HL7588_1104117

AirPrime HL7548 and HL7588 Product Technical Specification 4116369 9.0 September 04, 2017 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. 4116369 Rev 9.0 September 04, 2017 2 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright © 2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com 4116369 Rev 9.0 September 04, 2017 3 Product Technical Specification Document History Version Date Updates October 07, 2014 Creation December 01, 2014 Updated: • 2 Pad Definition • Table 10 VGPIO Electrical Characteristics • Figure 11 EMC and ESD Components Close to the SIM Removed section 6 X-Ray Exposure January 08, 2015 1.0 January 29, 2015 Updated: • 1.7 ESD • The note in section 3.2 Current Consumption Updated: • 1.8.2 Regulatory • Table 8 Current Consumption • 3.9 Main Serial Link (UART1) • 7 Legal Information Removed: • B13, IPv6 and digital audio support for the HL7548 • HSIC February 23, 2015 Updated section 2 Pad Definition 1.1 February 25, 2015 Updated: • 1.3 General Features • PCM support in: ▪ Figure 1 Architecture Overview ▪ 1.5 Interfaces ▪ Table 6 Pad Definition ▪ 3.14 PCM • Table 17 UART1 Pad Description • 5.4.1 Using UART1 1.2 February 27, 2015 Updated section 7 Legal Information April 09, 2015 Updated: • Table 1 Supported Bands/Connectivity • Table 3 ESD Specifications • 2 Pad Definition • Table 8 Current Consumption Removed SIM2 and GPIO12 throughout the document 2.0 May 05, 2015 May 07, 2015 4116369 Updated: • Supported LTE category for HL7548 in Table 2 General Features • 2 Pad Definition • 3.5 SIM Interface Added section 6 Reliability Specification Updated Table 41 Ordering Information Rev 9.0 September 04, 2017 4 Product Technical Specification Version Date Updates Updated: • Table 2 General Features • 3.7 Electrical Information for Digital I/O • 3.16.3 TX_ON Indicator (TX_ON) 2.1 May 18, 2015 2.2 May 19, 2015 Added PCM in section 3.7 Electrical Information for Digital I/O 3.0 July 13, 2015 Updated: • Signal names from PWR_ON to PWR_ON_N, and RESET_IN to RESET_IN_N • Figure 2 Mechanical Overview • 2 Pad Definition • 3.14 PCM • Figure 8 PWR_ON_N Sequence with VGPIO Information 3.1 July 21, 2015 Updated Table 6 Pad Definition 3.2 August 06, 2015 Updated: • Table 6 Pad Definition • 3.2 Current Consumption Removed GPIO3 from: • 2 Pad Definition • Table 12 UIM1 Pad Description • Table 16 GPIO Pad Description Added Table 9 Current Consumption per Power Supply Updated: • 3.2 Current Consumption • AT command to use from +CPOF to +CPWROFF • 7.1 FCC Regulations 3.3 August 21, 2015 3.4 September 21, 2015 Updated: • Table 8 Current Consumption • Table 9 Current Consumption per Power Supply 4.0 November 04, 2015 Updated: • Table 5 Regulation Compliance • Table 8 Current Consumption • 7 Legal Information 5.0 January 28, 2016 Updated Table 29 Conducted RX Sensitivity (dBm) 6.0 April 21, 2016 6.1 May 06, 2016 Added 5.5 Power Supply Design June 30, 2016 Updated: • Band support limitation in section 1 Introduction and Table 2 General Features • Figure 2 Mechanical Overview • 4 Mechanical Drawings • 8 Ordering Information July 08, 2016 Updated: • Band support limitation in section 1 Introduction and Table 2 General Features • 8 Ordering Information 6.2 6.3 4116369 Added inrush current and duration in section 5.1 Power-Up Sequence Removed HL7519 Rev 9.0 September 04, 2017 5 Product Technical Specification Version Date Updates 6.4 September 19, 2016 Updated: • PWR_ON_N pull up resistor value from 47kΩ to 100kΩ • 5.4.1 Using UART1 • 7.2 IC Statement 7.0 February 03, 2017 Updated: • Table 2 General Features • 3.14 PCM 7.1 February 15, 2017 Updated the Protocol Stack row of Table 2 General Features 8.0 June 22, 2017 Updated: • Table 15 Digital I/O Electrical Characteristics • 4 Mechanical Drawings August 23, 2017 Updated: • Pin 64 from UIM1_DET to UIM1_DET/GPIO3 • Table 6 Pad Definition • Note below Table 14 USB Pad Description 9.0 4116369 Rev 9.0 September 04, 2017 6 Contents 1. INTRODUCTION ................................................................................................ 12 1.1. Common Flexible Form Factor (CF3) ................................................................................12 1.2. Physical Dimensions .........................................................................................................13 1.3. General Features ...............................................................................................................13 1.4. Architecture........................................................................................................................15 1.5. Interfaces ...........................................................................................................................16 1.6. Connection Interface .........................................................................................................16 1.7. ESD ...................................................................................................................................17 1.8. Environmental and Certifications .......................................................................................17 1.8.1. Environmental Specifications ...................................................................................17 1.8.2. Regulatory................................................................................................................18 1.8.3. RoHS Directive Compliant .......................................................................................18 1.8.4. Disposing of the Product ..........................................................................................18 1.9. References ........................................................................................................................18 2. PAD DEFINITION ............................................................................................... 