EMW3090 Wi-Fi Module
Built-in ARM Cortex-M4F Wi-Fi MCU
Datasheet
2.4G Hz IEEE 802.11 b/g/n, ultra-high integration, rich peripherals
Version：2.6
Date: 2020-10-19
NO.: DS0125EN
Abstract
⚫ Input Voltage：3.0V~3.6V
⚫ Operating Temperature：-20℃ to +85℃
⚫ Processor：ARM Cortex-M4 Processor Core
MX1290
▪
MX1290，up to 125MHz
▪
MX1290V2，up to 62.5MHz
▪
40MHz clock input
▪
SWD/JTAG simulation debugger interface
⚫ Interface and Dimension
▪
⚫ Memory
Maintain pin compatibility with similar package
modules
▪
256K bytes SRAM
▪
512K bytes ROM
▪
512 bytes OTP memory area
▪
2M bytes XIP flash
▪
RF Interface: PCB antenna, or IPEX connector
antenna
▪
18mm x 20mm, stamp hole or pin
⚫ Application Functions
⚫ Wi-Fi
▪
IEEE 802.11 b/g/n 1T1R 2.4GHz Single Frequency
▪
Built-in power amplifier (PA) with self-calibration
▪
Support 802.11e QoS enhancement (WMM)
▪
Support WPA/WPA2 PSK，Open/WEP/
▪
Support AliOS and MXOS operating system
▪
Provide major cloud platforms access SDK
▪
Mass production firmware for typical applications
⚫ Typical applications:
TKIP/CCMP
▪
smart home appliances
▪
Support WPA/WPA2 Enterprise
▪
smart electric equipment
▪
Support WPS，Wi-Fi Direct
▪
Industrial automation
▪
Support IEEE Power Save mode
▪
MX1290: support HT20/HT40, 150Mbps max.
▪
MX1290v2: support HT20, 72Mbps max.
▪
Ordering Code
Ordering Code
Notes
EMW3090-P
PCB antenna，MX1290 processor
EMW3090-E
IPEX antenna， MX1290 processor
11 x GPIO
EMW3090V2-P
PCB antenna，MX1290V2 processor
▪
1 x SPI
EMW3090V2-E
IPEX antenna， MX1290V2 processor
▪
2 x I2C，support 400K high speed mode
▪
5 x PWM，up to 2MHz frequency
▪
2 x UART，support hardware flow control
▪
1 ADC channel
▪
Low-energy RTC
⚫ Rich Peripherals
▪
EMW3090V2-P-TR
PCB antenna，MX1290V2 processor, Tape
and Reel
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EMW3090 Series Wireless Module Datasheet
Order Code
Example
EMW
3
09
0
V2
-P
-xxx
Product Series
EMW=IoT Wi-Fi Module
Product Type
3=Welding type wireless module
Typical target applications and features
09=IOT Application 9 Series
Dimensions, enhancements
0=18mm x 20mm，2 x 9 pins 1.5 space, stamp hole
Processor version
[omit]= MX1290
V2= MX1290V2
RF Interface
P=2.4GHz On-Board PCB Antenna
E=2.4GHz External Antenna IPEX Connector
Option
TR = tape and reel（default package is tray
For a list of all relevant features (such as packaging, minimum order quantity, etc.) and other information, please
contact the nearest MXCHIP sales point and agent.
Accessories
Order Code
Description
MXKIT-Base
Development board for all EMW3090 modules
MXKIT-Core-3090
The development board core board for the EMW3090, used with MXKIT-Base
FX-3090
EMW3090 production fixture with accompanying test board：MXKIT-Base, MXKITCore-3090
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EMW3090 Series Wireless Module Datasheet
Version Update Instructions
Date
Version
Update Contents
2018-06-10
1.0
Release
2018-08-23
1.1
Add description of IO port level status at module startup
2018-12-26
1.2
Fixed SRRC ID
2019-01-17
1.3
Add module reference design circuit, add antenna parameters
2019-05-09
1.4
Change the antenna test parameters and clear zone schematic after MP
2019-05-13
1.5
Add OTA test data, modify sensitivity max.
2020-03-06
2.0
Rewritten according to new MXCHIP standard
2020-03-10
2.1
Update general assembly dimension diagram and pin distribution diagram
2020-03-24
2.2
Modify the default function and operating mode selection of pins
2020-04-16
2.3
Modify package information
2020-09-03
2.4
Update label information
2020-09-09
2.5
Update of order code information
2020-10-19
2.6
Reference design circuit updated
Copyright Notice
Without permission, it is prohibited to use or copy all or any part of this manual, especially for trademarks, model
naming, part numbers and drawings.
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EMW3090 Series Wireless Module Datasheet
Contents
Introduction ........................................................................................................................................................................... 1
Pin Definition ......................................................................................................................................................................... 3
Pin Arrangement ...........................................................................................................................................................................................3
Pin Definition .................................................................................................................................................................................................3
Electrical Parameter .............................................................................................................................................................. 6
Absolute Maximum Parameters ..................................................................................................................................................................6
Operating Voltage and Current ...................................................................................................................................................................6
General I/O interface ....................................................................................................................................................................................7
Typical Application Power Consumption ...................................................................................................................................................7
Temperature ...................................................................................................................................................................................................8
ESD ..................................................................................................................................................................................................................8
RF Parameter ..................................................................................................................................................................................................9
Antenna Information .......................................................................................................................................................... 13
PCB antenna parameters and use ............................................................................................................................................................ 13
4.1.1.
On-board PCB parameter........................................................................................................................................................................................................ 13
PCB Antenna Clearance ............................................................................................................................................................................. 14
External antenna parameters and use ..................................................................................................................................................... 14
4.3.1.
SRRC Important statements ....................................................................................................................................................................................................... 16
Dimensions and Production Guidance ............................................................................................................................ 17
Assembly Dimension Diagram.................................................................................................................................................................. 17
Recommended Package Drawing ............................................................................................................................................................. 17
Reference Circuits ............................................................................................................................................................... 18
Power ........................................................................................................................................................................................................... 18
Module basic circuit ................................................................................................................................................................................... 18
UART ............................................................................................................................................................................................................ 18
Production Guidelines ........................................................................................................................................................ 20
Precautions.................................................................................................................................................................................................. 21
Secondary reflow temperature curve ...................................................................................................................................................... 21
Storage Condition ...................................................................................................................................................................................... 22
Label Information ................................................................................................................................................................ 23
Sales and Technical Support Information ....................................................................................................................... 24
Table Catalog
Table 1 MX1290 and MX1290V2 difference Table ....................................................................................................... 2
Table 2 Pin Arrangement .................................................................................................................................................. 3
Table 3 operation mode ................................................................................................................................................... 4
Table 4 Absolute Maximum Parameter：Voltage ........................................................................................................ 6
Table 5 Operating parameters: rated voltage and current ......................................................................................... 6
Table 6 Operation parameter：Typical RF power consumption ................................................................................ 6
Table 7 DC current: digital I/O ......................................................................................................................................... 7
Table 8 Typical application power consumption .......................................................................................................... 8
Table 9 Temperature and humidity parameters ........................................................................................................... 8
Table 10 Electrostatic discharge parameters ................................................................................................................ 8
Table 11 RF Parameter ...................................................................................................................................................... 9
Table 12 RF Parameters in IEEE802.11b mode .............................................................................................................. 9
Table 13 RF Parameters in IEEE802.11g mode ............................................................................................................ 10
Table 14 RF Parameters in IEEE802.11n HT20 mode ................................................................................................. 11
Table 15 RF Parameters in IEEE802.11n HT40 mode ................................................................................................. 12
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EMW3090 Series Wireless Module Datasheet
Table 16 On-board PCB parameter ............................................................................................................................... 13
Table 17 Typical furnace temperature settings .......................................................................................................... 21
Figure Catalog
Figure 1 EMW3090 Hardware Block Diagram .............................................................................................................. 1
Figure 2 Pin Arrangement ................................................................................................................................................ 3
Figure 3 IO The power-on state interface ..................................................................................................................... 5
Figure 4 Antenna minimum clearance area (unit: mm) ............................................................................................ 14
Figure 5 Copper tube antenna size ............................................................................................................................... 15
Figure 6 Dimension drawing of external antenna connector .................................................................................. 16
Figure 7 Assembly Dimension Diagram（unit: mm, tolerance: ±0.1, outside tolerance±0.2） ） ................... 17
Figure 8 Package size (unit: mm) .................................................................................................................................. 17
Figure 9 Power reference circuit ................................................................................................................................... 18
Figure 10 module basic circuit connection ................................................................................................................. 18
Figure 11 USB to serial port reference circuit............................................................................................................. 19
Figure 12 UART 3.3V/5V conversion circuit ................................................................................................................ 19
Figure 13 Humidity Card ................................................................................................................................................ 20
Figure 14 Typical secondary reflux temperature profile .......................................................................................... 22
Figure 15 Storage Conditions Diagram........................................................................................................................ 22
Figure 16 Label diagram ................................................................................................................................................. 23
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EMW3090 Series Wireless Module Datasheet
Introduction
The EMW308x/EMW309x series modules are mainly used for IoT data communication. Data collection
and control are realized through a rich peripheral interface, and data can be transmitted to the Internet
of Things cloud service platform through a Wi-Fi network connection to realize the Internet of Everything.
