RF-WUB190DS-DD-E2

TG-201902281256NP SPECIFICATION RF-P**MI32DS-BF-N-Y REFOND P/N RF-WUB190DS-DD-E2 Mass Product Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:1 TG-201902281256NP Contents 1. Description .................................................................................................................................. 3 ................................................................................................................ 3 1.1 General Description 1.2 Features .................................................................................................................................... 3 ................................................................................................................................ 3 1.3 Application 1.4 Package Dimension ................................................................................................................ 4 1.5 Product Parameters ................................................................................................................ 5 1.6 Bin Range Of Forward Voltage and Luminous Flux (IF=20mA) BIN (IF=20mA)......................................................................................................................................................... 7 ............................................................... 8 1.7 Typical Optical Characteristics Curves 2. Packaging ................................................................................................................................. 12 ....................................................................................................... 12 2.1 Packaging Specification 2.1.1 Carrier Tape Dimension 2.1.2 Reel Dimension ...................................................................................... 12 .................................................................................................... 12 2.1.3 Label Form Specification .................................................................................... 13 ................................................................................................. 13 2.2 Moisture Resistant Packing 2.3 Cardboard Box ....................................................................................................................... 14 ........................................................ 14 2.4 Reliability Test Items And Conditions ...................................................................................... 15 2.5 Criteria For Judging Damage 3. SMT Reflow Soldering Instructions SMT 回流焊说明 ......................................................................... 16 3.1 SMT Reflow Soldering Instructions SMT ....................................................................... 16 4. Handling Precautions .............................................................................................. 18 4.1 Handling Precautions ............................................................................................ 18 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:2 TG-201902281256NP 1. Description 1.1 General Description The White LED, which was fabricated by using a blue chip and the phosphor. Product Package:1.6mmX0.8mmX0.7mm. 1.2 Features ► Extremely wide viewing angle. ► Suitable for all SMT assembly and solder process. ► Moisture sensitivity level: Level 3. ► RoHS compliant. SMT Level 3 RoHS 1.3 Application ►Optical indicator. ►Switch and Symbol, Display. ►Household electrical appliances . ►General use. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:3 TG-201902281256NP 1.4 Package Dimension 1.10 0.7 2 1 0.80 1.60 Fig.1-1 Top view Fig.1-2 Side view 0.80 0.70 8 .1 R0 2 1 LED 1 Fig.1-3 Bottom view Fig.1-4 Polarity 0.8 0.8 0.8 2 2.4 Fig.1-5 Soldering patterns Notes All dimensions units are millimeters. All dimensions tolerances are 0.2mm unless otherwise noted. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:4 TG-201902281256NP 1.5 Product Parameters Table 1-1 Electrical / Optical Characteristics at Ts=25°C Item Value Symbol Test Condition Min. ( Forward Voltage IF=20mA Luminous Intensity Viewing Angle Reverse Current Thermal Resistance. Note IF=20mA VF IV Unit Typ. Max. ) ( ) G1 G2 H1 H2 I1 I2 J1 J2 K1 1BG 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 650 ----------- 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 700 V V V V V V V V V mcd 1BH 700 -- 750 mcd 1BI 750 -- 800 mcd 1BJ 800 -- 850 mcd 1BK 850 -- 900 mcd 1FA 900 -- 950 mcd 1FB 950 -- 1000 mcd LC1 1000 -- 1050 mcd LC2 1050 -- 1100 mcd IF=20mA 2θ1/2 -- 140 -- deg VR=5V/10ms IR -- -- 10 A IF=20mA RTHJ-S -- -- 450 /W : VR=5V For test conditions. VR=5V Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:5 TG-201902281256NP Table 1-2 Absolute Maximum Ratings at Ts=25°C Parameter Power Dissipation Forward Current Peak Forward Current Of Pulse Electrostatic Discharge (HBM) Operating Temperature Storage Temperature Junction Temperature Symbol Rating Units Pd 111 mW IF 30 mA IFP 60 mA ESD 1000 V Topr -40 ~ +85 Tstg -40 ~ +85 Tj 95 Notes 1. 