19 2.1. Pad Configuration (Top View, Through Module) ...............................................................24 3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 25 3.1. Power Supply.....................................................................................................................25 3.2. Current Consumption ........................................................................................................25 3.3. VGPIO ...............................................................................................................................26 3.4. BAT_RTC ..........................................................................................................................27 3.5. SIM Interface .....................................................................................................................27 3.5.1. UIM1_DET ...............................................................................................................28 3.6. USB ...................................................................................................................................28 3.7. Electrical Information for Digital I/O ...................................................................................29 3.8. General Purpose Input/Output (GPIO) ..............................................................................29 3.9. Main Serial Link (UART1) ..................................................................................................30 3.10. POWER-ON Signal (PWR_ON_N)....................................................................................31 3.11. Reset Signal (RESET_IN_N).............................................................................................31 3.12. Analog to Digital Converter (ADC1) ..................................................................................32 3.13. Clock Interface ...................................................................................................................32 3.14. PCM ...................................................................................................................................33 3.15. Debug Interfaces ...............................................................................................................34 3.15.1. Trace Debug ............................................................................................................34 3.15.2. JTAG ........................................................................................................................35 3.16. RF Interface .......................................................................................................................35 3.16.1. RF Connection .........................................................................................................35 4116369 Rev 9.0 September 04, 2017 7 Product Technical Specification 3.16.2. 3.16.3. RF Performances .....................................................................................................36 TX_ON Indicator (TX_ON).......................................................................................36 4. MECHANICAL DRAWINGS ............................................................................... 37 5. DESIGN GUIDELINES ....................................................................................... 39 5.1. Power-Up Sequence .........................................................................................................39 5.2. Module Switch-Off .............................................................................................................40 5.3. Emergency Power OFF .....................................................................................................40 5.4. Sleep Mode Management .................................................................................................40 5.4.1. Using UART1 ...........................................................................................................40 5.4.2. Using USB ...............................................................................................................41 5.5. Power Supply Design ........................................................................................................41 5.6. ESD Guidelines for SIM Card ............................................................................................41 5.7. ESD Guidelines for USB ....................................................................................................42 6. RELIABILITY SPECIFICATION ......................................................................... 43 6.1. Reliability Compliance .......................................................................................................43 6.2. Reliability Prediction Model ...............................................................................................43 6.2.1. Life Stress Test ........................................................................................................43 6.2.2. Environmental Resistance Stress Tests ..................................................................44 6.2.3. Corrosive Resistance Stress Tests .........................................................................44 6.2.4. Thermal Resistance Cycle Stress Tests ..................................................................45 6.2.5. Mechanical Resistance Stress Tests .......................................................................46 6.2.6. Handling Resistance Stress Tests ...........................................................................47 7. LEGAL INFORMATION ..................................................................................... 48 7.1. FCC Regulations ...............................................................................................................48 7.2. IC Statement ......................................................................................................................49 7.2.1. Radiation Exposure Statement ................................................................................50 8. ORDERING INFORMATION .............................................................................. 51 9. TERMS AND ABBREVIATIONS ........................................................................ 52 4116369 Rev 9.0 September 04, 2017 8 List of Figures Figure 1. Architecture Overview ..................................................................................................... 15 Figure 2. Mechanical Overview ...................................................................................................... 16 Figure 3. Pad Configuration ............................................................................................................ 24 Figure 4. PCM Timing Waveform ................................................................................................... 34 Figure 5. TX_ON State During Transmission ................................................................................. 36 Figure 6. Mechanical Drawing ........................................................................................................ 37 Figure 7. Footprint .......................................................................................................................... 38 Figure 8. PWR_ON_N Sequence with VGPIO Information ............................................................ 