EPDM30-135-KIT

EPDM30 Two-Part Thermal Conductive Adhesive LiPOLY EPDM30 is a silicone-free two-part liquid gap filler, with high viscosity and good adhesion, it can be fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.0 W/m*K, EPDM30 provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe. FEATURES / Thermal conductivity: 3.0 W/m*K / Can be applied with dispenser / Room Temperature curing or heating curing / Low compression stress during assembly / Excellent adhesion to metal & PCB TYPICAL APPLICATION / Electronic components: IC、CPU、 MOS、Mother Board、Wireless Hub Telecom Device 、Automotive electronics、Computer and peripherals、Between any heat-generating component and a heat sink. CONFIGURATIONS / Cartridges:50ml, 400ml / Other special and custom sizes are available upon request PRESERVATION It can be preserved for 60 months under the condition of unopened and under room temperature 25℃. TYPICAL PROPERTIES PROPERTY EPDM30 TEST METHOD UNIT White (A part) Black (B part) Visual - Epoxy - - 100:100 - - Viscosity A 270 DIN 53018 Pa.s Viscosity B 330 DIN 53018 Pa.s Density 2.8 ASTM D792 g/cm³ -40~120 - °C 25°C/50 min By LiPOLY - 25°C/4 hrs By LiPOLY - Hardness 90 ASTM D2240 Shore A Elongation at break 10¹¹ ASTM D257 Ohm-m 3.0 ISO 22007-2 W/m*K Color Resin base A:B Application temperature Surface dry Curing condition ELECTRICAL Dielectric breakdown Volume resistivity THERMAL Thermal conductivity