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Specifications for Wire Wound Molded SMD Power Inductors Page 1 of 12
S P E C I F I C AT I O N S
Customer
Product Name
Wire Wound Molded SMD Power Inductors
Sunlord Part Number
MWLA-S Series
Customer Part Number
[
New Released,
Revised]
SPEC No.: ES017-09
【This SPEC is total 12 pages including specifications and appendix.】
【ROHS Compliant Parts】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Comments:
Date:
Restricted
Rejected
Re-checked By
Checked By
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Specifications for Wire Wound Molded SMD Power Inductors Page 2 of 12
【Version change history】
Rev.
Effective Date
Changed Contents
Change Reasons
Approved By
01
Jun. 3, 2020
New release
/
Simei Yu
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Specifications for Wire Wound Molded SMD Power Inductors Page 3 of 12
Caution:
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not
designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high
reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are
not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if
you intend to use our products in the following applications.
1.
Aircraft equipment
2.
Aerospace equipment
3.
Undersea equipment
4.
nuclear control equipment
5.
military equipment
6.
Power plant equipment
7.
Medical equipment
8.
Transportation equipment (automobiles, trains, ships,etc.)
9.
Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
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1.
Scope
This specification applies to MWLA-S - wire wound molded SMD power Inductors
2.
Product Description and Identification (Part Number)
1)
Description
Wire Wound Molded SMD Type Power Inductor, MWLA XXXX, XXμH± X% @XXX KHz/XXXV, XXXmΩ, XX A.
2)
Product Identification (Part Number)
MWLA XXXX
-XXX
□
T
①
②
③
④
⑤
①
MWLA
③
Type
②
Wire wound molded SMD power
Inductors
0402S/0503S//0624S/0603S/1004S/1235S/12
65S/1707S
Nominal Inductance(μH )
④
Example
Nominal Value
1R0
1.0μH
1R5
1.5μH
External Dimensions (mm)
Inductance Tolerance
M
±20%
N
±30%
Packing
⑤
T
Tape Carrier Package
3.
Electrical Characteristics
Please refer to Appendix A.
1)
Operating temperature range (Including self-heating): -55℃~+125℃.
2)
Storage temperature and humidity range (product with tapping ): -10℃~+40℃, RH 70% Max.
4.
Shape and Dimensions
1)
Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1 and Table 4-1.
Fig. 4-1
Unit: mm
Series
A
B
C
D
E
I typ.
J typ.
H typ.
MWLA0402S
4.2±0.25
4.4±0.35
1.8±0.2
0.8±0.3
2.0±0.3
1.5
2.2
2.5
MWLA0503S
5.2±0.20
5.7±0.30
2.8±0.2
1.2±0.2
2.0±0.3
1.9
2.2
2.5
MWLA0624S
6.6±0.3
7.3±0.30
2.2±0.2
1.60±0.3
3.0±0.3
2.35
3.7
3.5
MWLA0603S
6.6±0.3
7.3±0.30
2.8±0.2
1.60±0.3
3.0±0.3
2.35
3.7
3.5
MWLA1004S
10.0±0.3
11.0±0.50
3.8±0.2
2.0±0.5
3.0±0.5
4.1
5.4
4.1
MWLA1235S
12.6±0.3
13.5±0.5
3.3±0.2
2.0±0.5
See remark1
3.1
8.0
5.0
MWLA1265S
12.6±0.3
13.5±0.5
6.2±0.3
2.0±0.5
See remark2
3.1
8.0
5.0
MWLA1707S
17.0±0.3
17.5±0.5
7.0Max
2.5±0.5
12±0.3
3.5
11.2
12.8
Remarks1
E
Dimensions
3.85±0.5
R47/R68/R82
4.7±0.5
1R0/1R5/2R2/3R3/4R7
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Remarks2
E
Dimensions
3.85±0.5
R47/R68/1R0/1R5
4.7±0.5
2R2/3R3/4R7/6R8/8R2/100/150/220/330/470/680
Structure and Components: See Table 4-2
[
Table 4-2
Symbol
5.
Components
Material
a
MARKING
Ink(black)
b
CORE
Carbonyl powder
c
WIRE
Polyurethane copper wire
d
Terminal
Copper plated with Sn
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86 KPa to 106 KPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 25 ± 2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86KPa to 106 KPa
5.2 Visual Examination
a. Inspection Equipment: 10 X magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to Appendix A.
b. Test equipment (Analyzer): HIOKI3540 or equivalent.
5.3.2 Inductance (L)
a. Refer to Appendix A.
b. Test equipment: Wayne kerr3260+3265B or equivalent.
