XL2ED8K5MI-111YXC-25M

CRYSTAL UNIT YSX321SL Applications Features ‧SmartWearable ‧Dimensions:3.20 x 2.50 x 0.70 mm. ‧High precision and high frequency stability. IOT Communication. ‧Standard Frequency: 8 to 64MHz ‧Extremely good for reducing EMI effect. Specifications 8 to 64 MHz Standard Frequency Vibration Mode AT Fundamental 10pF, 20pF, or specify Load Capacitance ±10ppm, ±20ppm, or specify Frequency Tolerance (at 25 ℃ ) Frequency Versus Temperature Characteristics ±20ppm, or specify Operating Temperature -20~+70℃，-40~+85℃，or specify -55~+125℃ or specify Storage Temperature Shunt Capacitance 7 pF Max. Level of Drive 1~200μWMax. (100uW typical) Aging (at 25 ℃) ±3ppm/year Max. Equivalent Series Resistance(ESR) Fundamental 8 ~ 11.2892MHz 12 ~ 16 MHz 17 ~ 64 MHz 150 Ω Max. 80 Ω Max. 50 Ω Max. Dimensions and Patterns [unit:mm] Package Size – Dimensions (Unit: mm) 3.20±0.1 Marking To p Vi e w 3 1 2 GND 2 To p Vi e w C ry st a l Co nn e ct ion 0. 7 ± 0 . 1 1 4 GND 2.50±0.1 3 4 S id e V i ew 1 .4 0 .8 1 .4 1.2 1 0. 7 1. 2 0 . 5 1 . 2 2 4 Bo t t o m Vi e w 3 To p Vi e w S ug g e ste d L ay o ut U nits: mm www.yxcxtal.com CRYSTAL UNIT YSX321SL Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-3225 180±2.0 8.0±0.3 3.50±0.1 2.50±0.1 4.0±0.1 1.40±0.1 61.0±1.0 8.0±1.0 3000 pcs per reel www.yxcxtal.com