This series of modules is used in a wide range of IoT applications through a variety of different form
factors, interface types, antenna interfaces and temperature range.
The module includes a super-integrated Wi-Fi microcontroller MX1290 that integrates a Cortex-M4F core
up to 125MHz, 256K bytes of SRAM, 2M bytes of Flash memory, and IEEE 802.11 b/g/ n Standard 2.4
GHz RF. Streamlined peripheral circuitry makes the overall module size and interface design more flexible
and easier to control costs. The high-performance processing core and security module greatly improve
the speed of networking interaction and reduce the overall power consumption while ensuring data
security.
Shanghai MXCHIP provides MXOS and AliOS software platforms to support the development of
EMW3090 series modules, providing an efficient development environment, access protocol stacks for
various IoT cloud services, rich sample programs and various typical applications.
The following figure shows the hardware block diagram of the EMW3090 module, which mainly includes:
⚫
Wi-Fi processor MX1290/MX1290V2
⚫
Equipped with 2M bytes of SPI interface Flash memory
⚫
On-board or external antenna
⚫
Power and communication interface
Figure 1 EMW3090 Hardware Block Diagram
MX1290 Wi-Fi microcontrollers are provided in two versions, MX1290 and MX1290V2. In MX1290V2, in
order to provide a more cost-effective choice for this series of modules, the software restricts hardware
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EMW3090 Series Wireless Module Datasheet
functions and cannot be lifted through software upgrades. The main differences are as follows:
Table 1 MX1290 and MX1290V2 difference Table
Model
Main Frequency
MX1290
125MHz
MX1290V2
62.5MHz
Wi-Fi
Support HT20 and HT40，transmitting rate up to
150Mbps
Support HT20，transmitting rate up to
72.2Mbps
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Security
Support Flash
encryption，Trust Zone
Lite
-
2
EMW3090 Series Wireless Module Datasheet
Pin Definition
Pin Arrangement
Figure 2 Pin Arrangement
Pin Definition
Table 2 Pin Arrangement
Pin
Main Function
Name
Number
(After Reset)
PWM
UART
I2C
SPI
Others
1
VDD
2
CHIP_EN(3) (5)
3
PA_0
PA_0
PWM_2
4
PA_12
PA_12
PWM_3
5
PA_19
PA_19
TIM5_TRIG
UART0_CTS
I2C0_SDA
SPI1_CS
ADC1
6
PA_22
PA_22
PWM_5
UART0_RTS
I2C0_SCL
SPI1_MISO
WAKEUP_2
7
PA_30(1) (2) (5)
UART2_Log_TX
PWM_3
UART2_Log_TX
I2C0_SDA
PA_30
8
PA_29(2) (5)
UART2_Log_RX
PWM_4
UART2_Log_RX
I2C0_SCL
PA_29
9
VSS
10
PA_5
PA_5
PWM_4
11
PA_18
PA_18
TIM4_TRIG
UART0_RX
I2C1_SCL
SPI1_CLK
WAKEUP_0
12
PA_23
PA_23
PWM_0
UART0_TX
I2C1_SDA
SPI1_MOSI
WAKEUP_3
13
VSS
14
PA_8(1)
15
NC
16
NC
17
PA_11(1)
18
VSS
T1
PA_15
SWDIO
PWM_1
T2
PA_14
SWCLK
PWM_0
WAKEUP_1
PA_8
PA_11
Notes：
1.