39 Figure 9. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 40 Figure 10. Voltage Limiter Example ................................................................................................. 41 Figure 11. EMC and ESD Components Close to the SIM ................................................................ 42 Figure 12. ESD Protection for USB .................................................................................................. 42 4116369 Rev 9.0 September 04, 2017 9 List of Tables Table 1. Supported Bands/Connectivity ........................................................................................ 12 Table 2. General Features ............................................................................................................ 13 Table 3. ESD Specifications .......................................................................................................... 17 Table 4. Environmental Specifications .......................................................................................... 17 Table 5. Regulation Compliance ................................................................................................... 18 Table 6. Pad Definition .................................................................................................................. 19 Table 7. Power Supply .................................................................................................................. 25 Table 8. Current Consumption ...................................................................................................... 25 Table 9. Current Consumption per Power Supply ......................................................................... 26 Table 10. VGPIO Electrical Characteristics ..................................................................................... 26 Table 11. BAT_RTC Electrical Characteristics................................................................................ 27 Table 12. UIM1 Pad Description ..................................................................................................... 27 Table 13. Electrical Characteristics of UIM1 ................................................................................... 28 Table 14. USB Pad Description ....................................................................................................... 28 Table 15. Digital I/O Electrical Characteristics ................................................................................ 29 Table 16. GPIO Pad Description ..................................................................................................... 29 Table 17. UART1 Pad Description .................................................................................................. 30 Table 18. PWR_ON_N Electrical Characteristics ........................................................................... 31 Table 19. RESET_IN_N Electrical Characteristics .......................................................................... 32 Table 20. ADC Interface Pad Description ....................................................................................... 32 Table 21. ADC Electrical Characteristics ........................................................................................ 32 Table 22. Clock Interface Pad Description ...................................................................................... 32 Table 23. PCM Interface Pad Description ....................................................................................... 33 Table 24. PCM Electrical Characteristics ........................................................................................ 34 Table 25. Trace Debug Pad Description ......................................................................................... 34 Table 26. JTAG Pad Description ..................................................................................................... 35 Table 27. RF Main Connection ........................................................................................................ 35 Table 28. RF Diversity Connection .................................................................................................. 35 Table 29. Conducted RX Sensitivity (dBm) ..................................................................................... 36 Table 30. TX_ON Indicator Pad Description ................................................................................... 36 Table 31. TX_ON Characteristics .................................................................................................... 36 Table 32. Standards Conformity...................................................................................................... 43 Table 33. Life Stress Test................................................................................................................ 43 Table 34. Environmental Resistance Stress Tests ......................................................................... 44 Table 35. Corrosive Resistance Stress Tests ................................................................................. 44 Table 36. Thermal Resistance Cycle Stress Tests ......................................................................... 45 Table 37. Mechanical Resistance Stress Tests .............................................................................. 46 4116369 Rev 9.0 September 04, 2017 10 Product Technical Specification Table 38. Handling Resistance Stress Tests .................................................................................. 47 Table 39. IC IDs ............................................................................................................................... 50 Table 40. Approved Antenna Types ................................................................................................ 50 Table 41. Ordering Information ....................................................................................................... 