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EMC3080 Wi-Fi/BLE Module Built-in Cortex-M33 MCU Datasheet 2.4GHz IEEE 802.11 b/g/n, BLE 4.2, ultra-high integration, rich peripherals version：1.1 data：2020-08-26 Number：DS0156EN Abstract ⚫ Input Voltage：3.0V~3.6V ⚫ Operating Temperature：-20℃ to +85℃ ⚫ Processor: Cortex-M33 Processor Core MX1300CF ▪ MX1300CF: Main frequency up to 100MHz ▪ SWD/JTAG simulation debugger interface ⚫ Memory ▪ 256K bytes SRAM ▪ 384 bytes OTP memory area ▪ 2M bytes XIP flash ⚫ Interface and Dimension ⚫ Wi-Fi ▪ IEEE 802.11 b/g/n 1T1R 2.4GHz Single Frequency ▪ Support HT20, up to 65Mbps@MCS7 ▪ Support 802.11e QoS enhancement (WMM) ▪ Support WPA/WPA2 PSK，Open/WEP/ ▪ Maintain pin compatibility with similar package modules ▪ RF Interface: PCB antenna, IPEX connector antenna ▪ 18mm x 33mm, stamp hole or pin ⚫ Application Functions TKIP/CCMP ▪ Support WPA/WPA2 Enterprise ▪ Support AliOS and MXOS operating system ▪ Support WPS，Wi-Fi Direct ▪ Provide major cloud platforms access SDK ▪ Support IEEE Power Save mode ▪ Mass production firmware for typical applications ⚫ Typical applications ⚫ Bluetooth ▪ ▪ Bluetooth Low Energy BLE compliant with the 4.2 ▪ smart home appliances standard ▪ smart electric equipment Wi-Fi and BLE time division multiplexing, sharing ▪ Industrial automation the same PA and antenna ▪ Support Bluetooth slave mode, can be used for Bluetooth distribution network ⚫ Rich Peripherals ▪ 14 x GPIO ▪ 1 x SPI, 2 x I2C ▪ 8 x PWM ▪ 3 x UART，support hardware flow control ▪ Low-energy RTC ⚫ Ordering Code Ordering Code Notes EMC3080-PZI5 PCB antenna, MX1300CF processor EMC3080-EZI5 IPEX antenna, MX1300CF processor Copyright of Shanghai MXCHIP Information Technology Co., Ltd. EMC3080 Series Wireless Module Data Manual Order Code For example, EMC 3 08 0 -P I 5 -xxx Product Series EMC=IoT Wi-Fi/BLE Module Product Type 3=Welding type wireless module Typical target applications and features 08=IOT Application 8 Series Dimensions, enhancements 18mm x 33mm, 2 x 6pin 2.0 Spacing double row stamp hole + 9 pin 2.0 Spacing stamp hole or pin 2.0 Spacing stamp hole or pin RF Interface P=2.4GHz On-Board PCB Antenna E=2.4GHz External Antenna IPEX Connector Flash capacity I = 2M bytes of flash storage Temperature range 5 = Industrial grade temperature range, -20 ° C ~ 85 ° C Option TR = tape and reel（default package is tray） For a list of all relevant features (such as packaging, minimum order quantity, etc.) and other information, please contact the nearest MXCHIP sales point and agent. Accessories Order Code Description MXKIT-Base Development board for all EMC3080 modules MXKIT-Core-3080 The development board core board for the EMC3080, used with MXKIT-Base FX-3080 EMC3080 production fixture with accompanying test board：MXKIT-Base, MXKITCore-3080 Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 1 EMC3080 Series Wireless Module Data Manual Version Update Instructions Date Version Update Contents 2019-12-06 0.1 First edition 2020-01-08 0.2 Improve power consumption parameters and RF parameters 2020-03-12 0.3 Pin definition update 2020-04-22 0.4 Label update, power consumption data update 2020-05-13 0.5 Update RF parameters 2020-08-10 1.0 Updated pin arrangement, assembly dimensions, ordering code 2020-08-26 1.1 Update Order Code Information Copyright Notice Without permission, it is prohibited to use or copy all or any part of this manual, especially for trademarks, model naming, part numbers and drawings. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 2 EMC3080 Series Wireless Module Data Manual Contents INTRODUCTION ........................................................................................................................................................ 5 PIN DEFINITION ........................................................................................................................................................ 6 Pin Arrangement ............................................................................................................................................................................. 6 Pin Definition ................................................................................................................................................................................... 6 ELECTRIC PARAMETER ............................................................................................................................................. 