Module working mode selection signal. During the startup phase, the module detects the
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EMW3090 Series Wireless Module Datasheet
level of these pins and enters a specific working state. The correspondence between level and
working mode is shown in Table 3:
Table 3 operation mode
PA_30
Operation mode
(UART2_Log_TX)
Default: 1
PA_11（BOOT）
PA_8（EASYLINK）
Default: 1
Default: 1
ISP Program Mode
0
not detect
not detect
Bootloader
1
0
1
ATE
1
0
0
Normal
1
1 (Default)
not detect
(1). During the startup phase, if the processor hardware detects that the PA_30 level is low, it enters
the ISP programming mode. In ISP programming mode, you can program the flash of the module
through UART2 (PA_29, PA_30). In normal use, the level of the PA_30 pin must be high or floating at
the time of power-up, please pay special attention when designing the circuit.
(2). After the startup is completed, when the processor runs the firmware provided by MXCHIP, the
firmware detects the status of PA_11 and PA_8 to enter the corresponding working mode.
2.
The UART2_Log serial port is used for the input / output of debugging information. Do not
use it during design, and provide it in a convenient way to facilitate software development.
3.
The CHIP_EN pin is an enable reset pin, which is active low and can be left floating if not
used. Or pull up 3.3V.
4.
Please keep unused pins floating. It should be noted that the IO port is in a floating state at
startup. If you need to configure the state of the pin through software, you need to wait until the
code in the bootloader starts to execute. The time from when the module is powered on to when
the code in the bootloader is executed will be affected by the flash startup time. Therefore, if you
need IO to be in a certain level state at startup, you need to use a 100k resistor on the pin to pull
up and down. Figure 3 shows the level change of the IO port whose software is configured as a
low level after being pulled up by an external 100K resistor in the floating state. It can be seen
that the time from powering on the module to the IO port software controllable time is 69.4ms,
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EMW3090 Series Wireless Module Datasheet
during which the time for IO to be pulled to high level is about 20ms.
Figure 3 IO The power-on state interface
5.
The module has 100K hardware pull-up resistors in PA_30 (UART2_Log_TX) and PA_29
(UART2_Log_RX). The PA_0 pin has a 100K hardware pull-down resistor, and CHIP_EN has an
internal 100K pull-up resistor and 0.01F capacitance to ground.
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EMW3090 Series Wireless Module Datasheet
Electrical Parameter
Absolute Maximum Parameters
Operation of the module outside of its absolute maximum ratings may result in permanent damage. At
the same time, long-term exposure to the maximum rated conditions will affect the reliability of the
module.
Table 4 Absolute Maximum Parameter：Voltage
Symbol
Ratings
Min
Max
Unit
VDD–VSS
Voltage
–0.3
3.6
V
VIN
Input voltage on any other pin
VSS−0.3
VDD+0.3
V
Operating Voltage and Current
Table 5 Operating parameters: rated voltage and current
Symbol
Note
VDD
VDD_IO
IVDD
Specification
Min.
Typical
Max.
Unit
Voltage
3.0
3.3
3.6
V
Digital IO Supply Voltage
1.62
1.8～3.3
3.6
V
450
mA
50
mA
3.3V Rating Current (with 450 mA internal
regulator and integrated CMOS PA)
IDD_IO
IO Rating Current (including VDD_IO)
IVDD
Deep Sleep Mode
7
7
uA
IVDD
Deep Standby Mode
70
70
uA
IVDD
Sleep Power Gate
120
120
uA
IVDD
Sleep Clock Gate
350
350
uA
Table 6 Operation parameter：Typical RF power consumption
Symbol
IVDD
IVDD
Note
Specification
CPU
Wi-Fi
Deep Sleep Mode
Wi-Fi OFF
Deep Standby Mode
Pull up Flash CS pin
Min.
Typical
Max.
Unit
7
10
uA
150
uA
500
600
uA
14
26
mA
Wi-Fi OFF
IVDD
Sleep
Wi-Fi OFF
IVDD
Active
Wi-Fi OFF
IVDD
Sleep
Wi-Fi Associate, DTIM = 1
2.78
mA
IVDD
Sleep
Wi-Fi Associate, DTIM = 3
1.49
mA
IVDD
Active
Wi-Fi Associate, DTIM = 1
47
mA
IVDD
Active
Wi-Fi Associate, DTIM = 3
46
mA
IVDD
Sleep
Wi-Fi RX
90
mA
IVDD
Active
Wi-Fi RX
120
mA
IVDD
Active
TX@MCS7/HT40，13dBm
220
mA
IVDD
Active
TX@MCS7/HT40，16.5dBm
230
mA
14
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EMW3090 Series Wireless Module Datasheet
Symbol
Note
Specification
CPU
Wi-Fi
Min.
Typical
Max.
Unit
IVDD
Active
TX@MCS7/HT20，13dBm
244
mA
IVDD
Active
TX@MCS7/HT20，16.5dBm
257
mA
IVDD
Active
TX@OFDM54M, 15dBm
255
mA
IVDD
Active
TX@OFDM54M, 17.5dBm
267
mA
IVDD
Active
TX@CCK11M, 17dBm
287
mA
IVDD
Active
TX@CCK11M, 18dBm
295
mA
IVDD
Active
RX@Idle, HT40
120
mA
IVDD
Active
RX@MCS7, HT40 (Pin= -60dBm)
130
mA
IVDD
Active
RX@MCS7, HT20 (Pin= -60dBm)
127
mA
IVDD
Active
RX@OFDM54M (Pin= -60dBm)
127
mA
IVDD
Active
RX@CCK11M (Pin= -60dBm)
115
mA
IVDD
Active
RF Standby
84
mA
IVDD
Active
RF disable
62
mA
(1). The above parameters are measured in the laboratory wireless shielding environment. Refer to Table
8 for actual application power consumption.
(2). In Deep Standby Mode, the CS signal of Flash should be pulled high, otherwise the MX1290 will
generate leakage current on the Flash interface.
(3). Flash power consumption is not included in the data in Table 6. When reading code or reading and
writing data from the Flash, the power consumption of the Flash is not higher than 20mA, and the power
consumption of the Flash in standby mode (CS signal pulled high) is not higher than 50A.
General I/O interface
Table 7 DC current: digital I/O
Symbol
Note
Conditions
VIH
Input-High Voltage
VIL
Specification
Min.
Typical
Max.
Unit
LVTTL
2.0
-
-
V
Input-Low Voltage
LVTTL
-
-
0.8
V
VOH
Output-High Voltage
LVTTL
2.4
-
-
V
VOL
Output-Low Voltage
LVTTL
-
-
0.4
V
IT+
Schmitt-trigger High Level
1.78
1.87
1.97
V
IT-
Schmitt-trigger Low Level
1.36
1.45
1.56
V
IIL
Input-Leakage Current
-10
1
10
A
VIN=3.3V or 0
Typical Application Power Consumption
The module current test environment is based on VDD=3.3V. Test under common office application
environment (values measured under different test environments will be different).
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EMW3090 Series Wireless Module Datasheet
Table 8 Typical application power consumption
Mode
EMW3090
EMW3090V2
Unit
Note
21
mA
CPU idle
3.5
3.5
mA
24.7
19
20
mA
114.
121
110
126
mA
114
147
109
124
mA
14
290
9.06
282
mA
SoftAP mode
118
306
116
306
mA
SoftAP networking status
Monitor mode
114
122
114
126
mA
Distribution process, in RX state
10
12
10
12
A
off, can be woken up by wake-up
Average
Max.
Average
Max.
28.3
28.3
21
3.5
3.5
24.6
Wi-Fi off
Wi-Fi off
Wi-Fi off
Wi-Fi initial
Keep Wi-Fi
connected
Keep Wi-Fi
connected
CPU idle, turn on low power
consumption
CPU running at full load
Power on state, turn off low
power consumption
Turn off Wi-Fi and MCU low
power consumption
Turn on Wi-Fi and MCU low
power consumption
MCU / RAM / peripheral / RTC is
Deepsleep
mode
pin or internal Timer
Iperf
Turn off Wi-Fi and MCU low
performance
160
336
115
345
mA
power consumption
mode
Iperf
Turn on Wi-Fi and MCU low
performance
164
332
115
353
mA
power consumption
mode
Temperature
Table 9 Temperature and humidity parameters
ESD
Symbol
Ratings
Max
Unit
TSTG
Storage temperature
–55 to +125
℃
Twork
Ambient Operating Temperature
-20 to +85
℃
TJun
Junction Temperature
0 to +125
℃
k
Table 10 Electrostatic discharge parameters
Symbol
Name
Name
Electrostatic discharge
VESD(HBM)
voltage
(Human body model)
Level
Max.