51 4116369 Rev 9.0 September 04, 2017 11 1. Introduction This document is the Product Technical Specification for the AirPrime HL7548 and HL7588 Embedded Modules. It defines the high-level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7548 and HL7588 belong to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless networks (as listed in Table 1 Supported Bands/Connectivity). The HL7548 and HL7588 support a large variety of interfaces such as USB 2.0, UART and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power HL7548 HL7588* LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (± 2dBm) Class 3bis ✓ ✓ LTE B4 1710 to 1755 MHz 2110 to 2155 MHz +23 dBm (± 2dBm) Class 3bis ✓ ✓ LTE B5 824 to 849 MHz 869 to 894 MHz 23 dBm (± 2dBm) Class 3bis ✓ ✓ LTE B13 777 to 787 MHz 746 to 756 MHz 23 dBm (± 2dBm) Class 3bis LTE B17 704 to 716 MHz 734 to 746 MHz 23 dBm (± 2dBm) Class 3bis UMTS B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (± 2dBm) Class 3bis ✓ UMTS B5 824 to 849 MHz 869 to 894 MHz 23 dBm (± 2dBm) Class 3bis ✓ ✓ ✓ ✓ * AirPrime HL7588 modules operating on Verizon support LTE bands B2, B4, B13, and UMTS bands B2 and B5; while HL7588 modules operating on AT&T support LTE bands B2, B4, B5, B17, and UMTS bands B2 and B5. 1.1. Common Flexible Form Factor (CF3) The AirPrime HL7548 and HL7588 belong to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF 3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it: • Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings • Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions • Offers electrical and functional compatibility • Provides Direct Mount as well as Socketability depending on customer needs 4116369 Rev 9.0 September 04, 2017 12 Product Technical Specification 1.2. Introduction Physical Dimensions AirPrime HL7548 and HL7588 modules are compact, robust, fully shielded modules with the following dimensions: • Length: 23 mm • Width: 22 mm • Thickness: 2.5 mm • Weight: 3.5 g Note: Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL7548 and HL7588 features. Table 2. General Features Feature Description • Physical • • • Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal) Complete body shielding RF connection pads (RF main interface) Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V RF HL7548 (quad-band LTE): • LTE B2: 1900 PCS • LTE B4: 1700 AWS • LTE B5: 850 CLR • LTE B17: 700 HL7588 (penta-band LTE and dual-band UMTS)**: • LTE B2: 1900 PCS • LTE B4: 1700 AWS • LTE B5: 850 CLR • LTE B13: 700 • LTE B17: 700 • UMTS B2: 1900 PCS • UMTS B5: 850 CLR • • Audio interface* 4116369 • • • • • Digital interface only Supports Narrow-Band and Wide-band Adaptive Multirate (AMR-NB and AMR-WB) vocoders MO and MT calling Echo cancellation and noise reduction Emergency calls (112, 110, 911, etc.) Incoming call notification DTMF generation Rev 9.0 September 04, 2017 13 Product Technical Specification Feature SIM interface Application interface Introduction Description • • • • • • Dual SIM Single Standby (DSSS) 1.8V/3V support SIM extraction / hot plug detection SIM/USIM support Conforms with ETSI UICC Specifications Supports SIM application tool kit with proactive SIM commands • NDIS NIC interface support (Windows XP, Windows 7, Windows 8, Windows CE, Linux) Multiple non-multiplexed USB channel support Dial-up networking USB selective suspend to maximize power savings CMUX multiplexing over UART* AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands • • • • • • • Protocol Stack • • • SMS 4116369 • • • • • • • • • Single mode LTE operation: ▪ LTE FDD, bandwidth 1.4-20 MHz ▪ System Release: 3GPP Rel. 9 ▪ Category 4 (up to 150 Mbit/s in downlink, 50 Mbit/s in uplink) ▪ MIMO DL 2x2 and 4x2 ▪ Max modulation 64 QAM DL, 16 QAM UL ▪ Intra-frequency and inter-frequency mobility ▪ SMS over SGs and IMS ▪ SON ANR ▪ Public Warning System PWS HSDPA (High Speed Downlink Packet Access)* ▪ Evolved High Speed Downlink Packet Access (HSDPA+) ▪ Compliant with 3GPP Release 9 ▪ Up to Category 24 (DC, 42.2Mbps) ▪ Continuous Packet Connectivity (CPC) ▪ Enhance fractional DPCH ▪ IPv6 support HSUPA (High Speed Uplink Packet Access)* ▪ Compliant with 3GPP Release 9 ▪ Category 6 (5.7 Mbps) ▪ Robust Header Compression (RoHC) RXDIV Performance Enhancements* ▪ Type 3i (HSDPA) HSPA Enhancements* ▪ MAC-ehs Rel. 7 ▪ HSDPA Enhanced CELL_FACH/PCH states ▪ HSUPA Enhanced CELL_FACH states (eFACH) Rel 8 ▪ MAC-i/is Rel.8 ▪ Serving cell change enhancements Rel. 8 SMS over SGs and IMS SMS MO and MT SMS saving to SIM card or ME storage SMS reading from SIM card or ME storage SMS sorting SMS concatenation SMS Status Report SMS replacement support SMS storing rules (support of AT+CNMI, AT+CNMA) Rev 9.0 September 04, 2017 14 Product Technical Specification Feature Introduction Description • • • • Connectivity • • • • Multiple (up to 20) cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Support QoS profile ▪ Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput ▪ Release 99 QoS negotiation – Background, Interactive, and Streaming Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). Supports PAP and CHAP authentication protocols PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context RFC1144 TCP/IP header compression Operating temperature ranges (industrial grade): • Class A: -30°C to +70°C Environmental • RTC Class B: -40°C to +85°C Real Time Clock (RTC) with calendar * This feature is only available on the HL7588. ** AirPrime HL7588 modules operating on Verizon support LTE bands B2, B4, B13, and UMTS bands B2 and B5; while HL7588 modules operating on AT&T support LTE bands B2, B4, B5, B17, and UMTS bands B2 and B5. 1.4. Architecture The figure below presents an overview of the AirPrime HL7548 and HL7588’s internal architecture and external interfaces. Memory (Flash + RAM) VBATT GND VGPIO Baseband AirPrime HL7548 and HL7588 RX_LTE Dulpexer RF BAT_RTC Antenna Switch RF Main GPIO x 13 UART x 1 LGA146 MCU DSP PMU RF PA Trace Debug (5 pins) JTAG 26M_CLKOUT 32K_CLKOUT LGA146 Analog Baseband SIM1 RESET_IN PWR_ON Peripherals RX_LTE SAW Filters RF Antenna Switch RF DIV USB ADC x 1 PCM* TX_ON* 26MHz Figure 1. 4116369 32.768KHz Architecture Overview Rev 9.0 September 04, 2017 15 Product Technical Specification 1.5. Introduction Interfaces The AirPrime HL7548 and HL7588 modules provide the following interfaces and peripheral connectivity: • 1x – 8-wire UART for the HL7588; 4-wire UART for the HL7548 • 1x – Active Low RESET • 1x – USB 2.0 • 1x – Backup Battery Interface • 2x – System Clock Out • 1x – Active Low POWER-ON • 1x – 1.8V/3V SIM • 1x – JTAG Interface • 13x – GPIOs (3 of which have multiplexes) • 1x – Main Antenna • 1x – RX Diversity Antenna • 1x – VGPIO • 1x – TX_ON (only available on the HL7588) • 1x – ADC • 1x – PCM (only available on the HL7588) • 1x – Debug Interface 1.6. Connection Interface The AirPrime HL7548 and HL7588 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview The 146 pads have the following distribution: • 66 inner signal pads, 1x0.5mm, pitch 0.8mm • 1 reserved test point (do not connect), 1.0mm diameter • 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch • 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm • 4 inner corner ground pads, 1x1mm • 4 outer corner ground pads, 