MWLB0401S-100MT

Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 1 of 9 S P E C I F I C AT I O N S Customer Product Name Wire Wound Molded SMD Power Inductors Sunlord Part Number MWLB-S Series Customer Part Number [ New Released, Revised] SPEC No.: ES017-10 【This SPEC is total 9 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Verified By Comments: Date: Restricted Rejected Re-checked By Checked By Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 2 of 9 【Version change history】 Rev. Effective Date Changed Contents Change Reasons Approved By 01 Jun. 15, 2020 New release / Simei Yu 02 Sep. 28, 2020 Add Item / Simei Yu Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 3 of 9 Caution： All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 4 of 9 1. Scope This specification applies to MWLB-S - wire wound molded SMD power Inductors 2. Product Description and Identification (Part Number) 1) Description Wire Wound Molded SMD Type Power Inductor, MWLBXXXX, XXμH± X% @XXX KHz/XXXV, XXXmΩ, XX A. 2) Product Identification (Part Number) MWLB XXXX -XXX □ T ① ② ③ ④ ⑤ ① Type ② External Dimensions (mm) Wire wound molded SMD power Inductors MWLB ③ 0401S/0501S/0601S ④ Nominal Inductance(μH ) Example Nominal Value 2R2 2.2μH 100 10μH Inductance Tolerance M ±20% N ±30% ⑤ Packing T Tape Carrier Package 3. Electrical Characteristics Please refer to Appendix A. 1) Operating temperature range (Including self-heating): -55℃~+125℃. 2) Storage temperature and humidity range (product with tapping ): -10℃~+40℃, RH 70% Max. 4. Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1 and Table 4-1. Fig. 4-1 Series A B C D E I Typ. J Typ. H Typ. MWLB0401S 4.1±0.30 4.1±0.20 0.80±0.2 0.90±0.2 1.8±0.2 1.1 2.2 2.0 MWLB0501S 5.1±0.30 5.1±0.30 0.80±0.2 1.2±0.2 3.0±0.3 1.4 2.6 3.5 MWLB0601S 6.1±0.30 6.1±0.30 0.80±0.2 1.75±0.3 4.0±0.3 2.35 2.8 4.5 Structure and Components: See Table 4-2 [ Table 4-2 Symbol 5. Components Material a MARKING Ink(black) b CORE Alloy Sponge Powder c WIRE Polyurethane copper wire d Terminal Copper plated with Sn Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 5 of 9 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 25 ± 2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 10 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): HIOKI3540 or equivalent. 5.3.2 Inductance (L) a. Refer to Appendix A. b. Test equipment: Wayne kerr3260+3265B or equivalent. 5.3.3 Rated Current a. Refer to Appendix A. b. Test equipment: Wayne kerr3260+3265B, Agilent E3633A, R2M-2H3 or equivalent. c. Definition of Rated Current (Ir): With the condition of the DC current pass, the inductance decrease approximate 30% of the standard value, compare to the temperature rise approximate 40℃, the smaller is Rated Current.(reference environment temperature:25℃) 5.4 Reliability Test Mechanical Reliability Item Solderability Specification and Requirement Test Method The surface of terminal immersed shall be Solder heat proof: minimum of 95% covered with a new coating of 1. Preheating: 160 ± 10 ℃ solder 2. Retention time: 245 ± 5 ℃ for 2 ± 0.5 seconds 1. Vibration frequency: (10 Hz to 55 Hz to 10Hz) in 60 seconds as a period Inductance change: Within ± 10% Without 2. Vibration time: Vibration mechanical damage such as break Period cycled for 2 hours in each of 3 mutual perpendicular directions. Inductance change: Within ± 10% Without 3. Amplitude: 1.5 mm max. 1. Peak value: 100 G 2. Duration of pulse: 11ms 3. 3 times in each positive and negative direction of 3 mutual Shock mechanical damage such as break perpendicular directions Endurance Reliability Item Specification and Requirement Test Method 1. Repeat 100 cycles as follow: (-55 ± 2 ℃; 30 ± 3 min) →(Room temp., 5 min) Inductance change: Within ± 10% Without distinct → (+125 ± 2 ℃, 30 ± 3 min) Thermal Shock damage in appearance → (Room temp., 5 min) 2. Recovery: 48 + 4 / -0 hours of recovery under the standard condition after the test. 1. High Temperature Environment condition: 85 ± 2 ℃ Inductance change: Within ± 10% Without distinct Applied Current: Rated current Resistance Humidity Resistance damage in appearance 2. Duration: 1000 + 4 / -0 hours 1. Environment condition: 60 ± 2 ℃ Inductance change: Within ±10% Without distinct Humidity: 90–95% damage in appearance Applied Current: Rated current 2. Low Temperature Inductance change: Within ± 10% Without distinct Duration: 1000 + 4 / -0 hours Store temperature: Sunlord Categories: general confidential Store High Temperature Store 6. Specifications for Wire Wound Molded SMD Power Inductors Page 6 of 9 damage in appearance -55 ± 2 ℃,1000 + 4 / -0 hours Inductance change: Within ± 10% Without distinct Store temperature: damage in appearance +125 ± 2 ℃,1000 + 4 / -0 hours Packaging, Storage and Transportation 6.1 Tape Carrier Packaging: Packaging code: T (1) Tape carrier packaging are specified in attached figure Fig.6.1-1~2 (2) Tape carrier packaging quantity: Type Standard Quantity (pcs/reel) MWLB0401S 3000 MWLB0501S 3000 MWLB0601S 3000 a. Taping Drawings (Unit: mm) Fig.6.1-1 b.Reel and Taping Dimensions (Unit: mm) Fig.6.1-2 Reel dimensions (mm) Tape dimensions (mm) Type A N C W W0 P P0 H T A0 B0 MWLB0401S 330±2.0 97±0.5 13.2±0.2 12.8±0.2 12±0.3 8±0.1 4±0.1 1.1±0.1 0.30±0.05 4.5±0.1 4. 5±0.1 MWLB0501S 330±2.0 97±0.5 13.2±0.2 12.8±0.2 12±0.3 8±0.1 4±0.1 1.1±0.1 0.35±0.05 5.5±0.1 5. 85±0.1 MWLB0601S 330±2.0 97±0.5 13.2±0.2 16.8±0.2 16±0.3 12±0.1 4±0.1 1.1±0.1 0.35±0.05 6.4±0.1 6.5±0.1 c.Peeling off force: 10gf to 70gf in the direction show below. Top tape or cover tape 1650~ 1800 Fig. 6.1-4 6.2 Storage Base tape (1) The solderability of the external electrodes may deteriorate if packages are stored in high humidity. Besides, to ensure packing material’s good state, packages must be stored at -10℃ to 40℃ and 70% RH Max. (2) The solderability of the external electrodes may deteriorate if packages are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). (3) Packaging materials may deform if packages are exposed directly to sunlight. (4) Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. Sunlord 7. Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 7 of 9 (5) Solderability shall be guaranteed for a period of time from the date of delivery on condition that they are stored at the specified environment. For those parts, which passed more than the time shall be checked solderability before using. (6) For magnetic products, keep clear of anything that may generate magnetic fields to avoid change of products performance. (7) To avoid any damage to products, do not load mechanic force on products or place heavy goods on products, and exclude strong vibration or drop. (8)In case of storage over 12 months, solderability shall be checked before actual usage. Warning and Attentions 7.1 Precautions on Use (1) Always wear static control bands to protect against ESD. (2) Any devices used with the products (soldering irons, measuring instruments) should be properly grounded. (3) Keep bare hands and metal conductors (i.e., metal desk) away from electrodes or conductive areas that lead to electrodes. (4) Preheat when soldering. (5) Don’t apply current in excess of the rated current value. It may reduce the impedance or inductance, or cause damage to components due to over-current. (6) For magnetic products, keep clear of anything that may generate magnetic fields such as speakers and coils. Use non-magnetic tweezers when handing the chips. (7) When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress. (8) When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate reliability with the product mounted in your application set. (9) When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. (10) Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by other products may cause deterioration at joint of this product with substrate. (11) Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic coupling. (12) Please do not give the product any excessive mechanical shocks in transportation. (13) Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires. (14) Please do not add any shock and power to the soldered product to avoid causing any damage to chip body. (15) Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on the skin. 7.2 PCB Bending Design The following shall be considered when designing and laying out PCB’s. (1) PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the mechanical stress (Poor example) (Good example) (2) Products location on PCB separation. C Seam A 8 B Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. D (3) When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices. 7.3 Recommended PCB Design for SMT Land-Patterns When chips are mounted on a PCB, the amount of solder used (size of fillet) can directly affect chip performance. Therefore, the following items must be carefully considered in the design of solder land patterns: (1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering point is separated by solder-resist. Recommended land dimensions please refer to product specification. Recommended Soldering Technologies 8.1Re-flowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 8 of 9 △ △ Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2x max Please refer to Fig. 8.1 [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] Peak 260℃ max 260℃ 217℃ Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. 25℃ Time 25℃ to Peak =8 min max Fig. 8.1 8.2 Iron Soldering Profile △ Iron soldering power: Max. 30W △ Pre-heating: 150℃/60sec. 350℃ △ Soldering Tip temperature: 350℃ Max. △ Soldering time: 3sec. Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering Please refer to Fig. 8.2. [Note: Take care not to apply the tip of Tc ℃ the soldering iron to the terminal electrodes.] 8.3 Recommended Soldering Technologies Heat Gun Profile △ Soldering tip temperature: 350℃ Max. △ Hot air time: