 sec 2 times 22Pcs. 0/1 Temperature Cycle 温度循环 JESD22-A104 100℃ 30 min ↑↓5 min -40℃ 30 min 100 cycles 22Pcs. 0/1 Thermal Shock 冷热冲击 JESD22-A106 -40℃ 15min ↑↓ 100℃ 15min 300 cycles 22Pcs. 0/1 High Temperature Storage 高温保存 JESD22-A103 Temp:100℃ 1000 hrs. 22Pcs. 0/1 Low Temperature Storage 低温保存 JESD22-A119 Temp:-40℃ 1000 hrs. 22Pcs. 0/1 Life Test 常温通电 JESD22-A108 Ta=25℃ IF=5mA 1000 hrs. 22Pcs. 0/1 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:14 TG-201611280036EP 2.5 Criteria For Judging Damage 失效判定标准 Table 2-4 Criteria For Judging Damage 失效判定标准 Test Items 项目 Symbol 符号 Test Condition 测试条件 Criteria For Judgement 判定标准 Min. 最小 Max. 最大 Forward Voltage 正向电压 VF IF=5mA - U.S.L*)x1.1 Reverse Current 漏电流 IR VR= 5V - U.S.L*)x2.0 Luminous Flux 光通量 Φ IF=5mA L.S.L*)x0.7 - Notes 备注： 1.U.S.L: Upper standard level 规格上限 L.S.L: Lower standard level 规格下限 2.The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform,the reliability experiment was taken under good heat dissipation conditions. When customers applies th e LED to the series and parallel circuit,should take consideration of all the factors such as the current, voltage di stribution, heat dissipation and others. 以上可靠性测试是基于瑞丰现有实验平台单颗/条 LED 在良好散热条件验 证下的结果。客户端将 LED 应用于串、并联线路时，需自行评估电流、电压分配、散热等问题。 3.The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 以上技术数据仅为产品的典型值，只作为参考，不作为任何应用条件及应用方式的保证。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:15 TG-201611280036EP 3. SMT Reflow Soldering Instructions SMT 回流焊说明 3.1 SMT Reflow Soldering Instructions SMT 回流焊说明 tp TP Critical Zone T L to T P Temperature Ramp-up TL tL TS max TS min ts Ramp-down Preheat 25 t 25℃ to Peak Time Fig.3-1 SMT Reflow Soldering Instructions SMT 回流焊说明 Table 3-1 Parameter 参数 Average temperature rise speed平均升温速度（Tsmax 至 TP） 最高3 °C/秒 Max 3 °C/ s Preheating: minimum temperature预热：最低温度 (Tsmin) 150 °C Preheating: Max temperature预热：最高温度 (Tsmax) 200 °C Preheating: Time预热：时间（Tsmin 至 Tsmax） 60 - 120秒 60s-120s 217 °C Time limited to maintain high temperature: the temperature限时维持高温：温度(TL) Time limited to maintain high temperature: The Time 限时维持高温：时间 (tL) 60-150秒 Max 60-150s Peak /Classification of temperature:峰值 / 分类温度 (TP) 260 °C Time limit classification of peak temperature time限时峰值分类温度：时间（tp） 最多10秒 Max 10s Hold time within 5 °C with the actual peak temperature (TP) 与实际峰值温度 (TP) 相差 5 °C 以内的保持时间 最多30秒 Max 30s Cooling speed 降温速度 Needed time from 25 °C to Tp 最高6 °C/秒 Max 6 °C/ s 25 °C 升至峰值温度所需时间 最多8分钟 Max 8 minutes Notes 备注： Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:16 TG-201611280036EP (1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings , LED will be damaged. 回流焊次数不可以超过两次，两次回流焊的时间间隔如果超过24小时，LED可能由于吸湿而 损坏。 (2)Whensoldering , do not put stress on the LEDs during heating.当焊接时，不要在材料受热时用力压胶体表面。 3.1.1 Soldering Iron 烙铁焊接 (1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3 seconds.当手工焊接时,烙铁的温度必须小于300℃，时间不可超过3秒。 (2) Soldering by hand should be done only one time.手工焊接只可焊接一次。 3.1.2 Repairing 修补 Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or not be damaged by repairing. LED回流焊后不应该修复，当必须修复时，必须使用双头烙铁，而且事先应确认此种方式会不 会损坏LED本身的特性。 3.1.3 Cautions 注意事项 (1) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board.LED 灯珠不要焊接在弯曲的 PCB 板上，焊接之后，也不要弯折线板。 (2) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering.回流焊之后冷却过程中，不 要对材料实加外力，也不要有震动，回流焊后，不要采用激剧冷却的方式。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:17 TG-201611280036EP 4. Handling Precautions 产品使用注意事项 4.1 Handling Precautions 产品使用注意事项 (1) LED operating environment and sulfur element composition cannot be over 100PPM in the LEDmating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED 工作环境及与 LED 适配的材料中硫元素及化合物成份不可超过 100PPM.这只是 一个建议，不作任何品质担保。 (2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total content of Bromine element and Chlorine element in the external materials of the application products is required to be less than 1500PPM. This is provided for informational purposes only and is not a warranty or endorsement.为了防止外界物质进入 LED 内部以造成 LED 的损伤，所处环 境及所用套件等等，单一的溴元素含量要求小于 900PPM，单一氯元素含量要求小于 900PPM，溴元素 与氯元素总含量必须小于 1500PPM. 这只是一个建议，不作任何品质担保。 (3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against theuse of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability. To verifycompatibility, Refond recommends that all chemicals and materials be tested in the specific application and environment for which they are intended tobe used. Attaching LEDs, do not use adhesives that outgas organic vapor. 应用套件中的挥发性物质会渗透到 LED 内部，在通电产生光 子及热的条件下，会导致 LED 变色，进而造成严重光衰，提前了解套件材料能够避免产生这些问题。 瑞丰反对使用任何对 LED 器件的性能或者可靠性有害的物质或材料，不管这些材料是已经证实了的 还是仅仅怀疑有害。针对特定的用途和使用环境，瑞丰建议对所有的物质和材料进行相容性的测试。 在贴装 LED 时候，不要使用能产生有机挥发性气体的粘结剂。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:18 TG-201611280036EP (4) Handle the component along the side surface by using forceps or appropriate tools; Do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry.通过使用适 当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路。 Fig 4-1Handling Precautions 产品使用注意事项 (5) In designing a circuit,the current through each LED can not exceed the absolute maximum rating specified for each LED.In the mean while,resistors for protection should be applied,otherwise slight voltage shift will cause big current change,burn out may happen. The driving circuit must be designed to allow forward voltage only when it is ON or OFF.If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. 设计电路时，通 过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变化将会引起 较大电流变化，可能导致产品损毁。电路设计必须保证只有在开启或者关闭的时候出现正向电压的 变化，不要施加反压，否则会损坏 LED。 (6) Thermal Design is paramount importance because heat generation may result in the Characteristics decline,such as brightness decreased,Color change and so on.Please consider the heat generation of the LEDs when making the system design.LED 容易因为自身的发热和环境 的温度改变而改变，温度升高会降低 LED 发光效率，影响发光颜色，所以在设计时应充分考虑散热 问题。 (7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust,requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. Refond suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:19 TG-201611280036EP LED. 与其他封装胶相比，硅胶通常较软，表面易吸附脏物，应用时应特别注意，当对产品洁净度 要求较高时，回流焊以后需要采用恰当的清洗方式，我们推荐用异丙醇作清洗剂，如需要用到其他 清洗剂，必须保证不会破坏封装体，超声清洗可能会对 LED 带来损害，不推荐这种清洗方式。 Table 4-1Storage 储存 Conditions Temperature Humidity Time 种类 温度 湿度 时间 Before Opening Aluminum Bag Within 1 Year From Date ≤30℃ ≤75% Storage 拆包前 一年内 储存 After Opening Aluminum Bag 168hours ≤30℃ ≤60% 拆包后 168小时 ≥24hours Baking 60±5℃ - 烘烤 大于24小时 (8) If the moisture absorbent material（silica gel）has faded away or the LEDs have exceeded the storage time,baking treatment should be performed after unpacking and based on the following condition（60±5）℃ for above 24 hours.如果干燥剂或包装失效，或者产品不符合以上 有效储存条件，需拆包后进行烘烤，烘烤条件：60±5℃，大于 24 小时。 If the package is flatulence or damaged,please notify the sales staff to assist.如果包装胀气或者破 损，请通知销售人员协助处理。 (9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). 像其他的半导体电子器件一样，LED 对静电过流击穿非常敏感，需要 做好防护。 (10) Other points for attention, please refer to our relevant information.其它注意事项请参照瑞丰相 关资料。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:20 TG-201611280036EP Version History/修订历史 Date日期 Revisor修订者 Version版本 Verifier审核 Remarks备注 2016.11.28 王华建 E/0 宋明 新版本制定 2018.04.10 王华建 E/1 宋明 - 2018.12.30 王华建 E/2 宋明 - 2019.06.12 贾彬浩 E/3 宋明 修改规格书模板 2021.07.22 贾彬浩 E/4 刘军 2022.09.19 曾晓芬 E/5 刘军 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com 修改回流焊焊接限时 温度 更正烘烤温度 PAGE:21 TG-201611280036EP www.refond.com Declare 申明 This specification is written both in English and in Chinese and the latter is formal. 产品规格书以中英文方式书写，若有冲突以中文版本为准。 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/5 E-mail:sales@refond.com Web: www.refond.com PAGE:22