1/10 Duty cycle, 0.1ms pulse width. 2. The above forward voltage measurement allowance tolerance is ±0.1V. 3. The above color coordinates measurement allowance tolerance is ±0.005. 4. The above luminous intensity measurement allowance tolerance ±10%. 5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 6. All measurements were made under the standardized environment of Refond. 7.When the LEDs are in operation the maximum current should be decided after measuring the package temperature, junction temperature should not exceed the maximum rate Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:6 TG-201902281256NP 1.6 Bin Range Of Forward Voltage and Luminous Flux (IF=20mA) BIN (IF=20mA) Fig. 1-6 The C.I.E Chromaticity Diagram CIE Table 1-3 Bin Date Bin BIN CODE B11 B12 B21 B22 B51 B52 K11 K12 K21 K22 K31 K51 K61 CIE-X1 0.2423 0.2487 0.2461 0.2525 0.2551 0.2589 0.2577 0.2641 0.2615 0.2679 0.2653 0.2705 0.2743 CIE-Y1 0.2225 0.2325 0.2206 0.2306 0.2425 0.2406 0.2544 0.2644 0.2525 0.2625 0.2506 0.2744 0.2725 CIE-X2 0.2385 0.2449 0.2423 0.2487 0.2513 0.2551 0.2539 0.2603 0.2577 0.2641 0.2615 0.2667 0.2705 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 CIE-Y2 0.2244 0.2344 0.2225 0.2325 0.2444 0.2425 0.2563 0.2663 0.2544 0.2644 0.2525 0.2763 0.2744 CIE-X3 0.2449 0.2513 0.2487 0.2551 0.2577 0.2615 0.2603 0.2667 0.2641 0.2705 0.2679 0.2731 0.2769 CIE-Y3 0.2344 0.2444 0.2325 0.2425 0.2544 0.2525 0.2663 0.2763 0.2644 0.2744 0.2625 0.2863 0.2844 CIE-X4 0.2487 0.2551 0.2525 0.2589 0.2615 0.2653 0.2641 0.2705 0.2679 0.2743 0.2717 0.2769 0.2807 E-mail:sales@refond.com Web: www.refond.com CIE-Y4 0.2325 0.2425 0.2306 0.2406 0.2525 0.2506 0.2644 0.2744 0.2625 0.2725 0.2606 0.2844 0.2825 PAGE:7 TG-201902281256NP 1.7 Typical Optical Characteristics Curves 30 Forward Current (mA) 25 20 15 10 5 0 1 2 3 Forward Voltage (v) 4 5 Fig. 1-7 Forward Voltage Vs Forward Current 1.4 1.2 Relative Intensity 1 0.8 0.6 0.4 0.2 0 0 5 10 15 20 Forward Current (mA) 25 30 Fig. 1-8 Forward Current Vs Relative Intensity Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:8 TG-201902281256NP 1.1 Relative Intensity 1 0.9 0.8 0.7 0 25 50 75 100 Ambient Temperature (℃) Fig. 1-9 Pin Temperature Vs Relative Intensity Forward Current (mA) 45 30 15 0 0 20 40 60 80 100 120 Pin Temperature (℃) Fig. 1-10 Pin Temperature Vs Forward Current Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:9 TG-201902281256NP 0.23 0.22 1mA 0.21 5mA 0.2 Y 10mA 20mA 0.19 0.18 0.17 0.19 0.2 0.21 0.22 X 0.23 0.24 0.25 650 700 Fig. 1-11 Forward Current Vs Dominate Wavelength (Ta=25℃) 1.2 Relative Intensity 1 0.8 0.6 0.4 0.2 0 400 450 500 550 600 Wavelength (nm) Fig. 1-12 Relative Intensity Vs Wavelength (Ta=25℃) Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:10 TG-201902281256NP 40° 20° 0° 1.0 0.8 50° 0.6 0.4 70° 0.2 90° 0° 20° 40° 60° 80° 100° Fig. 1-13 Diagram characteristics of radiation Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:11 TG-201902281256NP 2. Packaging 2.1 Packaging Specification Package:4000pcs/reel. 4000pcs 2.1.1 Carrier Tape Dimension FEEDING DIRECTION 4.00 [0.157] 1.80 [0.071] Top Tape 0.92 [0.036] Polarity Mark 1.75 [0.069] 1.55 [0.061] 8.00 [0.315] 2.00 [0.079] 5.25 [0.207] Polarity Mark 0.95 [0.037] Back part drawing Fig.2-1 Carrier Tape Dimension 2.1.2 Reel Dimension B A 8.0 B 178 1mm C 60 0.1mm D C Table 2-1 Dimension A D 1mm 13.0 0.5mm Label 标签 Fig.2-2 Reel Dimension Notes The tolerances unless mentioned ±0.1mm. Unit : mm Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:12 TG-201902281256NP 2.1.3 Label Form Specification Table 2-2 Parameter Fig. 2-3 Label Form Specification PART NO. Part Number SPEC NO. Spec Number LOT NO. Lot Number BIN CODE Bin Code Ф Luminous flux XY Chromaticity Bin VF Forward Voltage WLD Wavelength QTY Packing Quantity DATE Made Date 2.2 Moisture Resistant Packing Label 标签 Moisture Barrier Bag 防潮袋 Reel 卷盘 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Label 标签 Fig.2-4 Moisture Resistant Packing Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:13 TG-201902281256NP 2.3 Cardboard Box 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO. Fig.2-5 Cardboard Box 2.4 Reliability Test Items And Conditions Table 2-3 Reliability Test Items And Conditions Test Items Ref.Standard Test Condition Time Quantity Ac/Re / Reflow Temperature Cycle Thermal Shock JESD22-B106 Temp:260 max T=10 sec 2 times 22Pcs. 0/1 JESD22-A104 100 30 min ↑↓5 min -40 30 min 100 cycles 22Pcs. 0/1 300 cycles 22Pcs. 0/1 -40 JESD22-A106 100 High Temperature Storage Low Temperature Storage Life Test 15min ↑↓ 15min JESD22-A103 Temp:100 1000 hrs. 22Pcs. 0/1 JESD22-A119 Temp:-40 1000 hrs. 22Pcs. 0/1 1000 hrs. 22Pcs. 0/1 JESD22-A108 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 Ta=25 IF=20mA E-mail:sales@refond.com Web: www.refond.com PAGE:14 TG-201902281256NP 2.5 Criteria For Judging Damage Table 2-4 Criteria For Judging Damage Criteria For Judgement Test Items Symbol Test Condition Min. Forward Voltage Reverse Current Luminous Flux Max. VF IF=20mA - U.S.L*)x1.1 IR VR= 5V - U.S.L*)x2.0 Φ IF=20mA L.S.L*)x0.7 - Notes 1.U.S.L: Upper standard level L.S.L: Lower standard level 2.The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform,the reliability experiment was taken under good heat dissipation conditions. When customers applies th e LED to the series and parallel circuit,should take consideration of all the factors such as the current, voltage di stribution, heat dissipation and others. 