XKYED8K5II-112YXC-32.768K 数据手册
CRYSTAL UNIT
32.768KHZ
YSX146GA
Applications
Glass Sealed
Features
‧RTC.
‧Dimensions:7.00 x 1.50 x 1.40 mm.
‧Reflow is possible.
‧Standard Frequency: 32.768KHz
‧Contains Pb in sealing glass exempted by RoHS directive.
Specifications
Standard Frequency
32.768 KHz
7pF, 9pF, 12.5pF, or specify
±10ppm, ±20ppm, or specify
Load Capacitance
Frequency Tolerance (at 25 ℃)
Parabolic Coefficient
( - 0.036 ± 0.006 ) * 10-6 / ℃2
Operating Temperature
-40~+85℃,or specify
Storage Temperature
-55~+125℃
Shunt Capacitance
2.0pF Max.
Motional Capacitance
3.0fF
Level of Drive
1.0μWMax
Aging (at 25 ℃)
±5ppm/year Max.
Equivalent Series Resistance(ESR)
YSX146GA
65KΩMax.
Dimensions and Patterns [unit:mm]
0.55
#4
#3
1.5 Max.
0.3
Package Size – Dimensions (Unit: mm)
0.3
*Marking
#1
6.7
7.0 Max.
#3
* Marking
#2
Y X C32X X X
#2
#1
0.1
or CFX X X
0.4
0.4
#1
#4
0.25
0.2
0.15
1.4
0.1
TOP VIEW
#4
0.2
#2
#3
0.2
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Units: mm
CRYSTAL UNIT
32.768KHZ
YSX146GA
Reflow Soldering Profile
Glass Sealed
Temperature
Pre Heating Temperature
Tp1 ~ Tp2 = + 170 °C
Heating Temperature
TMlt = + 220 °C
Peek Temperature
TMax. = + 260 °C
+260℃
TMax.
+220℃
Tmlt
Point of measuring
In case of Solder ability
Terminal.
In case of Resistance to soldering heat
Surface.
Tp2
Tp1
35s
100s
t(time)
Taping Specification(Unit: mm)
Size
A
B
C
D
E
F
G
H
SMD-7015
330±2.0
16.0±0.3
7.20±0.1
1.70±0.1
4.0±0.1
1.5±0.1
61.0±1.0
16.0±1.0
3000 pcs per reel
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CRYSTAL UNIT
32.768KHZ
YSX146GA
Glass Sealed
Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type)
1. Shock resistance
It may deteriorate the characteristics or cause of no oscillation if excess physical shock given.
Please be careful not to drop. Please use under condition to minimize the shocks as much as
possible. Please review the conditions if it is used by auto mounting or after the conditions are
changed.
2. Heat and humidity resistance in storage
Storing the crystal products under higher or lower temperature or high humidity for a long period
may deteriorate the characteristics of crystal units. Please store and use the crystal products at
the normal temperature and humidity.
3. Mounting method to PCB
When the crystal products need to be lay down please fix to PCB securely. If the crystal is used with
mechanical vibration location, please put cushion in between PCB or fix with elasticity glue (Silicon etc) as
0.6
0.6
0.3
shown in below figure. Please don’t gluing hermetic seal grass.
1.2
5.1
1.2
4. Ultrasonic cleaning and ultrasonic soldering
Soldered by ultrasonic cannot be guaranteed, because crystal maybe sympathetic vibrated and
may damage. Please study at your side about ultrasonic cleaning.
5. Drive level
Applying excessive drive level to the crystal units may cause deterioration of characteristics or
damage. Less then 1.0μW is recommended to this products. More than 2.0μW cannot be
guaranteed.
REVIEW OF SPECIFICATION
When something get doubtful with this specifications , we shall jointly work to get an agreement.
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