9 Absolute Maximum Parameters .................................................................................................................................................... 9 Operating Voltage and Current ..................................................................................................................................................... 9 General I/O interface .................................................................................................................................................................... 10 Typical Application Power Consumption ................................................................................................................................... 10 Temperature................................................................................................................................................................................... 11 ESD .................................................................................................................................................................................................. 11 RF Parameter ................................................................................................................................................................................. 11 EMC3080 Bluetooth RF Parameters ............................................................................................................................................ 13 ANTENNA INFORMATION ..................................................................................................................................... 14 PCB antenna parameters and use ............................................................................................................................................... 14 4.1.1. On-board PCB parameter....................................................................................................................................................................................... 14 PCB Antenna Clearance ................................................................................................................................................................ 14 External antenna parameters and use ........................................................................................................................................ 14 DIMENSIONS AND PRODUCTION GUIDANCE ................................................................................................... 16 Assembly Dimension Diagram .................................................................................................................................................... 16 Recommended Package Drawing ............................................................................................................................................... 16 PRODUCTION GUIDELINES.................................................................................................................................... 18 Precautions .................................................................................................................................................................................... 19 Secondary reflow temperature curve ......................................................................................................................................... 19 Storage Condition ......................................................................................................................................................................... 21 LABEL INFORMATION ............................................................................................................................................ 22 SALES AND TECHNICAL SUPPORT INFORMATION ........................................................................................... 23 Table Catalog Table 1 pin definition ........................................................................................................................................................ 6 Table 2 operation mode ................................................................................................................................................... 7 Table 3 Absolute Maximum Parameter：Voltage ........................................................................................................ 9 Table 4 Absolute Maximum Parameter：Current ........................................................................................................ 9 Table 5 operation parameter：Typical RF power consumption ................................................................................ 9 Table 6 DC current: digital I/O ....................................................................................................................................... 10 Table 7 Typical application power consumption ........................................................................................................ 10 Table 8 Temperature and humidity parameters ......................................................................................................... 11 Table 9 Electrostatic discharge parameters ................................................................................................................ 11 Table 10 RF Parameter .................................................................................................................................................... 11 Table 11 Output Power ................................................................................................................................................... 12 Table 12 Frequency error................................................................................................................................................ 12 Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 3 EMC3080 Series Wireless Module Data Manual Table 13 EVM .................................................................................................................................................................... 12 Table 14 RX sensitivity .................................................................................................................................................... 12 Table 15 EMC3080 BLE4.2 TX/RX Parameters ............................................................................................................ 13 Table 16 On-board PCB parameter ............................................................................................................................ 14 Table 17 Typical furnace temperature settings .......................................................................................................... 19 Figure Catalog Figure 1 EMC3080 Hardware Block Diagram ................................................................................................................ 5 Figure 2 Pin Arrangement ................................................................................................................................................ 6 Figure 3 IO The power-on state interface ..................................................................................................................... 8 Figure 4 Antenna minimum clearance area (unit: mm) ............................................................................................ 14 Figure 5 Copper tube antenna size ............................................................................................................................... 15 Figure 6 Dimension drawing of external antenna connector .................................................................................. 15 Figure 7 Assembly Dimension Diagram（unit: mm, tolerance: ±0.1, outside tolerance±0.2） ） ................... 16 Figure 8 DIP package dimension(unit: mm) ............................................................................................................... 16 Figure 9 Stamp hole package size (mounting pad, unit: mm) ................................................................................. 17 Figure 10 Stamp hole package size (no mounting pad, unit: mm) ......................................................................... 17 Figure 11 Humidity Card ................................................................................................................................................ 18 Figure 12 Typical secondary reflux temperature profile .......................................................................................... 20 Figure 13 Storage Conditions Diagram ....................................................................................................................... 21 Figure 14 Label Diagram ................................................................................................................................................ 