3.The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:15 TG-201902281256NP 3. SMT Reflow Soldering Instructions SMT 回流焊说明 3.1 SMT Reflow Soldering Instructions SMT tp TP Critical Zone T L to T P Temperature Ramp-up TL tL TS max TS min ts Ramp-down Preheat 25 t 25℃ to Peak Time Fig.3-1 SMT Reflow Soldering Instructions SMT Table 3-1 Parameter Average temperature rise speed Tsmax Preheating: minimum temperature 3 °C/ 200 °C (Tsmax) Tsmin Tsmax 60 - 120 Time limited to maintain high temperature: the temperature Time limited to maintain high temperature: The Time Peak /Classification of temperature: / 60 tp (TP) 5 °C Cooling speed Needed time from 25 °C to Tp 10 Max 10s 30 Max 30s 6 °C/ 25 °C Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 Max 60s 260 °C (TP) Hold time within 5 C with the actual peak temperature (TP) 60s-120s 217 °C (TL) (tL) Time limit classification of peak temperature time Max 3 °C/ s 150 °C (Tsmin) Preheating: Max temperature Preheating: Time TP 8 E-mail:sales@refond.com Web: www.refond.com Max 6 °C/ s Max 8 minutes PAGE:16 TG-201902281256NP Notes (1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings , LED will be damaged. (2)Whensoldering , do not put stress on the LEDs during heating. 3.1.1 Soldering Iron (1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3 seconds. (2) Soldering by hand should be done only one time. 3.1.2 Repairing Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or not be damaged by repairing. LED 3.1.3 Cautions (1) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board.LED (2) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:17 TG-201902281256NP 4. Handling Precautions 4.1 Handling Precautions (1) LED operating environment and sulfur element composition cannot be over 100PPM in the LEDmating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED (2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total content of Bromine element and Chlorine element in the external materials of the application products is required to be less than 1500PPM. This is provided for informational purposes only and is not a warranty or endorsement. (3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against theuse of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability. To verifycompatibility, Refond recommends that all chemicals and materials be tested in the specific application and environment for which they are intended tobe used. Attaching LEDs, do not use adhesives that outgas organic vapor. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:18 TG-201902281256NP (4) In designing a circuit,the current through each LED can not exceed the absolute maximum rating specified for each LED.In the meanwhile,resistors for protection should be applied,otherwise slight voltage shift will cause big current change,burn out may happen. The driving circuit must be designed to allow forward voltage only when it is ON or OFF.If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (5) Thermal Design is paramount importance because heat generation may result in the Characteristics decline,such as brightness decreased,Color change and so on.Please consider the heat generation of the LEDs when making the system design.LED (6) Storage Table 4-1 Storage Conditions Temperature Humidity Before Opening Aluminum Bag Time Within 1 Year From Date Storage 30 75% 30 60% After Opening Aluminum Bag 168hours Baking 60 5 - 168 24hours 24 (7) If the moisture absorbent material（silica gel）has faded away or the LEDs have exceeded the storage time，baking treatment should be performed after unpacking and based on the following condition（60±5）℃ for above 24 hours. If the package is flatulence or damaged,please notify the sales staff to assist. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:19 TG-201902281256NP (8) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). (9) Other points for attention, please refer to our relevant information. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:20 TG-201902281256NP Version History/ Date Revisor 2019.02.28 Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 Version Verifier Remarks E0 E-mail:sales@refond.com Web: www.refond.com PAGE:21 www.refond.com Declare This specification is written both in English and in Chinese and the latter is formal. Tel: +86-755-66839118 Fax:+86-755-66839300 REFOND:WI-E-045 A/3 REV:E/0 E-mail:sales@refond.com Web: www.refond.com PAGE:22