1x0.9mm 4116369 Rev 9.0 September 04, 2017 16 Product Technical Specification 1.7. Introduction ESD Refer to the following table for ESD Specifications. Table 3. ESD Specifications Category Connection Specification Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test) Non-operational Host connector interface Unless otherwise specified: • JESD22-A114 ± 1kV Human Body Model • JESD22-A115 ± 200V Machine Model • SIM connector Signals Other host signals 1.8. JESD22-C101C ± 250V Charged Device Model Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. Environmental Specifications Conditions Range Operating Class A -30°C to +70°C Operating Class B -40°C to +85°C Storage -40°C to +85°C Class A is defined as the operating temperature ranges that the device: • Shall exhibit normal function during and after environmental exposure. • Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device: • Shall remain fully functional during and after environmental exposure • Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. • Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed. 4116369 Rev 9.0 September 04, 2017 17 Product Technical Specification 1.8.2. Introduction Regulatory The AirPrime HL7548 and HL7588 are compliant with FCC and IC regulations. FCC and IC compliance will be reflected on the AirPrime HL7548 and HL7588 label. Table 5. Regulation Compliance Document Current Version Description GCF-CC v3.56.1 or later GCF Conformance Certification Criteria NAPRD.03 V5.22 or later North American Program Reference Document ✓ ✓ FCC Part 22, 24, 27 NA Federal Communications Commission ✓ ✓ IC RSS-130, RSS-132, RSS-133, RSS-139 NA Industry Canada ✓ ✓ 1.8.3. HL7548 HL7588 ✓ RoHS Directive Compliant The AirPrime HL7548 and HL7588 modules are compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”. 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. [1] References AirPrime HL Series Customer Process Guidelines Reference Number: 4114330 [2] AirPrime HL7518 and HL7548 AT Commands Interface Guide Reference Number: 4116303 [3] AirPrime HL7588 AT Commands Interface Guide Reference Number: 4117137 4116369 Rev 9.0 September 04, 2017 18 2. Pad Definition AirPrime HL7548 and HL7588 pads are divided into 3 functional categories. • Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF 3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules. • Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. • Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os. Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on other CF3 modules. Other pads marked as “not connected” or “reserved” should not be used. Table 6. Pad Definition Power Supply Domain Recommendation for Unused Pads Type I/O 1.8V Left Open Extension UART1 Ring indicator / Trace data 3 O 1.8V Connect to test point Core / Custom UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core 4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core 5 UART1_TX UART1 Transmit data I 1.8V Connect to test point Core 6 UART1_RX UART1 Receive data O 1.8V Connect to test point Core 7 UART1_DTR* UART1 Data terminal ready I L 1.8V Connect to test point Core 8 UART1_DCD* / TRACE_DATA1 UART1 Data carrier detect / Trace data 1 O L 1.8V Connect to test point Core / Custom Pad # Signal Name Function I/O 1 GPIO1 General purpose input/output 2 UART1_RI* / TRACE_DATA3 3 4116369 Rev 9.0 Active Low / High September 04, 2017 19 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 9 UART1_DSR* / TRACE_DATA0 UART1 Data set ready / Trace data 0 O L 1.8V Connect to test point Core / Custom 10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O 1.8V Connect to test point Core / Custom 11 RESET_IN_N Input reset signal I 1.8V Left Open Core 12 USB_D- Connect to test point Extension 13 USB_D+ Connect to test point Extension 14 NC Not Connected (Reserved for future use) Left Open Not connected 15 NC Not Connected (Reserved for future use) Left Open Not connected 16 USB_VBUS USB VBUS Connect to test point Extension 17 NC Not Connected (Reserved for future use) Left Open Not connected 18 NC Not Connected (Reserved for future use) Left Open Not connected 19 NC Not Connected (Reserved for future use) Left Open Not connected 20 NC Not Connected (Reserved for future use) Left Open Not connected 21 BAT_RTC Power supply for RTC backup I/O 1.8V Left Open Extension 22 26M_CLKOUT 26MHz System Clock Output O 1.8V Left Open Extension 23 32K_CLKOUT 32.768kHz System Clock Output O 1.8V Left Open Extension 24 ADC1 Analog to digital converter I 1.2V Left Open Extension 25 NC Not Connected (Reserved for future use) Left Open Not connected 26 UIM1_VCC 1.8V/3V SIM1 Power supply O 1.8V/3V Mandatory connection Core 27 UIM1_CLK 1.8V/3V SIM1 Clock O 1.8V/3V Mandatory connection Core 28 UIM1_DATA 1.8V/3V SIM1 Data I/O 1.8V/3V Mandatory connection Core 4116369 USB Data Negative (Low / Full Speed) USB Data Negative (High Speed) USB Data Positive (Low / Full Speed) USB Data Positive (High Speed) I/O I/O I Rev 9.0 L 3.3V 0.38V 3.3V 0.38V 3.3V – 5.5V September 04, 2017 20 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V Mandatory connection Core 30 GND Ground 0V 0V Mandatory connection Extension 31 RF_DIV RF Input - Diversity Mandatory connection Extension 32 GND Ground 0V 0V Mandatory connection Extension 33 PCM_OUT* PCM data out O 1.8V Left Open Extension 34 PCM_IN* PCM data in I 1.8V Left Open Extension 35 PCM_SYNC* PCM sync out I/O 1.8V Left Open Extension 36 PCM_CLK* PCM clock I/O 1.8V Left Open Extension 37 GND Ground 0V 0V Mandatory connection Core 38 NC Not Connected (Reserved for future use) Left Open Not connected 39 GND Ground 0V 0V Mandatory connection Core 40 GPIO7 General purpose input/output I/O 1.8V Left Open Core 41 GPIO8 / TRACE_CLK General purpose input/output / Trace clock I/O 1.8V Connect to test point Core/Custom 42 NC Not Connected (Reserved for future use) Left Open Not connected 43 NC Not Connected (Reserved for future use) Left Open Not connected 44 GPIO13 General purpose input/output O 1.8V Left Open Extension 45 VGPIO GPIO voltage output O 1.8V Left Open Core 46 GPIO6 General purpose input/output I/O 1.8V Left Open Core 47 NC Not Connected (Reserved for future use) Left Open Not connected 48 GND Ground Mandatory connection Core 4116369 0V Rev 9.0 0V September 04, 2017 21 Product Technical Specification Pad Definition Recommendation for Unused Pads Type Mandatory connection Core 0V Mandatory connection Core I 1.8V Left Open Extension General purpose input/output I/O 1.8V Left Open Extension GPIO11 General purpose input/output I/O 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O 1.8V Left Open Extension 55 NC Not Connected (Reserved for future