113990974

EMB1082 Datasheet BLE module Vision：1.1 Date：2019-03-25 Number: DS0135EN Abstract Features ⚫ Application Based on an ultra-low power BLE SOC ⚫ Intelligent lighting ▪ ARM Cortex-M4F Core 20MHz ⚫ Smart Home Application ▪ 160KB RAM ⚫ Wearables ⚫ Smart healthcare ⚫ Portable devices ▪ 512KB Flash in chip, and support external flash up to 8Mbyte ▪ 32K RCOSC in chip, and support external 32K clock ⚫ Operating Voltage: 2.7V～3.3V ⚫ Support up to 16 IOs pinmux. ⚫ Bluetooth Features ▪ Support Bluetooth 5.0 (BLE single mode) ▪ Max RF date rate 1Mbps ▪ Max TX power: 7dBm ▪ Min RX sensitivity: -96dBm@1Mbps ▪ Support BLE Master/ Slave mode Module Type Type Note EMB1082-P PCB antenna EMB1082-E IPEX connector Hardware Block ▪ Support broadcasting, data encryption, and adaptive frequency hopping ⚫ ▪ Support LE L2CAP ▪ Support LE date length expension Operating Temperature：-40℃ to +105℃ ⚫ Antenna: PCB antenna or IPEX connector (Optional) Copyright Notice Mxchip copyrights this specification. No part of this specification may be reproduced in any form or means, without the prior written consent of Mxchip. Datasheet [Page 1] Version history Date Vision Details 2018-10-23 1.0 Initial release 2019-03-25 1.1 Update power consumpiton EMB1082 Datasheet [Page 2] Content Abstract ............................................................................................................................................................................... 1 Version history .................................................................................................................................................................... 1 1. Product Introduction .................................................................................................................................................. 4 2. Pins and dimension ..................................................................................................................................................... 5 PIN ARRANGEMENT .......................................................................................................................................... 5 PIN DEFINITION ................................................................................................................................................ 7 3. Electrical Parameters ............................................................................................................................................... 10 OPERATING CONDITIONS ................................................................................................................................ 10 POWER CONSUMPTION ................................................................................................................................... 10 WORKING ENVIRONMENT............................................................................................................................... 11 ELECTROSTATIC DISCHARGE .......................................................................................................................... 11 4. RF parameters........................................................................................................................................................... 12 BASIC RF PARAMETERS .................................................................................................................................. 12 GFSK PARAMETERS ....................................................................................................................................... 12 5. Antenna Information ................................................................................................................................................ 14 ANTENNA TYPE .............................................................................................................................................. 14 PCB ANTENNA CLEARANCE ZONE ................................................................................................................. 14 EXTERNAL ANTENNA CONNECTOR ................................................................................................................. 15 6. Assembly Information and Production Guidance ................................................................................................. 16 ASSEMBLY SIZE .............................................................................................................................................. 16 PRODUCTION GUIDANCE（IMPORTANT） ...................................................................................................... 16 CONSIDERATIONS............................................................................................................................................ 18 STORAGE CONDITION ..................................................................................................................................... 19 TEMPERATURE CURVE OF SECONDARY REFLOW............................................................................................. 20 7. Reference Circuit ...................................................................................................................................................... 21 8. Module MOQ and Package Information ................................................................................................................ 23 9. Sales Information and Technical Support .............................................................................................................. 24 Figure Content Figure 1 EMB1082 DIP pacakge ......................................................................................................................... 6 Figure 2 EMB1082 half hole package ................................................................................................................. 6 Figure 3 EMB1082 Package Definition.............................................................................................................. 7 Figure 4 Minimum Clearance Zone of PCB Antenna (Unit: mm) ................................................................... 15 Figure 5 Size of External Antenna Connector ................................................................................................... 15 Figure 6 EWB1082 mechanical size (Unit: mm) ............................................................................................... 16 Figure 7 Humidity Card ..................................................................................................................................... 17 EMB1082 Datasheet [Page 3] Figure 8 Storage Condition ................................................................................................................................ 19 Figure 9 Temperature Curve of Secondary Reflow ........................................................................................... 20 Figure 10 Power Source Circuit......................................................................................................................... 21 Figure 11 USB to UART................................................................................................................................... 21 Figure 12 External Interface Circuit of EMB1082 ........................................................................................... 22 Figure 13 3.3V UART- 5V UART Convert Circuit ........................................................................................... 22 Table Content Table 1 EMB1082 Pin Definition ........................................................................................................................ 7 Table 2 Range of input voltage .......................................................................................................................... 10 Table 3 Absolute maximum voltage rating ....................................................................................................... 10 Table 4 EMB1082 Power Consumption ........................................................................................................... 10 Table 5 Temperature and humidity condition ....................................................................................................11 Table 6 Electrostatic Discharge Parameters ........................................................................................................11 Table 7 Radio-frequency standards................................................................................................................... 12 Table 8 GFSK mode parameters ....................................................................................................................... 12 Table 9 GFSK mode RX parameters....................................................................................................................... 12 Table 10 GFSK TX parameters.............................................................................................................................. 13 EMB1082 Datasheet [Page 4] 1. Product Introduction EMB1082 is an embedded BLE module by MXCHIP. It integrates a BLE5.0 single mode SOC, including ARM Cortex-M4F Core, BLE/2.4G Radio, 160KB RAM, 512KB Flash and rich peripherals. EMB1082 uses half-hole package which is easy for soldering, and also DIP package. Hardware diagram is shown below with three main parts: ⚫ 32-bit Cortex-M4F Core ⚫ BLE 2.4GHz RF ⚫ Power management With: 1. Up to 20MHz ARM Cortex-M4F MCU with 160KB RAM , 512KB FLASH, UART，I2C，SPI，ADC， SWD, Timer/PWM 2. RF part: support PCB antenna or IPEX connector 3. Power management: DC3.0V power supply, operating voltage range: 2.7V~3.3V EMB1082 Hardware block EMB1082 Datasheet [Page 5] 2. Pins and dimension Pin Arrangement EMB1082 has 21 pins, with 2.0mm pin pitch. EMB1082 uses half-hole package and DIP package (as shown in figure 2, figure3) , which could effectively reduce the quality risk of SMT re-flow. Solder mask openness has the same size with land. The width of solder mask is suggested to be 0.12mm to 0.14mm in SMT. EMB1082 Datasheet Figure 1 EMB1082 DIP pacakge Figure 2 EMB1082 half hole package EMB1082 [Page 6] Datasheet [Page 7] Pin Definition Figure 3 EMB1082 Package Definition Table 1 EMB1082 Pin Definition NO. Name Type IO Note 1 RESET I 2 ADC IO GPIO21 ADC/PWM/I2C/SPI/UART, max drive current 8mA 3 NC 4 SPI0_CSN IO GPIO31 SPI_CSN/PWM/I2C/SPI/UART, max drive current 8mA 5 SPI0_MOSI IO GPIO30 SPI_MOSI/PWM/I2S/SPI/UART, max drive current 8mA 6 SPI0_MISO IO GPIO29 SPI_MISO/PWM/I2C/SPI/UART, max drive current 8mA 7 SPI0_CLK IO GPIO28 SPI_CLK/PWM/I2C/SPI/UART, max drive current 8mA 8 VDD S DC 3.0V 9 GND S Ground 10 P3_2 IO GPIO26 11 Debug_TX IO GPIO3 12 32K_XI A/IO GPIO26 32K_XI/PWM/I2C/SPI/UART, max drive current 8mA 13 32K_XO A/IO GPIO27 32K_XO/PWM/I2C/SPI/UART, max drive current 8mA 14 PWM1 IO GPIO20 ADC/PWM/I2C/SPI/UART, max drive current 8mA 15 UART_RX IO GPIO25 UART_RX, or FW programming, not 16 UART_TX Reset, active low P3_2/PWM/I2C/SPI/UART, max drive current 8mA Debug log output, can’t be used as other function recommended to use as other function IO GPIO24 EMB1082 UART_TX, or FW programming, not Datasheet NO. Name Type [Page 8] IO Note recommended to use as other function IO GPIO8 FW programming, not recommended to use as 17 SWD_IO 18 SWD_CLK 19 P0_1 IO GPIO1 20 P0_0 IO GPIO0 GPIO/PWM/I2C/SPI/UART, max drive current 8mA 21 P0_5 IO GPIO5 GPIO/PWM/I2C/SPI/UART, max drive current 8mA other function IO GPIO9 FW programming, not recommended to use as other function GPIO/PWM/I2C/SPI/UART, max drive current 8mA ⚫ Type S：power/ground，I/O: GPIO，A: Analog； ⚫ Both UART_TX/RX and SWD can be used for firmware programming. Pull down Debug _TX and then power on the module to enter UART programming mode. ⚫ All the IO pins can be used as other functions. ⚫ SPI date rate: 5MHz ⚫ 400ksps, 12bit, AUXADC ⚫ The register setting of IO pins refer to below table: EMB1082 Datasheet EMB1082 [Page 9] Datasheet [Page 10] 3. Electrical Parameters Operating Conditions EMB1082 would be unstable when input voltage is less than the lowest rated voltage. Table 2 Range of input voltage Details Symbol Illustration Condition Minimum Typ Maximum Unit 2.7 3.0 3.3 V Power Supply VDD There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage. Table 3 Absolute maximum voltage rating Symbol Description Minimum Typ Unit VDD Module input voltage – 3.3 V VIN GPIO input voltage − 3.6 V Power Consumption Table 4 EMB1082 Power Consumption Mode Description Average Max TA=25°C TA=25°C 4.7uA 4.8uA 14.9mA 15.1mA Wait for 10 minutes to stop Sleep mode broadcasting, and test for 5 minutes Normal working mode Connect to Tmall Genie and control it by voice, and test for 5 minutes Actual working current is variable at different operating mode. EMB1082 Datasheet [Page 11] Working Environment Table 5 Temperature and humidity condition Symbol Name Maximum Unit TSTG Storage Temperature -40 to +110 ℃ TA Operation Temperature -40 to +105 ℃ Humidity Non-condensing, Relative humidity 95 % Electrostatic Discharge Table 6 Electrostatic Discharge Parameters Symbol Name Details Level Maximum TA= +25 °C , JESD22-A114 2 2000 Unit Electrostatic discharge VESD(HBM) voltage (Human Body Model) V Electrostatic discharge VESD(CDM) voltage (Charged Device TA = +25 °C , JESD22-C101 Model) EMB1082 II 500 Datasheet [Page 12] 4. RF parameters Basic RF parameters Table 7 Radio-frequency standards Name Illustration Working frequency 2.4GHz ISM band Wi-Fi wireless standard Bluetooth5.0 Modulation GFSK Data rate 1Mbps PCB (Default) Antenna type IPEX Connector (Optional) GFSK Parameters Table 8 GFSK mode parameters Item Notes Modulation Frequency range Data rate GFSK 2.400GHz-2.4835GHz ISM band 1Mbps Table 9 GFSK mode RX parameters RX parameter Min Typ. Max Unit Sensitivity -97 -96 -95 dBm Frequency error -10 +10 KHz EMB1082 Datasheet [Page 13] Table 10 GFSK TX parameters BT Spec test item datarate 输出功率 （POWER_AVERAGE） 初始载波频率容许量 (Frequency Drift Error) Measurement Min Typical Max Max LE -20 6.5 7.5 6.49 6.18 6.18 6.49 6.31 LE -50KHz 50KHz 2.501 -3.055 1.398 2.501 -3.055 Carrier frequency offset and drift at NOC: Average Min Channel Frequency CH0 CH19 CH39 (2402MHz) (2440MHz) (2480MHz) 在正常操作模式下的载波频率偏移和漂移 |Fn|max LE |F0-Fn| -150KHz 150KHz 4.858 2.872 2.872 4.858 4.007 LE 50KHz 4.394 2.636 2.636 4.394 3.707 |F1-F0| LE 20KHz 2.339 0.313 0.313 2.339 0.648 |Fn-F(n-5）| n=6,7,8…k LE 20KHz 3.547 2.335 2.335 3.337 3.547 调制特性 Modulation characteristics: △F1avg LE 225KHz 275KHz 249.489 242.04 248.111 242.043 249.489 △F2avg LE 185KHz 275KHz 248.284 231.35 241.481 231.353 248.284 △F2avg/△F1avg LE 0.8 0.99517 0.9558 0.9732781 0.9558343 0.995170128 EMB1082 Datasheet [Page 14] 5. Antenna Information Antenna Type EMB1082 has two types of antenna: PCB antenna (EMB1082-P), IPEX connector (EMB1082-E). Figure 5 EMB1082-P Figure 6 EMB1082-E PCB Antenna Clearance Zone Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and other material that could cause signal interference. EMB1082 Datasheet Figure 4 Minimum Clearance Zone of PCB Antenna (Unit: mm) External Antenna Connector Figure 5 Size of External Antenna Connector EMB1082 [Page 15] Datasheet [Page 16] 6. Assembly Information and Production Guidance Assembly Size Figure 6 EWB1082 mechanical size (Unit: mm) Production Guidance（Important） ⚫ The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch. ▪ Devices for SMT patch: （1）Reflow soldering machine （2）AOI detector （3）Suction nozzle with 6-8mm caliber ▪ Device for drying: （1）Cabinet type oven （2）Anti-static and high thermos tolerant tray （3）Anti-static and high thermos tolerant gloves ⚫ Conditions of product storage (Storage environment is shown in figure 8): EMB1082 Datasheet [Page 17] ▪ Moisture bag must be stored in temperature below 30 and humidity less than 85%RH. ▪ Dry packaging products, the guarantee period should be from 6 months date of packing seal. ▪ Humidity indicator card is in the hermetic package. Figure 7 Humidity Card ⚫ Humidity indicator card and drying situation: ▪ 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after unpacking; ▪ 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking; ▪ 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after unpacking; ▪ 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink after unpacking. ⚫ Drying parameters: ▪ Drying temperature: 125℃±5℃； ▪ Alarm temperature: 130℃； ▪ SMT patch when the device cool down below 36℃ in natural condition; ▪ Dry times: 1; ▪ Please dry again if the module is unsoldering in 12 hours after last drying. ⚫ SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the corresponding responsibility; ⚫ ESD protection is required before SMT; ⚫ SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile diagram is shown in figure 10; EMB1082 Datasheet [Page 18] ⚫ In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production. Considerations ⚫ Operator should wear anti-static gloves during producing; ⚫ No more than drying time; ⚫ Any explosive, flammable and corrosive material is not allowed to add in drying; ⚫ Module should be put into oven with high thermotolerant tray. Ventilation should exist between each module and no direct contact with oven; ⚫ Make sure oven is closed when drying to prevent temperature leaking; ⚫ Reduce opening time or keep closing the door of the oven during drying; ⚫ Use anti-static glove to take out module when its temperature below 36℃ by natural cool down after drying; ⚫ Make sure no water and dirt in the bottom of the module; ⚫ Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020. EMB1082 Datasheet Storage Condition Figure 8 Storage Condition EMB1082 [Page 19] Datasheet [Page 20] Temperature Curve of Secondary Reflow Suggested solder paste type: SAC305, unleaded, solder paste thickness from 0.12 to 0.15, less than 2 times reflow. Figure 9 Temperature Curve of Secondary Reflow EMB1082 Datasheet [Page 21] 7. Reference Circuit Power source circuit is shown in figure 11, USB to UART is shown in figure 12, external interface circuit is shown in figure 13. Figure 10 Power Source Circuit Figure 11 USB to UART EMB1082 Datasheet [Page 22] Figure 12 External Interface Circuit of EMB1082 Voltage of EMB1082 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V chips. Convert circuit is shown in figure 14. Figure 13 3.3V UART- 5V UART Convert Circuit EMB1082 Datasheet [Page 23] 8. Module MOQ and Package Information Table 16 Module MOQ and Package Information PN EMW1082-P EMW1082-E MOQ(pcs) Package type 2240 Tray EMB1082 Datasheet 9. Sales Information and Technical Support For consultation or purchase the product, please contact Mxchip during working hours: From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode：200333 Email: sales@mxchip.com EMB1082 [Page 24]