22 Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 4 EMC3080 Series Wireless Module Data Manual Introduction The EMC308x series modules are mainly used for IoT data communication. Data collection and control are realized through a rich peripheral interface, and data can be transmitted to the Internet of Things cloud service platform through a Wi-Fi network connection to realize the Internet of Everything. This series of modules is used in a wide range of IoT applications through a variety of different form factors, interface types, antenna interfaces and temperature range. The module includes a super-integrated Wi-Fi microcontroller MX1300CF that integrates a Cortex-M33 core up to 125MHz, 256K bytes of SRAM, 2M bytes of Flash memory, and IEEE 802.11 b/g/ n Standard 2.4 GHz RF. Streamlined peripheral circuitry makes the overall module size and interface design more flexible and easier to control costs. The high-performance processing core and security module greatly improve the speed of networking interaction and reduce the overall power consumption while ensuring data security. Shanghai MXCHIP provides MXOS and AliOS software platforms to support the development of EMC3080 series modules, providing an efficient development environment, access protocol stacks for various IoT cloud services, rich sample programs and various typical applications. The following figure shows the hardware block diagram of the EMC3080 module, which mainly includes: ⚫ Cortex-M33 core clocked up to 100MHz ⚫ 256K bytes of SRAM ⚫ 2M bytes XIP Flash ⚫ 2.4GHz Wi-Fi controller conforming to IEEE 802.11 b / g / n standard ⚫ Bluetooth Low Energy Controller that complies with BT4.2 BQB specifications Figure 1 EMC3080 Hardware Block Diagram Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 5 EMC3080 Series Wireless Module Data Manual Pin Definition Pin Arrangement Figure 2 Pin Arrangement Pin Definition Table 1 pin definition Pin Name No. I/O Function Type 1 PA0 I/O PA0/SWD_CLK 2 PA1 I/O PA1/SWD_DIO 3 PA0 I/O PA0/SWD_CLK 4 PA1 I/O PA1/SWD_DIO 5 PA10 I/O PA10 6 PA4 I/O PA4/PWM4 7 PA2 I/O PA2/I2C_SCL 8 PA3 I/O PA3/I2C_SDA 9 PA14 I/O PA14/UART_TXD 10 PA13 I/O PA13/UART_RXD 11 CHIP_EN(3) (5) I/O RESET 12 PA17(5) I/O PA17/PWM5 13 PA18 I/O PA18/PWM6 14 PA23 I/O PA23/PWM7 15 PA9 I/O PA9/SPIM_D2 Recommended Recommended function 1 function 2 Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 6 EMC3080 Series Wireless Module Data Manual 16 VDD I/O VDD 17 VSS I/O GND 18 PA12 I/O PA12 19 PA20(1) I/O PA20/PWM0 20 PA11 I/O PA11/SPIM_D0 21 PA16 I/O PA16/DBG_TXD 22 PA15 I/O PA15/DBG_RXD 23 PA19 I/O PA19 24 PA16 I/O PA16/DBG_TXD 25 PA15 I/O PA15/DBG_RXD Notes： 1. Module working mode selection signal. During the startup phase, the module detects the level of these pins and enters a specific working state. The correspondence between level and working mode is shown in Table 3: Table 2 operation mode PA_0 PA_13 PA_20（BOOT） PA_19（EASYLINK） Default: 0 Default: 0 Default: 1 Default: 1 ISP Program Mode 1 1 not detect not detect Test mode 1 0 not detect not detect 0 0 0 1 1 not detect Operation mode QC Normal ATE APP 0 not detect (1). ISP Program Mode, Test mode and Normal mode are detected by hardware at startup. PA_0 and PA_13, because it is a function of hardware solidification, it cannot be modified. (2). QC, ATE and APP modes are judged by the firmware provided by MXCHIP, and the detection conditions and functions can be adjusted by modifying the firmware. (3). ISP Program Mode function contempt: In the startup phase, if the processor hardware detects that the levels of PA_0 and PA_13 are high, it enters ISP programming mode. In the ISP programming mode, the flash of the module can be programmed through UART2 (PA_16, PA_15). (4). Test mode is the reserved mode of the chip and will not be used. (5). After the startup is completed, when the processor runs the firmware provided by MXCHIP, the firmware detects the status of PA_20 and PA_19 to enter the corresponding working mode. among them: ⚫ QC mode is used to self-check the hardware during production, and generate QC information for the production device to check the quality of the module. ⚫ In the ATE mode, a series of serial commands are provided to make the radio frequency in a specific transceiver mode, so that the instrument can be tested and calibrated. ⚫ APP is the normal working mode for running applications. 2. The UART2 serial port is used for the input / output of debugging information. Do not use it Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 7 EMC3080 Series Wireless Module Data Manual during design and provide as easy a way as possible to facilitate software development. 