5.3.3 Rated Current
a. Refer to Appendix A.
b. Test equipment: Wayne kerr3260+3265B, Agilent E3633A, R2M-2H3 or equivalent.
c. Definition of Rated Current (Ir): With the condition of the DC current pass, the inductance decrease approximate 30% of
the standard value, compare to the temperature rise approximate 40℃, the smaller is Rated Current.(reference
environment temperature:25℃)
5.4 Reliability Test
Mechanical Reliability
Item
Solderability
Specification and Requirement
Test Method
The surface of terminal immersed shall be
Solder heat proof:
minimum of 95% covered with a new coating of
1.
Preheating: 160 ± 10 ℃
solder
2.
Retention time: 245 ± 5 ℃ for 2 ± 0.5 seconds
1.
Vibration frequency:
(10 Hz to 55 Hz to 10Hz) in 60 seconds as a period
Vibration
Inductance
change:
Within
±
10%
Without
2.
mechanical damage such as break
Vibration time:
Period cycled for 2 hours in each of 3 mutual perpendicular
directions.
Shock
Inductance
change:
Within
±
mechanical damage such as break
10%
Without
3.
Amplitude: 1.5 mm max.
1.
Peak value: 100 G
2.
Duration of pulse: 11ms
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3.
3 times in each positive and negative direction of 3 mutual
perpendicular directions
Endurance Reliability
Item
Specification and Requirement
Test Method
1.
Repeat 100 cycles as follow:
(-55 ± 2 ℃; 30 ± 3 min)
Thermal Shock
→(Room temp., 5 min)
Inductance change: Within ± 10% Without distinct
→ (+125 ± 2 ℃, 30 ± 3 min)
damage in appearance
→ (Room temp., 5 min)
2.
Recovery: 48 + 4 / -0 hours of recovery under the standard
condition after the test.
High Temperature
Resistance
Humidity
Resistance
Inductance change: Within ± 10% Without distinct
damage in appearance
1.
Applied Current: Rated current
2.
Duration: 1000 + 4 / -0 hours
1.
Environment condition: 60 ± 2 ℃
Inductance change: Within ±10% Without distinct
Humidity: 90–95%
damage in appearance
Applied Current: Rated current
2.
Low Temperature
Store
High Temperature
Store
6.
Environment condition: 85 ± 2 ℃
Duration: 1000 + 4 / -0 hours
Inductance change: Within ± 10% Without distinct
Store temperature:
damage in appearance
-55 ± 2 ℃,1000 + 4 / -0 hours
Inductance change: Within ± 10% Without distinct
Store temperature:
damage in appearance
+125 ± 2 ℃,1000 + 4 / -0 hours
Packaging, Storage and Transportation
6.1 Tape Carrier Packaging:
Packaging code: T
(1) Tape carrier packaging are specified in attached figure Fig.6.1-1~2
(2) Tape carrier packaging quantity:
Type
Standard Quantity
(pcs/reel)
MWLA0402S
3000
MWLA0503S
2000
MWLA0624S
1500
MWLA0603S
1500
MWLA1004S
500
MWLA1235S
500
MWLA1265S
500
MWLA1707S
200
a. Taping Drawings (Unit: mm)
Fig.6.1-1
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b.Reel and Taping Dimensions (Unit: mm)
Fig.6.1-2
Reel dimensions (mm)
Type
Tape dimensions (mm)
A
N
C
W
W0
P
P0
MWLA0402S
330±2.0
97±0.5
13±0.2
12.8±0.2
12±0.3
8±0.1
4±0.1
MWLA0503S
330±2.0
97±0.5
13.2±0.2
12.8±0.2
12±0.3
8±0.1
MWLA0624S
330±2.0
97±0.5
13.2±0.2
16.8±0.2
MWLA0603S
330±2.0
97±0.5
13.2±0.2
MWLA1004S
330±2.0
97±0.5
MWLA1235S
330±2.0
MWLA1265S
MWLA1707S
H
T
A0
B0
2.3±0.1 0.35±0.05
4.5±0.1
4.85±0.1
4±0.1
3.3±0.1 0.35±0.05
5.5±0.1
5.90±0.1
16±0.3
12±0.1 4±0.1
2.7±0.1 0.35±0.05
6.9±0.1
7.50±0.1
16.8±0.2
16±0.3
12±0.1 4±0.1
3.3±0.1 0.35±0.05
6.9±0.1
7.50±0.1
13.0±0.2
24±0.50
24±0.3
16±0.1 4±0.1
4.3±0.1 0.35±0.05
10.4±0.1
11.6±0.1
97±0.5
13.0±0.2
24±0.50
24±0.3
16±0.1 4±0.1
3.8±0.1 0.50±0.05
13.1±0.1
14.0±0.1
330±2.0
97±0.5
13.0±0.2
24±0.50
24±0.3
16±0.1 4±0.1
6.8±0.1 0.50±0.05
13.1±0.1
14.0±0.1
330±2.0
97±0.5
13.0±0.2
24±0.50
24±0.3
16±0.1 4±0.1
7.3±0.1 0.50±0.05
17.5±0.1
18.1±0.1
c.Peeling off force: 10gf to 70gf in the direction show below.