use) Left Open Not connected 56 NC Not Connected (Reserved for future use) Left Open Not connected 57 NC Not Connected (Reserved for future use) Left Open Not connected 58 NC Not Connected (Reserved for future use) Left Open Not connected 59 PWR_ON Active Low Power On control signal I 1.8V Mandatory connection Core 60 TX_ON* TX indicator O 2.3V Left Open Extension 61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 63 VBATT Power supply I 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 64 UIM1_DET / GPIO3 UIM1 Detection / General purpose input/output I/O H 1.8V Left Open Core 65 GPIO4 General purpose input/output I/O H 1.8V Left Open Extension 66 GPIO5 General purpose input/output I/O 1.8V Left Open Extension 67-70 GND Ground GND 0V Pad # Signal Name Function 49 RF_MAIN RF Input/output 50 GND Ground 0V 51 GPIO14 General purpose input/output 52 GPIO10 53 4116369 I/O Rev 9.0 Active Low / High L Power Supply Domain Core September 04, 2017 22 Product Technical Specification Pad Definition Pad # Signal Name Function I/O 71 - 166 Note: 167 - 234 GND Ground GND 236 JTAG_RESET JTAG RESET I 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO 239 Active Low / High Power Supply Domain Recommendation for Unused Pads Type These pads are not available on the AirPrime HL7548 and HL7588 module. 0V 1.8V Left Open Extension I 1.8V Left Open Extension JTAG Test Data Output O 1.8V Left Open Extension JTAG_TMS JTAG Test Mode Select I 1.8V Left Open Extension 240 JTAG_TRST JTAG Test Reset I 1.8V Left Open Extension 241 JTAG_TDI JTAG Test Data Input I 1.8V Left Open Extension 242 JTAG_RTCK JTAG Returned Test Clock O 1.8V Left Open Extension * 4116369 L Core L This signal is only available on the HL7588. Rev 9.0 September 04, 2017 23 Product Technical Specification 167 192 193 194 195 196 197 198 171 191 214 215 216 217 218 199 172 1 2 3 4 5 6 7 69 8 GND 9 32 10 GND PCM_OUT 11 28 12 UIM1_DATA UIM1_RESET GND RF_DIV 13 26 14 UIM1_VCC UIM1_CLK 15 22 16 26M_CLKOUT 32K_CLKOUT ADC1 NC 20 17 19 18 68 NC NC BAT_RTC 67 GND 66 GPIO5 GPIO4 UIM1_DET / GPIO3 65 21 64 VBATT VBATT_PA VBATT_PA TX_ON 63 23 62 24 25 190 213 228 229 230 219 200 173 189 212 227 234 231 220 201 174 188 211 226 233 232 221 202 175 187 210 225 224 223 222 203 176 186 209 208 207 206 205 204 177 185 184 183 182 181 180 179 178 61 60 58 56 30 55 31 54 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 52 GPIO11 GPIO10 70 GND 53 33 169 JTAG_RESET JTAG_TCK JTAG_TDO Extension pin NC NC NC GPIO15 57 29 Core pin PWR_ON NC 59 27 JTAG_TMS 242 241 240 239 238 237 236 242 241 240 239 238 237 236 GND JTAG_TDI JTAG_RTCK 168 JTAG_TRST Pad Configuration (Top View, Through Module) NC NC USB_VBUS NC NC USB_D+ USB_DRESET_IN_N GPIO2 / TRACE_DATA2 UART1_DSR / TRACE_DATA0 UART1_DCD / TRACE_DATA1 UART1_DTR UART1_RX UART1_TX UART1_CTS UART1_RTS UART1_RI / TRACE_DATA3 GPIO1 2.1. Pad Definition PCM_IN PCM_SYNC PCM_CLK GND NC GND GPIO7 GPIO8 / TRACE_CLK NC NC GPIO13 VGPIO GPIO6 NC GND RF_MAIN GND GPIO14 170 Figure 3. 4116369 Pad Configuration Rev 9.0 September 04, 2017 24 3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7548 and HL7588 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL7548 and HL7588 modules are supplied through the VBATT signal with the following characteristics. Table 7. Power Supply Supply Minimum Typical Maximum VBATT voltage (V) 3.2* 3.7 4.5 VBATT_PA voltage (V) Full Specification 3.2* 3.7 4.5 VBATT_PA voltage (V) Extended Range 2.8 3.7 4.5 * This value must be guaranteed during the burst. Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module. Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module. 3.2. Current Consumption The following table lists the current consumption of the AirPrime HL7548 and HL7588 at different conditions. Note: The following data is with USB disconnected to achieve the lowest current consumption. An additional 0.6mA will be consumed if USB is connected. Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports. Maximum values are provided for VSWR3:1 with worst conditions among supported ranges of voltages and temperature. Table 8. Current Consumption Parameter Minimum Typical Maximum Unit Off mode 95 110 202 µA Band 2 1.2 1.4 6.2 mA Band 4 1.2 1.4 6.2 mA Band 5 1.2 1.4 6.2 mA Band 13* 1.2 1.4 6.2 mA Band 17 1.2 1.4 6.2 mA Sleep mode – LTE DRX = 1.28s USB = disconnected 4116369 Rev 9.0 September 04, 2017 25 Product Technical Specification Detailed Interface Specifications Parameter LTE in communication mode (TX Max) UMTS (TX Max) * Table 9. Minimum Typical Maximum Unit Band 2 630 650 895 mA Band 4 510 610 945 mA Band 5 440 520 745 mA Band 13* 460 540 720 mA Band 17 540 560 780 mA Band 2* 570 660 770 mA Band 5* 400 460 500 mA Typical Unit Band 2 214 mA Band 4 207 mA Band 5 211 mA Band 13* 212 mA Band 17 218 mA Band 2* 124 mA Band 5* 118 mA Band 2 436 mA Band 4 403 mA Band 5 309 mA Band 13* 328 mA Band 17 342 mA Band 2* 536 mA Band 5* 342 mA This band is only supported on the HL7588. Current Consumption per Power Supply Parameter (at nominal voltage, 3.7 V) VBATT_BB LTE in communication mode (TX Max) USB = disconnected UMTS (TX Max) USB = disconnected VBATT_PA LTE in communication mode (TX Max) USB = disconnected UMTS (TX Max) USB = disconnected * This band is only supported on the HL7588. 3.3. VGPIO The VGPIO output can be used to: • Pull-up signals such as I/Os • Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL7548 and HL7588 module is switched ON. Table 10. VGPIO Electrical Characteristics Parameter Minimum Typical Maximum Remarks Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode Current capability Active Mode (mA) - - 50 Power management support up to 50mA output in Active mode 4116369 Rev 9.0 September 04, 2017 26 Product Technical Specification Detailed Interface Specifications Parameter Minimum Typical Maximum Remarks Current capability Sleep Mode (mA) - - 3 Power management support up to 3mA output in Sleep mode Rise Time (ms) - - 1.5 Start-Up time from 0V 3.4. BAT_RTC The AirPrime HL7548 and HL7588 modules provide an input/output to connect a Real Time Clock power supply. This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off. If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator. Table 11. BAT_RTC Electrical Characteristics Parameter Minimum Typical Maximum Unit Input voltage - 1.8 - V Input current consumption - 2.5 - µA Output voltage -5% 1.8 +5% V Max charging current (@VBATT=3.7V) - 25 - mA Note: When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed, Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pad. 3.5. SIM Interface The AirPrime HL7548 and HL7588 have one physical SIM interface, UIM1, which has optional