2
2000
TA= +25 °C comply with
JESD22-A114
V
Electrostatic discharge
VESD(CDM)
voltage
(Discharge
Unit
TA = +25 °C comply with
JESD22-C101
II
500
equipment model)
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EMW3090 Series Wireless Module Datasheet
RF Parameter
Table 11 RF Parameter
Item
Specification
Operating Frequency
2.412~2.484GHz
Channel BW
20MHz，40MHz(MX1290 only)
Antenna Interface
1T1R, Single stream
Wi-Fi Standard
IEEE 802.11b/g/n
11b: DBPSK, DQPSK, CCK for DSSS
Modulation Type
11g: BPSK, QPSK, 16QAM, 64QAM for OFDM
11n: MCS0~7, OFDM
802.11b: 1, 2, 5.5 and 11Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps
Data Rates
802.11n: MCS0~7, up to 72.2Mbps
802.11n: MCS0~7, up to 150Mbps (MX1290 only)
One U.F.L connector for external antenna
Antenna type
PCB printed ANT (Reserve)
Note: The typical values of the following Tx test data are recorded under normal temperature
environment and Tx lasts about 20s.
IEEE 802.11b mode
Table 12 RF Parameters in IEEE802.11b mode
Item
Description
Mode
IEEE802.11b
Channel
CH1 to CH13
Data rate
1, 2, 5.5, 11Mbps
TX Characteristics
Min.
Typical
Max.
Unit
11b Target Power@1Mbps
15
16.5
18
dBm
11b Target Power@11Mbps
15.0
16.5
18.0
dBm
fc +/-11MHz to +/-22MHz
-
-
-30
dBr
fc > +/-22MHz
-
-
-50
dBr
-15
-1
＋15
ppm
-
-15.5
Min.
Typical
Max.
Unit
1Mbps (FER≦8%)
-
-98
-97
dBm
11Mbps (FER≦8%)
-
-90
-90
dBm
Transmitter Output Power
Spectrum Mask
Frequency Error
Constellation Error (peak EVM)
1~11Mbps
RX Characteristics
35%（or -11dB）
Minimum Input Level Sensitivity
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EMW3090 Series Wireless Module Datasheet
The 11b power is the power obtained from the factory mode test (through the wall mode), the actual
user application and certification test will be 2dB lower than the factory mode, i.e. the actual maximum
power of the 11b is capped at 16dBm. ensure that the PSD test item of the certification test can be
passed.
IEEE802.11g mode
Table 13 RF Parameters in IEEE802.11g mode
Item
Description
Mode
IEEE802.11g
Channel
CH1 to CH13
Datarate
6, 9, 12, 18, 24, 36, 48, 54Mbps
TX Characteristics
Min.
Typical
Max.
Unit
11g Target Power@6Mbps
14
15.5
17
dBm
11g Target Power@54Mbps
13
14.5
16
dBm
fc +/- 11MHz
-
-
-20
dBr
fc +/- 20MHz
-
-
-28
dBr
fc > +/-30MHz
-
-
-40
dBr
-15
-1
+15
ppm
6Mbps
-
-30
-5
dBm
54Mbps
-
-31
-25
dBm
Min.
Typical
Max.
Unit
6Mbps (FER≦10%)
-
-92.5
-92.5
dBm
54Mbps (FER≦10%)
-
-76
-75.5
dBm
Transmitter Output Power
Spectrum Mask
Frequency Error
Constellation Error (peak EVM)
RX Characteristics
Minimum Input Level Sensitivity
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EMW3090 Series Wireless Module Datasheet
IEEE802.11n HT20 mode
Table 14 RF Parameters in IEEE802.11n HT20 mode
Item
Description
Mode
IEEE802.11n HT20
Channel
CH1 to CH13
Datarate
MCS0/1/2/3/4/5/6/7
TX Characteristics
Min.
Typical
Max.
Unit
11n Target Power@MCS0
13.5
15
16.5
dBm
11n Target Power@MCS7
12
13.5
15.0
dBm
fc +/- 11MHz
-
-
-20
dBr
fc +/- 20MHz
-
-
-28
dBr
fc > +/-30MHz
-
-
-45
dBr
-15
-1
+15
ppm
MCS0
-
-30
-5
dBm
MCS7
-
-32
-27
dBm
Min.