3. The CHIP_EN pin is an enable reset pin, which is active low and can be left floating if not used. Or pull up 3.3V. 4. Please keep the unused pins floating. It should be noted that the IO port is in a floating state at startup. If you need to configure the state of the pin through software, you need to wait until the code in the bootloader starts to execute. The time from when the module is powered on to when the code in the bootloader is executed will be affected by the flash startup time. Therefore, if you need IO to be in a certain level state at startup, you need to use a 100k resistor on the pin to pull up and down. Figure 3 shows the level change of the IO port whose software is configured as a low level after being pulled up by an external 100K resistor in the floating state. It can be seen that the time from the power-on of the module to the controllable IO port software is 69.4ms, and the time during which the IO is pulled to the high level is about 20ms. Figure 3 IO The power-on state interface 5. The processing of chip pins inside the module is as follows: ⚫ PA_0, PA_1, PA_23: 10K pull-down resistor. ⚫ CHIP_EN: 100K pull-up resistor and 22nF capacitance to ground. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 8 EMC3080 Series Wireless Module Data Manual Electric Parameter Absolute Maximum Parameters Operation of the module outside of its absolute maximum ratings may result in permanent damage. At the same time, long-term exposure to the maximum rated conditions will affect the reliability of the module. Table 3 Absolute Maximum Parameter：Voltage Symbol Ratings Min Max Unit VDD–VSS Voltage –0.3 3.6 V VIN Input voltage on any other pin VSS−0.3 VDD+0.3 V Operating Voltage and Current Table 4 Absolute Maximum Parameter：Current Specification Symbol Note VDD Voltage IVDD IVDD Min. Typical Max. Unit 3.0 3.3 3.6 V 3.3V inrush current 400 mA 3.3V，RF Tx CCK 11M 21dBm，peak current 600 mA Table 5 operation parameter：Typical RF power consumption Symbol Note Specification CPU Wi-Fi Min. Typical Max. Unit IVDD Shut Down Wi-Fi OFF 10 μA IVDD Deep Sleep Wi-Fi OFF 30 μA IVDD Standby Wi-Fi OFF 200 μA IVDD Sleep Wi-Fi OFF 450 μA IVDD Active Wi-Fi OFF 9 mA IVDD Active TX@MCS7/HT20，14dBm 198 mA IVDD Active TX@MCS7/HT20，16dBm 218 mA IVDD Active TX@OFDM54M, 15dBm 207 mA IVDD Active TX@OFDM54M, 17dBm 230 mA IVDD Active TX@CCK11M, 18dBm 249 mA IVDD Active TX@CCK11M, 21dBm 315 mA IVDD Active RX@MCS7, HT20 (Pin= -60dBm) 67 mA IVDD Active RX@OFDM54M (Pin= -60dBm) TBD mA IVDD Active RX@CCK11M (Pin= -60dBm) 61 mA IVDD Active RF Standby 33 mA IVDD Active RF disable 24 mA (1). The above parameters are measured in the laboratory wireless shielding environment. Refer to Table 8 for actual application power consumption. (2). Flash power consumption is not included in the data in Table 6. When reading code or reading and Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 9 EMC3080 Series Wireless Module Data Manual writing data from the Flash, the power consumption of the Flash is not higher than 20mA, and the power consumption of the Flash in standby mode (CS signal is pulled high) is not higher than 50mA. General I/O interface Table 6 DC current: digital I/O Symbol Note Conditions VIH Input-High Voltage VIL Specification Min. Typical Max. Unit LVTTL 2.0 - - V Input-Low Voltage LVTTL - - 0.8 V VOH Output-High Voltage LVTTL 2.4 - - V VOL Output-Low Voltage LVTTL - - 0.4 V IT+ Schmitt-trigger High Level 1.78 1.87 1.97 V IT- Schmitt-trigger Low Level 1.36 1.45 1.56 V IIL Input-Leakage Current -10 1 10 A VIN=3.3V or 0 Typical Application Power Consumption The module current test environment is based on VDD=3.3V. Test under common office application environment (values measured under different test environments will be different). Table 7 Typical application power consumption Mode Average Max. Unit Note Wi-Fi off 18.2 20 mA CPU Active Wi-Fi off TBD TBD mA CPU Sleep Wi-Fi initialization TBD TBD mA CPU Active, Wi-Fi initialization is in standby 82.4 97.4 mA 35.6 97.4 mA TBD TBD mA TBD TBD mA TBD TBD mA SoftAP mode 67.9 244.6 mA SoftAP networking status Monitor mode 86.4 101.5 mA Distribution process, in RX state TBD TBD mA Keep Wi-Fi connected Keep Wi-Fi connected Keep Wi-Fi connected Keep Wi-Fi connected Keep Wi-Fi connected Iperf performance mode Turn off Wi-Fi and MCU low power consumption Turn on Wi-Fi low power consumption, turn off MCU low power consumption, DTIM = 1 Turn on Wi-Fi low power consumption, turn off MCU low power consumption, DTIM = 3 Turn on Wi-Fi low power consumption and MCU low power consumption, DTIM = 1 Turn on Wi-Fi low power consumption and MCU low power consumption, DTIM = 3 Turn off the low power consumption of