support for dual SIM application with an external SIM switch. The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11 recommendations concerning SIM functions. The five signals used by this interface are as follows: • UIM1_VCC: power supply • UIM1_CLK: clock • UIM1_DATA: I/O port • UIM1_RESET: reset • UIM1_DET: SIM detection Table 12. UIM1 Pad Description Pad # Signal Name Description 26 UIM1_VCC 1.8V/3V SIM1 Power supply 27 UIM1_CLK 1.8V/3V SIM1 Clock 28 UIM1_DATA 1.8V/3V SIM1 Data 4116369 Rev 9.0 Multiplex September 04, 2017 27 Product Technical Specification Detailed Interface Specifications Pad # Signal Name Description 29 UIM1_RESET 1.8V/3V SIM1 Reset 64 UIM1_DET UIM1 Detection Table 13. Multiplex GPIO3 Electrical Characteristics of UIM1 Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V) (VCC, CLK, IO, RST) - 2.9 - - 1.80 - The appropriate output voltage is auto detected and selected by software. UIM1 Detect - 1.80 - High active UIM1_VCC Current (mA) - - 10 Max output current in sleep mode = 3 mA UIM1_VCC Line Regulation (mV/V) - - 50 At Iout_Max UIM1_VCC Power-up Setting Time (µs) from power down - 10 - 3.5.1. UIM1_DET UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of UIM1_DET transitions from logic 1 to logic 0. 3.6. USB The AirPrime HL7548 and HL7588 have one USB interface. Table 14. USB Pad Description Pad Number Signal Name I/O Function 12 USB_D- I/O USB Data Negative 13 USB_D+ I/O USB Data Positive 16 USB_VBUS I USB VBUS Note: 4116369 When a USB supply is not available, connect USB_VBUS to VBATT to supply the USB interface. USB_VBUS will have a voltage range of 3.3V to 4.5V when connected to VBATT. Rev 9.0 September 04, 2017 28 Product Technical Specification 3.7. Detailed Interface Specifications Electrical Information for Digital I/O The AirPrime HL7548 and HL7588 support two groups of digital interfaces with varying current drain limits. The following list enumerates these interface groupings and the following table enumerates the electrical characteristics of each digital interface. • Group 1 (6mA current drain limit) GPIO2, GPIO3, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15 ▪ • Group 2 (1mA current drain limit) ▪ GPIO1, GPIO5, GPIO7 ▪ UART1 ▪ JTAG ▪ PCM Table 15. Digital I/O Electrical Characteristics Parameter Symbol Minimum Maximum Input Current-High(µA) IIH - -240 Input Current-Low(µA) IIL - 240 DC Output Current-High (mA) IOH - 6 DC Output Current-Low (mA) IOL -6 - DC Output Current-High (mA) IOH - 1 DC Output Current-Low (mA) IOL -1 - Input Voltage-High(V) VIH 1.33 1.90 Input Voltage-Low(V) VIL -0.20 0.34 VOH 1.45 - IOH = -6mA VOH 1.60 - IOH = -0.1mA VOL - 0.35 IOL = 6mA VOL - 0.20 IOL = 0.1mA Group 1 Group 2 Output Voltage-High(V) Output Voltage-Low(V) 3.8. Remarks General Purpose Input/Output (GPIO) The AirPrime HL7548 and HL7588 modules provide 13 GPIOs, 3 of which have multiplexes. Table 16. GPIO Pad Description Pad Number Signal Name 1 GPIO1 10 GPIO2 40 GPIO7 41 GPIO8 44 46 4116369 Multiplex I/O Power Supply Domain I/O 1.8V I/O 1.8V I/O 1.8V I/O 1.8V GPIO13 I/O 1.8V GPIO6 I/O 1.8V TRACE_DATA2 TRACE_CLK Rev 9.0 September 04, 2017 29 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name 51 I/O Power Supply Domain GPIO14 I/O 1.8V 52 GPIO10 I/O 1.8V 53 GPIO11 I/O 1.8V 54 GPIO15 I/O 1.8V 64 GPIO3 I/O 1.8V 65 GPIO4 I/O 1.8V 66 GPIO5 I/O 1.8V 3.9. Multiplex UIM1_DET Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL7548 and HL7588 modules and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s. The signals used by UART1 are as follows: • TX data (UART1_TX) • RX data (UART1_RX) • Request To Send (UART1_RTS) • Clear To Send (UART1_CTS) • Data Terminal Ready (UART1_DTR) • Data Set Ready (UART1_DSR) • Data Carrier Detect (UART1_DCD) • Ring Indicator (UART1_RI) Note: Signal names are according to PC view. UART1_DTR, UART1_DSR, UART1_DCD and UART1_RI are not available on the HL7548. UART1 pad description is summarized in the table below. Table 17. UART1 Pad Description Pad # Signal Name* I/O* Description 2 UART1_RI** O Signal incoming calls (data only), SMS, etc. 3 UART1_RTS I Request to send 4 UART1_CTS O AirPrime HL7548 or HL7588 is ready to receive AT commands 5 UART1_TX I Transmit data 6 UART1_RX O Receive data 7 UART1_DTR** I (active low) Prevents the AirPrime HL7588 from entering sleep mode, switches between data mode and command mode, and wakes the module up. 4116369 Rev 9.0 September 04, 2017 30 Product Technical Specification Detailed Interface Specifications Pad # Signal Name* I/O* Description 8 UART1_DCD** O Signal data connection in progress 9 UART1_DSR** O Signal UART interface is ON * According to PC view. ** This signal is not available on the HL7548. 3.10. POWER-ON Signal (PWR_ON_N) A low-level signal should be provided to switch the AirPrime HL7548 and HL7588 module ON. It is internally connected to the permanent 1.8V supply regulator inside the HL7548 or HL7588 via a pull-up resistor. Once VBAT is supplied to the HL7548 or HL7588 module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level. The PWR_ON_N signal’s characteristics are listed in the table below. Table 18. PWR_ON_N Electrical Characteristics Parameter Minimum Input Voltage-Low (V) Typical Maximum - 0.51 Input Voltage-High (V) 1.33 - 2.2 Power-up period (ms) from PWR_ON_N falling edge 2000 - - PWR_ON_N assertion time (ms) 25 Note: As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must be used for ignition. VGPIO is an output from the module that can be used to check if the module is active. • When VGPIO = 0V, the module is OFF • When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT command AT+CPWROFF. 3.11. Reset Signal (RESET_IN_N) To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms. This action will immediately restart the AirPrime HL7548 or HL7588 module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to control this signal. The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for the next power on. Note: 4116369 As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open collector or open drain transistor has to be used to control this signal. Rev 9.0 September 04, 2017 31 Product Technical Specification Table 19. Detailed Interface Specifications RESET_IN_N Electrical Characteristics Parameter Minimum Input Voltage-Low (V) Typical Maximum - 0.51 Input Voltage-High (V) 1.33 - 2.2 Reset assertion time (ms) 20 - - Power-up period (ms) from RESET_IN_N falling edge* 2000 - - * With the PWR_ON_N Signal at low level 3.12. Analog to Digital Converter (ADC1) One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7548 and HL7588 module. This converter is a 10-bit resolution ADC ranging from 0 to 1.2V. The following table describes the pad description of the ADC interface. Table 20. ADC Interface Pad Description Pad Number Signal Name I/O Description 24 ADC1 I Analog to digital converter Typical ADC1 use is for monitoring external voltage; wherein an application is used to safely power OFF an external supply in case of overvoltage. Table 21. ADC Electrical Characteristics Parameter Minimum Typical Maximum Remarks ADC1 Resolution (bits) - 10 - Input Voltage Range (V) 0 - 1.2 Update rate per channel (kHz) - - 125 Integral Nonlinearity (bits) - - ±2 LSB Offset Error (bits) - - ±1 LSB Gain 849 853 858 Input Resistance (MΩ) 1 - - Input Capacitance (pF) - 1 - General purpose input 3.13. Clock Interface The AirPrime HL7548 and HL7588 modules support two digital clock interfaces. The following table describes the pad description of the clock out interfaces. Table 22. Clock Interface Pad Description Pad Number Signal Name I/O I/O Type Description 22 26M_CLKOUT O 1.8V 26MHz Digital Clock output 4116369 Rev 9.0 September 04, 2017 32 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name I/O I/O Type Description 23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to documents [2] AirPrime HL7518 and HL7548 AT Commands Interface Guide and [3] AirPrime HL7588 AT Commands Interface Guide. 3.14. PCM Note: This interface is only available on the HL7588. The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals. The signals used by the Digital Audio Interface are as follows: • PCM_SYNC: The frame synchronization signal delivers an 8 kHz/16 kHz frequency pulse that synchronizes the frame data in and the frame data out. • PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral. • PCM_OUT: The frame “data out” relies on the selected configuration mode. • PCM_IN: The frame “data in” relies on the selected configuration mode. The PCM interface is a high speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The Digital Audio Interface also features the following: • PCM master or slave • 16 bits data word length, linear mode • MSB first • Configurable PCM bit clock rate on 256kHz, 384kHz, 512kHz, 768kHz or 1024kHz • Long frame sync The following table describes the pad description of the PCM interface. Table 23. PCM Interface Pad Description Pad Number Signal Name I/O Description 33 PCM_OUT O PCM data out 34 PCM_IN I PCM data in 35 PCM_SYNC I/O PCM sync out 36 PCM_CLK I/O PCM clock Refer to the following table for the electrical characteristics of the digital audio interface. 4116369 Rev 9.0 September 04, 2017 33 Product Technical Specification Table 24. Detailed Interface Specifications PCM Electrical Characteristics Signal Description Minimum Tsync_low + Tsync_high PCM-SYNC period 125 µs Tsync_low PCM-SYNC low time 62.5 µs Tsync_high PCM-SYNC high time 62.5 µs TCLK-cycle PCM-CLK period (T) 1.95 TIN-setup PCM-IN setup time 59.6 TIN-hold PCM-IN hold time 12 TOUT-delay PCM-OUT delay time TSYNC-delay PCM-SYNC output delay -24 Typical 2.6 Maximum 3.9 Unit µs ns ns 21.6 ns 31.2 ns The following figure shows the PCM timing waveform. Figure 4. PCM Timing Waveform 3.15. Debug Interfaces The AirPrime HL7548 and HL7588 modules provide 2 interfaces for a powerful debug system. 3.15.1. Trace Debug The AirPrime HL7548 and HL7588 modules provide a Trace Debug interface, providing real-time instruction and data trace of the modem core. Table 25. Trace Debug Pad Description Pad Number Signal Name Function 2 TRACE_DATA3 Trace data 3 8 TRACE_DATA1 Trace data 1 9 TRACE_DATA0 Trace data 0 4116369 Rev 9.0 Multiplex September 04, 2017 34 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name Function Multiplex 10 TRACE_DATA2 Trace data 2 GPIO2 41 TRACE_CLK Trace clock GPIO8 Note: It is strongly recommended to provide access to this interface through Test Points. 3.15.2. JTAG The JTAG interface provides debug access to the core of the AirPrime HL7548 and HL7588. These JTAG signals are accessible through solder-able test points. Table 26. JTAG Pad Description Pad Number Signal Name Function 236 JTAG_RESET JTAG RESET 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO JTAG Test Data Output 239 JTAG_TMS JTAG Test Mode Select 240 JTAG_TRST JTAG Test Reset 241 JTAG_TDI JTAG Test Data Input 242 JTAG_RTCK JTAG Returned Test Clock Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board to allow JTAG debugging. 3.16. RF Interface The RF interface of the HL7548 and HL7588 modules allow the transmission of RF signals. This interface has a 50Ω nominal impedance. 3.16.1. RF Connection A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for antenna connection. Table 27. RF Main Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 49 RF_MAIN 50Ω 1.5:1 1.5:1 Table 28. RF Diversity Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 31 RF_DIV 50Ω 1.5:1 --- 4116369 Rev 9.0 September 04, 2017 35 Product Technical Specification Detailed Interface Specifications 3.16.2. RF Performances RF performances are compliant with 3GPP recommendation TS 36.101. Table 29. Conducted RX Sensitivity (dBm) Frequency Band Primary (Typical) Secondary (Typical) SIMO (Typical) LTE B2 Full RB; BW: 20 MHz* -93 -94 -97 LTE B4 Full RB; BW: 20 MHz* -95 -95 -98 LTE B5 Full RB; BW: 10 MHz* -98 -99 -101 LTE B13 Full RB; BW: 10 MHz* -95 -98 -100 LTE B17 Full RB; BW: 10 MHz* -98 -99 -101 * Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz) 3.16.3. TX_ON Indicator (TX_ON) Note: This feature is not available on the HL7548. The AirPrime HL7588 module provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V signal and its status signal depends on the module transmitter state. Refer to the following table for the status of the TX_ON signal depending on the embedded module’s state. Table 30. TX_ON Indicator Pad Description Pad Number Signal Name Function I/O Type Power Supply Domain 60 TX_ON TX indicator O 2.3V Table 31. TX_ON Characteristics Parameter Minimum Tadvance 30µs Typical Tdelay 10µs TX_ON T duration VBATT_PA Voltage drop T advance Figure 5. 4116369 Maximum T delay TX_ON State During Transmission Rev 9.0 September 04, 2017 36 4. Mechanical Drawings Figure 6. 4116369 Mechanical Drawing Rev 9.0 September 04, 2017 37 Product Technical Specification Figure 7. 4116369 Mechanical Drawings Footprint Rev 9.0 September 04, 2017 38 5. Design Guidelines 5.1. Power-Up Sequence Apply a low-level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB. When using UART1, the AT command interface is available after the transition of UART1_CTS from high to low level. When using a USB connection, the HL7548 and HL7588 will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host. Module is OFF PWR_ON_N VGPIO Module is ON 2000 ms