Typical
Max.
Unit
MCS0 (FER≦10%)
-
-92.5
-92.5
dBm
MCS7 (FER≦10%)
-
-73
-73
dBm
Transmitter Output Power
Spectrum Mask
Frequency Error
Constellation Error (peak EVM)
RX Characteristics
Minimum Input Level Sensitivity
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EMW3090 Series Wireless Module Datasheet
IEEE802.11n HT40 mode (MX1290V2 not support)
Table 15 RF Parameters in IEEE802.11n HT40 mode
Item
Description
Mode
IEEE802.11n HT40
Channel
CH3 to CH11
Datarate
MCS0/1/2/3/4/5/6/7
TX Characteristics
Min.
Typical
Max.
Unit
11n Target Power@MCS0
13.5
15
16.5
dBm
11n Target Power@MCS7
12
13.5
15.0
dBm
fc +/- 11MHz
-
-
-20
dBr
fc +/- 20MHz
-
-
-28
dBr
fc > +/-30MHz
-
-
-45
dBr
-15
-1
+15
ppm
MCS0
-
-30
-5
dBm
MCS7
-
-32
-28
dBm
Min.
Typical
Max.
Unit
MCS0 (FER≦10%)
-
-92.5
-92.5
dBm
MCS7 (FER≦10%)
-
-73
-73
dBm
Transmitter Output Power
Spectrum Mask
Frequency Error
Constellation Error (peak EVM)
RX Characteristics
Minimum Input Level Sensitivity
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EMW3090 Series Wireless Module Datasheet
Antenna Information
EMW3090 has two specifications: PCB antenna and external antenna, please refer to the order code for
order. IPX antenna connectors are not soldered on the modules using PCB antennas. By connecting an
external antenna through an IPX connector, you can get better RF performance.
PCB antenna parameters and use
4.1.1.
On-board PCB parameter
Table 16 On-board PCB parameter
Item
Min.
Frequency
2400
Impedance
Typical
Max.
Unit
2500
MHz
50
VSWR
Ω
2
Gain
≤2dBi
Efficiency
>60% ordBi
>-2.22dB
Note: The above conditions are obtained with the module soldered to the motherboard and under
anechoic chamber test conditions.
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EMW3090 Series Wireless Module Datasheet
Note: The above antenna test data is based on the module soldered to the test board with good
clearance area in anechoic chamber conditions, the measured data is for reference only. In actual use,
the antenna is affected by the whole structure and enclosure, the data will be deviated.
PCB Antenna Clearance
When using PCB antenna in Wi-Fi module, it is necessary to ensure that PCB and other metal devices are
at least 16 mm away from the motherboard. The shaded areas in the figure below need to be far away
from metal devices, sensors, interference sources and other materials that may cause signal interference.
Figure 4 Antenna minimum clearance area (unit: mm)
External antenna parameters and use
Users can choose different 2.4G antennas with different external dimensions and gains not greater
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EMW3090 Series Wireless Module Datasheet
than 2dBi according to the application environment.
When using an external antenna, it should be noted that the module must be powered on after the
antenna is connected, because the module will perform IQ calibration after power on, and send a
single carrier through the PA to pass the RX loop detection signal. If the load is not loaded (the
antenna is not connected), it will cause calibration errors, which will make the PA output power
abnormal, and a large standing wave will be formed at the PA output, which may damage the internal
devices.
The following is a copper tube antenna with an IPEX connector commonly used by MXCHIP:
Figure 5 Copper tube antenna size
⚫
Frequency range: 2400-2500 MHz
⚫
Input impedance: 50 OHM
⚫
VSWR: < 2.0
⚫
Gain：2.0DBI
⚫
Polarization: vertical
⚫
Directivity: Omnidirectional
⚫
Copper tube: 4.4 * 23mm
⚫
Wire: 1.13 gray wire L-82mm
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EMW3090 Series Wireless Module Datasheet
External antenna IPEX seat size:
Figure 6 Dimension drawing of external antenna connector
4.3.1.
SRRC Important statements
The SRRC type approval number obtained for module models using an external antenna base has the
(M) suffix and any module with the (M) suffix is specifically declared as follows.