Wi-Fi and MCU, iperf sends at full speed Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 10 EMC3080 Series Wireless Module Data Manual Temperature Table 8 Temperature and humidity parameters Symbol Ratings Max Unit TSTG Storage temperature –55 to +125 ℃ Twork Ambient Operating Temperature -20 to +85 ℃ TJun Junction Temperature 0 to +125 ℃ k ESD Table 9 Electrostatic discharge parameters Symbol Name Name Level Max. 2 2000 Unit Electrostatic VESD(HBM) discharge voltage TA= +25 °C comply with JESD22(Human body A114 model) V Electrostatic discharge voltage VESD(CDM) (Discharge TA = +25 °C comply with JESD22- equipment C101 II 500 model) RF Parameter Table 10 RF Parameter Item Specification Operating Frequency 2.412~2.484GHz Channel BW 20MHz Antenna Interface 1T1R, Single stream Wi-Fi Standard IEEE 802.11b/g/n 11b: DBPSK, DQPSK, CCK for DSSS Modulation Type 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 11n: MCS0~7, OFDM 802.11b: 1, 2, 5.5 and 11Mbps Data Rates 802.11g: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps 802.11n: MCS0~7, up to 65Mbps Antenna type One U.F.L connector for external antenna PCB printed ANT (Reserve) Note: The typical values of the following Tx test data are recorded under normal temperature environment and Tx lasts about 20s. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 11 EMC3080 Series Wireless Module Data Manual TX performance Table 11 Output Power TX Characteristics Min. Typical Max. Unit Power@11Mbps, 802.11b 14 16.5 18 dBm Power@54Mbps, 802.11g 13 14.5 16 dBm Power@HT20, MCS7,802.11n 11 12.5 14 dBm Table 12 Frequency error TX Characteristics Min. Typical Max. Unit Frequency Error -15 - +15 ppm Table 13 EVM TX Characteristics Min. Typical Max. Unit EVM@11Mbps, 802.11b - -20 -10 dB EVM@54Mbps, 802.11g - -29 -25 dB EVM@HT20, MCS7,802.11n - -31 -27 dB Min. Typical Max. Unit PER≦8%@11Mbps,802.11b - -88 - dBm PER≦10%@54Mbps,802.11g - -75 - dBm PER≦10%@HT20, MCS7, 802.11n - -72 - dBm RX performance Table 14 RX sensitivity RX Characteristics Minimum Input Level Sensitivity Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 12 EMC3080 Series Wireless Module Data Manual EMC3080 Bluetooth RF Parameters Table 15 EMC3080 BLE4.2 TX/RX Parameters Item DataRate Min Typical Max Unit POWER_AVERAGE LE_1M 6 8 10 dBm Frequency Drift Error LE_1M -50 -5 50 KHz -150 6.1 150 KHz Carrier frequency offset and drift at NOC: ∆Fn max LE_1M |F0-Fn| LE_1M 2.37 50 KHz |F1-F0| LE_1M 2.1 20 KHz |Fn-Fn5| LE_1M 0.89 20 KHz Modulation characteristics: ∆F1avg LE_1M 225 249 275 KHz ∆F2avg LE_1M 185 238 275 KHz ∆F2avg/∆F1avg LE_1M 0.8 0.96 KHz ∆F2max LE_1M 185 245 KHz In-Band Emissions OFFSET_-2 LE_1M -44.3 -20 dBm OFFSET_-3 LE_1M -46.6 -30 dBm OFFSET_-4 LE_1M -46.5 -30 dBm OFFSET_-5 LE_1M -50.6 -30 dBm OFFSET_2 LE_1M -46.1 -20 dBm OFFSET_3 LE_1M -45.7 -30 dBm OFFSET_4 LE_1M -44.4 -30 dBm OFFSET_5 LE_1M -50.2 -30 dBm -98 -97 dBm RX Characteristics Minimum Sensitivity PER ≤30.8% LE_1M - Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 13 EMC3080 Series Wireless Module Data Manual Antenna Information EMC3080 has two specifications: PCB antenna and external antenna, please refer to the order code for order. IPX antenna connectors are not soldered on the modules using PCB antennas. By connecting an external antenna through an IPX connector, you can get better RF performance. PCB antenna parameters and use 4.1.1. On-board PCB parameter Table 16 On-board PCB parameter Item Min. Frequency 2400 Impedance Typical Max. Unit 2500 MHz 50 VSWR Ω 2 Gain ≤2dBi Efficiency >70% ordBi >-1.54dB PCB Antenna Clearance When using PCB antenna in WIFI module, it is necessary to ensure that PCB and other metal devices are at least 16 mm away from the motherboard. The shaded areas in the figure below need to be far away from metal devices, sensors, interference sources and other materials that may cause signal interference. Figure 4 Antenna minimum clearance area (unit: mm) External antenna parameters and use Users can choose different 2.4G antennas with different external dimensions and gains not greater than 2dBi according to the application environment. When using an external antenna, it should be noted that the module must be powered on after the antenna is connected, because the module will perform IQ calibration after power on, and send a single carrier through the PA to pass the RX loop detection signal. If the load is not loaded (the antenna is not connected), it will cause calibration errors, which will make the PA output power abnormal, and a large standing wave will be formed at the PA output, which may damage the internal devices. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 14 EMC3080 Series Wireless Module Data Manual The following is a copper tube antenna with an IPEX connector commonly used by MXCHIP: Figure 5 Copper tube antenna size ⚫ Frequency range：2400-2500 MHz ⚫ Input impedance：50 OHM ⚫ VSWR：< 2.0 ⚫ Gain：2.0DBI ⚫ Polarization: vertical ⚫ Directivity: Omnidirectional ⚫ Copper tube: 4.4 * 23mm ⚫ Wire: 1.13 gray wire L-82mm External antenna IPEX seat size: Figure 6 Dimension drawing of external antenna connector Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 15 EMC3080 Series Wireless Module Data Manual Dimensions and Production Guidance Assembly Dimension Diagram Figure 7 Assembly Dimension Diagram（unit: mm, tolerance: ±0.1, outside tolerance±0.2） ） Recommended Package Drawing The solder resist window and the pad size are the same. SMT recommends a steel mesh thickness of 0.12mm-0.14mm. Figure 8 DIP package dimension(unit: mm) Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 16 EMC3080 Series Wireless Module Data Manual Figure 9 Stamp hole package size (mounting pad, unit: mm) Figure 10 Stamp hole package size (no mounting pad, unit: mm) Notes: The two-dot chain line indicates the outline of the module, and components cannot be arranged on the main board in the outline. The hatching in the middle oblique line indicates the mounting pad of the module on the main board and expresses the size of the mounting position of the module on the main board. The medium meshed wire frame indicates the place where the pad cannot be placed on the main board, and expresses the position size of the prohibited pad on the motherboard. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 17 EMC3080 Series Wireless Module Data Manual Production Guidelines MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after unpacking more than a fixed time patches to bake module. SMT patches require instruments ⚫ ⚫ ▪ Reflow bonding machine ▪ AOI detector ▪ 6-8mm suction nozzle Baking requires equipment: ▪ Cabinet oven ▪ Anti-static, high temperature tray ▪ Antistatic and heat resistant gloves The storage conditions of MXCHIP module are as follows: ▪ Moisture-proof bags must be stored in an environment with temperature < 30 degree C and humidity < 85% RH. ▪ A humidity indicator card is installed in the sealed package. Figure 11 Humidity Card After the module is split, if the humidity card shows pink, it needs to be baked. The baking parameters are as follows: ▪ The baking temperature is 120℃±5℃ and the baking time is 4 hours. ▪ The alarm temperature is set to 130℃. ▪ SMT patches can be made after cooling < 36℃ under natural conditions. ▪ Drying times: 1 time. ▪ If there is no welding after baking for more than 12 hours, please bake again. Copyright of Shanghai MXCHIP Information Technology Co., Ltd. 18 EMC3080 Series Wireless Module Data Manual If the disassembly time exceeds 3 months, SMT process is forbidden to weld this batch of modules, because PCB gold deposition process, over 3 months, pad oxidation is serious, SMT patch is likely to lead to virtual welding, leak welding, resulting in various problems, our company does not assume the corresponding responsibility; Before SMT patch, ESD (Electrostatic Discharge, Electrostatic Release) protection should be applied to the module. SMT patches should be made according to the reflow curve. The peak temperature is 250 C. In order to ensure the qualified rate of reflow soldering, 10% of the first patches should be taken for visual inspection and AOI testing to ensure the rationality of furnace temperature control, device adsorption mode and placement mode, and 5-10 patches per hour are recommended for visual inspection and AOI testing in subsequent batch production. Precautions ⚫ Operators of each station must wear static gloves during the entire production process. ⚫ Do not exceed the baking time when baking. ⚫ It is strictly forbidden to add explosive, flammable, or corrosive substances during baking. ⚫ When baking, the module uses a high temperature tray to be placed in the oven to keep the air circulation between each module while avoiding direct contact between the module and the inner wall of the oven. ⚫ When baking, please close the oven door to ensure that the oven is closed to prevent temperature leakage and affect the baking effect. ⚫ Try not to open the door when the oven is running. If it must be opened, try to shorten the time for opening the door. ⚫ After baking, the module should be naturally cooled to