XL3ED8K5OI-111YXC-27M

CRYSTAL UNIT YSX221SL Applications Small Size Features ‧SmartWearable ‧Dimensions:2.55 x 2.05 x 0.55 mm. ‧High precision and high frequency stability. IOT Communication. ‧Standard Frequency: 12 to 54MHz ‧Excellent heat resistance and environmental characteristics. Specifications 12 to 54 MHz Standard Frequency Vibration Mode AT Fundamental 8pF,10pF, 20pF, or specify Load Capacitance Frequency Tolerance (at 25 ℃) ±10ppm, ±20ppm, or specify Frequency Versus Temperature Characteristics Operating Temperature ±20ppm, or specify -20~+70℃，-40~+85℃，or specify Storage Temperature -40~+85℃ or specify Shunt Capacitance 3 pF Max. 1~200μWMax. (100uW typical) Level of Drive Aging (at 25 ℃) ±3ppm/year Max. Equivalent Series Resistance(ESR) Fundamental 12 ~ 14 MHz 14 ~ 30 MHz 30 ~ 48 MHz 48 ~ 54 MHz 150 Ω Max. 100 Ω Max. 60 Ω Max. 50 Ω Max. Dimensions and Patterns [unit:mm] Package Size – Dimensions (Unit: mm) 2.5±0.05 2 .0 5±0 .05 4 3 4 GND 3 Marking GND 2 1 To p V i ew 2 0. 55 ± 0. 0 5 1 S i d e Vi e w 1.0 0. 85 1 . 0 0 .9 0. 9 2 4 B o t t om Vi e w 0.9 0.7 0.65 1 To p V i e w C r y s t al C o n n e ct io n To p V i e w S u g g e s t e d L a y o ut 3 www.yxcxtal.com CRYSTAL UNIT YSX221SL Small Size Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-2520 180±2.0 8.0±0.3 2.70±0.1 2.25±0.1 4.0±0.1 1.05±0.1 61.0±1.0 8.0±1.0 3000 pcs per reel www.yxcxtal.com