Type approval of a module does not imply that the end equipment in which the module is
embedded or in which it is used complies with the relevant radio regulations or standards, and the
end equipment manufacturer is responsible for the conformity of the technical characteristics of
the product with the radio regulations or standards.
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EMW3090 Series Wireless Module Datasheet
Dimensions and Production Guidance
Assembly Dimension Diagram
Figure 7 Assembly Dimension Diagram（unit: mm, tolerance: ±0.1, outside tolerance±0.2） ）
Recommended Package Drawing
Figure 8 Package size (unit: mm)
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EMW3090 Series Wireless Module Datasheet
Reference Circuits
Power
The module uses 3.3V DC single voltage power supply. The following is an example of power supply after
conversion with 5V power supply of USB interface.
Figure 9 Power reference circuit
Module basic circuit
Figure 10 module basic circuit connection
Note: The module has 100K hardware pull-up resistors in PA_30 (UART2_Log_TX) and PA_29
(UART2_Log_RX). The PA_0 pin has a 100K hardware pull-down resistor. CHIP_EN has an internal 100K pullup resistor and 0.01F capacitance to ground. Please pay special attention to the design schematic and
PCB and allocate the pull-up and pull-down according to the internal hardware.
UART
During the debugging process, the UART signal is usually converted to USB and then connected to the PC.
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EMW3090 Series Wireless Module Datasheet
The conversion reference circuit is shown in Figure 11:
Figure 11 USB to serial port reference circuit
If the UART of the chip used by the user is 5V, you need to convert the 5V UART to 3.3V to
communicate with the module. For the 5V-3.3V UART conversion circuit, please refer to the circuit
shown in Figure 12.
Figure 12 UART 3.3V/5V conversion circuit
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EMW3090 Series Wireless Module Datasheet
Production Guidelines
MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity
grade MSL3, after unpacking more than a fixed time patches to bake module.
SMT patches require instruments
⚫
⚫
▪
Reflow bonding machine
▪
AOI detector
▪
6-8mm suction nozzle
Baking requires equipment:
▪
Cabinet oven
▪
Anti-static, high temperature tray
▪
Antistatic and heat resistant gloves
The storage conditions of MXCHIP module are as follows:
▪
Moisture-proof bags must be stored in an environment with temperature < 30 degree C and
humidity < 85% RH.
▪
A humidity indicator card is installed in the sealed package.
Figure 13 Humidity Card
After the module is split, if the humidity card shows pink, it needs to be baked.
The baking parameters are as follows:
▪
The baking temperature is 120℃±5℃ and the baking time is 4 hours.
▪
The alarm temperature is set to 130℃.
▪
SMT patches can be made after cooling < 36℃ under natural conditions.
▪
Drying times: 1 time.
▪
If there is no welding after baking for more than 12 hours, please bake again.
If the disassembly time exceeds 3 months, SMT process is forbidden to weld this batch of modules,
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EMW3090 Series Wireless Module Datasheet
because PCB gold deposition process, over 3 months, pad oxidation is serious, SMT patch is likely to lead
to virtual welding, leak welding, resulting in various problems, our company does not assume the
corresponding responsibility.
Before SMT patch, ESD (Electrostatic Discharge, Electrostatic Release) protection should be applied to
the module.
SMT patches should be made according to the reflow curve. The peak temperature is 250 C.
In order to ensure the qualified rate of reflow soldering, 10% of the first patches should be taken for
visual inspection and AOI testing to ensure the rationality of furnace temperature control, device
adsorption mode and placement mode, and 5-10 patches per hour are recommended for visual
inspection and AOI testing in subsequent batch production.
Precautions
⚫
Operators of each station must wear static gloves during the entire production process.
⚫
Do not exceed the baking time when baking.
⚫
It is strictly forbidden to add explosive, flammable, or corrosive substances during baking.
⚫
When baking, the module uses a high temperature tray to be placed in the oven to keep the air
circulation between each module while avoiding direct contact between the module and the inner
wall of the oven.
⚫
When baking, please close the oven door to ensure that the oven is closed to prevent temperature
leakage and affect the baking effect.
⚫
Try not to open the door when the oven is running. If it must be opened, try to shorten the time for
opening the door.
⚫
After baking, the module should be naturally cooled to
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