Top tape or cover tape
1650~ 1800
Fig. 6.1-4
6.2 Storage
Base tape
(1) The solderability of the external electrodes may deteriorate if packages are stored in high humidity. Besides, to ensure packing
material’s good state, packages must be stored at -10℃ to 40℃ and 70% RH Max.
(2) The solderability of the external electrodes may deteriorate if packages are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of
H2S).
(3) Packaging materials may deform if packages are exposed directly to sunlight.
(4) Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon
as possible.
(5) Solderability shall be guaranteed for a period of time from the date of delivery on condition that they are stored at the specified
environment. For those parts, which passed more than the time shall be checked solderability before using.
(6) For magnetic products, keep clear of anything that may generate magnetic fields to avoid change of products performance.
(7) To avoid any damage to products, do not load mechanic force on products or place heavy goods on products, and exclude strong
vibration or drop.
(8)In case of storage over 12 months, solderability shall be checked before actual usage.
7.
Warning and Attentions
7.1 Precautions on Use
(1) Always wear static control bands to protect against ESD.
(2) Any devices used with the products (soldering irons, measuring instruments) should be properly grounded.
(3) Keep bare hands and metal conductors (i.e., metal desk) away from electrodes or conductive areas that lead to electrodes.
(4) Preheat when soldering.
(5) Don’t apply current in excess of the rated current value. It may reduce the impedance or inductance, or cause damage to
components due to over-current.
(6) For magnetic products, keep clear of anything that may generate magnetic fields such as speakers and coils. Use non-magnetic
tweezers when handing the chips.
(7) When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress.
(8) When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior
coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please
evaluate reliability with the product mounted in your application set.
(9) When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land
pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use.
(10) Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat
by other products may cause deterioration at joint of this product with substrate.
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(11) Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic
coupling.
(12) Please do not give the product any excessive mechanical shocks in transportation.
(13) Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires.
(14) Please do not add any shock and power to the soldered product to avoid causing any damage to chip body.
(15) Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on
the skin.
7.2 PCB Bending Design
The following shall be considered when designing and laying out PCB’s.
(1) PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection.
Products shall be located in
the sideways direction to
the mechanical stress
(Poor example)
(Good example)
(2) Products location on PCB separation.
Seam
A
8
B
C
Product shall be located carefully because they may
be subjected to the mechanical stress in order of A>C=B>D.
D
(3) When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to
give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of
electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices.
7.3 Recommended PCB Design for SMT Land-Patterns
When chips are mounted on a PCB, the amount of solder used (size of fillet) can directly affect chip performance. Therefore, the following
items must be carefully considered in the design of solder land patterns:
(1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking.
Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form the fillets.
(2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering
point is separated by solder-resist.
Recommended land dimensions please refer to product specification.
Recommended Soldering Technologies
Peak 260℃ max
8.1Re-flowing Profile:
260℃
△ Preheat condition: 150 ~200℃/60~120sec.
△ Allowed time above 217℃: 60~90sec.
Max Ramp Up Rate=3℃/sec.
△ Max temp: 260℃
217℃
Max Ramp Down Rate=6℃/sec.
△ Max time at max temp: 10sec.
60~90sec.
△ Solder paste: Sn/3.0Ag/0.5Cu
200℃
△ Allowed Reflow time: 2x max
150℃
Please refer to Fig. 8.1
60~120sec.
[Note: The reflow profile in the above table is only for
qualification and is not meant to specify board assembly
25℃
Time 25℃ to Peak =8 min max
profiles. Actual board assembly profiles must be based on
Fig. 8.1
the customer's specific board design, solder paste and process,
and should not exceed the parameters as the Reflow profile shows.]
8.2 Iron Soldering Profile
△ Iron soldering power: Max. 30W
△ Pre-heating: 150℃/60sec.
350℃
△ Soldering Tip temperature: 350℃ Max.
3sec. Max.
Soldering Iron
Soldering time: 3sec. Max.
Power: max. 30W
Solder paste: Sn/3.0Ag/0.5Cu
Max.1 times for iron soldering
Diameter of Soldering
Please refer to Fig. 8.2.
Iron 1.0mm max.
[Note: Take care not to apply the tip of
Tc ℃
the soldering iron to the terminal electrodes.]
8.3 Recommended Soldering Technologies
Heat Gun Profile
Fig. 8.2.
△ Soldering tip temperature: 350℃ Max.
△ Hot air time: